CN207766454U - Mems microphone - Google Patents
Mems microphone Download PDFInfo
- Publication number
- CN207766454U CN207766454U CN201721850089.6U CN201721850089U CN207766454U CN 207766454 U CN207766454 U CN 207766454U CN 201721850089 U CN201721850089 U CN 201721850089U CN 207766454 U CN207766454 U CN 207766454U
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- CN
- China
- Prior art keywords
- mems
- pcb board
- chip
- mems microphone
- acoustic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000003292 glue Substances 0.000 claims abstract description 10
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 7
- 239000006071 cream Substances 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 4
- 239000002245 particle Substances 0.000 abstract description 7
- 239000000047 product Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 241000209140 Triticum Species 0.000 description 2
- 235000021307 Triticum Nutrition 0.000 description 2
- 235000013339 cereals Nutrition 0.000 description 2
- 239000013066 combination product Substances 0.000 description 2
- 229940127555 combination product Drugs 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Abstract
The utility model provides a kind of MEMS microphone, it include the encapsulating structure formed by shell and pcb board, wherein, it is internally provided with MEMS chip in encapsulating structure, MEMS chip is fixed on pcb board, and the acoustic aperture for making MEMS chip be connected to outside is provided on pcb board, wherein, position corresponding with acoustic aperture is provided with logical acoustic form part on pcb board, in the sticky glue of surface setting of logical acoustic form part.Using the utility model, it can solve the problem of that external foreign particles pollute MEMS microphone from entering in acoustic aperture inside MEMS.
Description
Technical field
The utility model is related to microphone techniques fields, and more specifically, being related to one kind can be in anti-external foreign matter enters
The MEMS microphone in portion.
Background technology
MEMS (Microelectromechanical Systems, MEMS) microphone is that a kind of micromechanics adds
The electric energy that work technology is made changes sound device, has the characteristics that small, good frequency response, noise are low.With electronic equipment
Compact, slimming development, MEMS microphone applied to more and more widely in these equipment.
Current MEMS microphone or the combination product with MEMS microphone function all there are one or multiple acoustic aperture.Its
In, acoustic aperture is directly naked to be exposed on the external in environment, foreign particles is easily accessible, and then pollute MEMS microphone, to influence product
Performance.
Therefore, to solve the above-mentioned problems, the utility model proposes a kind of new MEMS microphones.
Utility model content
In view of the above problems, the purpose of this utility model is to provide a kind of MEMS microphone, with the foreign matter outside solution
The problem of grain enters from acoustic aperture inside MEMS, pollution MEMS microphone.
MEMS microphone provided by the utility model includes the encapsulating structure formed by shell and pcb board, wherein sealing
Assembling structure is internally provided with MEMS chip, and MEMS chip is fixed on pcb board, be provided on pcb board make MEMS chip with
The acoustic aperture of outside connection, wherein
Position corresponding with acoustic aperture is provided with logical acoustic form part on pcb board, viscous in the surface setting of logical acoustic form part
Property glue.
Furthermore it is preferred that structure be that logical acoustic form part includes structure end face and is used to support the support column of structure end face.
Furthermore it is preferred that structure be that the diameter of structure end face is more than the diameter of acoustic aperture, and the height of support column is less than
The height of MEMS chip.
Furthermore it is preferred that structure be to be additionally provided with asic chip in the inside of encapsulating structure, asic chip is fixed on PCB
On plate.
Furthermore it is preferred that structure be that asic chip is electrically connected with MEMS chip, pcb board respectively by metal wire.
Furthermore it is preferred that structure be that MEMS chip, asic chip are fixed on by tin cream on pcb board.
Furthermore it is preferred that structure be that shell is fixed to each other with pcb board by conducting resinl or tin cream.
From technical solution above it is found that MEMS microphone provided by the utility model, by PCB corresponding with acoustic aperture
It is arranged on plate and leads to acoustic form part, and the sticky glue of setting on the surface of logical acoustic form part, for adheres to the foreign matter entered from acoustic aperture
Particle, to solve the problem of because influencing microphone property inside pollution MEMS microphone.
