CN207800642U - Back sticking type LED light - Google Patents

Back sticking type LED light Download PDF

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Publication number
CN207800642U
CN207800642U CN201820235715.9U CN201820235715U CN207800642U CN 207800642 U CN207800642 U CN 207800642U CN 201820235715 U CN201820235715 U CN 201820235715U CN 207800642 U CN207800642 U CN 207800642U
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China
Prior art keywords
pad
big
small
led light
pin
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Application number
CN201820235715.9U
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Chinese (zh)
Inventor
袁晖军
朱元良
黄峰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DONGGUAN AOGUANG OPTOELECTRONIC TECHNOLOGY Co Ltd
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DONGGUAN AOGUANG OPTOELECTRONIC TECHNOLOGY Co Ltd
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Priority to CN201820235715.9U priority Critical patent/CN207800642U/en
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Abstract

The utility model discloses a kind of back sticking type LED light, wherein the bottom surface of the lamp housing is recessed with downward opening Lamp cup, and the bottom of the Lamp cup is equipped with LED wafer, and LED wafer is respectively turned on and connect with above-mentioned small pad terminal and big pad terminal;The small pad terminal includes small pad interconnecting piece and small pad pin, big pad terminal includes big pad interconnecting piece and big pad pin, small pad interconnecting piece and big pad interconnecting piece are exposed independent from the bottom surface of Lamp cup, big pad pin and small pad pin horizontally outward extend from two middle side parts of lamp housing respectively, there is big pad solder face, the bottom surface of small pad pin to have small pad solder face for the bottom surface of big pad pin.By designing a kind of back sticking type LED light, the small pad solder face of small pad pin bottom surface and the big pad solder face of big pad pin bottom surface are welded on the back side of pcb board, to make LED light and other control elements be arranged at the back side of pcb board, keep its processing technology simpler, to reduce processing cost.

