CN112129770A - Cutting hole defect detection equipment, system and method - Google Patents
Cutting hole defect detection equipment, system and method Download PDFInfo
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- CN112129770A CN112129770A CN202011107631.5A CN202011107631A CN112129770A CN 112129770 A CN112129770 A CN 112129770A CN 202011107631 A CN202011107631 A CN 202011107631A CN 112129770 A CN112129770 A CN 112129770A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/89—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles
- G01N21/892—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles characterised by the flaw, defect or object feature examined
- G01N21/8921—Streaks
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/89—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles
- G01N21/8901—Optical details; Scanning details
Abstract
The embodiment of the invention discloses equipment, a system and a method for detecting defects of a cutting hole. One embodiment of the apparatus comprises: the device comprises a detection table, an image acquisition assembly and an adjusting assembly, wherein the image acquisition assembly and the adjusting assembly are positioned on the detection table; the adjusting assembly is used for adjusting the position of the cutting hole to be measured or the image acquisition assembly; the image acquisition assembly is used for acquiring a plurality of surface images of the cutting hole to be measured in the adjusting process of the adjusting assembly; the surface image comprises partial image information of the cutting hole to be detected and is used for determining the surface defect of the cutting hole to be detected. This embodiment mutually supports through image acquisition subassembly, adjusting part, realizes cutting the automatic detection in hole, and detection efficiency is high, detection standard is unified, has avoided the influence of human factor, in addition, obtains the image information in complete cutting hole through gathering a plurality of surface images, has improved the accuracy of testing result.
Description
Technical Field
The invention relates to the technical field of mobile phone camera detection, in particular to a device, a system and a method for detecting defects of a cutting hole.
Background
In the industrial production process, the defects of the produced products are inevitable, and the product defect detection is necessary for ensuring the quality of the products; the small round hole of the existing mobile phone camera is mainly cut by laser, cracks are inevitably generated when the small round hole of the camera is cut by the laser, the user experience is influenced in order to avoid that defective products flow into the market, and the camera round hole with the defects must be removed before entering the next process.
At present, the detection of a mobile phone camera hole mainly depends on manual detection, whether a small round hole cut by laser is qualified or not is observed under a microscope through a worker, but the manual detection has the defects that the detection efficiency is low, the detection standard cannot be unified (some people consider the small hole to be a good product and some people consider the small hole to be a defective product), and meanwhile, the influence of human factors cannot be avoided (misjudgment is easy to generate).
Disclosure of Invention
The invention aims to provide a device, a system and a method for detecting defects of a cutting hole, so as to solve at least one of the problems in the prior art.
In order to achieve the purpose, the invention adopts the following technical scheme:
the present invention in a first aspect provides a cut hole defect detection apparatus, comprising:
the device comprises a detection table, an image acquisition assembly and an adjusting assembly, wherein the image acquisition assembly and the adjusting assembly are positioned on the detection table;
the adjusting assembly is used for adjusting the position of the cutting hole to be measured or the image acquisition assembly;
the image acquisition assembly is used for acquiring a plurality of surface images of the cutting hole to be measured in the adjusting process of the adjusting assembly; the surface image comprises partial image information of the cutting hole to be detected and is used for determining the surface defect of the cutting hole to be detected.
In a possible implementation manner, the adjusting component is used for adjusting the position of the cutting hole to be measured to move in a circular track.
In one possible implementation, the adjusting assembly includes:
a first rail unit including a first driver and a first rail;
a second rail unit including a second driver and a second rail, the first rail and the second rail being perpendicular to each other in a horizontal plane; the first guide rail unit is integrally arranged on the second guide rail in a sliding manner;
the first driver is used for driving the detection plate to slide on the first guide rail;
the second driver is used for driving the first guide rail unit to slide on the second guide rail.
In a possible implementation manner, the adjusting assembly includes a circular guide rail and a third driver, and the third driver is configured to drive the cutting hole to be measured to slide on the circular guide rail.
In one possible implementation, the apparatus further comprises an encoder and a control component;
the encoder is used for sending displacement generated when the adjusting component adjusts the position of the cutting hole to be detected or the image acquisition component to the control component;
the control component is used for sending a control instruction to the adjusting component so as to enable the adjusting component to carry out the adjustment; and determining the relative position relationship between the cutting hole to be detected and the image acquisition assembly according to the displacement, and adjusting the control instruction based on the relative position relationship.
