CN207572340U - A kind of silicon chip drying oxidation unit - Google Patents
A kind of silicon chip drying oxidation unit Download PDFInfo
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- CN207572340U CN207572340U CN201721378276.9U CN201721378276U CN207572340U CN 207572340 U CN207572340 U CN 207572340U CN 201721378276 U CN201721378276 U CN 201721378276U CN 207572340 U CN207572340 U CN 207572340U
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- Prior art keywords
- silicon chip
- drying
- spray
- ozone
- oxidation unit
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Oxygen, Ozone, And Oxides In General (AREA)
Abstract
The utility model discloses a kind of silicon chip drying oxidation units, can be moved including groove body, transmission assembly, ozone spraying component and drying spray assemblies, silicon chip along the bottom surface of the groove body；Ozone spraying component is set to the groove body, and for spraying ozone to the silicon chip, to aoxidize the silicon chip, the first cover body is provided with outside the ozone spraying component；Drying spray assemblies are set in the groove body, and for spraying hot wind to the silicon chip, the second cover body is provided with outside the drying spray assemblies.In the silicon chip drying oxidation unit, ozone spraying component and drying spray assemblies are located in same groove body, compact-sized, reduce the volume of silicon chip drying oxidation unit, reduce cost；Sampling spray assemblies and drying spray assemblies are separated by the first cover body and the second cover body, the two is avoided to influence each other, guarantee is dried and oxidation effectiveness.
Description
Technical field
The utility model is related to solar cell preparing technical field more particularly to a kind of silicon chip drying oxidation units.
Background technology
In the preparation process of solar cell, silicon chip is needed successively by making herbs into wool, diffusion, etching, plated film and printing etc.
Process.Diffusion technique is a core process in solar cell preparation process, i.e. silicon chip is put into expansion by carrier of quartz boat
It dissipates in stove, at a certain temperature, nitrogen and diffusion source is passed through into diffusion furnace, so that the diffusion into the surface deposition PN junction of silicon chip.By
In in diffusion process, even if using the back-to-back single side diffusion way of silicon chip, all surface (including edge) of silicon chip all will
Inevitably deposition has diffusion source so that the light induced electron on silicon chip collected by the front of PN junction can flow to PN along edge
Short circuit is caused at the back side of knot, therefore, needs to perform etching process after the diffusion, to remove the diffusion source of silicon chip edge deposition, keeps away
Exempting from PN junction short circuit causes parallel resistance to reduce.After the completion of silicon chip erosion, surface meeting residual solution or other impurities need carry out table
Face is cleaned, and enters subsequent processing after the completion of cleaning after drying, aoxidizing.
As shown in Figure 1, in the prior art, drying oxidation unit includes 1 ＇ of groove body, and 1 ＇ of groove body is by divides into two
Part is placed drying 2 ＇ of spray assemblies and ozone spraying component 3 ＇, 5 ＇ of silicon chip and is transmitted along the bottom surface of 1 ＇ of groove body, passed through successively respectively
Dry 3 ＇ of 2 ＇ of spray assemblies and ozone spraying component.In existing drying oxidation unit, due to drying 2 ＇ of spray assemblies and ozone
For 3 ＇ of spray assemblies respectively in two parts of 1 ＇ of groove body, the overall dimensions for leading to 1 ＇ of groove body are larger, dry accounting for for oxidation unit
Ground area is big, and cost is higher.
Drying 2 ＇ of spray equipment is typically provided with two, and two 2 ＇ of drying spray equipment need to increase by the size of 1 ＇ of groove body,
And the drying capacity of two 2 ＇ of drying spray equipment is more than the practical drying demand of drying oxidation unit, causes energy waste.
As shown in Fig. 2, existing 3 ＇ of ozone spraying component generally comprises hollow spraying box, sent out inside spraying box with ozone
Generating apparatus connects, and the bottom surface of spraying box is 21 ＇ of shower plate, is provided with multiple 211 ＇ of spray apertures on 21 ＇ of shower plate, ozone passes through spray
Leaching 211 ＇ of hole is ejected into 5 ＇ surfaces of silicon chip, and then 5 ＇ of silicon chip is aoxidized.