Description

Back sticking type LED light
Technical field
The utility model is related to LED light source module field technologies, refer in particular to a kind of back sticking type LED light.
Background technology
The small pad terminal 20' and big pad terminal 30' of traditional LED light are arranged at the bottom of lamp housing 10', to only It can be welded on the front of pcb board 81', as shown in figure:LED light and reflecting plate 82' are arranged on the front of pcb board 81', face Film 83' is arranged in the upper surface of reflecting plate 82' and covers the light source channel 821' of reflecting plate 82', and the back side of pcb board 81' is set It is equipped with other control element 84'.Such LED light and control element 84' need to process work in the two-sided just patch of pcb board 81' Skill is complicated, increases production cost, and the light extraction colloid 50' in LED light is thicker, the figure shown on facial mask 83' is uneven.
Utility model content
In view of this, the utility model is in view of the existing deficiencies of the prior art, main purpose is to provide a kind of back sticking type LED light only needs a face patch, it is multiple to efficiently solve existing processing technology by being arranged LED light at the back side of pcb board The non-uniform problem of figure that is miscellaneous, being shown on production cost height and facial mask.
To achieve the above object, the utility model is using following technical solution:
A kind of back sticking type LED light, includes lamp housing and the small pad terminal being set on lamp housing and big pad terminal, In, the bottom surface of the lamp housing is recessed with downward opening Lamp cup, and the bottom of the Lamp cup is equipped with LED wafer, LED wafer with it is above-mentioned small Pad terminal and big pad terminal are respectively turned on connection;The small pad terminal includes to be integrally formed the small pad interconnecting piece of connection With small pad pin, big pad terminal includes the big pad interconnecting piece for being integrally formed connection and big pad pin, and small pad connects Socket part and big pad interconnecting piece are exposed independent from the bottom surface of Lamp cup, and big pad pin and small pad pin are respectively from two middle side parts of lamp housing Horizontally outward extend, there is big pad solder face, the bottom surface of small pad pin to be welded with small pad for the bottom surface of big pad pin Junction.
As a preferred embodiment, it is recessed with triangular groove at the top of one end of the lamp housing, the triangular groove is close Big pad terminal.
As a preferred embodiment, light extraction colloid is filled in the Lamp cup, it is brilliant which covers above-mentioned LED Piece.
As a preferred embodiment, the LED wafer is located at big pad interconnecting piece bottom surface, and small pad terminal passes through bonding line It is electrically connected with the anode of LED wafer, big pad terminal is electrically connected by bonding line and the cathode of LED wafer.
As a preferred embodiment, the LED wafer is fixed on big pad interconnecting piece bottom surface by a conductive crystal-bonding adhesive, should Conductive crystal-bonding adhesive and the cathode of LED wafer bottom are electrically connected, and small pad terminal passes through the anode at the top of bonding line and LED wafer It is electrically connected.
As a preferred embodiment, it is logical to offer first for the junction between the small pad interconnecting piece and small pad pin Hole, the first through hole part are embedded in lamp housing, and another portion exposes to outside lamp housing.
As a preferred embodiment, it is logical to offer second for the junction between the big pad interconnecting piece and big pad pin Hole, the second through-hole part are embedded in lamp housing, and another portion exposes to outside lamp housing.
As a preferred embodiment, the outer end face of the big pad pin is convexly equipped with a protrusion.
As a preferred embodiment, the outer end face of the small pad pin is recessed with arc notch.
As a preferred embodiment, the LED wafer is light-emitting diodes tube body chip.
The utility model has clear advantage and advantageous effect compared with prior art, specifically, by above-mentioned technology Known to scheme:
Include lamp housing and the small pad terminal being set on lamp housing and big weldering by designing a kind of back sticking type LED light Disk terminal, the small pad terminal and big pad terminal are horizontally outward extended from two middle side parts of lamp housing respectively, small pad pin The small pad solder face of bottom surface and the big pad solder face of big pad pin bottom surface are welded on the back side of pcb board, to make LED light It is arranged at the back side of pcb board with other control elements, keeps its processing technology simpler, to reduce processing cost, and light extraction Colloid can be done more frivolous, and the figure shown on facial mask is more uniform.
More clearly to illustrate the structure feature and effect of the utility model, come below in conjunction with the accompanying drawings with specific embodiment pair The utility model is described in detail.
Description of the drawings
Fig. 1 is the scheme of installation of the LED light of the prior art;
Fig. 2 is the vertical view of the preferred embodiment of the utility model;
Fig. 3 be the utility model preferred embodiment in be double pad LED wafers perspective view;
Fig. 4 be the utility model preferred embodiment in be double pad LED wafers upward view;
Fig. 5 be the utility model preferred embodiment in be single pad LED wafer perspective view;
Fig. 6 be the utility model preferred embodiment in be single pad LED wafer upward view;
Fig. 7 is the scheme of installation of the preferred embodiment of the utility model.
Description of drawing identification:
10', lamp housing 20', small pad terminal
30', big pad terminal 50', light extraction colloid
81', pcb board 82', reflecting plate
821', light source channel 83', facial mask
84', control element
10, lamp housing 101, Lamp cup
102, triangular groove 20, small pad terminal
