CN207691705U - A kind of MEMS travelling-wave types micro-motor structure - Google Patents

A kind of MEMS travelling-wave types micro-motor structure Download PDF

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Publication number
CN207691705U
CN207691705U CN201721606522.1U CN201721606522U CN207691705U CN 207691705 U CN207691705 U CN 207691705U CN 201721606522 U CN201721606522 U CN 201721606522U CN 207691705 U CN207691705 U CN 207691705U
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rotor
travelling
mems
drive device
stator
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杜亦佳
陈余
代刚
周泉丰
李小石
弓冬冬
颜薪瞩
杨婷婷
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Institute of Electronic Engineering of CAEP
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Institute of Electronic Engineering of CAEP
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Abstract

The utility model discloses a kind of MEMS travelling-wave types micro-motor structures, including rotor structure, stator travelling wave drive device structure and pre-fastening structure, the stator travelling wave drive device structure lower end is fixedly connected with the pre-fastening structure, the rotor structure includes rotor case and rotor, the rotor is pressed together with the stator travelling wave drive device close structure, and the rotor case is set in the outside of the rotor.It designs through the above structure, motor based on MEMS technology includes rotor structure, stator travelling wave drive device structure and pre-fastening structure, signal interconnection does not need bonding wire, so that the compacter size of device architecture is smaller, the utility model proposes motor configuration by bonding assembling can be completed, therefore few with assembly, facilitate the advantage of mass production.