Surface to ensure 5 ＇ of silicon chip is aoxidized, and 3 ＇ of ozone spraying component can be moved, and movement side relative to 1 ＇ of groove body
To vertical with the conveying direction of 5 ＇ of silicon chip.But this structure can make 5 ＇ surfaces of silicon chip contact ozone density unevenness, and due to
3 ＇ positions of ozone spraying component are not fixed, and the time of 5 ＇ surfaces of silicon chip and ozone contact is shorter, and oxidation effectiveness is poor.
If the position of fixed 3 ＇ of ozone spraying component, needs to expand 21 ＇ sizes of shower plate, makes the spray of 21 ＇ of shower plate
Range can cover sizes of 5 ＇ of silicon chip perpendicular to transmission direction.But after the size for increasing by 21 ＇ of shower plate, 3 ＇ of ozone spraying component
In house the volume of spraying box of ozone and will accordingly increase, and then the flow for the ozone that single 211 ＇ of spray apertures sprays can be influenced,
Influence the oxidation effectiveness of 5 ＇ of silicon chip.
In addition, 211 ＇ of spray apertures on 21 ＇ of shower plate is easily blocked by sundries, and since 211 ＇ of spray apertures is smaller, spray apertures
211 ＇ are difficult to find after blocking and constant repair, influence the oxidation effectiveness of 5 ＇ of silicon chip.
Utility model content
The purpose of this utility model is that proposing a kind of silicon chip drying oxidation unit, compact-sized, floor space is small, cost
It is low.
For this purpose, the utility model uses following technical scheme：
A kind of silicon chip drying oxidation unit, including：
Groove body, silicon chip can be moved along the bottom surface of the groove body；
Ozone spraying component is set in the groove body, for spraying ozone to the silicon chip, to aoxidize the silicon chip,
The first cover body is provided with outside the ozone spraying component；And
Spray assemblies are dried, are set in the groove body, for spraying hot wind, the drying spray assemblies to the silicon chip
It is provided with the second cover body outside.
Wherein, the ozone spraying component includes the spray tube that the more moving directions along the silicon chip arrange, the spray
The bottom surface of shower pipe offers spray port, and the length of the spray tube is adapted with the length of side of the silicon chip perpendicular to transmission direction.
Wherein, the spray port is convexly equipped with spray nozzle.
Wherein, the area of section of the spray nozzle gradually increases from top to bottom.
Wherein, the ozone spraying component connects respectively with ozone generating-device and oxygen generator.
Wherein, the drying spray assemblies are arranged in order with the ozone spraying component along the moving direction of the silicon chip.
Wherein, the drying spray assemblies include spraying box, and the bottom surface of the spraying box is shower plate, on the shower plate
It is provided with spray apertures.
Wherein, multiple spray apertures arranged in arrays are provided on the bottom surface of the spraying box.
Wherein, transmission assembly is further included, is set in the groove body, silicon chip is used to support and silicon chip is driven to move；It is described
Drying spray assemblies and the ozone spraying component are respectively positioned on the top of the transmission assembly.
Wherein, the side wall of the groove body is provided with the material transfer mouth for inputting or exporting silicon chip.
Wherein, the transmission assembly includes roller conveyor.
Advantageous effect：The utility model provides a kind of silicon chip drying oxidation unit, including groove body, transmission assembly, ozone
Spray assemblies and drying spray assemblies, silicon chip can be moved along the bottom surface of the groove body；Ozone spraying component is set to the slot
In vivo, for spraying ozone to the silicon chip, to aoxidize the silicon chip, the first cover body is provided with outside the ozone spraying component；
Drying spray assemblies are set in the groove body, for spraying hot wind to the silicon chip, are provided with outside the drying spray assemblies
Second cover body.In the silicon chip drying oxidation unit, ozone spraying component and drying spray assemblies are located in same groove body, and structure is tight
It gathers, reduces the volume of silicon chip drying oxidation unit, reduce cost；It will be sampled spray assemblies by the first cover body and the second cover body
It is separated with drying spray assemblies, the two is avoided to influence each other, ensure drying and oxidation effectiveness.
