CN207831017U - A kind of LED structure and optical projection system - Google Patents
A kind of LED structure and optical projection system Download PDFInfo
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- CN207831017U CN207831017U CN201820250684.4U CN201820250684U CN207831017U CN 207831017 U CN207831017 U CN 207831017U CN 201820250684 U CN201820250684 U CN 201820250684U CN 207831017 U CN207831017 U CN 207831017U
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- 235000000177 Indigofera tinctoria Nutrition 0.000 description 1
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Projection Apparatus (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
The utility model is related to LED patch encapsulation technologies field, a kind of LED structure and optical projection system are disclosed.Wherein the LED structure includes：First nonisulated substrate；First LED light source is set to the side of the described first nonisulated substrate；The second insulated substrate；Second LED light source is set to the side of the second insulated substrate；Radiator, the other side of the first nonisulated substrate and the other side fitting of the second insulated substrate are installed in the radiator.In the above manner, the utility model embodiment can effectively meet the needs of not only ensureing heat dissipation effect but also radiator is facilitated to install.
Description
Technical field
The utility model embodiment is related to LED patch encapsulation technologies field, and in particular to a kind of LED structure and projection system
System.
Background technology
LED light source is widely used in projection lighting field, and the heat dissipation of LED, light type, service life etc. are asked as core
Topic.LED light source major part energy consumption can be converted into thermal energy, if cannot in time disperse this partial heat, it will lead to LED's
Temperature is excessively high, and luminous efficiency declines, service life reduction.The heat 90% that LED light source generates is required in thermo-conducting manner from LED
Package substrate back channel is conducted by metal substrate to radiator, has copper base and aluminum substrate using more metal substrate at present.
The thermal conductance of on-insulated substrate (such as pure Cu substrate) is preferable, but due to the on-insulated characteristic of on-insulated substrate, without cease
With radiator short circuit may occur for edge substrate, it is therefore desirable to for processing in structure, such as：Using heat conductive pad, increase screw
Column adds boss etc., causes certain difficulty to design and the installation of radiator, technique is increasingly complex to easily cause security risk.
Insulating substrate (such as composite aluminum substrate) thermal coefficient is low, and heat dissipation effect, but can be directly with radiator much worse than on-insulated substrate
Contact, it is easy for installation.
Inventor has found that the LED structure of the relevant technologies cannot be satisfied both during realizing the utility model embodiment
Ensure that heat dissipation effect facilitates the demand of installation again.
Utility model content
In order to solve the above technical problems, the purpose of this utility model is to provide a kind of LED structure and optical projection system, it can
Meets the needs of not only ensureing heat dissipation effect but also radiator is facilitated to install.
In order to solve the above technical problems, the technical solution that the utility model embodiment uses is：A kind of LED junction is provided
Structure, including：First nonisulated substrate；First LED light source is set to the side of the described first nonisulated substrate；The second insulated substrate；
Second LED light source is set to the side of the second insulated substrate；Radiator, the other side of the first nonisulated substrate and institute
The other side fitting for stating the second insulated substrate is installed in the radiator.
Optionally, the described first nonisulated substrate includes first boss and first circuit board, and the first circuit board is set to
The first boss, the first boss fit in the radiator.
Optionally, the second insulated substrate includes second boss, second circuit board, thermally conductive insulating layer, aluminum substrate and sun
Pole insulating layer, the second circuit board are set to the second boss, and the side of the thermally conductive insulating layer is pasted with the second boss
It closes, the other side of the thermally conductive insulating layer is bonded with the side of the aluminum substrate, and the other side of the aluminum substrate is equipped with the sun
Pole insulating layer, the anode insulating layer are bonded with the radiator.
Optionally, the second boss is T-type boss.
Optionally, first LED light source is red-light LED light source, and second LED light source is green/blue LED light
Source.
Optionally, the radiator includes first side and second side, and the first nonisulated substrate is set to described the
One side, the second insulated substrate are set to the second side.
Optionally, the LED structure further includes：Third insulating substrate and third LED light source；The third LED light source is set
The radiator is fitted in the other side of the side of the third insulating substrate, the third insulating substrate.
