CN107947631B - MEMS traveling wave type micro-motor structure - Google Patents
MEMS traveling wave type micro-motor structure Download PDFInfo
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- CN107947631B CN107947631B CN201711206727.5A CN201711206727A CN107947631B CN 107947631 B CN107947631 B CN 107947631B CN 201711206727 A CN201711206727 A CN 201711206727A CN 107947631 B CN107947631 B CN 107947631B
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- mems
- motor
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- 239000000463 material Substances 0.000 claims description 20
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 17
- 229910052710 silicon Inorganic materials 0.000 claims description 17
- 239000010703 silicon Substances 0.000 claims description 17
- 230000005540 biological transmission Effects 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 4
- 238000001312 dry etching Methods 0.000 claims description 3
- 238000001039 wet etching Methods 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 238000005459 micromachining Methods 0.000 description 2
- 230000036316 preload Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- -1 LIGA Substances 0.000 description 1
- 238000005411 Van der Waals force Methods 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N2/00—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction
- H02N2/10—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction producing rotary motion, e.g. rotary motors
- H02N2/16—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction producing rotary motion, e.g. rotary motors using travelling waves, i.e. Rayleigh surface waves
- H02N2/166—Motors with disc stator
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N2/00—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction
- H02N2/0005—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction producing non-specific motion; Details common to machines covered by H02N2/02 - H02N2/16
- H02N2/005—Mechanical details, e.g. housings
- H02N2/0055—Supports for driving or driven bodies; Means for pressing driving body against driven body
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N2/00—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction
- H02N2/10—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction producing rotary motion, e.g. rotary motors
- H02N2/12—Constructional details
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N2/00—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction
- H02N2/10—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction producing rotary motion, e.g. rotary motors
- H02N2/12—Constructional details
- H02N2/123—Mechanical transmission means, e.g. for gearing
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
Abstract
The invention discloses an MEMS traveling wave type micro motor structure which comprises a rotor structure, a stator traveling wave driver structure and a pretightening force structure, wherein the lower end of the stator traveling wave driver structure is fixedly connected with the pretightening force structure, the rotor structure comprises a rotor shell and a rotor, the rotor and the stator traveling wave driver structure are tightly pressed together, and the rotor shell is sleeved outside the rotor. Through the structural design, the motor based on the MEMS technology comprises a rotor structure, a stator traveling wave driver structure and a pretightening force structure, and the signal interconnection does not need bonding wires, so that the device structure is more compact and smaller in size.
Description
Technical Field
The invention relates to the technical field of micro-electromechanical systems, in particular to a MEMS traveling wave type micro-motor structure.
Background
Microelectromechanical systems (MEMS, micro-Electro-Mechanical System), also called microelectromechanical systems, microsystems, micromechanical etc., refer to high-tech devices with dimensions of a few millimeters or even smaller. Microelectromechanical systems have evolved based on microelectronic technology (semiconductor fabrication technology) and incorporate high-tech electromechanical devices fabricated by techniques such as photolithography, etching, thin film, LIGA, silicon micromachining, non-silicon micromachining, and precision machining.
The piezoelectric motor is a motor which uses piezoelectric ceramics as an exciting element, utilizes the inverse piezoelectric effect of the piezoelectric ceramics to generate high-frequency mechanical vibration, applies an electric signal to a stator which uses the piezoelectric ceramics as sensitive materials, and generates mechanical vibration with a certain track by the stator so as to drive a rotor to move. The device has the advantages of flexible and changeable design, high response speed, high positioning precision, no electromagnetic interference and the like, and is applied to the fields of biomedical treatment, precise instruments, aerospace, civil products and the like. An ultrasonic motor generally includes: a stator as a vibration element for generating vibration; the rotor is in extrusion contact with the stator, the vibrating element vibrates, and friction force is generated on the contact surface so as to drive the rotor to rotate.
The motor manufactured by the traditional machining process is large in size and is assembled by a plurality of parts, compression, friction and rotation of the stator and the rotor are generally realized through fastening screws, the diameter of the annular motor is generally in the range of a few centimeters, the annular motor cannot be applied to a high-density integrated environment, and meanwhile, the mass production cannot be realized. In view of the above, it is a technical problem to be solved by those skilled in the art to provide a miniaturized motor with few parts, less assembly, high precision and mass production.