In a possible implementation manner, the device further comprises a hall sensor for feeding back a magnetic pole position signal of the adjusting component to the control component, and the control component is further used for determining an initial phase of the adjusting component according to the magnetic pole position signal.
In one possible implementation manner, a plurality of matched preset position pairs are preset on the first guide rail and the second guide rail, and each preset position pair comprises a first preset position on the first guide rail and a second preset position on the second guide rail; the control assembly is used for sending an acquisition instruction to the image acquisition assembly when the to-be-detected cutting hole moves to each preset position pair, so that the image acquisition assembly acquires the surface image.
In a possible implementation manner, a plurality of preset positions are preset on the circular guide rail; the control assembly is used for sending an acquisition instruction to the image acquisition assembly when the to-be-detected cutting hole moves to each preset position, so that the image acquisition assembly acquires the surface image.
The invention provides a cut hole defect detection system, which comprises an upper computer and cut hole defect detection equipment provided by the first aspect of the invention, wherein the upper computer is used for determining the surface defects of the cut hole to be detected according to the plurality of surface images from the image acquisition assembly.
The third aspect of the present invention provides a cut hole defect detection method based on the cut hole defect detection system provided by the second aspect of the present invention, including:
adjusting the position of a cutting hole to be measured or the image acquisition assembly;
acquiring a plurality of surface images of the cutting hole to be detected by using the image acquisition assembly in the adjusting process, wherein the surface images comprise partial image information of the cutting hole to be detected;
and determining the surface defects of the cutting hole to be measured according to the plurality of surface images.
The invention has the following beneficial effects:
according to the technical scheme, the automatic detection of the cutting hole is realized through the mutual matching of the image acquisition assembly and the adjusting assembly, the detection efficiency is high, the detection standards are unified, the influence of human factors is avoided, in addition, the image information of the complete cutting hole is obtained through the acquisition of a plurality of surface images, and the accuracy of the detection result is improved.
Drawings
The following describes embodiments of the present invention in further detail with reference to the accompanying drawings.
Fig. 1 is a schematic structural diagram of a defect detection apparatus provided in an embodiment of the present invention;
FIG. 2 is a schematic diagram of a defect detection system provided by an embodiment of the invention;
fig. 3 is a schematic diagram illustrating a defect detection method according to an embodiment of the present invention.
Reference numerals: 1. a shock-absorbing air bag; 2. a detection table; 3. an X-axis linear motor; 4. a Y-axis linear motor; 5. detecting a plate; 6. a product sensor; 7. mounting a bracket; 8. a first guide rail; 9. a second guide rail.
Detailed Description
In order to more clearly illustrate the present invention, the present invention will be further described with reference to the following examples and the accompanying drawings. Similar parts in the figures are denoted by the same reference numerals. It is to be understood by persons skilled in the art that the following detailed description is illustrative and not restrictive, and is not to be taken as limiting the scope of the invention.
At present, detection of a camera hole of a mobile phone mainly depends on manual detection, whether a small round hole cut by laser is qualified or not is observed under a microscope through a worker, but the manual detection has the defects that the detection efficiency is low, the detection standard cannot be unified (some people consider the small hole to be a good product and some people consider the small hole to be a defective product), and meanwhile, the influence of human factors cannot be avoided (misjudgment is easy to generate).
Based on this, as shown in fig. 1, one embodiment of the present invention provides a cut hole defect detecting apparatus, including: an inspection table 2, and an image acquisition assembly (the image acquisition assembly is located on a mounting bracket 7, not shown in fig. 1) and an adjustment assembly located on the inspection table 2; the adjusting assembly is used for adjusting the position of the cutting hole to be measured (the cutting hole to be measured is positioned above the product sensor 6 in fig. 1, and is not shown in fig. 1) or the position of the image acquisition assembly; the image acquisition assembly is used for acquiring a plurality of surface images of the cutting hole to be measured in the adjusting process of the adjusting assembly; the surface image comprises partial image information of the cutting hole to be detected and is used for determining the surface defect of the cutting hole to be detected.
Can understand, mutually support through image acquisition subassembly, adjusting part, realize cutting the automatic detection in hole, detection efficiency is high, detection standard is unified, has avoided the influence of human factor, in addition, obtains the image information in complete cutting hole through gathering a plurality of surface images, has improved the accuracy of testing result.