Description

A kind of MEMS travelling-wave types micro-motor structure
Technical field
The utility model is related to micro-electromechanical system fields, more particularly to a kind of MEMS travelling-wave types micro-motor structure.
Background technology
MEMS (MEMS, Micro-Electro-Mechanical System), also referred to as mems System, micro-system, micromechanics etc. refer to size at several millimeters or even smaller high-tech device.MEMS is in microelectronics skill Grow up on the basis of art (semiconductor fabrication), it is micro- to have merged photoetching, burn into film, LIGA, silicon micromachined, non-silicon The high-tech electronic mechanical devices that the technologies such as processing and precision machinery processing make.
Piezo-electric motor be one kind using piezoelectric ceramics as exciting element, utilize piezoelectric ceramics inverse piezoelectric effect generate High-frequency machine Tool vibrates, and the mechanical oscillation of certain track are being generated in turn using piezoelectric ceramics as electric signal, stator is applied on sensitive material stator Drive the motor of rotor motion.The advantages that it is changeable with flexible design, fast response time, and positioning accuracy is high, no electromagnetic interference, In biologic medical, precision instrument, the fields such as aerospace and the product for civilian use are all applied.Ultrasonic motor generally comprises:Stator, As vibrating elements, vibration is generated;Rotor, rotor are contacted with stator extruding, vibrating elements vibration, and frictional force is generated on contact surface To drive rotor to rotate.
The motor volume that tradition machinery processing technology makes is big, is formed by multiple component assemblies, generally passes through trip bolt Realize that compression, friction and the rotation of rotor, the diameter of ring motor can not be applied to height generally all in several centimetres of range In the integrated environment of density, while it cannot achieve mass.In conclusion how to provide, a kind of part is few, assembles less, precision It is high, can the micromation motor of mass production become those skilled in the art's technical problem urgently to be resolved hurrily.
Utility model content
The purpose of this utility model is to provide a kind of MEMS travelling-wave types micro-motor structure, exists to solve the above-mentioned prior art The problem of, make the small of motor, part be few, assembly less, precision it is high and can mass production.
To achieve the above object, the utility model provides following scheme:The utility model provides a kind of MEMS traveling waves Type micro-motor structure, including rotor structure, stator travelling wave drive device structure and pre-fastening structure, the stator travelling wave drive device knot Structure lower end is fixedly connected with the pre-fastening structure, and the rotor structure includes rotor case and rotor, the rotor with it is described Stator travelling wave drive device close structure is pressed together, and the rotor case is set in the outside of the rotor.
Preferably, the rotor structure further includes transmission gear, the rotor case and the stator travelling wave drive device knot Together by low-temperature bonding material binds, the rotor is rotatably connected on by rotation axis on the rotor case structure, described Power gear is fixedly connected in the rotation axis of rotor, the transmission gear is rotatably connected on the rotor case, described dynamic Powershift gear is engaged with the transmission gear.
Preferably, the rotor case and the pre-fastening structure by low-temperature bonding material binds together with, described turn Son is rotatably connected on by rotation axis on the rotor case, and the rotation axis of the rotor stretches out the rotor case.
Preferably, the stator travelling wave drive device structure includes sequentially connected SOI substrate silicon layer, silicon oxide layer, SOI junction Structure silicon layer and PZT material layer, the PZT material layer is close to the position of the rotor, the SOI substrate silicon layer and the pretightning force Structure is fixedly connected;The stator travelling wave drive device structure further includes the TSV structure based on SOI, the TSV knots based on SOI Structure is bonded connection with the pre-fastening structure, and disc structure, the rotor are provided among the stator travelling wave drive device structure It is closely pressed together with the disc structure, the disc structure supports connection by folded beam.
Preferably, the pre-fastening structure include bottom plate, signal path TSV structure and apply pretightning force structure, it is described Signal path TSV structure is arranged on the bottom plate, and the signal path TSV structure connects with the TSV structure based on SOI It connects, the structure setting for applying pretightning force is on the bottom plate.
Preferably, the structure for applying pretightning force is cylinder, and the rotor is cylinder.
Preferably, the structure for applying pretightning force is silicon, is obtained by dry etching or wet etching.
Preferably, the structure for applying pretightning force is structure as a whole with the bottom plate.
The utility model achieves following technique effect compared with the existing technology:
The MEMS travelling-wave type micro-motor structures of the utility model, including rotor structure, stator travelling wave drive device structure and pre- Clamp force structure, the stator travelling wave drive device structure lower end are fixedly connected with the pre-fastening structure, and the rotor structure includes Rotor case and rotor, the rotor are pressed together with the stator travelling wave drive device close structure, the rotor case set It is located at the outside of the rotor.It designs through the above structure, the motor based on MEMS technology includes rotor structure, the drive of stator traveling wave Dynamic device structure and pre-fastening structure, signal interconnection do not need bonding wire so that and the compacter size of device architecture is smaller, this Assembling can be completed by bonding in the motor configuration that utility model proposes, therefore few with assembly, facilitates the excellent of mass production Gesture.
Description of the drawings
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment Needed in attached drawing be briefly described, it should be apparent that, the accompanying drawings in the following description is only the utility model Some embodiments for those of ordinary skill in the art without having to pay creative labor, can also basis These attached drawings obtain other attached drawings.
Fig. 1 is the overall structure diagram of the MEMS travelling-wave type micro-motor structures of the utility model;
Fig. 2 is a kind of structural schematic diagram of angle of the stator travelling wave drive device structure of the utility model;
Fig. 3 is the structural schematic diagram of another angle of the stator travelling wave drive device structure of the utility model;
Fig. 4 is a kind of structural schematic diagram of angle of the pre-fastening structure of the utility model;
