CN111261565A - Semiconductor equipment, wafer transmission chamber thereof and wafer transmission method - Google Patents
Semiconductor equipment, wafer transmission chamber thereof and wafer transmission method Download PDFInfo
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- CN111261565A CN111261565A CN202010071454.3A CN202010071454A CN111261565A CN 111261565 A CN111261565 A CN 111261565A CN 202010071454 A CN202010071454 A CN 202010071454A CN 111261565 A CN111261565 A CN 111261565A
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- 238000000605 extraction Methods 0.000 claims abstract description 8
- 238000012546 transfer Methods 0.000 claims description 28
- 238000005086 pumping Methods 0.000 claims description 12
- 230000005693 optoelectronics Effects 0.000 claims description 2
- 238000013022 venting Methods 0.000 claims description 2
- 230000008569 process Effects 0.000 abstract description 7
- 235000012431 wafers Nutrition 0.000 description 166
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- 229910052786 argon Inorganic materials 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
Abstract
The invention discloses a semiconductor device, a wafer transmission chamber thereof and a wafer transmission method, wherein the wafer transmission chamber comprises an air extraction component, a cavity body and a wafer transmission device, wherein the air extraction component is used for extracting air from the cavity body; the mark detection assembly is positioned in the chamber body and used for detecting the alignment mark on the wafer; and the positioning and calibrating component is positioned in the chamber body and used for bearing the wafer, driving the wafer to rotate, and gradually stopping rotating after the mark detection component detects the alignment mark so as to stop the wafer at a preset position. The invention has the advantages that the alignment mark of the wafer is detected by the mark detection component in the process of vacuumizing the wafer transmission chamber, the positioning and calibration of the wafer are realized by the positioning and calibration component, the steps (wafer positioning and calibration and chamber vacuumizing) which are carried out step by step originally are combined and carried out simultaneously in one step, the transmission time of the wafer is shortened, and the use efficiency of the machine is improved.
Description
Technical Field
The invention relates to the field of semiconductor equipment, in particular to semiconductor equipment, a wafer transmission chamber and a wafer transmission method thereof.
Background
With the rapid development of microelectronic technology, the critical dimension of wafer processing is gradually reduced, and the complexity of wafer processing is continuously increased, so that the overall cycle of wafer processing is continuously prolonged. In order to obtain the wafer products required by the customers more quickly, how to effectively reduce the overall processing time of the wafers becomes a key for improving the wafer processing efficiency on the premise of not influencing the wafer processing technology. The total processing time of the wafer includes the process time of the wafer and the transfer time of the wafer. Therefore, the improvement of the wafer transmission time is very important for the improvement of the wafer processing efficiency. The plasma etcher is an important component in the wafer processing process, and the service efficiency of a machine table chamber is directly influenced by the transmission time of the wafer.
At present, a wafer transmission system mainly comprises an atmospheric transmission module, an atmospheric vacuum exchange module and a vacuum transmission module. The wafer needs to be subjected to position calibration through the position calibration device in the atmospheric end transmission process, then enters the atmospheric vacuum exchange module, and finally enters the vacuum end. The wafer stays in the atmosphere for a long time (position calibration is required), which greatly increases the overall transfer time of the wafer, and thus affects the transfer efficiency of the wafer.
Therefore, how to reduce the wafer transportation time on the machine is a major problem.
Disclosure of Invention
The invention aims to provide a semiconductor device, a wafer transmission chamber thereof and a wafer transmission method, which solve the problem of long transmission time of wafers in a transmission system.
In order to achieve the above object, the present invention provides a wafer transfer chamber in a semiconductor device, including a chamber body, further including:
a pumping assembly for pumping gas from the chamber body;
the mark detection assembly is positioned in the chamber body and used for detecting the alignment mark on the wafer;
and the positioning and calibrating component is positioned in the chamber body and used for bearing the wafer, driving the wafer to rotate, and gradually stopping rotating after the mark detection component detects the alignment mark so as to stop the wafer at a preset position.
Optionally, the wafer transfer chamber further comprises a wafer sensor in the chamber body for detecting whether a wafer is placed on the positioning and calibrating assembly.
Alternatively, the wafer sensor comprises an opto-electronic proximity switch or an ultrasonic proximity switch.
Alternatively, the alignment marks are indentations provided at the edge of the wafer.
