CN207690775U - A kind of wafer automatic station-keeping system and the loading machine including it - Google Patents
A kind of wafer automatic station-keeping system and the loading machine including it Download PDFInfo
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- CN207690775U CN207690775U CN201820056531.6U CN201820056531U CN207690775U CN 207690775 U CN207690775 U CN 207690775U CN 201820056531 U CN201820056531 U CN 201820056531U CN 207690775 U CN207690775 U CN 207690775U
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- wafer
- automatic station
- keeping system
- adjustment platform
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Abstract
The utility model is related to a kind of wafer automatic station-keeping systems comprising several parts such as adjustment platform, vacuum generator, manipulator, driving device, laser ranging system, camera system, first controller.After wafer is tentatively in place, its telltale mark is captured in real time by the camera system being arranged right over it, picture is sent to the first controller, generate its floating coordinate (X, Y), the Z phase coordinates values of wafer upper surface are obtained further through laser ranging system, it is then compared with preset coordinate value in the first controller, sends out control signal.Driving device drives adjustment platform to carry out X, Y, Z axis direction movement according to above-mentioned control signal, the secondary adjustment of wafer position is carried out, to improve the positioning accuracy of wafer.
Description
Technical field
The utility model is related to wafer manufacturing field, more particularly to a kind of wafer automatic station-keeping system and the loading including it
Machine.
Background technology
During wafer level packaging, wafer placement typically is carried out by with suctorial manipulator, is made for a long time
With in the process, manipulator hand can be there is a situation where movement warp or mechanical oscillation etc. be inevitable, to reduce determining for wafer
Position precision.However, with advances in technology, the requirement to the precision of wafer is higher and higher, to load positioning accuracy to placing
Higher requirements are also raised, how to ensure positioning accuracy of the wafer in loading process, and it is field technology people to reduce error
Member's urgent problem to be solved.
Utility model content
Problem to be solved in the utility model be to provide it is a kind of it is simple in structure, positioning accuracy is high, the wafer of polyvinyl chloride
Automatic station-keeping system.
In order to solve the above-mentioned technical problem, the utility model is related to a kind of wafer automatic station-keeping systems comprising adjustment
Platform, for placing wafer；
It is provided with vacuum suction slot on the adjustment platform, and it is connected with vacuum generator；
Manipulator, for picking up wafer and putting it into adjustment platform；
Telltale mark is provided on wafer；
Driving device, for driving adjustment platform to carry out X, Y, Z axis direction movement；
Laser ranging system, for being detected in real time to the Z-direction size of wafer；
Camera system for absorbing crystal column surface and forming real-time pictures, and captures the telltale mark on wafer；
First controller, is connected with laser ranging system and camera system；First controller is caught according to camera system
The telltale mark grasped generates floating coordinate and plants, and is planted according to the floating coordinate and compared with preset coordinate plant, to send out
Signal is controlled to driving device.
After wafer is tentatively in place, its telltale mark is carried out in real time by the camera system being arranged right over it
It captures, picture is sent to the first controller, its floating coordinate (X, Y) is generated, is obtained on wafer further through laser ranging system
The Z phase coordinates values on surface, are then compared with preset coordinate value in the first controller, send out control signal.Driving device
It drives adjustment platform to carry out X, Y, Z axis direction movement according to above-mentioned control signal, the secondary adjustment of wafer position is carried out, to improve
The positioning accuracy of wafer.
Vacuum suction slot is annular concentric slot as a further improvement of the utility model, and is provided with down on its seamed edge
Angle.
When vacuum generator works, for wafer under the vacuum bothrium effect of concentric ring shape, absorption deformation is smaller.
In addition chamfering is also set up on the seamed edge of vacuum bothrium, so, is reduced since stress caused by local deformation is to wafer
Influence.
The wafer automatic station-keeping system further includes second controller as a further improvement of the utility model, and its with
Vacuum generator is connected.It is additionally provided with sensing device on adjustment platform, for identifying whether wafer is in place, and sends out phase
Induction signal is to second controller.
After the sensing device being arranged on adjusting platform detects that wafer is in place, second controller sends out control immediately
Signal processed adsorbs wafer by vacuum suction slot, is positioned to vacuum generator, to prevent adjustment platform in movement
Wafer is opposite in the process slides.
Sensing device includes RF transmitter and infrared receiver as a further improvement of the utility model,.
When wafer is not placed into adjustment platform, infrared receiver can receive infrared ray；And when wafer is placed
After in place, infrared ray is blocked to the propagation path of infrared receiver.The sensing device fast response time, it is simple in structure.
