CN207692158U - A kind of high density interconnection pcb board - Google Patents
A kind of high density interconnection pcb board Download PDFInfo
- Publication number
- CN207692158U CN207692158U CN201820038823.7U CN201820038823U CN207692158U CN 207692158 U CN207692158 U CN 207692158U CN 201820038823 U CN201820038823 U CN 201820038823U CN 207692158 U CN207692158 U CN 207692158U
- Authority
- CN
- China
- Prior art keywords
- pcb board
- layer
- high density
- connection
- welding block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The utility model system provides a kind of high density interconnection pcb board, including the circuit board unit that n groups are stacked, and n is the integer more than or equal to 3, and circuit board unit includes insulating layer and line layer, and line layer is set to the surface of insulating layer；At least side of line layer is connected with protrusion connection structure, and protrusion connection structure includes m welding block, and m is the integer more than or equal to 1, and connection through-hole is equipped in welding block.The layer connectivity structure that the utility model setting is concentrated, and the structure is located at outside full page, the connection being conveniently adjusted between each layer, the condition reprocessed is provided for the conducting of pcb board layer, especially for the interconnection pcb board of density superelevation, the serious forgiveness of interlayer attended operation can be effectively improved, line reconditioning can be returned error, the scrappage of pcb board is reduced, in addition, non-adjacent interlayer connection may be implemented in pcb board.
Description
Technical field
The utility model is related to pcb boards, specifically disclose a kind of high density interconnection pcb board.
Background technology
PCB (Printed Circuit Board, i.e. printed circuit board) is at least attached there are one conductive pattern thereon, and cloth
There is hole slot to realize the interconnection between electronic component, the basis of almost all electronic products.It is, in general, that if
There is electronic component in some equipment, then they are integrated on the pcb board of different sizes.Electronic component is increasingly light
The mode of thinning, multifunction and Integration Design, pcb board generally use laminated multi-layer circuit realizes highdensity integrate.
For existing pcb board, the medium holes being connected with each other are formed in interlayer by way of drilling between each layer circuit,
Again by forming the electroplated layer conducted in medium holes, this interconnection procedure of processing is complicated, needs the copper that successively drilled, sunk
To realize the conducting between each layer, finished product pcb board, once finding interlayer connection error, just can not carry out during detection
Redjustment and modification can only be done and scrap processing.
Utility model content
Based on this, it is necessary to be directed to prior art problem, provide a kind of high density interconnection pcb board, the layer that concentration is arranged connects
Logical structure, and the structure is located at outside full page, the connection being conveniently adjusted between each layer, and the condition reprocessed is provided for the conducting of pcb board layer.
To solve prior art problem, the utility model discloses a kind of high density interconnection pcb board, including n groups are stacked
Circuit board unit, n is integer more than or equal to 3, and circuit board unit includes insulating layer and line layer, and line layer is set to insulation
The surface of layer；At least side of line layer is connected with protrusion connection structure, and protrusion connection structure includes m welding block, m for more than
Integer equal to 1, welding block is interior to be equipped with connection through-hole.
Further, the thickness of circuit board unit is 0.15~0.25mm.
Further, insulating layer is heat conduction silicone.
Further, the opposite both sides of line layer are equipped with protrusion connection structure.
Further, welding block is silver-colored welding block.
When installation, each connection through-hole is passed through using the conducting wire for having insulating materials to coat, and the both ends of conducting wire are respectively welded
In the structure that interlayer connection on the correspondence welding block of respective layer, can be managed concentratedly, it is conveniently adjusted, is coated with leading for insulating materials
Line can effectively prevent that short circuit occurs between the welding block that need not be connected to.
The beneficial effects of the utility model are：The utility model discloses a kind of high density interconnection pcb board, and the layer of concentration is arranged
Connectivity structure, and the structure is located at outside full page, the connection being conveniently adjusted between each layer, and the item reprocessed is provided for the conducting of pcb board layer
Part can effectively improve the serious forgiveness of interlayer attended operation especially for the interconnection pcb board of density superelevation, even if error
Line reconditioning can be returned, the scrappage of pcb board is reduced, in addition, non-adjacent interlayer connection may be implemented in pcb board.
Description of the drawings
Fig. 1 is the cross-sectional view of the utility model.
Fig. 2 is the overlooking structure diagram of the utility model.
Reference numeral is：Circuit board unit 10, line layer 12, protrusion connection structure 13, welding block 131, connects insulating layer 11
Connect hole 132.
Specific implementation mode
For that can further appreciate that the feature, technological means and the specific purposes reached, function of the utility model, below
The utility model is described in further detail with specific implementation mode in conjunction with attached drawing.
With reference to figure 1, Fig. 2.