Alternatively, the mark detection assembly comprises a laser emitter and a laser receiver which are oppositely arranged, wherein one of the laser emitter and the laser receiver is arranged on the top wall of the chamber body, and the other one of the laser emitter and the laser receiver is arranged on the bottom wall of the chamber body.
As an alternative, the positioning calibration assembly comprises: set up in rotatable support column on the cavity diapire, and with support column fixed connection follows a plurality of bracing pieces that support column circumference distributes, every the tip of bracing piece all is provided with the supporting pad.
Optionally, the wafer transfer chamber further comprises:
an air intake assembly for venting air into the chamber body;
a gas pressure sensor for detecting a gas pressure inside the chamber body.
The invention also provides semiconductor equipment comprising the wafer transmission chamber.
Alternatively, the semiconductor device further includes: a driver, a controller, wherein,
the driver is used for driving the positioning calibration assembly to rotate or stop;
the controller is used for controlling the air pumping assembly to pump air to the cavity when the positioning and calibrating assembly bears a wafer, and controlling the driver to drive the positioning and calibrating assembly to rotate so as to drive the wafer to rotate and control the mark detection assembly to detect an alignment mark of the wafer; when the alignment mark is detected by the mark detection component, determining the current position of the wafer as an initial position; based on the initial position, the driver is controlled to stop the positioning and calibrating assembly from rotating step by step, so that the wafer is stopped at a preset position.
The invention also provides a wafer transmission method, which is applied to the wafer transmission chamber and comprises the following steps:
placing a wafer on the positioning and calibrating component;
performing air extraction operation on the chamber body through the air extraction assembly, driving the wafer to rotate through the positioning calibration assembly, and detecting an alignment mark of the wafer through the mark detection assembly;
when the mark detection component detects the alignment mark, the positioning calibration component is gradually stopped rotating, and the wafer is stopped at a preset position.
The invention has the beneficial effects that:
the alignment mark of the wafer is detected through the mark detection component in the process of vacuumizing the wafer transmission chamber, the positioning and calibration of the wafer are realized through the positioning and calibration component, the steps (wafer positioning and calibration and chamber vacuumizing) which are carried out step by step originally are combined and carried out simultaneously in one step, the transmission time of the wafer is shortened, and the use efficiency of the machine table is improved.
The apparatus and methods of the present invention have other features and advantages which will be apparent from or are set forth in detail in the accompanying drawings and the following detailed description, which are incorporated herein, and which together serve to explain certain principles of the invention.
Drawings
The above and other objects, features and advantages of the present invention will become more apparent by describing in more detail exemplary embodiments thereof with reference to the attached drawings, in which like reference numerals generally represent like parts.
Fig. 1 is a schematic diagram of a wafer transfer chamber according to an embodiment of the invention.
FIG. 2 shows a schematic diagram of a positioning calibration assembly according to an embodiment of the invention.
Description of reference numerals:
100-a chamber body; 1-an air inlet pipeline; 2-a first control valve; 3-a second control valve; 4-gas outlet pipeline; 5-a gas pressure sensor; 6-support column; 61-a support bar; 62-a support pad; 7-a wafer sensor; 8-a laser emitter; 9-a wafer; 10-a laser receiver; 201-a motor; 202-a fixed part; 203-rotating part.
Detailed Description
The invention will be described in more detail below with reference to the accompanying drawings. While the preferred embodiments of the present invention are shown in the drawings, it should be understood that the present invention may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.
Referring to fig. 1, a wafer transfer chamber according to an embodiment of the present invention is shown in a schematic structural view, and the wafer transfer chamber includes a chamber body 100, and further includes:
a pumping assembly for pumping gas from the chamber body 100;
a mark detection assembly in the chamber body 100 for detecting an alignment mark on the wafer 9;
and a positioning calibration assembly located in the chamber body 100 and configured to carry the wafer 9, drive the wafer 9 to rotate, and gradually stop rotating after the mark detection assembly detects the alignment mark, so that the wafer 9 stops at a predetermined position.