Description of the drawings
By reference to the following description in conjunction with the accompanying drawings and the contents of the claims, and with to the utility model more
Comprehensive understanding, other purposes and result of the utility model will be more clearly understood and understood.In the accompanying drawings：
Fig. 1 is the structural schematic diagram according to the MEMS microphone of the utility model embodiment；
Fig. 2 is the vertical view according to the structural member of the utility model embodiment；
Fig. 3 is the schematic cross-sectional view according to the structural member of the utility model embodiment.
Reference numeral therein includes：1, pcb board, 2, shell, 3, MEMS chip, 4, metal wire, 5, asic chip, 6, sound
Hole, 7, logical acoustic form part, 71, structure end face, the 72, first support column, the 73, second support column.
Identical label indicates similar or corresponding feature or function in all the appended drawings.
Specific implementation mode
Existing MEMS microphone for aforementioned proposition or the combination product with MEMS microphone function all there are one
Or multiple acoustic aperture；Acoustic aperture is directly naked to be exposed on the external in environment, is easily accessible foreign particles, and then pollute MEMS microphone, to
Properties of product are influenced, to solve the problems, such as this, the utility model provides a kind of novel MEMS microphone.
Specific embodiment of the utility model is described in detail below with reference to attached drawing.
In order to illustrate the structure of MEMS microphone provided by the utility model, Fig. 1 is shown to be implemented according to the utility model
The structure of the MEMS microphone of example.
As shown in Figure 1, MEMS microphone provided by the utility model, includes the encapsulation knot formed by shell 2 and pcb board 1
Structure.
Specifically, it is internally provided with MEMS chip 3 in encapsulating structure, MEMS chip 3 is fixed on pcb board 1, in PCB
The acoustic aperture 6 for making MEMS chip 3 be connected to outside is provided on plate 1, wherein position corresponding with acoustic aperture 6 is set on pcb board 1
It is equipped with logical acoustic form part 7, in the sticky glue of surface setting of logical acoustic form part 7, for adsorbing the foreign particles entered from acoustic aperture 6.
In order to illustrate the structure of further structural member, Fig. 2 shows overlooked according to the structural member of the utility model embodiment
Structure, Fig. 3 show the sectional structure of the structural member according to the utility model embodiment.
As Fig. 2 and Fig. 3 jointly shown in, logical acoustic form part is not influence MEMS microphone with the structural member of logical sound function
Acoustical behavior, logical acoustic form part includes structure end face 71 and is used to support the support column of structure end face, wherein support column is distinguished
For the first support column 72 and the second support column 73, the first support column 72 and the second support column 73 are used to support structure end face 71, and
And be coated with one layer of sticky glue on the surface of structural member, i.e.,：In the surface of mechanism end face 71 and the table of the first support column 72
Face, the second support column 73 surface be coated with one layer of sticky glue.
Wherein, the diameter of structure end face 71 is more than the diameter of acoustic aperture 6, when the diameter of structure end face is more than the diameter of acoustic aperture 6
Can covering completely by acoustic aperture, to avoid foreign from entering from acoustic aperture；And the height of support column is less than MEMS
The height of chip 3, that is, the height of the first support column 72 and the second support column 73 is far smaller than the height of MEMS chip 3, makes
It obtains logical acoustic form part 7 and is not readily accessible to MEMS chip 5, to influence the performance of MEMS microphone, in order to keep MMES microphones
Performance, setting lead to acoustic form part 7 when, the height of support column will be less than MEMS chip far away, to ensure MEMS wheats
The good performance of wind.
One layer of sticky glue is set on the surface of logical acoustic form part 7, sticky glue is for adhering to the foreign matter entered from acoustic aperture 6
Grain to promote protective capacities of the product to foreign particles, and then promotes MEMS wheats to avoid inside pollution MEMS microphone
The performance of the product of gram wind.