Disclosure of Invention
The invention aims to provide a MEMS traveling wave type micro motor structure, which solves the problems of the prior art, and ensures that the motor has small volume, fewer parts, less assembly, high precision and mass production.
In order to achieve the above object, the present invention provides the following solutions: the invention provides an MEMS traveling wave type micro motor structure which comprises a rotor structure, a stator traveling wave driver structure and a pretightening force structure, wherein the lower end of the stator traveling wave driver structure is fixedly connected with the pretightening force structure, the rotor structure comprises a rotor shell and a rotor, the rotor and the stator traveling wave driver structure are tightly pressed together, and the rotor shell is sleeved outside the rotor.
Preferably, the rotor structure further comprises a transmission gear, the rotor shell and the stator traveling wave driver structure are bonded together through a low-temperature bonding material, the rotor is rotationally connected to the rotor shell through a rotating shaft, a power gear is fixedly connected to the rotating shaft of the rotor, the transmission gear is rotationally connected to the rotor shell, and the power gear is meshed with the transmission gear.
Preferably, the rotor housing and the pre-tightening structure are bonded together through a low-temperature bonding material, the rotor is rotationally connected to the rotor housing through a rotating shaft, and the rotating shaft of the rotor extends out of the rotor housing.
Preferably, the stator traveling wave driver structure comprises an SOI substrate silicon layer, a silicon oxide layer, an SOI structure silicon layer and a PZT material layer which are sequentially connected, wherein the PZT material layer is close to the position of the rotor, and the SOI substrate silicon layer is fixedly connected with the pretightening force structure; the stator traveling wave driver structure further comprises an SOI-based TSV structure, the SOI-based TSV structure is connected with the pretightening force structure in a bonding mode, a disc structure is arranged in the middle of the stator traveling wave driver structure, the rotor and the disc structure are tightly pressed together, and the disc structure is supported and connected through a folding beam.
Preferably, the pre-tightening structure comprises a bottom plate, a signal path TSV structure and a pre-tightening structure, wherein the signal path TSV structure is arranged on the bottom plate, the signal path TSV structure is connected with the SOI-based TSV structure, and the pre-tightening structure is arranged on the bottom plate.
Preferably, the structure for applying the pre-tightening force is cylindrical, and the rotor is cylindrical.
Preferably, the structure applying the pre-tightening force is silicon, and is obtained through dry etching or wet etching.
Preferably, the structure for applying the pre-tightening force and the bottom plate are integrated.
Compared with the prior art, the invention has the following technical effects:
the MEMS traveling wave type micro motor structure comprises a rotor structure, a stator traveling wave driver structure and a pre-tightening force structure, wherein the lower end of the stator traveling wave driver structure is fixedly connected with the pre-tightening force structure, the rotor structure comprises a rotor shell and a rotor, the rotor and the stator traveling wave driver structure are tightly pressed together, and the rotor shell is sleeved outside the rotor. Through the structural design, the motor based on the MEMS technology comprises a rotor structure, a stator traveling wave driver structure and a pretightening force structure, and the signal interconnection does not need bonding wires, so that the device structure is more compact and smaller in size.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions of the prior art, the drawings that are needed in the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of the overall structure of a MEMS traveling wave type micro-motor structure according to the present invention;
FIG. 2 is a schematic view of an angle configuration of the stator traveling wave driver configuration of the present invention;
FIG. 3 is a schematic view of another angular configuration of the stator traveling wave driver configuration of the present invention;
FIG. 4 is a schematic view of an angle of the pretension structure of the present invention;
FIG. 5 is a schematic diagram of an integrated configuration of the preload configuration and stator traveling wave driver configuration of the present invention;
FIG. 6 is a schematic overall structure of another embodiment of a MEMS traveling wave type micro-motor structure of the present invention;
wherein 1 is a rotor shell, 101 is a rotating shaft, 12 is a power gear, 102 is a wire, 13 is a transmission gear, 14 is a rotor, 2 is a stator traveling wave driver structure, 21 is a TSV structure based on SOI, 22 is a silicon oxide layer, 23 is a PZT material layer, 24 is a SOI substrate silicon layer, 25 is a SOI structure silicon layer, 26 is a folding beam, 27 is a disc structure, 3 is a low-temperature bonding material, 4 is a pre-tightening structure, 41 is a bottom plate, 42 is a structure for applying pre-tightening force, and 43 is a signal path TSV structure.