Camera system includes multiple Charged Couples being set to above wafer as a further improvement of the utility model,
Element imaging sensor.
The top different zones of wafer are provided with multiple charge coupled cell imaging sensors, so, each charge
Coupling element imaging sensor can carry out subregion scanning to wafer, substantially increase the speed of picture identification, furthermore charge
Coupling element imaging sensor itself also has high sensitivity, and noise is low, and dynamic range is big, fast response time, there is self-scanning work(
The characteristics of energy, pattern distortion is small, no image retention.
Driving device includes servo motor as a further improvement of the utility model,.
Driving device realizes the displacement of adjustment platform X, Y, Z axis by three groups of servo motors respectively, and control process is simple, phase
Answering property is good.
Driving device further includes ball-screw as a further improvement of the utility model,.
Driving device realizes the displacement of adjustment platform by three groups of ball-screws and servo motor cooperation respectively.Ball wire
Bar has corresponding speed fast, and transmission process is steady, accurate feature.
Manipulator includes vacuum absorption device as a further improvement of the utility model, passes through electricity with adjustment platform
Magnet valve is connected with vacuum generator.
After manipulator operates in program predeterminated position, solenoid valve by it is electric come and meanwhile realize vacuum absorption device to crystalline substance
Round loosening and adjust platform acts the absorption of wafer, to prevent adjustment platform wafer in moving process relatively sliding
It is dynamic.
Solenoid valve is reversal valve as a further improvement of the utility model,.
Loading machine, including rack further include being set in rack such as above-mentioned wafer automatic station-keeping system.
Description of the drawings
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is some embodiments of the utility model, for those of ordinary skill in the art, in the premise not made the creative labor
Under, other drawings may also be obtained based on these drawings.
Fig. 1 is the first embodiment structure schematic diagram of wafer automatic station-keeping system in the utility model.
Fig. 2 is second of embodiment structure schematic diagram of wafer automatic station-keeping system in the utility model.
Fig. 3 is the third embodiment structure schematic diagram of wafer automatic station-keeping system in the utility model.
Fig. 4 is the arrangement schematic diagram of wafer telltale mark in wafer automatic station-keeping system in the utility model.
1- adjusts platform；2- wafers；3- manipulators；4- vacuum generators；5- driving devices；6- laser ranging system；7-
Camera system；The first controllers of 8-；9- second controllers；10- RF transmitters；11- infrared receivers；12- commutates
Valve.
Specific implementation mode
With reference to specific embodiment, the content of the utility model is described in further detail：
Hereinafter the upper and lower of so-called "upper", "lower" and attached drawing itself is to consistent, but not to the structure of utility model
Play restriction effect.In order to reach the purpose of this utility model, wafer automatic station-keeping system in the utility model is shown in Fig. 1
The first embodiment structure schematic diagram.The wafer automatic station-keeping system include adjustment platform 1, vacuum generator 4, manipulator 3,
Several parts such as driving device 5, laser ranging system 6, camera system 7, the first controller 8, wherein being arranged on adjustment platform 1 useful
To adsorb the ring vaccum bothrium of wafer 2, and it is connected with vacuum generator 4.In order to realize that adjustment platform 1 carries out X, Y, Z axis
Direction is moved, and is additionally provided with driving device 5 thereunder, and the driving device 5 is real by 3 groups of servo motors and ball-screw respectively
Existing X, Y, Z axis direction movement.That completes wafer 2 by manipulator 3 captures process.Laser ranging system 6 and camera system 7
It is arranged at the surface of wafer 2, the Z-direction size that the two is respectively intended in real time to wafer 2 is detected and absorbs wafer
2 surfaces simultaneously form real-time pictures.Facilitate for the ease of camera system 7 and carry out picture identification, is additionally provided in the upper surface of wafer 2
Telltale mark.In order to further increase identification and the positioning accuracy of wafer 2, the quantity of telltale mark may be configured as it is multiple, preferably
Mode is circumferentially distributed along 2 outer rim of wafer.So, it after wafer 2 is tentatively in place, is taken the photograph by what is be arranged right over it
As system 7 in real time captures its telltale mark, picture is sent to the first controller 8, generate its floating coordinate (X,
Y), the Z phase coordinates values of 2 upper surface of wafer are obtained further through laser ranging system 6, then with preset seat in the first controller 8
Scale value is compared, and control signal is sent out.Driving device 5 drives adjustment platform 1 to carry out X, Y, Z axis according to above-mentioned control signal
Direction is moved, and the secondary adjustment in 2 position of wafer is carried out, to improve the positioning accuracy of wafer 2.In order to further increase picture
Recognition speed, above-mentioned camera system 7 use charge coupled cell imaging sensor, and with high sensitivity, noise is low, dynamic model
Enclose big, the characteristics of fast response time has self-scanning function, and pattern distortion is small, no image retention.In addition, different in the top of wafer 2
Region is provided with multiple charge coupled cell imaging sensors, and so, each charge coupled cell imaging sensor can be right
Wafer 2 carries out subregion scanning, to further improve the speed of picture identification.