Optionally, the LED structure further includes：4th insulating substrate and the 4th LED light source；4th LED light source is set
The radiator is fitted in the other side of the side of the 4th insulating substrate, the 4th insulating substrate.
Optionally, the LED structure further includes：4th nonisulated substrate and the 4th LED light source；4th LED light source
Set on the side of the 4th nonisulated substrate, the other side of the 4th nonisulated substrate fits in the radiator.
In order to solve the above technical problems, another technical solution that the utility model embodiment uses is：A kind of throwing is provided
Shadow system, including above-mentioned LED structure.
The advantageous effect of the utility model embodiment is：The case where being different from the prior art, the utility model embodiment are logical
It crosses and a kind of LED structure and optical projection system is provided, the first nonisulated substrate and the second insulated substrate are set in LED structure, for not
Characteristic with light source carries out patch using different substrate, also, the first nonisulated substrate and the second insulated substrate are directly set simultaneously
In radiator, to make between different LED light sources will not short circuit, so that the LED structure had not only been ensured heat dissipation effect again convenient scattered
The demand of hot device installation.
Description of the drawings
One or more embodiments are illustrated by the picture in corresponding attached drawing, these exemplary theorys
The bright restriction not constituted to embodiment, the element with same reference numbers label is expressed as similar element in attached drawing, removes
Non- to have special statement, composition does not limit the figure in attached drawing.
Fig. 1 is a kind of structural schematic diagram for LED structure that the utility model wherein embodiment provides；
Fig. 2 is the structural schematic diagram of the first LED light source shown in FIG. 1；
Fig. 3 is the structural schematic diagram of the shown in FIG. 1 first nonisulated substrate；
Fig. 4 is the structural schematic diagram of the second insulated substrate shown in FIG. 1；
Fig. 5 is the structural schematic diagram of the second insulated substrate shown in FIG. 1；
Fig. 6 is a kind of structural schematic diagram for LED structure that another embodiment of the utility model provides；
Fig. 7 is a kind of structural schematic diagram for LED structure that another embodiment of the utility model provides；
Fig. 8 is a kind of structural schematic diagram for LED structure that another embodiment of the utility model provides；
Fig. 9 is a kind of structural schematic diagram for optical projection system that another embodiment of the utility model provides.
Specific implementation mode
For the ease of understanding the utility model, in the following with reference to the drawings and specific embodiments, the utility model is carried out more detailed
Thin explanation.It should be noted that when element is expressed " being fixed on " another element, it can be directly in another element
Upper or placed in the middle there may be one or more therebetween elements.When an element is expressed " connection " another element, it can
To be directly to another element or may exist one or more elements placed in the middle therebetween.This specification is used
Term " vertical ", " horizontal ", "left", "right", "upper", "lower", "inner", "outside", the instructions such as " bottom " orientation or position
It is to be based on the orientation or positional relationship shown in the drawings to set relationship, is merely for convenience of describing the present invention and simplifying the description, and
It is not that the device of instruction or hint meaning or element must have a particular orientation, with specific azimuth configuration and operation, therefore
It should not be understood as limiting the present invention.In addition, term " first ", " second " etc. are used for description purposes only, and cannot manage
Solution is instruction or implies relative importance.
Unless otherwise defined, technical and scientific term all used in this specification and the skill for belonging to the utility model
The normally understood meaning of technical staff in art field is identical.Art used in the description of the utility model in this specification
Language, which is only for the purpose of describing specific embodiments, is not intended to limitation the utility model.Term used in this specification
"and/or" includes any and all combinations of one or more relevant Listed Items.
In addition, as long as technical characteristic involved in the utility model difference embodiment disclosed below is each other not
Constituting conflict can be combined with each other.
LED structure in the utility model embodiment and optical projection system can be applied to digital light processing (Digital
Light Processing, DLP) in projector, wherein the LED structure provides light source for the optical projection system.LED structure dissipates
Thermal effect plays an important role to the performance of optical projection system.Therefore, the utility model embodiment both ensures to dissipate by providing one kind
Thermal effect facilitates the LED structure and optical projection system of installation again, to meet the needs of not only ensureing heat dissipation effect but also facilitating installation.