Fig. 5 is the integrated morphology schematic diagram of the pre-fastening structure and stator travelling wave drive device structure of the utility model;
Fig. 6 is the overall structure signal of the another embodiment of the MEMS travelling-wave type micro-motor structures of the utility model Figure;
Wherein, 1 is rotor case, and 11 be rotation axis, and 12 be power gear, and 102 be conducting wire, and 13 be transmission gear, and 14 are Rotor, 2 be stator travelling wave drive device structure, and 21 be the TSV structure based on SOI, and 22 be silicon oxide layer, and 23 be PZT material layer, 24 It is soi structure silicon layer for SOI substrate silicon layer, 25,26 be folded beam, and 27 be disc structure, and 3 be low-temperature bonding material, and 4 be preload Power structure, 41 be bottom plate, and 42 be the structure for applying pretightning force, and 43 be signal path TSV structure.
Specific implementation mode
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work The every other embodiment obtained, shall fall within the protection scope of the present invention.
The purpose of this utility model is to provide a kind of MEMS travelling-wave types micro-motor structure, exists to solve the above-mentioned prior art The problem of, make the small of motor, part be few, assembly less, precision it is high and can mass production.
To keep the above objects, features, and advantages of the utility model more obvious and easy to understand, below in conjunction with the accompanying drawings and have Body embodiment is described in further detail the utility model.
Embodiment one
As shown in Figs. 1-5, the utility model provides a kind of MEMS travelling-wave types micro-motor structure, including rotor structure, fixed Sub-line wave activation configuration 2 and pre-fastening structure 4,2 lower end of stator travelling wave drive device structure are fixedly connected with pre-fastening structure 4, The rotor structure includes rotor case 1 and rotor 14, and rotor 14 is closely pressed together with stator travelling wave drive device structure 2, Rotor case 1 is set in the outside of rotor 14.
Wherein, the rotor structure further includes transmission gear 13, and the rotor case is logical with stator travelling wave drive device structure 2 It crosses low temperature bonding material 3 to be bonded together, rotor 14 is rotatably connected on by rotation axis 11 on rotor case 1, and rotor 14 turns Power gear 12 is fixedly connected on moving axis 11, transmission gear 13 is rotatably connected on rotor case 1, power gear 12 and transmission Gear 13 engages.The power transmission of motor is gone out by transmission gear 13.Low-temperature bonding material 3 is solder or organic Polymer.Bonding is by two panels surface cleaning, the homogeneity of atomically flating or heterogeneous semiconductor material through surface clean and activation Processing, binds directly under certain condition, makes the skill that bonding chip is integrally formed by Van der Waals force, molecular force even atomic force Art.
Specifically, stator travelling wave drive device structure 2 includes sequentially connected SOI substrate silicon layer 24, silicon oxide layer 22, SOI Structure silicon layer 25 and PZT material layer 23, PZT material layer 23 is close to the position of the rotor, SOI substrate silicon layer 24 and pretightning force knot Structure 4 is fixedly connected.Stator travelling wave drive device structure further includes the TSV structure 21 based on SOI, the TSV structure 21 based on SOI with it is pre- The bonding connection of clamp force structure 4.Disc structure 27 is provided among stator travelling wave drive device structure, hanging disc structure 27 passes through The support connection of folded beam 26.Plane is the plane of protrusion on disc structure 27, and when integrating assembly, the plane and rotor plane are close It compresses.
Further, pre-fastening structure 4 includes bottom plate 41, signal path TSV structure 43 and the structure 42 for applying pretightning force, Signal path TSV structure 43 is arranged on bottom plate 41, and signal path TSV structure 43 is connect with the TSV structure 21 based on SOI, is applied The structure 42 of pretightning force is added to be arranged on bottom plate 41.The structure 42 for applying pretightning force is cylinder, and rotor 14 is also cylinder.Institute It states and applies the structure of pretightning force as silicon, obtained by dry etching or wet etching.
In order to reduce number of parts, the structure 42 and bottom plate 41 for applying pretightning force are structure as a whole.
Wafer level or core are completed by low-temperature bonding material 3 between stator travelling wave drive device structure 2 and the rotor structure Chip level is bonded, and bonding temperature is less than 150 DEG C.Motor configuration after bonding, disc structure 27 and rotor 14 are tightly pressed against together, After PZT material layer 23 applies certain biasing, the vibration of disc structure 27 generates traveling wave elliptic motion to drive rotor 14 to transport Turn, other required applications are driven by transmission gear 13.
It designs through the above structure, the motor based on MEMS technology includes rotor structure, 2 and of stator travelling wave drive device structure Pre-fastening structure 4, signal interconnection does not need bonding wire so that the compacter size of device architecture is smaller, the utility model Assembling can be completed by bonding in the motor configuration of proposition, therefore few with assembly, facilitates the advantage of mass production.
Embodiment two
As shown in fig. 6, in another specific embodiment, rotor case 1 passes through low-temperature bonding material 3 with pre-fastening structure 4 It is bonded together, rotor 14 is rotatably connected on by rotation axis 11 on rotor case 1, and the rotation axis 11 of rotor 14 stretches out rotor case Body 1.SOI substrate silicon layer 24 is bonded on bottom plate 41, and signal path TSV structure 43 passes through conducting wire with the electrode on PZT material layer 102 welding.In the present embodiment, the wiring in stator travelling wave drive device structure 2 is different from embodiment one, and other parts are homogeneous Together.
Each embodiment is described by the way of progressive in this specification, the highlights of each of the examples are with other The difference of embodiment, just to refer each other for identical similar portion between each embodiment.For system disclosed in embodiment For, since it is corresponded to the methods disclosed in the examples, so description is fairly simple, related place is said referring to method part It is bright.
Specific case is applied in the utility model to be expounded the principles of the present invention and embodiment, it is above The explanation of embodiment is merely used to help understand the method and its core concept of the utility model;Meanwhile for the one of this field As technical staff, according to the utility model thought, there will be changes in the specific implementation manner and application range.To sum up Described, the content of the present specification should not be construed as a limitation of the present invention.