Preferably, the chamber body 100 of the wafer transfer chamber may be a sealed chamber, and in this embodiment, the pumping assembly may include a gas outlet pipe 4 penetrating the bottom wall of the chamber, a second control valve 3 disposed on the gas outlet pipe 4, and a vacuum pump (not shown) connected to the gas outlet pipe 4, and the pumping assembly is configured to pump the chamber body 100 to a vacuum. In this embodiment, the second control valve 3 is an electromagnetic valve, and a gas pressure sensor 5 may be further disposed inside the chamber body 100 for measuring the atmospheric pressure inside the chamber body 100. In a preferred embodiment, the gas pressure sensor 5 may be a digital gas pressure sensor, which has the characteristics of small volume, high precision, fast response speed and no influence from temperature change.
The chamber body 100 is further provided with a mark detection assembly for detecting an alignment mark of a wafer. The alignment marks of the wafer are easily identifiable portions provided on the wafer 9. The mark detection component can identify the alignment mark of the wafer. In a preferred embodiment, the alignment mark of the wafer may be a notch disposed at the edge of the wafer 9, and the mark detection component may be the laser transmitter 8 and the laser receiver 10 disposed oppositely. One of the laser transmitter 8 and the laser receiver 10 is provided to the top wall of the chamber body 100, and the other is provided to the bottom wall of the chamber body 100. When the notch of the wafer 9 is located on the laser emitting path of the laser emitter 8, the laser emitted by the laser emitter 8 is received by the laser receiver 10, so as to detect the wafer alignment mark. In this embodiment, the notch is disposed at the edge of the wafer, but the notch is not limited to the wafer edge, and a through hole through which laser can pass may be disposed at another position of the wafer 9.
In another embodiment, when the alignment mark of the wafer is a notch formed on the edge of the wafer, the wafer mark detection component may be a profile scanner, and the profile scanner scans the outer profile of the wafer to find the notch formed on the edge of the wafer to detect the alignment mark of the wafer, and the profile scanner may be installed on the top wall of the chamber.
The wafer transmission chamber further comprises a positioning and calibrating component, which is used for bearing the wafer 9, driving the wafer 9 to rotate, and gradually stopping rotating after the mark detection component detects the alignment mark, so that the wafer 9 stops at a preset position.
Referring to fig. 2, in a preferred embodiment, the positioning calibration assembly may include: set up rotatable support column 6 on the chamber diapire to and with support column 6 fixed connection and along a plurality of bracing pieces 61 of support column 6 circumference distribution, the tip of every bracing piece 61 all is provided with supporting pad 62, and supporting pad 62 is used for bearing the wafer.
In this embodiment, the number of the supporting rods 61 is 3, and the 3 supporting rods 61 are uniformly distributed. In other embodiments, the number of support rods may be 4, 5, etc. The support pads 62 are located at the ends of the support bars 61, including a case where the support pads 62 on each support bar 61 are separated from each other; alternatively, the support pad 62 is a ring-shaped unit disposed at the edge of the plurality of support rods 61. The surface of the support pad 62 is relatively rough to provide sufficient friction to rotate the wafer 9.
In another embodiment, the positioning and alignment assembly may include a support column and a tray positioned above the support column, the wafer being placed above a surface of the tray.
Preferably, the wafer transfer chamber may further include a wafer sensor 7 in the chamber body 100 for detecting whether a wafer is placed on the alignment assembly. The wafer sensor 7 includes, but is not limited to, an electro-optical proximity switch or an ultrasonic proximity switch. In this embodiment, the wafer sensor 7 is disposed on the bottom wall of the chamber body 100, and if the wafer 9 is blocked from below by the detection positioning calibration assembly, the wafer sensor 7 may be disposed on the top wall or the side wall of the chamber body.
Preferably, the wafer transfer chamber may further include a gas inlet assembly for ventilating the chamber body 100. As an optional embodiment mode, the gas inlet assembly includes a gas inlet pipeline 1 penetrating through the top wall of the chamber, a first control valve 2 disposed on the gas inlet pipeline 1, and a gas source connected to the gas inlet pipeline 1, in this embodiment, the first control valve 2 is an electromagnetic valve, and the gas source is nitrogen gas, and in other embodiments, other gases that do not react with the wafer 9, such as inert gases like helium, argon, and the like, may also be introduced.