Specifically, the LED structure and its optical projection system are illustrated below by several embodiments.
Referring to Fig. 1, for a kind of LED structure that the utility model wherein embodiment provides, which includes
First LED light source 10, the first nonisulated substrate 11, the second LED light source 20, the second insulated substrate 21 and radiator 30.
Wherein, the first LED light source 10 is set to the side of the first nonisulated substrate 11, and the second LED light source 20 is set to second absolutely
The side of edge substrate 21, the other side of the first nonisulated substrate 11 and the other side fitting of the second insulated substrate 21 are installed in heat dissipation
Device 30.The present embodiment is carried out for the characteristic of different light sources using different substrate by the way that different substrate is arranged in same LED structure
Patch makes the LED structure disclosure satisfy that the demand for not only ensureing heat dissipation effect but also facilitating installation.
Specifically, above-mentioned first LED light source 10 is red-light LED light source.Since red LED light source is temperature sensitive, to dissipating
The demand of thermal effect is high, if good heat radiating is not achieved, will produce serious light decay.It is non-that first LED light source 10 is set to first
Insulating substrate 11 can ensure heat dissipation effect.
In some embodiments, referring to Fig. 2, the first LED light source 10 includes LED chip 101, holder 102 and pin
103.There are two the quantity of pin 103, and two pins 103 are partially submerged into holder 102 respectively, and LED chip 101 is set to holder 102
It is interior, and connect respectively with two pins 103.The part fitting that two pins 103 are exposed to outside holder 102 is installed in radiator 30.
Wherein, LED chip 101 is red LED chip.Holder 102 is plastic-carrier or resin carrier, generally hollow cuboid
Shape.Holder 102 offers host cavity (not indicating), and LED chip 101 is contained in the host cavity, filled with encapsulation in host cavity
Glue, packaging plastic can be transparent adhesive tape or fluorescent glue, to form luminous lens.Certainly in some embodiments, work as host cavity
Size it is smaller when, packaging plastic can also be filled in outside host cavity, and both of which does not interfere with LED light extractions.Two pins
Gap is formed between 103, gap can be filled with plastic cement, to make two pins 103 separate.
It is understood that in some other embodiments, the first LED light source 10 can not be red-light LED light source, can be with
Other higher color LED light sources of demand for orange light LED light source, yellow light LED light source etc. to heat dissipation effect.
Referring to Fig. 3, above-mentioned first nonisulated substrate 11 is copper base.The thermal coefficient of copper base is high, pure Cu substrate
Thermal coefficient theoretically can reach 380W/m.k, so as to reach preferable heat dissipation effect.First nonisulated substrate 11 includes the
One boss 111 and first circuit board 112.Wherein, first boss 111 is T-type boss, and first boss 111 is prepared for copper, the
The bottom of one boss 111 is mounted directly on radiator 30.First boss 111 includes the first lug boss 1111, first circuit board 112
Set on the both sides of the first lug boss 1111, and the first lug boss 1111 is slightly below first circuit board 112, so that the first LED light
Source 10 is contacted with the first lug boss 1111.Wherein, first circuit board 112 is for welding the first LED light source 10, first circuit board
112 can be FPC circuit boards, and FPC circuit boards are prepared by the fire-retardant class F insulating material F of highest.
Above-mentioned second LED light source 20 is green light or blue light LED light source.Due to compared with red-light LED light source, green light or blue light
For LED light source to temperature-insensitive, the demand to heat dissipation effect is not relatively high.Second LED light source 20 is set to the second insulated substrate
21, it can ensure heat dissipation effect.
In some embodiments, in addition to light source colour, the structure of the second LED light source 20 can be with above-mentioned first LED light source
10 structure is identical, and details are not described herein again.
It is understood that in some other embodiments, the second LED light source 20 can not be green light or blue-ray LED light
Source can be other relatively low color LED lights of the demand of green light LED light source, indigo light LED light source etc. to heat dissipation effect
Source.