As can be known to those skilled in the art, the adjusting component adjusts the relative positions of the cutting hole to be measured and the image acquisition component by the following methods: in the first mode, the adjusting assembly can adjust the position of the cutting hole to be detected according to the received control instruction, at the moment, the cutting hole to be detected moves, and the image acquisition assembly does not move; in a second mode, the adjusting assembly can adjust the position of the image acquisition assembly according to the received control instruction, at the moment, the image acquisition assembly moves, and the cutting hole to be measured does not move; in a third mode, the adjusting assembly can adjust the positions of the cutting hole to be measured and the image acquisition assembly according to the received control instruction, and the cutting hole to be measured and the image acquisition assembly move simultaneously; it should be noted that no matter what adjustment is adopted, no matter what adjustment method is substantially influenced, and it is within the ability of those skilled in the art to select other configurations without inventive effort, without affecting the main idea of the present invention.
This embodiment adopts a first kind of regulation mode according to actual conditions, and this kind of regulation mode equipment structure is simple, and the motor as long as drive the cutting hole motion that awaits measuring can, require to reduce to the motor load, save the cost, require not high to the equipment, do not need great portal frame structure, the control degree of difficulty reduces, is favorable to improving the detection accuracy.
In some embodiments, the adjusting component is used for adjusting the position of the cutting hole to be measured to move in a circular track. Therefore, the complete image information of the cutting hole to be detected can be obtained conveniently by acquiring the plurality of surface images in the adjusting process, namely, the partial image information of the cutting hole to be detected, which is contained in each of the plurality of surface images, can form the complete image information of the cutting hole to be detected.
In some embodiments, the adjustment assembly comprises: a first rail unit including a first driver and a first rail 8; a second rail unit including a second driver and a second rail 9, the first rail 8 and the second rail 9 being perpendicular to each other in a horizontal plane; the first guide rail unit is integrally arranged on the second guide rail 9 in a sliding manner; the cutting hole to be detected is positioned on a detection plate 5;
a first driver for driving the detection plate 5 to slide on the first guide rail 8;
and the second driver is used for driving the first guide rail unit to slide on the second guide rail 9.
In a specific example, the first guide rail 8 and the second guide rail 9 are disposed in the horizontal X-axis direction and the horizontal Y-axis direction, respectively. The first driver and the second driver respectively comprise a servo driver and a linear motor, the cutting hole to be measured is driven by the first driver and the second driver together to move circularly along the horizontal plane, and the image acquisition assembly can acquire images on the surface of the cutting hole conveniently.
In some other embodiments, the adjusting assembly includes a circular guide rail and a third driver, and the third driver is used for driving the cutting hole to be cut to slide on the circular guide rail.
It will be appreciated that the slide is driven by the drive to move along the circular track, and it should be noted that the use of the combination of the first track 8 and the second track 9 or the circular track does not substantially affect the design of the slide, and it is within the ability of the person skilled in the art to select other configurations of tracks without inventive step, without affecting the concept of the invention.
In some embodiments, the apparatus further comprises an encoder and a control component; the encoder is used for sending displacement generated when the adjusting component adjusts the position of the cutting hole to be detected or the image acquisition component to the control component; the control component is used for sending a control instruction to the adjusting component so as to enable the adjusting component to carry out the adjustment; and determining the relative position relationship between the cutting hole to be detected and the image acquisition assembly according to the displacement, and adjusting the control instruction based on the relative position relationship.
The encoder feeds back displacement information generated in the adjusting process of the adjusting component to the control component, the control component compares the fed-back displacement information with received control parameters, and if the difference exists, the control component adjusts a control instruction to enable the actual displacement of the adjusting component to be carried out according to the received control parameters, so that the accuracy of a detection result is improved.
It should be noted that, the control assembly can receive the control parameter of host computer to according to control parameter, generate control instruction, control parameter includes: the coordinate position of cutting hole, cutting hole diameter and image acquisition quantity, control command includes: the preset motion track of the cutting hole to be detected and the preset position of the image acquired by the image acquisition assembly are determined; the control process of the invention is as follows: the host computer sends control parameters to the control assembly, and the control assembly receives the control parameters, generates control instructions, and transmits the control instructions to the adjusting assembly, and the adjusting assembly adjusts the position of the cutting hole to be detected according to the received control instructions, and the control process adopts the host computer to control the process, thereby being beneficial to realizing automatic control.
In some embodiments, the apparatus further comprises a hall sensor for feeding back a magnetic pole position signal of the adjustment assembly to the control assembly, the control assembly further for determining an initial phase of the adjustment assembly based on the magnetic pole position signal.