Description of the embodiments
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The invention aims to provide a MEMS traveling wave type micro motor structure, which solves the problems of the prior art, and ensures that the motor has small volume, fewer parts, less assembly, high precision and mass production.
In order that the above-recited objects, features and advantages of the present invention will become more readily apparent, a more particular description of the invention will be rendered by reference to the appended drawings and appended detailed description.
Examples
As shown in fig. 1-5, the invention provides a MEMS traveling wave type micro-motor structure, which comprises a rotor structure, a stator traveling wave driver structure 2 and a pre-tightening structure 4, wherein the lower end of the stator traveling wave driver structure 2 is fixedly connected with the pre-tightening structure 4, the rotor structure comprises a rotor shell 1 and a rotor 14, the rotor 14 and the stator traveling wave driver structure 2 are tightly pressed together, and the rotor shell 1 is sleeved outside the rotor 14.
The rotor structure further comprises a transmission gear 13, the rotor shell and the stator traveling wave driver structure 2 are bonded together through the low-temperature bonding material 3, the rotor 14 is rotationally connected to the rotor shell 1 through a rotating shaft 101, a power gear 12 is fixedly connected to the rotating shaft 101 of the rotor 14, the transmission gear 13 is rotationally connected to the rotor shell 1, and the power gear 12 is meshed with the transmission gear 13. The power of the motor is transmitted through the transmission gear 13. The low temperature bonding material 3 is a low temperature solder or an organic polymer. Bonding is a technology of directly bonding two pieces of homogeneous or heterogeneous semiconductor materials with clean surfaces and flat atomic levels through surface cleaning and activation treatment under certain conditions, and bonding wafers into a whole through Van der Waals force, molecular force and even atomic force.
Specifically, the stator traveling wave driver structure 2 comprises an SOI substrate silicon layer 24, a silicon oxide layer 22, an SOI structure silicon layer 25 and a PZT material layer 23 which are sequentially connected, wherein the PZT material layer 23 is close to the position of the rotor, and the SOI substrate silicon layer 24 is fixedly connected with the pretightening force structure 4. The stator traveling wave driver structure further comprises a SOI-based TSV structure 21, the SOI-based TSV structure 21 being bonded to the pretensioning structure 4. A disc structure 27 is arranged in the middle of the stator traveling wave driver structure, and the suspended disc structure 27 is connected through a folding beam 26 in a supporting way. The upper plane of the disc structure 27 is a convex plane, and the plane is tightly pressed with the rotor plane during the integrated assembly.
Further, the pre-tightening structure 4 includes a bottom plate 41, a signal path TSV structure 43, and a pre-tightening structure 42, the signal path TSV structure 43 is disposed on the bottom plate 41, the signal path TSV structure 43 is connected with the SOI-based TSV structure 21, and the pre-tightening structure 42 is disposed on the bottom plate 41. The pre-load applying structure 42 is cylindrical and the rotor 14 is also cylindrical. The structure for applying the pretightening force is silicon and is obtained through dry etching or wet etching.
In order to reduce the number of parts, the structure 42 for applying the pre-tightening force is formed integrally with the bottom plate 41.
And wafer-level or chip-level bonding is completed between the stator traveling wave driver structure 2 and the rotor structure through a low-temperature bonding material 3, wherein the bonding temperature is lower than 150 ℃. The bonded motor structure, the disc structure 27 and the rotor 14 are tightly pressed together, and after a certain bias is applied to the PZT material layer 23, the disc structure 27 vibrates to generate travelling wave elliptical motion so as to drive the rotor 14 to operate, and other needed applications are driven through the transmission gear 13.
Through the structural design, the motor based on the MEMS technology comprises a rotor structure, a stator traveling wave driver structure 2 and a pretightening force structure 4, and the signal interconnection does not need bonding wires, so that the device structure is more compact in size and smaller, and the motor structure provided by the invention can be assembled through bonding, so that the motor structure has the advantages of less assembly and convenience in mass production.