Referring to Fig. 4, above-mentioned the second insulated substrate 21 is composite aluminum substrate.The thermal coefficient of composite aluminum substrate is relatively
It is low, thermal coefficient about 122W/m.k, but it is used in green light or blue light LED light source to temperature relative insensitivity, it disclosure satisfy that it
Radiating requirements.
The second insulated substrate 21 includes second boss 211, second circuit board 212, thermally conductive insulating layer 213,214 and of aluminum substrate
Anode insulating layer 215.Second boss 211 is prepared for copper.Second boss 211 is T-type boss, and T-type boss can make heat
Entire thermally conductive insulating layer 213 is covered, to be transmitted to aluminum substrate 214, heat-conducting area bigger, faster, effect is more preferable for heat-transfer rate.
Second boss 211 includes the second lug boss 2111, and second circuit board 212 is set to the both sides of the second lug boss 2111, and second
Lug boss 2111 is slightly below second circuit board 212, so that the second LED light source 20 is contacted with the second lug boss 2111.Second circuit
Plate 212 can be FPC circuit boards for welding the first LED light source 10, second circuit board 212, and FPC circuit boards are fire-retardant by highest
Class F insulating material F is prepared.Thermally conductive insulating layer 213 is made of the ceramic dielectric filled polymer of high heat conduction, high insulation, is had
Insulation performance, thermal ageing resistant capacity and high cementability.In the present embodiment, thermally conductive insulating layer 213 is hardening oxidation layer.It leads
The side of thermal insulation layer 213 is bonded with the bottom of second boss 211, the other side of thermally conductive insulating layer 213 and the one of aluminum substrate 213
Side is bonded.Thermally conductive insulating layer 213 is for separating aluminum substrate 214 and second boss 212.The other side of aluminum substrate 214 is equipped with sun
Pole insulating layer 215.The thickness of anode insulating layer 215 can be 1-15 microns, directly can carry out reaction treatment to aluminum substrate 214
After generate, can also be coated on aluminum substrate 214 on.The second insulated substrate 21 is bonded by anode insulating layer 215 with radiator 30.
In the present embodiment, the heat transfer of the second LED light source 20 generation passes through to second boss 212, second boss 212
Thermally conductive insulating layer 213 transfers heat to aluminum substrate 214, and a part of heat is removed by aluminum substrate 214, another part heat from
Aluminum substrate 214 transfers heat to radiator 30 by anode insulating layer 215.In the above manner, the second insulated substrate 21 can
Directly to be contacted with radiator 30, without using designs such as heat conductive pads so that installation, design can be more convenient, are more efficient, more
Safety.
It is understood that in some other embodiments, referring to Fig. 5, the second insulated substrate 21 further includes protective layer
216, protective layer 216 is set between second boss 212 and thermally conductive insulating layer 213.Protective layer 216 is titanium coating, for protecting
Thermally conductive insulating layer 213 is not etched liquid and other chemical attacks.
It is understood that in some other embodiments, second boss 212 can also be other shapes, as long as increasing
Heat-conducting area accelerates heat-transfer rate.
It is understood that in some other embodiments, above-mentioned aluminum substrate 214 can also for other made of metal are standby and
At can be selected according to actual demand.
It is understood that in some other embodiments, ceramic substrate material is because its electric conductivity is remarkable, anticorrosion,
High temperature resistant, high-frequency loss is small, is widely used in power electronic, Electronic Packaging, mixing microelectronics and multi-chip module etc. fields.On
It can also be ceramic substrate to state the second insulated substrate 21, and aluminum substrate 214 can be replaced with potsherd.
It is understood that in some other embodiments, the first lug boss 1111 and the second lug boss 2111 can be divided equally
It is not coated with diamond film (not shown), diamond film is directly contacted with the first LED light source 10 and the second LED light source 20 respectively, can
To increase the heat dissipation performance of the first nonisulated substrate 11 and the second insulated substrate 21.