In the embodiments of the present invention, it is fixed to each other between shell 2 and pcb board 1, and be electrically connected, wherein shell
2 are fixed to each other with pcb board 1 by conducting resinl or tin cream etc..
In addition, in the embodiments of the present invention, MEMS chip 3, MEMS cores are additionally provided in the inside of encapsulating structure
Piece 3 is fixed on by tin cream on pcb board 1, wherein asic chip 5 by metal wire 4 respectively with MEMS chip 3 and pcb board 1
Electrical connection；Also, MEMS chip 3, asic chip 5 are fixed on by tin cream on pcb board 1.
By the above embodiment as can be seen that MEMS microphone provided by the utility model, by opposite with acoustic aperture
It answers to be arranged on pcb board and leads to acoustic form part, and the sticky glue of setting on the surface of logical acoustic form part, enter from acoustic aperture for adhering to
Foreign particles, to solve the problem of because influencing microphone property inside pollution MEMS microphone.
Described in an illustrative manner above with reference to attached drawing according to the utility model proposes MEMS microphone.But this
Field technology personnel should be appreciated that the MEMS microphone proposed for above-mentioned the utility model, can also not depart from this reality
With making various improvement on the basis of new content.Therefore, the scope of protection of the utility model should be by the attached claims
The content of book determines.
Claims (7)
1. a kind of MEMS microphone includes the encapsulating structure formed by shell and pcb board, wherein in the encapsulating structure
Portion is provided with MEMS chip, and the MEMS chip is fixed on the pcb board, and being provided on the pcb board makes the MEMS
The acoustic aperture that chip is connected to outside, which is characterized in that
Position corresponding with the acoustic aperture is provided with logical acoustic form part on the pcb board, in the table of the logical acoustic form part
Toughness glue is arranged in face.
2. MEMS microphone as described in claim 1, which is characterized in that
The logical acoustic form part includes structure end face and is used to support the support column of the structure end face.
3. MEMS microphone as claimed in claim 2, which is characterized in that
The diameter of the structure end face is more than the diameter of acoustic aperture, and the height of the support column is less than the height of the MEMS chip
Degree.
4. MEMS microphone as described in claim 1, which is characterized in that
It is additionally provided with asic chip in the inside of the encapsulating structure, the asic chip is fixed on the pcb board.
5. MEMS microphone as claimed in claim 4, which is characterized in that
The asic chip is electrically connected with the MEMS chip, the pcb board respectively by metal wire.
6. MEMS microphone as claimed in claim 4, which is characterized in that
The MEMS chip, the asic chip are fixed on by tin cream on the pcb board.
7. MEMS microphone as described in claim 1, which is characterized in that
The shell is fixed to each other with the pcb board by conducting resinl or tin cream.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721850089.6U CN207766454U (en) | 2017-12-26 | 2017-12-26 | Mems microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721850089.6U CN207766454U (en) | 2017-12-26 | 2017-12-26 | Mems microphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207766454U true CN207766454U (en) | 2018-08-24 |
Family
ID=63184907
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721850089.6U Active CN207766454U (en) | 2017-12-26 | 2017-12-26 | Mems microphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207766454U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111107480A (en) * | 2019-12-06 | 2020-05-05 | 青岛歌尔智能传感器有限公司 | SIP module mounting structure and method of microphone |
| CN112087693A (en) * | 2020-09-22 | 2020-12-15 | 歌尔科技有限公司 | MEMS microphone |
-
2017
- 2017-12-26 CN CN201721850089.6U patent/CN207766454U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111107480A (en) * | 2019-12-06 | 2020-05-05 | 青岛歌尔智能传感器有限公司 | SIP module mounting structure and method of microphone |
| CN112087693A (en) * | 2020-09-22 | 2020-12-15 | 歌尔科技有限公司 | MEMS microphone |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200617 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 266100 Qingdao, Laoshan District, North House Street investment service center room, Room 308, Shandong Patentee before: GOERTEK TECHNOLOGY Co.,Ltd. |
|
| TR01 | Transfer of patent right |