An embodiment of the present invention further provides a semiconductor device, including the wafer transfer chamber, further including: a driver, a controller, wherein,
the driver is used for driving the positioning calibration assembly to rotate or stop;
the controller is used for controlling the air exhaust assembly to perform air exhaust operation on the cavity when the positioning and calibrating assembly bears the wafer, and simultaneously controlling the driver to drive the positioning and calibrating assembly to rotate so as to drive the wafer to rotate and control the mark detection assembly to detect the alignment mark of the wafer; when the mark detection component detects the alignment mark, determining the current position of the wafer as an initial position; based on the initial position, the driver is controlled to gradually stop the rotation of the positioning and calibrating assembly so as to stop the wafer at a preset position.
With continued reference to fig. 1, in a preferred embodiment, the driver may include: a motor 201 located outside the wafer transfer chamber; the transmission component comprises a rotating part 203 and a fixing part 202, the fixing part 202 is annular and surrounds the rotating part 203, a through hole is formed in the bottom wall of the chamber body 100, and the rotating part 203 penetrates through the through hole to be connected with the positioning calibration assembly. The top end of the fixing portion 202 is hermetically connected to the bottom wall of the wafer transfer chamber. The transmission component is connected with the motor 201, and after the motor 201 is started, the fixed part 202 is kept still, and only the rotating part 203 rotates, so that the sealing performance of the wafer transmission chamber is ensured. The connection mode of the transmission component and the positioning calibration assembly comprises the following steps: the positioning calibration assembly and the transmission component are provided with parts embedded into each other, for example, the part of the transmission component connected with the positioning calibration assembly is of a hollow structure, one part of the positioning calibration assembly extends into the hollow structure, the outer surface of the part extending into the hollow structure is provided with a protrusion, and the hollow inner surface of the transmission component is provided with a groove matched with the protrusion. And the transmission component is clamped with the positioning and calibrating component to drive the positioning and calibrating component. In another embodiment, an intermediate connection is provided between the drive member and the support member, by means of which the drive member is fixedly connected to the support member.
The controller may include a plurality of control modules capable of controlling the pumping assembly, the driver, and the indicia detection assembly, respectively. Specifically, in this embodiment, the controller is provided with a signal receiving terminal capable of controlling the start and stop of the motor 201, and the mark detection assembly is provided with a signal emitting terminal. The step of stopping the wafer at a predetermined position in the present embodiment includes: the controller receives the detection signal transmitted by the mark detection component, and marks the wafer position corresponding to the mark detection component when detecting the wafer alignment mark as the initial position of the wafer. The controller determines the rotation angle of the wafer based on the initial position of the wafer and the designated position of the wafer (the designated position may be stored in the controller or sent by the upper computer), and controls the motor 201 to gradually stop the rotation of the positioning and calibrating assembly according to the rotation angle of the wafer, so as to finally stop the wafer at the designated position. If the designated position of the wafer is the initial position and rotates 30 degrees clockwise, the controller controls the motor 201 to start, the transmission component drives the positioning calibration component to rotate, after the initial position is determined, the motor 201 can be controlled based on a preset algorithm to gradually reduce the rotation speed of the positioning calibration component, so that the rotation speed of the wafer at the designated position is reduced to 0 right after the wafer rotates through a preset distance (or angle), and the wafer is stopped at the designated position. Well known algorithms may be employed herein, and are not repeated in this disclosure.
In the embodiment, the alignment mark of the wafer is detected by the mark detection component in the process of vacuumizing the wafer transmission chamber, the positioning and calibration of the wafer is realized by the positioning and calibration component, and the steps (wafer positioning and calibration and chamber vacuumizing) which are performed step by step originally are combined and performed simultaneously in one step, so that the transmission time of the wafer is shortened, and the use efficiency of the machine is improved.
An embodiment of the invention further provides a wafer transmission method, which is applied to the wafer transmission chamber. The method comprises the following steps:
s01: placing the wafer on the positioning and calibrating component;
s02: performing air extraction operation on the chamber body through the air extraction assembly, driving the wafer to rotate by the positioning and calibrating assembly, and detecting the alignment mark of the wafer through the mark detection assembly;
s03: when the mark detection component detects the alignment mark, the positioning calibration component is gradually stopped rotating, and the wafer is stopped at a preset position.