Also referring to Fig. 1, above-mentioned radiator 30 can be that aluminium or copper are prepared.Radiator 30 includes first side 31
With second side 32,32 vertical connection of first side 31 and second side.Second side 32 is equipped with cooling fin (not indicating), this is dissipated
Backing is used for increasing heat radiation area, to improve radiating rate.First nonisulated substrate 11 is set to first side 31, and first is non-exhausted
The bottom of the first boss 111 of edge substrate 11 is directly contacted with the first nonisulated substrate 11；The second insulated substrate 21 is set to second
Side 32, and the anode insulating layer 215 of the second insulated substrate 21 is directly contacted with second side 32.First nonisulated substrate, 11 He
The heat that the second insulated substrate 21 generates is transmitted to first side 31 and second side 32 respectively, to realize heat dissipation.
The present embodiment, will be to temperature by the way that the first nonisulated substrate 11 and the second insulated substrate 21 is arranged in LED structure 100
The first sensitive LED light source 10 is set to the first nonisulated substrate 11, will be set to the second LED light source 20 of temperature relative insensitivity
The second insulated substrate 21 carries out patch, also, the first nonisulated substrate simultaneously for the characteristic of different light sources using different substrate
11 and the second insulated substrate 21 be directly arranged in radiator 30, to make between different LED light sources will not short circuit, make the LED structure
100 can not only ensure heat dissipation effect but also facilitate the demand of installation.
Referring to Fig. 6, a kind of LED structure provided for another embodiment of the utility model, which includes the
One LED light source 10, the first nonisulated substrate 11, the second LED light source 20, the second insulated substrate 21, radiator 30, third LED light
Source 40 and third insulating substrate 41.Wherein, the first LED light source 10, the first nonisulated substrate 11, the second LED light source 20, second are exhausted
Edge substrate 21 is same as the previously described embodiments, no longer illustrates herein.
Above-mentioned third LED light source 40 is green light or blue light LED light source.Due to compared with red-light LED light source, green light or blue light
For LED light source to temperature-insensitive, the demand to heat dissipation effect is not relatively high.Third LED light source 40 is set to third insulating substrate
41, it can ensure heat dissipation effect.
In some embodiments, in addition to light source colour, the structure of third LED light source 40 can be in above-described embodiment
The structure of two LED light sources 20 is identical, and details are not described herein again.
Optionally, the first LED light source 10 is red-light LED light source, and the second LED light source 20 is green light LED light source, the 3rd LED
Light source 30 is blue light LED light source, and a combination thereof can make LED structure 200 emit white light.
The structure of above-mentioned third insulating substrate 41 can be identical as the structure of the second insulated substrate 21 in above-described embodiment,
Details are not described herein again.
Above-mentioned radiator 30 further includes third side 33, third side 33 and 32 vertical connection of second side, and with the
One side 31 is opposite.In the present embodiment, third LED light source 40 is set to 41 side of third insulating substrate, third insulating substrate 41
The other side fit in the third side 33 of radiator 30.
It is understood that in some other embodiments, referring to Fig. 7, LED structure 200 further includes the 4th LED light source
50 and the 4th insulating substrate 51, the 4th LED light source 50 be set to the 4th insulating substrate 51, the 4th insulating substrate 51 is set to third side
33.Wherein, the structure of the 4th LED light source 50 can be identical as the structure of the second LED light source 20 in above-described embodiment, and the 4th absolutely
The structure of edge substrate 51 can be identical as the structure of the second insulated substrate 21 in above-described embodiment, and details are not described herein again.It is optional
Ground, the first LED light source 10 are red-light LED light source, and the second LED light source 20 is green light LED light source, and third LED light source 30 is blue light
LED light source, the 4th LED light source 30 are blue light LED light source.
