CN207642214U - A kind of target backboard rapid molding device - Google Patents
A kind of target backboard rapid molding device Download PDFInfo
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- CN207642214U CN207642214U CN201721572065.9U CN201721572065U CN207642214U CN 207642214 U CN207642214 U CN 207642214U CN 201721572065 U CN201721572065 U CN 201721572065U CN 207642214 U CN207642214 U CN 207642214U
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- backboard
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- outer toroid
- molding machine
- staking punch
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Abstract
The utility model is related to a kind of target backboard rapid molding devices, described device includes outer toroid and staking punch, and heating blank is placed in molding machine outer toroid, staking punch is pressed into blank surface using forging hammer, so that blank is full of molding machine, realizes target backboard rapid shaping.The utility model is suitable for aluminium alloy, copper and copper alloy backing plate processing can not only simplify process using rapid molding device, improve processing efficiency, promote yield rate, moreover it is possible to greatly reduce cost.
Description
Technical field
The utility model belongs to metal working technical area, and in particular to a kind of target backboard rapid molding device.
Background technology
High pure metal sputtering target material is sputter coating raw material important in Electronic products manufacturing.In general, sputtering target
Material is mainly made of the part such as target blankss, backboard, wherein target blankss are the target materials of high-speed ion line bombardment, belong to sputtering target
The core of material, during sputter coating, target blankss are dispersed out and deposited by after ionic bombardment, surface atom is sputtered
In electric thin is made on substrate；Since high purity metal is generally softer, and sputtering target material needs to be mounted in dedicated board
Sputtering process is completed, is high voltage, high vacuum environment inside board, therefore, backboard primarily serves the effect of fixed sputtering target material,
And need to have good conductive, heat conductivility.Target needs to bear back side cooling water simultaneously during magnetron sputtering plating
Pressure and positive negative pressure of vacuum, therefore target backboard is particularly important.Usual target backboard selects aluminium alloy, copper and the copper alloy back of the body
Plate has higher intensity mainly due to this kind of material, while heat conductivility is preferable, can meet the needs of semicon industry.
For 5500 sputtering machine tables of Endura, backboard is polymorphic structure, as shown in fig. 6, Conventional processing methods have three
Kind：The first is directly is processed using plank, and the defect of this method is that backboard raw material dosage is excessive, and more than turnery processing
Amount is too many, and backboard cost can increase substantially；Second is processed for electron beam welding, as depicted in figs. 1 and 2, is processed respectively
Bottom plate and annulus carry out solder bond to the two using electron beam welding, finished product backboard are formed using machining；The third is
Solder brazing is processed, as shown in figure 3, processing method and second species are seemingly, is processed bottom plate and annulus respectively, is welded using Ag base solder brazing
Material carries out solder bond to the two, and finished product backboard is formed using machining；Both methods can be significantly reduced former material
Expect dosage, but have the disadvantage that manufacturing procedure is extremely complex, bottom plate and annulus are needed by works such as multiple cold rolling heat treatment cuttings
Sequence is processed, and electron beam welding easily generates stomata and crackle, is susceptible to drainage during sputtering use, causes
Magnetron sputtering board is abnormal, and the solder brazing of Ag bases is higher to equipment requirement, equally exists weld crack and stomata problem.At present
5500 backboards of Endura are mainly used in Endura boards, and sputtering target material material includes Al, Cu, Ti, NiV, NiPt, Co, WTi
Deng, type is various, and demand is very big, using conventional machining mode production capacity can not fast lifting, the supply of material speed cannot meet client
Demand, urgent need seek more suitable processing method.
In view of the above problems, this patent is quasi- to reach the molding mesh of the nearly finished size of blank using the method that mold forges
, at the same have both raw material usage is small, manufacturing procedure is short, be integrally formed, pore-free crack problem many advantages, such as.Mold forges
Refer to that first METAL HEATING PROCESS is become liquid or the state of softening, then put it into mold, closed by the conjunction of the upper and lower mould of mold
Disposal molding, it is sometimes desirable to repeatedly.It is that the molten metal after heating is directly poured into mould to be to cast with the difference of casting
In type, and die forging also needs to close by the conjunction of upper and lower mould, extruding force is received during molding, so the tissue of forging part
It will be better than cast member with mechanical property.