201, first through hole 202, arc notch
21, small pad interconnecting piece 22, small pad pin
23, small pad solder face 30, big pad terminal
301, the second through-hole 302, protrusion
31, big pad interconnecting piece 32, big pad pin
33, big pad solder face 40, LED wafer
50, light extraction colloid 60, bonding line
70, conductive crystal-bonding adhesive 81, pcb board
811, through-hole 82, reflecting plate
821, light source channel 83, facial mask
84, control element.
Specific implementation mode
It please refers to shown in Fig. 2 to Fig. 7, that show the concrete structures of the preferred embodiment of the utility model, include Lamp housing 10 and the small pad terminal 20 being set on lamp housing 10 and big pad terminal 30.
The bottom surface of the lamp housing 10 is recessed with downward opening Lamp cup 101, and the bottom of the Lamp cup 101 is equipped with LED wafer 40, LED wafer 40 is respectively turned on and connect with above-mentioned small pad terminal 20 and big pad terminal 30, and LED wafer 40 shines after energization, and one As 100nm to 1400nm, can also be the mixed light of multi-wavelength, in the present embodiment, LED wafer be light-emitting diodes tube body core Piece.Light extraction colloid 50 is provided in Lamp cup 101, which covers above-mentioned LED wafer 40, light extraction colloid 50 generally by The glue materials such as epoxies or silica type are constituted, and need to select specific glue material specification according to client's use environment.One end of lamp housing 10 Top is recessed with triangular groove 102, which makees close to big pad terminal 30, its mark of triangular groove 102 With convenient for identification positive and negative anodes.
The small pad terminal 20 includes the small pad interconnecting piece 21 for being integrally formed connection and small pad pin 22, the small weldering Disk interconnecting piece 21 exposes the bottom surface of above-mentioned Lamp cup 101, which horizontally outward extends from a middle side part of lamp housing 10 Go out, the bottom surface of small pad pin 22 has small pad solder face 23.Between above-mentioned small pad interconnecting piece 21 and small pad pin 22 Junction offer first through hole 201, which is embedded in lamp housing 10, and another portion exposes to lamp housing 10 Outside;The outer end face of small pad pin 22 is recessed with arc notch 202, and arc notch 202 plays mark action.
The big pad terminal 30 includes the big pad interconnecting piece 31 for being integrally formed connection and big pad pin 32, the big weldering Disk interconnecting piece 31 exposes the bottom surface of Lamp cup 101, which horizontally outward extends in the middle part of the other side of lamp housing 10, The bottom surface of big pad pin 32 has big pad solder face 33.Junction between big pad interconnecting piece 31 and big pad pin 32 The second through-hole 301 is offered, which is embedded in lamp housing 10, and another portion exposes to outside lamp housing 10;Big pad The outer end face of pin 32 is convexly equipped with a protrusion 302, and mark action is played in protrusion 302.
If double pad LED wafers 40(As shown in figure three and figure four), above-mentioned LED wafer 40 is located at big pad interconnecting piece 31 Bottom surface, small pad terminal 20 are electrically connected by the anode of bonding line 60 and LED wafer 40, and big pad terminal 30 passes through bonding line 60 are electrically connected with the cathode of LED wafer 40(It is anode and cathode which two pads, which are not fixed, needs to adjust according to client It is whole).
If single pad LED wafer 40(As shown in figure five and figure six), the LED wafer 40 passes through a conductive crystal-bonding adhesive 70 It is fixed on big 31 bottom surface of pad interconnecting piece, the conduction crystal-bonding adhesive 70 and the cathode of LED wafer 40 are electrically connected, small pad terminal 20 It is electrically connected by the anode of bonding line 60 and LED wafer 40(The polarity of positive and negative pad, by 40 top and bottom of LED wafer Polarity determines).
It is the scheme of installation of the utility model as shown in figure seven;Through there is through-hole 811, the LED light back of the body pastes pcb board 81 Formula is mounted on 81 back side of pcb board, and Lamp cup 101 is located in through-hole 811, and reflecting plate 82 is arranged on the front of pcb board 81, reflection Plate 82 has a light source channel 821, and 101 face light source channel 821 of above-mentioned Lamp cup, facial mask 83 is arranged in the upper surface of reflecting plate 82 And light source channel 821 is covered, the back side of pcb board 81 is provided with control element 84, and control element 84 is located at the both sides of LED light. It is more traditional that LED light is arranged in the front of pcb board 81(As shown in figure), by the way that LED light to be arranged to the back of the body in pcb board 81 Face, LED light and control element 84 are arranged in one side, keep its processing technology simpler, to reduce processing cost.
The design focal point of the utility model is:
Include lamp housing and the small pad terminal being set on lamp housing and big weldering by designing a kind of back sticking type LED light Disk terminal, the small pad terminal and big pad terminal are horizontally outward extended from two middle side parts of lamp housing respectively, small pad pin The small pad solder face of bottom surface and the big pad solder face of big pad pin bottom surface are welded on the back side of pcb board, to make LED light It is arranged at the back side of pcb board with other control elements, keeps its processing technology simpler, to reduce processing cost, and light extraction Colloid can be done more frivolous, and the figure shown on facial mask is more uniform.
The above descriptions are merely preferred embodiments of the present invention, not makees to the technical scope of the utility model Any restrictions, therefore any trickle amendment made by the above technical examples according to the technical essence of the present invention, equivalent change Change and modify, is still within the scope of the technical solutions of the present invention.