It is understood that in some other embodiments, referring to Fig. 8, LED structure 200 further includes the 4th light source 50
With the 4th nonisulated substrate 52, the 4th LED light source 50 is set to the 4th nonisulated substrate 52, and the 4th nonisulated substrate 52 is set to third
Side 33.Wherein, the structure of the 4th LED light source 50 can be identical as the structure of the second LED light source 20 in above-described embodiment, the
The structure of four nonisulated substrates 52 can be identical as the structure of the first nonisulated substrate 11 in above-described embodiment, no longer superfluous herein
It states.Optionally, the first LED light source 10 is red-light LED light source, and the second LED light source 20 is blue light LED light source, third LED light source 30
For blue light LED light source, the 4th LED light source 30 is green light LED light source.
The present embodiment is by the way that the LED light sources of multiple and different colors is arranged in LED structure 200, and according to the spy of different light sources
Property using different substrate carry out patch, so that the LED structure 200 had not only been ensured heat dissipation effect but also facilitate the demand of installation.
Referring to Fig. 9, for a kind of optical projection system that another embodiment of the utility model provides, which includes
LED structure 100 or LED structure 200, dmd chip 300, projection lens 400 in above-described embodiment and lens group 500.At this
In embodiment, illustrated by taking LED structure 200 as an example.
In the present embodiment, lens group 500 is set between LED structure 200 and projection lens 400, and is located at dmd chip
In the normal direction of 300 receiving planes, LED structure 200, lens group 500 and projection lens 400 are of a straight line type arrangement so that projection
The compact in design of system 600 is reasonable.
Specifically, the receiving plane of dmd chip 300 is towards lens group 500 so that the illuminating bundle being emitted from lens group 500
It can be received by the receiving plane of dmd chip 300, meanwhile, the projected light beam that dmd chip 300 exports can also be incident to lens group
500。
In the present embodiment, lens group 500 is located at below the receiving plane of dmd chip 300, certainly, in some alternative realities
It applies in mode, lens group 500 may be located on receiving plane top, left side or right side of dmd chip 300 etc..
In the present embodiment, LED structure 200 is for generating white illumination beam.Wherein, first in LED structure 200
LED light source 10 is red light source, and the second LED light source 20 is green light source, and third LED light source 40 is blue-light source.Dmd chip
300 for exporting projected light beam, and projection lens 400 is then used to project the projected light beam into exterior display screen, realizes projection.
Lens group 500 is used to receive the illuminating bundle of the outgoing of LED structure 200, and carries out light path converting to illuminating bundle, so that described
Illuminating bundle is incident to dmd chip 300, and receives the projected light beam that dmd chip 300 is exported according to illuminating bundle, and right
Projected light beam is emitted to projection lens 400 after carrying out light path converting.
In the present embodiment, the specific working mode of optical projection system 600 is：LED structure 200 generates white illumination beam,
The illuminating bundle being emitted from LED structure 200 receives and carries out light path converting, the illuminating bundle after light path converting by lens group 500
It is emitted to dmd chip 300 from lens group 500, dmd chip 300 exports projected light beam and is incident to lens group 500, carries out light path
It converts, the projected light beam after light path converting is emitted to projection lens 400 from lens group 500, to form projection.
Optical projection system 600 in the present embodiment includes the LED structure for not only ensureing heat dissipation effect but also facilitating installation, be disclosure satisfy that
Not only ensure heat dissipation effect but also facilitate the demand of installation.
It should be noted that giving the preferable implementation of the utility model in the specification and its attached drawing of the utility model
Mode, still, the utility model can be realized by many different forms, however it is not limited to which this specification is described to be implemented
Mode, these embodiments are not as the additional limitation to the utility model content, the purpose of providing these embodiments is that making
It is more thorough and comprehensive to the understanding of the disclosure of the utility model.Also, above-mentioned each technical characteristic continues to be combined with each other, and is formed
The various embodiments not being enumerated above are accordingly to be regarded as the range of the utility model specification record；Further, to this field
For those of ordinary skill, it can be modified or changed according to the above description, and all these modifications and variations should all belong to
The protection domain of the appended claims for the utility model.
Claims (10)
1. a kind of LED structure, which is characterized in that including：
First nonisulated substrate；
First LED light source is set to the side of the described first nonisulated substrate；
The second insulated substrate；
Second LED light source is set to the side of the second insulated substrate；
Radiator, the other side of the first nonisulated substrate and the other side fitting of the second insulated substrate are installed in described
Radiator.