It should be noted that the motor used in the adjusting assembly is a non-absolute encoder, the non-absolute encoder cannot remember the phase deviation after power failure, phase searching operation is required during initial power-on, and the motor can make a sound and has a jitter phenomenon during phase searching.
In some embodiments, a plurality of matching predetermined position pairs are preset on the first guide rail 8 and the second guide rail 9, each predetermined position pair comprising a first predetermined position on the first guide rail 8 and a second predetermined position on the second guide rail 9; the control assembly is used for sending an acquisition instruction to the image acquisition assembly when the to-be-detected cutting hole moves to each preset position pair, so that the image acquisition assembly acquires the surface image.
In some other embodiments, a plurality of predetermined positions are preset on the circular guide rail; the control assembly is used for sending an acquisition instruction to the image acquisition assembly when the to-be-detected cutting hole moves to each preset position, so that the image acquisition assembly acquires the surface image.
Can understand, whether control assembly judges the cutting hole according to the positional information who receives and removes to preset position, when the cutting hole removed to preset position, control assembly sent the instruction of shooing to the image acquisition subassembly, the image acquisition subassembly includes camera integrated circuit board and camera, the signal of shooing that control assembly sent is received to the camera integrated circuit board, and will shoot signal transmission to the host computer and trigger the camera simultaneously and shoot, the host computer passes through the camera and gathers the cutting hole surface image that awaits measuring, receive the cutting hole surface image that awaits measuring through the host computer, improve the automation of image acquisition.
In a specific example, the control component comprises a PMAC controller, the PMAC controller can obtain the position information of the cutting hole through a motion state signal, and further enables an upper computer to combine the image position information with the received image information to obtain the complete image information of the cutting hole, in addition, because the PMAC controller does not have interface display per se, the corresponding platform control state needs to be fed back to the PC, and the state of the platform displayed on the PC mainly comprises (1) the manual/automatic state of the platform, (2) alarm information (linear motor alarm, product vacuum suction alarm and the like) of the platform, (3) feeding back the position information of an X/Y linear motor to the PC, and (4) the running state of the platform, because two products are detected simultaneously, and the camera holes of one mobile phone can be multiple, which mobile phone and what camera hole need to be detected by the PC in real time, different algorithms need to be called for judging different camera hole pictures PC.
The structure of the defect detection apparatus of the present embodiment is described below with reference to specific examples.
As shown in fig. 1, the defect detecting apparatus includes: the detection device comprises a damping air bag 1, a detection table 2, an X-axis linear motor 3, a Y-axis linear motor 4, a detection plate 5, a product inductor 6, a mounting support 7, a first guide rail 8, a second guide rail 9 and a sliding plate 10, wherein the damping air bag 1 is provided with four parts which are respectively positioned at four corners of the detection table 2, the detection table 2 is provided with the first guide rail 8 and the second guide rail 9, the first guide rail 8 is arranged along the horizontal X-axis direction, the second guide rail 9 is arranged along the horizontal Y-axis direction, the X-axis linear motor 3 can drive the detection plate 5 to move in the X-axis horizontal guide rail, the Y-axis linear motor 4 can drive the detection plate 5 to move in the Y-axis horizontal guide rail, the detection plate 5 is driven by the X-axis linear motor 3 and the Y-axis linear motor 4 together to move along a circular track, the product inductor 6 is arranged at the upper part of the detection plate 5, The camera card, the PMAC controller can be with host computer communication connection.
Can know from above-mentioned example, the defect detection equipment that this embodiment provided adopts the cutting hole motion that awaits measuring, camera rigid's regulation mode, this kind of regulation mode equipment simple structure, the motor as long as drive the cutting hole motion that awaits measuring can, require to reduce the motor load, save the cost, reduce the control degree of difficulty simultaneously, be favorable to improving the accuracy of testing result.
The invention further provides a cut hole defect detection system which comprises an upper computer and the defect detection equipment, wherein the upper computer is used for determining the surface defects of the cut hole to be detected according to the plurality of surface images from the image acquisition assembly.
The following describes a specific embodiment of the trap detection system according to the present invention with reference to the drawings.