Specifically, when it is desired to transfer a wafer from the atmospheric side to the vacuum side, a robot or other transfer component places the wafer on the alignment assembly, the robot moves out of the chamber, and the chamber is sealed. The first valve 2 of the air inlet pipeline 1 is closed at the moment, the second valve 3 of the air outlet pipeline 4 is opened, one end of the air outlet pipeline 4 is connected with a vacuum pump, the vacuum pump is started, the vacuumizing operation of the cavity is started, the air pressure in the cavity is monitored at any time by the air pressure sensor 5, the wafer is driven to rotate by the positioning and calibrating assembly, the alignment mark of the wafer is detected by the mark detecting assembly, and the initial positioning of the wafer is completed. In the embodiment, the alignment mark of the wafer is a notch arranged on the edge of the wafer, and the mark detection component comprises a laser transmitter 8 and a laser receiver 9, and when the laser signal emitted by the laser transmitter 8 passes through the notch on the edge of the wafer and is received by the laser receiver 9, the initial positioning of the wafer is considered to be completed. After the initial positioning of the wafer is completed, the positioning and calibrating assembly gradually stops rotating by taking the initial positioning as a reference, so that the wafer stops at a preset position. And in the process of positioning and calibrating the wafer, the air exhaust assembly simultaneously performs air exhaust operation on the chamber.
In this embodiment, the positioning calibration assembly is driven by the driver, and the driver, the mark detection assembly and the air suction assembly are controlled by the controller. Referring to fig. 1, the driver includes: a motor 201 located outside the wafer transfer chamber; the transmission component comprises a rotating part 203 and a fixing part 202, the fixing part 202 is annular and surrounds the rotating part 203, a through hole is formed in the bottom wall of the chamber body 100, and the rotating part 203 penetrates through the through hole to be connected with the positioning calibration assembly. The top end of the fixing portion 202 is hermetically connected to the bottom wall of the wafer transfer chamber. The transmission component is connected with the motor, and after the motor 201 is started, the fixed part 202 is kept still, and only the rotating part 203 rotates, so that the sealing performance of the wafer transmission chamber is ensured. The connection mode of the transmission component and the positioning calibration assembly comprises the following steps: the positioning calibration assembly and the transmission component are provided with parts embedded into each other, for example, the part of the transmission component connected with the positioning calibration assembly is of a hollow structure, one part of the positioning calibration assembly extends into the hollow structure, the outer surface of the part extending into the hollow structure is provided with a protrusion, and the hollow inner surface of the transmission component is provided with a groove matched with the protrusion. And the transmission component is clamped with the positioning and calibrating component to drive the positioning and calibrating component. In another embodiment, an intermediate connection is provided between the drive member and the support member, by means of which the drive member is fixedly connected to the support member.
The controller includes a plurality of control modules capable of controlling the pump-down assembly, the driver, and the indicia detection assembly, respectively. Specifically, in this embodiment, the controller is provided with a signal receiving terminal capable of controlling the start and stop of the motor 201, and the mark detection assembly is provided with a signal emitting terminal. The step of stopping the wafer at a predetermined position in the present embodiment includes: the controller receives the detection signal transmitted by the mark detection component, and marks the wafer position corresponding to the mark detection component when detecting the wafer alignment mark as the initial position of the wafer. The controller determines the rotation angle of the wafer based on the initial position of the wafer and the designated position of the wafer (the designated position may be stored in the controller or sent by the upper computer), and controls the motor 201 to gradually stop the rotation of the positioning and calibrating assembly according to the rotation angle of the wafer, so as to finally stop the wafer at the designated position. If the designated position of the wafer is the initial position and rotates 30 degrees clockwise, the controller controls the motor 201 to start, the transmission component drives the positioning calibration component to rotate, after the initial position is determined, the motor 201 can be controlled based on a preset algorithm to gradually reduce the rotation speed of the positioning calibration component, so that the rotation speed of the wafer at the designated position is reduced to 0 right after the wafer rotates through a preset distance (or angle), and the wafer is stopped at the designated position. Well known algorithms may be employed herein, and are not repeated in this disclosure.
In the embodiment, the alignment mark of the wafer is detected by the mark detection component in the process of vacuumizing the wafer transmission chamber, the positioning and calibration of the wafer is realized by the positioning and calibration component, and the steps (wafer positioning and calibration and chamber vacuumizing) which are performed step by step originally are combined and performed simultaneously in one step, so that the transmission time of the wafer is shortened, and the use efficiency of the machine is improved.
The rotation and the vacuum pumping operation of the positioning and calibrating assembly are carried out simultaneously, and when the wafer rotates to the designated position and the pressure in the chamber reaches the set value, and the two conditions are met simultaneously, the wafer is taken out of the chamber by a mechanical arm or other transmission parts.