Claims (8)

1. a kind of MEMS travelling-wave types micro-motor structure, it is characterised in that:Including rotor structure, stator travelling wave drive device structure and pre- Clamp force structure, the stator travelling wave drive device structure lower end are fixedly connected with the pre-fastening structure, and the rotor structure includes Rotor case and rotor, the rotor are pressed together with the stator travelling wave drive device close structure, the rotor case set It is located at the outside of the rotor.
2. MEMS travelling-wave types micro-motor structure according to claim 1, it is characterised in that:The rotor structure further includes passing Moving gear, the rotor case and the stator travelling wave drive device structure by low-temperature bonding material binds together with, described turn Son is rotatably connected on by rotation axis on the rotor case, and power gear, institute are fixedly connected in the rotation axis of the rotor It states transmission gear to be rotatably connected on the rotor case, the power gear is engaged with the transmission gear.
3. MEMS travelling-wave types micro-motor structure according to claim 1, it is characterised in that:The rotor case with it is described pre- Together by low-temperature bonding material binds, the rotor is rotatably connected on the rotor case to clamp force structure by rotation axis On, the rotation axis of the rotor stretches out the rotor case.
4. MEMS travelling-wave types micro-motor structure according to claim 2 or 3, it is characterised in that:The stator travelling wave drive Device structure includes sequentially connected SOI substrate silicon layer, silicon oxide layer, soi structure silicon layer and PZT material layer, the PZT material layer Close to the position of the rotor, the SOI substrate silicon layer is fixedly connected with the pre-fastening structure;The stator travelling wave drive device Structure further includes the TSV structure based on SOI, described to be bonded connection with the pre-fastening structure based on the TSV structure of SOI, described It is provided with disc structure among stator travelling wave drive device structure, the rotor is closely pressed together with the disc structure, institute Disc structure is stated by folded beam to support connection.
5. MEMS travelling-wave types micro-motor structure according to claim 4, it is characterised in that:The pre-fastening structure includes bottom Plate, signal path TSV structure and the structure for applying pretightning force, the signal path TSV structure is arranged on the bottom plate, described Signal path TSV structure is connect with the TSV structure based on SOI, and the structure setting for applying pretightning force is in the bottom plate On.
6. MEMS travelling-wave types micro-motor structure according to claim 5, it is characterised in that:The structure for applying pretightning force For cylinder, the rotor is cylinder.
7. MEMS travelling-wave types micro-motor structure according to claim 5, it is characterised in that:The structure for applying pretightning force For silicon, obtained by dry etching or wet etching.
8. according to claim 6-7 any one of them MEMS travelling-wave type micro-motor structures, it is characterised in that:The application pre-tightens The structure of power is structure as a whole with the bottom plate.
CN201721606522.1U 2017-11-27 2017-11-27 A kind of MEMS travelling-wave types micro-motor structure Active CN207691705U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107947631A (en) * 2017-11-27 2018-04-20 中国工程物理研究院电子工程研究所 A kind of MEMS travelling-wave types micro-motor structure

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107947631A (en) * 2017-11-27 2018-04-20 中国工程物理研究院电子工程研究所 A kind of MEMS travelling-wave types micro-motor structure
CN107947631B (en) * 2017-11-27 2024-02-09 中国工程物理研究院电子工程研究所 MEMS traveling wave type micro-motor structure

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