As shown in fig. 2, specifically, the PC sends a motion trajectory parameter to the PMAC controller, the PMAC controller sends a corresponding pulse signal to the servo controller through program operation according to a trajectory motion control program written in advance and the motion parameter sent by the upper computer, the servo controller drives the linear motor to execute a corresponding action, and simultaneously, the linear motor encoder feeds back the current position state of the linear motor to the PMAC controller in real time, so as to ensure the motion precision of the linear motor; the PMAC sends a photographing signal to the camera board card at a corresponding position according to the value fed back by the encoder, the camera is controlled by the board card to photograph, the PC obtains a product picture photographed by the camera after obtaining the photographing signal of the board card to finish image acquisition, and the PC host computer analyzes the picture by utilizing a compiled image algorithm to judge whether the product is a good product.
Can know from above-mentioned embodiment, the defect detection system that this embodiment provided passes through PMAC controller, motor, camera and host computer and mutually supports, realizes cutting hole automated inspection, and detection efficiency is high, detection standard is unified, has avoided the influence of human factor, in addition, through gathering a plurality of surface images, obtains the image information of complete cutting hole, has improved the accuracy of testing result.
Another embodiment of the present invention provides a cut hole defect detection system method, including:
s1: adjusting the position of a cutting hole to be measured or the image acquisition assembly;
s2: acquiring a plurality of surface images of the cutting hole to be detected by using the image acquisition assembly in the adjusting process, wherein the surface images comprise partial image information of the cutting hole to be detected;
s3: and determining the surface defects of the cutting hole to be measured according to the plurality of surface images.
The following describes a specific process of the defect detection method after the mobile phone is placed on the detection plate 5 by taking the cutting hole of the shooting camera as an example:
(1) the user inputs the coordinate position (the center position of the camera round hole) of the detection plate 5 where the current camera cutting hole is located on the PC.
(2) The user inputs the diameter of a circle with the cut outline size of the camera and sets the number of images to be shot.
(3) A start command is issued to the PMAC controller at the PC interface.
(4) After receiving the starting signal, the PMAC controller calculates the motion track and the positions needing to start the camera to take pictures according to the coordinate position, the diameter and the image quantity parameters given by the PC, and sends a control signal to the servo controller.
(5) The detection board 5 executes corresponding track motion according to a pulse signal of the PMAC controller, when circular track positioning is executed, the camera is triggered to take a picture at a corresponding position, the whole process that the detection board 5 is positioned is not stopped (the mobile phone continuously moves, and signals are sent to the camera board card in the moving process to finish image acquisition), the camera flying shooting action is finished, and efficient operation of equipment is met.
(6) When the camera is triggered to take a picture, the PC receives a picture taking command through the camera board card, and the shot image of the camera cutting hole is collected in real time.
(7) After completing the track, the PC collects a corresponding number of images, and judges whether the camera hole is a good product or not according to a pre-developed image algorithm.
(8) And finishing the detection of the camera hole and taking out the product.
It can be understood that when the defect detection system is matched with the feeding machine and the blanking machine in the detection process, the processes (1), (3) and (8) in the detection method can be completed by the feeding machine and the blanking machine, and the efficiency is higher. Specifically, the appointed coordinate position can be placed to by last unloading in process (1), and the start signal of shooing is sent out after the blowing of process (3) material loading machine is accomplished, and process (8) is accomplished and is detected the back, and the PMAC controller informs the blanking machine to accomplish and get the material, and the blanking machine takes out the product and places different positions according to the PC result.
It should be noted that, on adopting material loading machine and unloader to do not need the manual work to place the platform with the cell-phone screen, the platform is whole can not change, and concrete cooperation process is as follows:
firstly, establishing communication between a PMAC and a feeding and discharging machine PLC in a Modbus TCP mode; when the PMAC platform is not loaded, the PMCA moves to a loading position and sends a loading signal to the loading machine; after the feeding machine receives a platform material requiring signal, the feeding machine is adjusted to a mobile phone camera placing position required by PMAC through a UVW platform (the feeding machine is provided with the UVW platform), and then a mobile phone screen is grabbed and placed on an X/Y platform through a feeding gripper; the feeding machine sends a discharging completion signal to the PMAC. Then the PMCA finishes the whole mobile phone photographing and drawing test process according to the set parameters of the PC; after the test is finished, the PMAC moves to a blanking position, sends out a blanking request and sends a test result to a blanking machine; and the blanking machine takes materials and carries out material distribution operation according to the test result.
The defect detection method provided by the invention can be known from the embodiment, the automatic detection of the cutting hole is realized through the mutual matching of the PMAC controller, the motor, the camera and the upper computer, the detection efficiency is high, the detection standard is unified, the influence of human factors is avoided, in addition, the image information of the complete cutting hole is obtained through collecting a plurality of surface images, and the accuracy of the detection result is improved.