Description of the drawings
Fig. 1 is the structure diagram of silicon chip drying oxidation unit in the prior art；
Fig. 2 is the structure diagram of shower plate in the prior art；
Fig. 3 is the structure diagram of silicon chip drying oxidation unit provided by the utility model；
Fig. 4 is the structure diagram of spray tube provided by the utility model；
Fig. 5 is the structure diagram of shower plate provided by the utility model.
Wherein：
1st, groove body；11st, material transfer mouth；
2nd, spray assemblies are dried；21st, shower plate；211st, spray apertures；22nd, the second cover body；
3rd, ozone spraying component；31st, spray tube；32nd, spray nozzle；33rd, the first cover body；
41st, roller conveyor；
5th, silicon chip；
1 ＇, groove body；2 ＇, drying spray assemblies；21 ＇, shower plate；211 ＇, spray apertures；3 ＇, ozone spraying component；5 ＇, silicon
Piece.
Specific embodiment
The technical issues of to solve the utility model, the technical solution used and the technique effect reached are clearer,
Further illustrate the technical solution of the utility model below with reference to the accompanying drawings and specific embodiments.
A kind of silicon chip drying oxidation unit is present embodiments provided, for drying silicon chip and the oxidation after cleaning, dries work
Sequence and oxidation operation can be carried out continuously, and improve the preparation efficiency of solar battery sheet.
As shown in figure 3, drying cleaning device includes groove body 1, transmission assembly, drying spray assemblies 2 and ozone spraying component
3, transmission assembly, drying spray assemblies 2 and ozone spraying component 3 may be contained in groove body 1, and the inside of groove body 1 forms silicon chip 5 and dries
Dry and oxidation space, to avoid in drying or oxidation process, external environment is polluted in gas leakage.
To avoid in drying and oxidation process, the gas of spray influences each other, so as to influence the quality of solar battery sheet,
The second cover body 22 is provided with outside drying spray assemblies 2, the first cover body 33, the first cover body can be provided with outside ozone spraying component 3
33 and second cover body 22 air-flow at two stations can be separated to a certain extent, both avoid influencing each other.
Specifically, transmission assembly is located at the bottom surface of groove body 1, transmission assembly can include roller conveyor 41, and silicon chip 5 is put
It is placed in roller conveyor 41, and is moved with roller conveyor 41.Drying spray assemblies 2 and ozone spraying component 3 are respectively positioned on biography
The top of defeated component, and position is fixed, drying spray assemblies 2 are arranged successively with ozone spraying component 3 along the moving direction of silicon chip 5
Row, silicon chip 5 are positioned on transmission assembly, and are moved by transmission assembly, successively by drying station and oxidation station.Dry work
Position is corresponding with drying spray assemblies 2, and when silicon chip 5 is located at drying 2 lower section of spray assemblies, drying spray assemblies 2 are sprayed to silicon chip 5
Hot wind, and then dry the water stain of 5 surface of silicon chip；It is corresponding with ozone spraying component 3 to aoxidize station, when silicon chip 5 is located at ozone spraying
During 3 lower section of component, ozone spraying component 3 sprays ozone to silicon chip 5, so as to oxidized silicon chip 5.
To realize that silicon chip 5 is continuously entered in groove body 1, the side wall of groove body 1 can be provided with material transfer mouth 11, and material transfer mouth 11 can be with
Positioned at the bottom end of side wall so that silicon chip 5 can smoothly by material transfer mouth 11 enter or spread out of groove body 1, be conducive to improve production
Efficiency.