Having described embodiments of the present invention, the foregoing description is intended to be exemplary, not exhaustive, and not limited to the embodiments disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments.
Claims (10)
1. A wafer transmission chamber in semiconductor equipment comprises a chamber body, and is characterized by further comprising:
a pumping assembly for pumping gas from the chamber body;
the mark detection assembly is positioned in the chamber body and used for detecting the alignment mark on the wafer;
and the positioning and calibrating component is positioned in the chamber body and used for bearing the wafer, driving the wafer to rotate, and gradually stopping rotating after the mark detection component detects the alignment mark so as to stop the wafer at a preset position.
2. The wafer transfer chamber of claim 1, further comprising a wafer sensor in the chamber body for detecting whether a wafer is placed on the alignment assembly.
3. The wafer transfer chamber of claim 2, wherein the wafer sensor comprises an opto-electronic proximity switch or an ultrasonic proximity switch.
4. The wafer transfer chamber of claim 1, wherein the alignment mark is a notch disposed at an edge of the wafer.
5. The wafer transfer chamber of claim 4, wherein the mark detection assembly comprises a laser emitter and a laser receiver disposed opposite to each other, one of the laser emitter and the laser receiver being disposed on a top wall of the chamber body, and the other of the laser emitter and the laser receiver being disposed on a bottom wall of the chamber body.
6. The wafer transfer chamber of any of claims 1-5, wherein the positioning and alignment assembly comprises: set up in rotatable support column on the cavity diapire, and with support column fixed connection follows a plurality of bracing pieces that support column circumference distributes, every the tip of bracing piece all is provided with the supporting pad.
7. The wafer transfer chamber of any of claims 1-5, further comprising:
an air intake assembly for venting air into the chamber body;
a gas pressure sensor for detecting a gas pressure inside the chamber body.
8. A semiconductor device comprising the wafer transfer chamber of any of claims 1-7.
9. The semiconductor device according to claim 8, further comprising: a driver, a controller, wherein,
the driver is used for driving the positioning calibration assembly to rotate or stop;
the controller is used for controlling the air pumping assembly to pump air to the cavity when the positioning and calibrating assembly bears a wafer, and controlling the driver to drive the positioning and calibrating assembly to rotate so as to drive the wafer to rotate and control the mark detection assembly to detect an alignment mark of the wafer; when the alignment mark is detected by the mark detection component, determining the current position of the wafer as an initial position; based on the initial position, the driver is controlled to stop the positioning and calibrating assembly from rotating step by step, so that the wafer is stopped at a preset position.
10. A wafer transfer method applied to the wafer transfer chamber as claimed in any one of claims 1 to 7, wherein the method comprises:
placing a wafer on the positioning and calibrating component;
performing air extraction operation on the chamber body through the air extraction assembly, driving the wafer to rotate through the positioning calibration assembly, and detecting an alignment mark of the wafer through the mark detection assembly;
when the mark detection component detects the alignment mark, the positioning calibration component is gradually stopped rotating, and the wafer is stopped at a preset position.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112614799A (en) * | 2020-12-18 | 2021-04-06 | 上海广川科技有限公司 | Wafer transmission device and transmission method |
| CN112768393A (en) * | 2021-02-02 | 2021-05-07 | 沈阳芯源微电子设备股份有限公司 | Calibration device, alignment system and alignment method |
| CN114520176A (en) * | 2020-11-18 | 2022-05-20 | 长鑫存储技术有限公司 | Vacuum chamber and wafer machine |
| CN116721960A (en) * | 2023-08-11 | 2023-09-08 | 江苏鲁汶仪器股份有限公司 | Wafer position calibration method and device |
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| CN112614799A (en) * | 2020-12-18 | 2021-04-06 | 上海广川科技有限公司 | Wafer transmission device and transmission method |
| CN112614799B (en) * | 2020-12-18 | 2022-12-20 | 上海广川科技有限公司 | Wafer transmission device and transmission method |
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| CN116721960A (en) * | 2023-08-11 | 2023-09-08 | 江苏鲁汶仪器股份有限公司 | Wafer position calibration method and device |
| CN116721960B (en) * | 2023-08-11 | 2023-10-24 | 江苏鲁汶仪器股份有限公司 | Wafer position calibration method and device |
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