Fig. 2 shows second of embodiment structure schematic diagram of wafer automatic station-keeping system in the utility model, with
Differing only in for wafer automatic station-keeping system in embodiment one, further includes second controller 9 and sensing device.Induction dress
It sets and is connected with vacuum generator 4 by second controller 9.Sensing device is arranged in the surface of wafer 2, for identifying wafer 2
Whether it is in place, and sends out corresponding signal to second controller 9.The sensing device includes RF transmitter 10 and infrared ray
Receiver 11, is separately positioned on the upper and lower of wafer 2, and is arranged oppositely.It is infrared when wafer 2 is not placed into adjustment platform 1
Line receiver 11 can receive infrared ray, and second controller 9 does not send out action command；When be arranged adjustment platform 1 on
After sensing device detects that wafer 2 is in place, infrared ray is blocked to the propagation path of infrared receiver 11, the second control
Device 9 processed sends out control signal to vacuum generator 4 immediately, is adsorbed, is positioned to wafer 2 by vacuum suction slot, to anti-
The opposite sliding of the wafer 2 in moving process of adjustment platform 1 is stopped.
Fig. 3 shows the third embodiment structure schematic diagram of wafer automatic station-keeping system in the utility model.Its with
Wafer automatic station-keeping system in embodiment one differs only in, and manipulator 3 passes through the vacuum absorption device that is arranged thereon
Complete capturing to wafer 2, and the vacuum absorption device and vacuum suction slot pass through a reversal valve 12 and 4 phase of vacuum generator
Even.The reversal valve 12 can be programmed control by PLC controller.After manipulator 3 operates in program predeterminated position, loosen
Wafer 2, reversal valve 12 obtain electric, absorption action of the realization adjustment platform 1 to wafer 2, to prevent adjustment platform by right side
The 1 opposite sliding of wafer 2 in moving process.
As advanced optimizing, Level-adjusting device is also set up in the lower section of adjustment platform 1, in addition, in adjustment platform 1
Upper surface be additionally provided with the electrolevel of detection level degree, and send out signal in real time, further include for receiving signal and right
It carries out the processing unit for handling and being compared with processing unit predetermined inclination angle, is sent out according to comparison, analysis result
Signal is controlled, which exchanges leveling platform 1 by control device and send out corresponding action command.
Fig. 4 shows the arrangement schematic diagram of wafer telltale mark in wafer automatic station-keeping system in the utility model.Along brilliant
Multiple laser telltale marks have been arranged in the outer rim on 2 surfaces of circle, have changed traditional notch mark pattern, so as to avoid
Stress concentration and defect situation occur caused by the introducing of notch label.In addition, for the ease of the first controller 8 to capturing
To picture carry out contraposition identification, each telltale mark is respectively set to different shapes.
Loading machine, including rack further include being set in rack such as above-mentioned wafer automatic station-keeping system.
The foregoing description of the disclosed embodiments enables professional and technical personnel in the field to realize or use this practicality new
Type.Various modifications to these embodiments will be apparent to those skilled in the art, and determine herein
The General Principle of justice can be realized in other embodiments without departing from the spirit or scope of the present utility model.Cause
This, the utility model is not intended to be limited to the embodiments shown herein, and is to fit to and principles disclosed herein
The widest range consistent with features of novelty.
Claims (10)
1. a kind of wafer automatic station-keeping system, which is characterized in that including：
Platform is adjusted, for placing wafer；
It is provided with vacuum suction slot on the adjustment platform, is connected with vacuum generator；
Manipulator, for picking up the wafer and putting it into the adjustment platform；
It is provided with telltale mark on the wafer；
Driving device, for driving the adjustment platform to carry out X, Y, Z axis direction movement；
Laser ranging system, for being detected in real time to the Z-direction size of the wafer；
Camera system for absorbing the crystal column surface and forming real-time pictures, and captures the telltale mark on wafer；
First controller is connected with the laser ranging system and the camera system, which is according to camera shooting
The telltale mark captured of uniting generates floating coordinate and plants, and is planted according to the floating coordinate and compared with preset coordinate plant, to
Control signal is sent out to the driving device.