The detection is performed by taking one camera cutting hole as an example, and when the cutting holes are multiple, the adjustment component can move to the next cutting hole for detection after the previous cutting hole is detected. The method is characterized in that a pre-alignment process is further included before the cutting hole detection, the central position of the cutting hole to be detected is determined by moving the product to be detected below the acquisition assembly, and then the product is returned to the position for detection operation. Of course, the pre-alignment operation can also be realized by a feeding and discharging machine, and is not limited specifically.
In the description of the present invention, it should be noted that the terms "upper", "lower", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, which are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and operate, and thus, should not be construed as limiting the present invention. Unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are intended to be inclusive and mean, for example, that they may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
It is further noted that, in the description of the present invention, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
It should be understood that the above-mentioned embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention, and it will be obvious to those skilled in the art that other variations and modifications can be made on the basis of the above description, and all embodiments cannot be exhaustive, and all obvious variations and modifications belonging to the technical scheme of the present invention are within the protection scope of the present invention.
Claims (10)
1. A cut hole defect detecting apparatus, comprising:
the device comprises a detection table, an image acquisition assembly and an adjusting assembly, wherein the image acquisition assembly and the adjusting assembly are positioned on the detection table;
the adjusting assembly is used for adjusting the position of the cutting hole to be measured or the image acquisition assembly;
the image acquisition assembly is used for acquiring a plurality of surface images of the cutting hole to be measured in the adjusting process of the adjusting assembly; the surface image comprises partial image information of the cutting hole to be detected and is used for determining the surface defect of the cutting hole to be detected.
2. The apparatus of claim 1, wherein the adjustment assembly is configured to adjust the position of the cutting hole to be measured to move in a circular trajectory.
3. The apparatus of claim 2, wherein the adjustment assembly comprises:
a first rail unit including a first driver and a first rail;
a second rail unit including a second driver and a second rail, the first rail and the second rail being perpendicular to each other in a horizontal plane; the first guide rail unit is integrally arranged on the second guide rail in a sliding manner;
the first driver is used for driving the detection plate to slide on the first guide rail;
the second driver is used for driving the first guide rail unit to slide on the second guide rail.
4. The apparatus of claim 2, wherein the adjustment assembly includes a circular guide and a third driver for driving the cutting hole to be cut to slide on the circular guide.
5. The apparatus of claim 3 or 4, further comprising an encoder and a control component;
the encoder is used for sending displacement generated when the adjusting component adjusts the position of the cutting hole to be detected or the image acquisition component to the control component;
the control component is used for sending a control instruction to the adjusting component so as to enable the adjusting component to carry out the adjustment; and determining the relative position relationship between the cutting hole to be detected and the image acquisition assembly according to the displacement, and adjusting the control instruction based on the relative position relationship.
6. The apparatus of claim 5, further comprising a hall sensor for feeding back a magnetic pole position signal of the adjustment assembly to the control assembly, the control assembly further configured to determine an initial phase of the adjustment assembly based on the magnetic pole position signal.
7. The apparatus of claim 5, wherein a plurality of matching pairs of predetermined locations are preset on the first rail and the second rail, each pair of predetermined locations comprising a first predetermined location on the first rail and a second predetermined location on the second rail; the control assembly is used for sending an acquisition instruction to the image acquisition assembly when the to-be-detected cutting hole moves to each preset position pair, so that the image acquisition assembly acquires the surface image.
8. The apparatus according to claim 5, characterized in that a plurality of predetermined positions are preset on the circular guide rail; the control assembly is used for sending an acquisition instruction to the image acquisition assembly when the to-be-detected cutting hole moves to each preset position, so that the image acquisition assembly acquires the surface image.
9. A cut hole defect detection system, characterized by comprising an upper computer and the device of any one of claims 1-8, wherein the upper computer is used for determining the surface defects of the cut hole to be detected according to the plurality of surface images from the image acquisition assembly.
10. A cut hole defect detection method based on the system of claim 9, comprising:
adjusting the position of a cutting hole to be measured or the image acquisition assembly;
acquiring a plurality of surface images of the cutting hole to be detected by using the image acquisition assembly in the adjusting process, wherein the surface images comprise partial image information of the cutting hole to be detected;
and determining the surface defects of the cutting hole to be measured according to the plurality of surface images.
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