The forging mold of this patent design is simple in structure, easily operated, design is light, is easily portable.
Utility model content
The utility model is different from existing target backboard processing method, provides a kind of target backboard rapid molding device,
The technical solution of the utility model is as follows：
A kind of target backboard rapid molding device, including 11 two parts of outer toroid 10 and staking punch, the blank of heating is set
In in molding machine outer toroid, staking punch is pressed by blank surface using forging hammer, blank is made to be full of molding machine, realizes the target back of the body
Plate rapid shaping；The outer toroid 10 is stepped annular structures, and staking punch 11 is frustum structure, for convenience of demoulding, at step
For oblique angle design.
The 10 thickness L1 of outer toroid is 45-47mm；Outer diameter D 1 is 500-600mm；Step circular diameter is respectively D3：
412-418mm、D2：335-340mm；Step height L2 is 18-20mm；Oblique angle A1 is identical as finished product backboard oblique angle；Oblique angle A2 is
95-100°；11 maximum dimension D 5 of staking punch is 302-308mm；Thickness L3 is 27-29mm；Oblique angle A3 is 92-95 °.
The molding machine material includes but not limited to 45# steel, 5CrMnMo steel alloys.
The blank includes aluminium alloy, copper and copper alloy backing plate blank.
Compared with existing method, the utility model has the advantages that：
The rapid shaping that target backboard is realized by outer toroid and staking punch, greatly improves processing efficiency；
By the rational design of molding machine size, obtain the blank of nearly finished size, reduce raw material usage, reduce at
This；
Target backboard is integrally formed, the defects of not will produce stomata, crackle, leak etc. will not be caused to use abnormal；
Molding machine has many advantages, such as that simple in structure, easily operated, design is light, is easily portable.
Description of the drawings
Fig. 1 is the utility model target backboard rapid molding device structural schematic diagram.
Fig. 2 is electro-beam welding process cooperation machining sketch chart.
Fig. 3 is electron beam welding schematic diagram.
Fig. 4 is brazing process cooperation machining sketch chart.
Fig. 5 is solder brazing schematic diagram.
Fig. 6 is target backboard forging schematic diagram.
Fig. 7 is target backboard after-swage dimension schematic diagram.
Fig. 8 is target backboard finished size schematic diagram.
Specific implementation mode
The utility model is further illustrated with reference to the accompanying drawings and examples.
Fig. 1 is the utility model target backboard rapid molding device structural schematic diagram.
10 be outer toroid, and 11 be staking punch, including 45# steel, 5CrMnMo steel alloys.
Fig. 2 is electro-beam welding process cooperation machining sketch chart, and 20 be outer toroid, and 21 be bottom plate.
Fig. 3 is electron beam welding schematic diagram, and 20 be outer toroid, and 21 be bottom plate, and 22 be electron beam weld region.
Fig. 4 is brazing process cooperation machining sketch chart, and 23 be outer toroid, and 24 be bottom plate.
Fig. 5 is solder brazing schematic diagram, and 23 be outer toroid, and 24 be bottom plate, and 25 be solder brazing region.
Fig. 6 is target backboard forging schematic diagram, and 10 be outer toroid, and 11 be staking punch, and 30 be backboard blank, including aluminium conjunction
Gold, copper and copper alloy；
Fig. 7 is schematic shapes after the forging of target backboard.
Fig. 8 is target backboard finished size schematic diagram.
Embodiment 1
Endura anaerobic copper backboard blank specifications are 180 × 160mm of φ, cutting stock weight 36.2kg, and heating temperature is
700-980 DEG C, soaking time 1-3h, hot forging is carried out in 3T pneumatic hammers using molding machine after coming out of the stove, blank is made to fill completely
Full mold, carries out water cooling to backboard blank later.
It requires to be processed according to drawing size, as shown in figure 8, finished weight is about 20kg.
Stock utilization is：20kg/36.2kg × 100%=55.2%.