2. LED structure according to claim 1, which is characterized in that
The first nonisulated substrate includes first boss and first circuit board, and it is convex that the first circuit board is set to described first
Platform, the first boss fit in the radiator.
3. LED structure according to claim 1, which is characterized in that
The second insulated substrate includes second boss, second circuit board, thermally conductive insulating layer, aluminum substrate and anode insulating layer, institute
It states second circuit board and is set to the second boss, the side of the thermally conductive insulating layer is bonded with the second boss, the heat conduction
The other side of insulating layer is bonded with the side of the aluminum substrate, and the other side of the aluminum substrate is equipped with the anode insulating layer, institute
Anode insulating layer is stated to be bonded with the radiator.
4. LED structure according to claim 3, which is characterized in that the second boss is T-type boss.
5. LED structure according to claim 1, which is characterized in that
First LED light source is red-light LED light source, and second LED light source is green/blue LED light source.
6. LED structure according to claim 1, which is characterized in that the radiator includes first side and second side,
The first nonisulated substrate is set to the first side, and the second insulated substrate is set to the second side.
7. LED structure according to claim 1, which is characterized in that the LED structure further includes：Third insulating substrate and
Third LED light source；
The third LED light source is set to the side of the third insulating substrate, and the other side of the third insulating substrate fits in
The radiator.
8. LED structure according to claim 7, which is characterized in that the LED structure further includes：4th insulating substrate and
4th LED light source；
4th LED light source is set to the side of the 4th insulating substrate, and the other side of the 4th insulating substrate fits in
The radiator.
9. LED structure according to claim 7, which is characterized in that the LED structure further includes：4th nonisulated substrate
With the 4th LED light source；
4th LED light source is set to the side of the 4th nonisulated substrate, the other side patch of the 4th nonisulated substrate
Together in the radiator.
10. a kind of optical projection system, which is characterized in that including claim 1-9 any one of them LED structures.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820250684.4U CN207831017U (en) | 2018-02-10 | 2018-02-10 | A kind of LED structure and optical projection system |
| PCT/CN2019/070433 WO2019153989A1 (en) | 2018-02-10 | 2019-01-04 | Led structure and projection system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820250684.4U CN207831017U (en) | 2018-02-10 | 2018-02-10 | A kind of LED structure and optical projection system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207831017U true CN207831017U (en) | 2018-09-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820250684.4U Active CN207831017U (en) | 2018-02-10 | 2018-02-10 | A kind of LED structure and optical projection system |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN207831017U (en) |
| WO (1) | WO2019153989A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019153989A1 (en) * | 2018-02-10 | 2019-08-15 | 广景视睿科技（深圳）有限公司 | Led structure and projection system |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201606851U (en) * | 2009-12-21 | 2010-10-13 | 东莞华明灯具有限公司 | Heat dissipation device of lighting fixture |
| CN202101017U (en) * | 2011-06-03 | 2012-01-04 | 中山市隆源光电有限公司 | Light-emitting diode (LED) bulb |
| US9447957B2 (en) * | 2011-06-30 | 2016-09-20 | Seoul Semiconductor Co., Ltd. | LED lamp |
| KR101227527B1 (en) * | 2011-09-05 | 2013-01-31 | 엘지전자 주식회사 | Lighting apparatus |
| JP6145918B2 (en) * | 2013-02-13 | 2017-06-14 | パナソニックＩｐマネジメント株式会社 | Lighting device and lighting fixture using the same |
| CN207831017U (en) * | 2018-02-10 | 2018-09-07 | 广景视睿科技（深圳）有限公司 | A kind of LED structure and optical projection system |
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2018
- 2018-02-10 CN CN201820250684.4U patent/CN207831017U/en active Active
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019153989A1 (en) * | 2018-02-10 | 2019-08-15 | 广景视睿科技（深圳）有限公司 | Led structure and projection system |
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| Publication number | Publication date |
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| WO2019153989A1 (en) | 2019-08-15 |
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