2. wafer automatic station-keeping system according to claim 1, which is characterized in that the vacuum suction slot is annular concentric
Slot, and it is provided with chamfering on its seamed edge.
3. wafer automatic station-keeping system according to claim 1, which is characterized in that further include second controller, and its with
The vacuum generator is connected；It is additionally provided with sensing device on the adjustment platform, for identifying whether wafer is in place,
And corresponding signal is sent out to the second controller.
4. wafer automatic station-keeping system according to claim 3, which is characterized in that the sensing device includes infrared ray hair
Emitter and infrared receiver.
5. wafer automatic station-keeping system according to claim 1, which is characterized in that the camera system includes multiple settings
Charge coupled cell imaging sensor above the wafer.
6. wafer automatic station-keeping system according to claim 1, which is characterized in that the driving device includes servo electricity
Machine.
7. wafer automatic station-keeping system according to claim 6, which is characterized in that the driving device further includes ball wire
Thick stick.
8. wafer automatic station-keeping system according to claim 1, which is characterized in that the manipulator includes vacuum suction dress
It sets, is connected with the vacuum generator by solenoid valve with the adjustment platform.
9. wafer automatic station-keeping system according to claim 8, which is characterized in that the solenoid valve is reversal valve.
10. loading machine, including rack, which is characterized in that further include that wafer as described in claim any one of 1-9 is automatically fixed
Position system, is set in the rack.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820056531.6U CN207690775U (en) | 2018-01-12 | 2018-01-12 | A kind of wafer automatic station-keeping system and the loading machine including it |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820056531.6U CN207690775U (en) | 2018-01-12 | 2018-01-12 | A kind of wafer automatic station-keeping system and the loading machine including it |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207690775U true CN207690775U (en) | 2018-08-03 |
Family
ID=62991718
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| Application Number | Title | Priority Date | Filing Date |
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| CN201820056531.6U Active CN207690775U (en) | 2018-01-12 | 2018-01-12 | A kind of wafer automatic station-keeping system and the loading machine including it |
Country Status (1)
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| CN (1) | CN207690775U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108305848A (en) * | 2018-01-12 | 2018-07-20 | 昆山成功环保科技有限公司 | A kind of wafer automatic station-keeping system and the loading machine including it |
| CN111261565A (en) * | 2020-01-21 | 2020-06-09 | 北京北方华创微电子装备有限公司 | Semiconductor equipment, wafer transmission chamber thereof and wafer transmission method |
-
2018
- 2018-01-12 CN CN201820056531.6U patent/CN207690775U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108305848A (en) * | 2018-01-12 | 2018-07-20 | 昆山成功环保科技有限公司 | A kind of wafer automatic station-keeping system and the loading machine including it |
| CN111261565A (en) * | 2020-01-21 | 2020-06-09 | 北京北方华创微电子装备有限公司 | Semiconductor equipment, wafer transmission chamber thereof and wafer transmission method |
| CN111261565B (en) * | 2020-01-21 | 2023-11-14 | 北京北方华创微电子装备有限公司 | Semiconductor device, wafer transmission chamber thereof and wafer transmission method |
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Legal Events
| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Room 3, No. 248, Chenghu Road, Kunshan Development Zone, Suzhou City, Jiangsu Province 215300 Patentee after: Chenggong Environmental Protection Technology (Nantong) Co.,Ltd. Address before: Room 3, No. 248, Chenghu Road, Kunshan Development Zone, Suzhou City, Jiangsu Province 215300 Patentee before: KUNSHAN CHENGGONG ENVIRONMENTAL PROTECTION TECHNOLOGY CO.,LTD. |
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| CP01 | Change in the name or title of a patent holder | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20221124 Address after: No. 323, Jinchuan Road, Nantong Hi tech Industrial Development Zone, Nantong, Jiangsu 226399 Patentee after: Jiangsu Sizhi Semiconductor Technology Co.,Ltd. Address before: Room 3, No. 248, Chenghu Road, Kunshan Development Zone, Suzhou City, Jiangsu Province 215300 Patentee before: Chenggong Environmental Protection Technology (Nantong) Co.,Ltd. |
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| TR01 | Transfer of patent right |