Embodiment 2
6061 aluminum alloy back plate blank specifications of Endura are 180 × 150mm of φ, and cutting stock weight is about 10.3kg, heating temperature
Degree is 300-500 DEG C, soaking time 1-3h, carries out hot forging in 3T pneumatic hammers using molding machine after coming out of the stove, keeps blank complete
It is full of mold entirely, water cooling is carried out to backboard blank later.
It requires to be processed according to drawing size, as shown in figure 8, finished weight is about 6.1kg.
Stock utilization is：6.1kg/10.3kg × 100%=59.2%.
Comparative example 1
Endura anaerobic copper backboard blank specifications are 180 × 240mm of φ, and cutting stock weight is about 54.3kg, cold using two rollers
It is rolled to φ 440*40mm；It anneals later, annealing temperature is 100-400 DEG C, soaking time 1-3h.
It requires to be processed according to drawing size, as shown in figure 8, finished weight is about 20kg.
Stock utilization is：20kg/54.3kg × 100%=36.8%.
Comparative example 2
Endura anaerobic copper backboard blank specifications are 180 × 160mm of φ, and φ 440*27mm are cold-rolled to using two rollers；Later
It anneals, annealing temperature is 100-400 DEG C, soaking time 1-3h；It is φ to process outer toroid specification using Water Cutting
(410-300) * 27mm carry out two rollers to φ 300*27mm disks later and are cold-rolled to φ 360*18mm；It anneals, moves back later
Fiery temperature is 100-400 DEG C, soaking time 1-3h；
It requires to be processed according to Fig. 2 illustrated dimensions, later according to carrying out electron beam welding shown in Fig. 3；
It requires to be processed according to drawing size, as shown in figure 8, finished weight is about 20kg.
Stock utilization is：20kg/36.2kg × 100%=55.2%.
The factors such as integrated survey blanking specification, manufacturing procedure, process-cycle, stock utilization, the utility model is beneficial to effect
Fruit is apparent.
Technical scheme of the present invention is described in detail in above-described embodiment.It is apparent that the present invention is not limited being retouched
The embodiment stated.Based on the embodiments of the present invention, those skilled in the art can also make a variety of variations accordingly, but appoint
What is equal with the present invention or similar variation shall fall within the protection scope of the present invention.
Claims (3)
1. a kind of target backboard rapid molding device, which is characterized in that including outer toroid (10) and staking punch (11), by heating
Blank is placed in molding machine outer toroid, and staking punch is pressed into blank surface using forging hammer, and blank is made to be full of molding machine；It is described
Outer toroid (10) be stepped annular structures, staking punch (11) is frustum structure, is oblique angle design at step.
2. molding machine according to claim 1, which is characterized in that described outer toroid (10) thickness is 45-47mm；Outside
Diameter is 500-600mm；Step circular diameter is respectively 412-418mm, 335-340mm；Step height is 18-20mm；Oblique angle A1 with
Finished product backboard oblique angle is identical；Oblique angle A2 is 95-100 °.
3. molding machine according to claim 1, which is characterized in that described staking punch (11) maximum gauge is 302-
308mm；Thickness is 27-29mm；Oblique angle A3 is 92-95 °.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721572065.9U CN207642214U (en) | 2017-11-22 | 2017-11-22 | A kind of target backboard rapid molding device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721572065.9U CN207642214U (en) | 2017-11-22 | 2017-11-22 | A kind of target backboard rapid molding device |
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| CN207642214U true CN207642214U (en) | 2018-07-24 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111421063A (en) * | 2020-04-10 | 2020-07-17 | 宁波江丰电子材料股份有限公司 | Pot-shaped target material processing and forming method |
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2017
- 2017-11-22 CN CN201721572065.9U patent/CN207642214U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111421063A (en) * | 2020-04-10 | 2020-07-17 | 宁波江丰电子材料股份有限公司 | Pot-shaped target material processing and forming method |
| CN111421063B (en) * | 2020-04-10 | 2022-02-18 | 宁波江丰电子材料股份有限公司 | Pot-shaped target material processing and forming method |
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