The utility model embodiment discloses a kind of high density interconnection pcb board, including the circuit board unit that n groups are stacked
10, n be the integer more than or equal to 3, and circuit board unit 10 includes insulating layer 11 and line layer 12, and line layer 12 is usually copper wire
Road, line layer 12 are set to the surface of insulating layer 11；At least side of line layer 12 is connected with protrusion connection structure 13, and protrusion connects
Binding structure 13 includes m welding block 131, and m is the integer more than or equal to 1, and connection through-hole 132 is equipped in welding block 131.
When installation, each connection through-hole 132 is passed through using the conducting wire for having insulating materials to coat, and the both ends of conducting wire are welded respectively
It is connected on the correspondence welding block 131 of respective layer, the structure of interlayer connection can be managed concentratedly, be conveniently adjusted, be coated with insulation material
The conducting wire of material can effectively prevent that short circuit occurs between the welding block that need not be connected to 131.
The layer connectivity structure that the utility model setting is concentrated, and the structure is located at outside full page, is conveniently adjusted between each layer
Connection provides the condition reprocessed for the conducting of pcb board layer, especially for the interconnection pcb board of density superelevation, can effectively improve layer
Between attended operation serious forgiveness, even if error can return line reconditioning, the scrappage of pcb board is reduced, in addition, pcb board can be real
Existing non-adjacent interlayer connection.
To ensure the lightening design of the utility model pcb board, it is based on above-described embodiment, the thickness of circuit board unit 10 is
0.15~0.25mm can effectively ensure that pcb board meets lightening design, while can ensure integrally-built stability.
To improve the heat dissipation performance of the utility model pcb board, it is based on any of the above-described embodiment, insulating layer 11 is heat conductive silica gel
Layer, heat conductive silica gel are high-end heat conduction compounds, have remarkable cold-and-heat resistent alternation performance, ageing-resistant performance and electrical insulating property
Can, have good caking property, heat conductivility better than general resin most metals and nonmetallic materials.
To reduce the difficulty of modification interlayer connection, it is based on any of the above-described embodiment, the opposite both sides of line layer 12 are equipped with
Protrude connection structure 13.One circuit board unit 10 corresponds to two protrusion connection structures 13, can effectively reduce welding block 131 and set
The density set is easily modified interlayer connection to reduce the density of communication conductive wire；It can effectively ensure that enough welding simultaneously
Block 131 for realizing each interlayer difference circuit conducting.
To improve the electrical connection properties of welding block 131, it is based on any of the above-described embodiment, welding block 131 is silver-colored welding block, gold
The silver-colored resistance of category is low, perfect heat-dissipating can effectively improve interlayer connection in addition, the connection of metallic silver and scolding tin is more secured
Reliability.
Above-described embodiments merely represent several embodiments of the utility model, the description thereof is more specific and detailed,
But it should not be understood as limiting the scope of the patent of the utility model.It should be pointed out that for the common of this field
For technical staff, without departing from the concept of the premise utility, various modifications and improvements can be made, these all belong to
In the scope of protection of the utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.
Claims (5)
1. a kind of high density interconnects pcb board, which is characterized in that the circuit board unit (10) being stacked including n groups, n be more than
Integer equal to 3, the circuit board unit (10) include insulating layer (11) and line layer (12), and the line layer (12) is set to
The surface of the insulating layer (11)；At least side of the line layer (12) is connected with protrusion connection structure (13), the protrusion
Connection structure (13) includes m welding block (131), and m is the integer more than or equal to 1, and it is logical to be equipped with connection in the welding block (131)
Hole (132).
2. a kind of high density according to claim 1 interconnects pcb board, which is characterized in that the circuit board unit (10)
Thickness is 0.15~0.25mm.
3. a kind of high density according to claim 1 interconnects pcb board, which is characterized in that the insulating layer (11) is heat conduction
Layer of silica gel.
4. a kind of high density according to claim 1 interconnects pcb board, which is characterized in that the line layer (12) is opposite
Both sides are equipped with protrusion connection structure (13).
5. a kind of high density according to claim 1 interconnects pcb board, which is characterized in that the welding block (131) is silver soldering
Connect block.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820038823.7U CN207692158U (en) | 2018-01-08 | 2018-01-08 | A kind of high density interconnection pcb board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820038823.7U CN207692158U (en) | 2018-01-08 | 2018-01-08 | A kind of high density interconnection pcb board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207692158U true CN207692158U (en) | 2018-08-03 |
Family
ID=62991470
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820038823.7U Expired - Fee Related CN207692158U (en) | 2018-01-08 | 2018-01-08 | A kind of high density interconnection pcb board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207692158U (en) |
-
2018
- 2018-01-08 CN CN201820038823.7U patent/CN207692158U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180803 Termination date: 20210108 |