Examples
In another embodiment, as shown in fig. 6, the rotor housing 1 and the pretensioning structure 4 are bonded together by the low temperature bonding material 3, the rotor 14 is rotatably connected to the rotor housing 1 by the rotation shaft 101, and the rotation shaft 101 of the rotor 14 protrudes out of the rotor housing 1. The SOI substrate silicon layer 24 is bonded to the backplane 41 and the signal via TSV structures 43 are soldered to electrodes on the PZT material layer by wires 102. In this embodiment, the wiring on the stator traveling wave driver structure 2 is different from that in the first embodiment, and the other portions are the same.
In the present specification, each embodiment is described in a progressive manner, and each embodiment is mainly described in a different point from other embodiments, and identical and similar parts between the embodiments are all enough to refer to each other. For the system disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant points refer to the description of the method section.
The principles and embodiments of the present invention have been described in detail with reference to specific examples, which are provided to facilitate understanding of the method and core ideas of the present invention; also, it is within the scope of the present invention to be modified by those of ordinary skill in the art in light of the present teachings. In view of the foregoing, this description should not be construed as limiting the invention.
Claims (5)
1. A MEMS traveling wave type micro-motor structure, characterized in that: the traveling wave motor comprises a rotor structure, a stator traveling wave driver structure and a pre-tightening structure, wherein the lower end of the stator traveling wave driver structure is fixedly connected with the pre-tightening structure, the rotor structure comprises a rotor shell and a rotor, the rotor and the stator traveling wave driver structure are tightly compressed together, and the rotor shell is sleeved outside the rotor;
the rotor structure further comprises a transmission gear, the rotor shell and the stator traveling wave driver structure are bonded together through a low-temperature bonding material, the rotor is rotationally connected to the rotor shell through a rotating shaft, a power gear is fixedly connected to the rotating shaft of the rotor, the transmission gear is rotationally connected to the rotor shell, and the power gear is meshed with the transmission gear;
the stator traveling wave driver structure comprises an SOI substrate silicon layer, a silicon oxide layer, an SOI structure silicon layer and a PZT material layer which are sequentially connected, wherein the PZT material layer is close to the position of the rotor, and the SOI substrate silicon layer is fixedly connected with the pretightening force structure; the stator traveling wave driver structure further comprises an SOI-based TSV structure, the SOI-based TSV structure is connected with the pretightening force structure in a bonding mode, a disc structure is arranged in the middle of the stator traveling wave driver structure, the rotor and the disc structure are tightly pressed together, and the disc structure is supported and connected through a folding beam;
the pre-tightening structure comprises a bottom plate, a signal path TSV structure and a structure for applying pre-tightening force, wherein the signal path TSV structure is arranged on the bottom plate, the signal path TSV structure is connected with the SOI-based TSV structure, and the structure for applying pre-tightening force is arranged on the bottom plate.
2. The MEMS traveling wave type micro-motor structure according to claim 1, wherein: the rotor shell is bonded with the pretightening force structure through a low-temperature bonding material, the rotor is rotationally connected to the rotor shell through a rotating shaft, and the rotating shaft of the rotor extends out of the rotor shell.
3. The MEMS traveling wave type micro-motor structure according to claim 1, wherein: the structure for applying the pretightening force is cylindrical, and the rotor is cylindrical.
4. The MEMS traveling wave type micro-motor structure according to claim 1, wherein: the structure for applying the pretightening force is silicon and is obtained through dry etching or wet etching.
5. A MEMS traveling wave type micro-motor structure according to any one of claims 3-4, wherein: the structure for applying the pretightening force and the bottom plate are of an integrated structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711206727.5A CN107947631B (en) | 2017-11-27 | 2017-11-27 | MEMS traveling wave type micro-motor structure |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201711206727.5A CN107947631B (en) | 2017-11-27 | 2017-11-27 | MEMS traveling wave type micro-motor structure |
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| Publication Number | Publication Date |
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| CN107947631A CN107947631A (en) | 2018-04-20 |
| CN107947631B true CN107947631B (en) | 2024-02-09 |
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| CN201711206727.5A Active CN107947631B (en) | 2017-11-27 | 2017-11-27 | MEMS traveling wave type micro-motor structure |
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| CN111952433B (en) * | 2020-08-13 | 2023-04-18 | 中国工程物理研究院电子工程研究所 | Isolated pole structure of piezoelectric traveling wave micro-actuator |
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| CN107947631A (en) | 2018-04-20 |
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