CN207828430U - 电解铜箔电沉积装置以及电解铜箔制造装置 - Google Patents

电解铜箔电沉积装置以及电解铜箔制造装置 Download PDF

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Publication number
CN207828430U
CN207828430U CN201721869890.5U CN201721869890U CN207828430U CN 207828430 U CN207828430 U CN 207828430U CN 201721869890 U CN201721869890 U CN 201721869890U CN 207828430 U CN207828430 U CN 207828430U
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CN
China
Prior art keywords
grinding
copper foil
structural unit
negative pole
pole part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201721869890.5U
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English (en)
Chinese (zh)
Inventor
郑俊基
金相裕
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KCF Technologies Co Ltd
Original Assignee
LS Mtron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LS Mtron Ltd filed Critical LS Mtron Ltd
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Publication of CN207828430U publication Critical patent/CN207828430U/zh
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
    • B24B29/005—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents using brushes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/006—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the speed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/14—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the temperature during grinding
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Battery Electrode And Active Subsutance (AREA)
  • Electroplating Methods And Accessories (AREA)
CN201721869890.5U 2017-06-12 2017-12-27 电解铜箔电沉积装置以及电解铜箔制造装置 Active CN207828430U (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20-2017-0002958 2017-06-12
KR2020170002958U KR200495566Y1 (ko) 2017-06-12 2017-06-12 전해동박 전착장치 및 전해동박 제조장치

Publications (1)

Publication Number Publication Date
CN207828430U true CN207828430U (zh) 2018-09-07

Family

ID=63389946

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201721869890.5U Active CN207828430U (zh) 2017-06-12 2017-12-27 电解铜箔电沉积装置以及电解铜箔制造装置

Country Status (2)

Country Link
KR (1) KR200495566Y1 (ko)
CN (1) CN207828430U (ko)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2959993B2 (ja) * 1995-04-28 1999-10-06 アミテック株式会社 ホイール式研磨機
JPH10330984A (ja) * 1997-06-02 1998-12-15 Fukuda Metal Foil & Powder Co Ltd 電解銅箔の製造方法
JP2003266288A (ja) * 2002-03-15 2003-09-24 Seiko Instruments Inc 端面研磨装置および端面研磨方法
JP5492288B2 (ja) * 2011-08-30 2014-05-14 西工業株式会社 孔開き箔電解析出装置
KR101630979B1 (ko) * 2014-12-12 2016-06-16 주식회사 포스코 금속박판 제조장치

Also Published As

Publication number Publication date
KR200495566Y1 (ko) 2022-06-23
KR20180003575U (ko) 2018-12-20

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Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant
TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20180829

Address after: Gyeonggi Do, South Korea

Patentee after: KCF Technology Co., Ltd.

Address before: South Korea Gyeonggi Do Anyang

Patentee before: Ls Megtron Co.

CP03 Change of name, title or address
CP03 Change of name, title or address

Address after: Han Guoquanluobeidao

Patentee after: Sk Nashi Co.,Ltd.

Address before: Han Guojingjidao

Patentee before: KCF Technology Co.,Ltd.