Claims (10)

1. a kind of back sticking type LED light includes lamp housing and the small pad terminal being set on lamp housing and big pad terminal, spy Sign is:The bottom surface of the lamp housing is recessed with downward opening Lamp cup, and the bottom of the Lamp cup is equipped with LED wafer, LED wafer with it is upper It states small pad terminal and big pad terminal is respectively turned on connection;The small pad terminal includes to be integrally formed the small pad company of connection Socket part and small pad pin, big pad terminal include the big pad interconnecting piece for being integrally formed connection and big pad pin, small weldering Disk interconnecting piece and big pad interconnecting piece are exposed independent from the bottom surface of Lamp cup, and big pad pin and small pad pin are respectively from the both sides of lamp housing Middle part is horizontally outward extended, and there is big pad solder face, the bottom surface of small pad pin to have small weldering for the bottom surface of big pad pin Disk welding surface.
2. back sticking type LED light according to claim 1, it is characterised in that:It is recessed with triangle at the top of one end of the lamp housing Connected in star, the triangular groove is close to big pad terminal.
3. back sticking type LED light according to claim 1, it is characterised in that:Light extraction colloid is filled in the Lamp cup, this goes out Optical cement body covers above-mentioned LED wafer.
4. back sticking type LED light according to claim 1, it is characterised in that:The LED wafer is located at big pad interconnecting piece bottom Face, small pad terminal are electrically connected by the anode of bonding line and LED wafer, and big pad terminal passes through bonding line and LED wafer Cathode be electrically connected.
5. back sticking type LED light according to claim 1, it is characterised in that:The LED wafer is set by a conductive crystal-bonding adhesive It sets in big pad interconnecting piece bottom surface, the conduction crystal-bonding adhesive and the cathode of LED wafer bottom are electrically connected, and small pad terminal passes through key Zygonema is electrically connected with the anode at the top of LED wafer.
6. back sticking type LED light according to claim 1, it is characterised in that:The small pad interconnecting piece and small pad pin Between junction offer first through hole, which is embedded in lamp housing, and another portion exposes to outside lamp housing.
7. back sticking type LED light according to claim 1, it is characterised in that:The big pad interconnecting piece and big pad pin Between junction offer the second through-hole, which is embedded in lamp housing, and another portion exposes to outside lamp housing.
8. back sticking type LED light according to claim 1, it is characterised in that:The outer end face of the big pad pin is convexly equipped with One protrusion.
9. back sticking type LED light according to claim 1, it is characterised in that:The outer end face of the small pad pin is recessed with Arc notch.
10. back sticking type LED light according to claim 1, it is characterised in that:The LED wafer is light-emitting diodes tube body Chip.
CN201820235715.9U 2018-02-09 2018-02-09 Back sticking type LED light Active CN207800642U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201820235715.9U CN207800642U (en) 2018-02-09 2018-02-09 Back sticking type LED light

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201820235715.9U CN207800642U (en) 2018-02-09 2018-02-09 Back sticking type LED light

Publications (1)

Publication Number Publication Date
CN207800642U true CN207800642U (en) 2018-08-31

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ID=63276375

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201820235715.9U Active CN207800642U (en) 2018-02-09 2018-02-09 Back sticking type LED light

Country Status (1)

Country Link
CN (1) CN207800642U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110017459A (en) * 2019-05-24 2019-07-16 上海钧正网络科技有限公司 Mounting structure, electronic product and the shared vehicle of a kind of LED light on pcb board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110017459A (en) * 2019-05-24 2019-07-16 上海钧正网络科技有限公司 Mounting structure, electronic product and the shared vehicle of a kind of LED light on pcb board

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Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant
PE01 Entry into force of the registration of the contract for pledge of patent right

Denomination of utility model: Back mounted LED lamp

Effective date of registration: 20200904

Granted publication date: 20180831

Pledgee: Dongguan branch of Bank of Dongguan Co.,Ltd.

Pledgor: Sunny Optical Electronic Science and Technology Co.,Ltd.

Registration number: Y2020980005715

PE01 Entry into force of the registration of the contract for pledge of patent right