In the present embodiment, as shown in figure 5, drying spray assemblies 2 include spraying box, spraying box is hollow structure, spraying box
It is connected by pipeline with generating the device of hot wind.The bottom surface of spraying box is shower plate 21, is provided with spray apertures 211, is entered
Hot wind in spraying box arrives 5 surface of silicon chip by the spray of spray apertures 211, so as to dry silicon chip 5.
To improve the drying efficiency of silicon chip 5, spray apertures 211 may be uniformly distributed on shower plate 21 so that silicon chip 5 it is each
The drying degree of position is consistent, and since silicon chip 5 is generally rectangular cross-section, spray apertures 211 can be arranged in a matrix, and cover silicon chip 5.When
So, spray apertures 211 can also arrange in other forms, not be limited herein.
In existing drying oxidation unit, two drying spray assemblies 2 are typically provided with, it is each to dry in spray assemblies 2
The length of shower plate 21 along the conveying direction of silicon chip 5 be generally 3cm or so, drying efficiency is far more than actual use demand, consumption
Power-consuming energy, increases the production cost of solar battery sheet, and increases the volume of drying oxidation unit.For this purpose, the present embodiment
In, a drying spray assemblies 2 can be only set, reduce equipment cost and size.To ensure drying effect, shower plate 21 is along silicon
The length of the conveying direction of piece 5 can be appropriately extended, such as can be 4-6cm.
As shown in figure 4, in the present embodiment, ozone spraying component 3 includes the spray that the more moving directions along silicon chip 5 arrange
Pipe 31, the bottom surface of spray tube 31 offer spray port, and length and the length of side of the silicon chip 5 perpendicular to transmission direction of spray tube 31 are mutually fitted
Match so that ozone spraying component 3, which does not need to movement, can make the surface of ozone uniform fold silicon chip 5；And ozone spraying component 3
Position is fixed, and can not only be ensured that the ozone concentration of silicon chip 5 everywhere is identical, be obtained uniform oxidation effectiveness, can also extend silicon
5 surface of piece and the time of contact of ozone are conducive to improve the oxidation effectiveness of silicon chip 5.Although the length of ozone spraying component 3 increases
Add, but the small volume of single spray tube 31, meet the traffic requirement for the ozone that each spray port sprays, avoid influencing oxidation effect
Fruit.
Due to the hot wind that drying spray assemblies 2 spray out, generally directly using the air in processing workshop, by simple
After filtering and heating, it is delivered in drying spray assemblies 2, the degree of purity of hot wind is poor.To avoid impurity or hot wind in hot wind
The impurity of surrounding is blown into ozone spraying component 3, spray port is blocked, can be equipped with as shown in figure 4, spray port goes out with convex
Spray nozzle 32.Spray nozzle 32 outwardly protrudes certain distance, on the one hand can make ozone is opposite to gather, avoid ozone by spray port stream
Directly disperse after going out to all directions, so as to improve the uniformity of 5 surface ozone distribution of silicon chip；On the other hand, spray nozzle 32 is outer
Wall can also play the role of stopping that impurity enters spray port, prevent spray port from blocking, so as to ensure the oxidation effectiveness of silicon chip 5.
To make ozone can be with uniform fold in the surface of silicon chip 5, the area of section of spray nozzle 32 gradually increases from top to bottom,
So that the area coverage increase for the ozone that each spray port comes out, ensures that silicon chip 5 is all covered with ozone everywhere, so as to improve silicon chip
The uniformity coefficient of 5 oxidations.
In the present embodiment, ozone spraying component 3 is connected separately with ozone generating-device and oxygen generator, that is, is aoxidizing
In the process, oxygen is as the carrier for carrying ozone, relative to carrying ozone by nitrogen in the prior art, during oxidation, ozone and
Oxygen sprays to silicon chip 5 together, can improve the oxidisability of ozone, so as to obtain better oxidation effectiveness.
More than content is only the preferred embodiment of the utility model, for those of ordinary skill in the art, according to this reality
With novel thought, there will be changes, the content of the present specification should not be construed as in specific embodiments and applications
Limitation to the utility model.
Claims (10)
1. a kind of silicon chip drying oxidation unit, which is characterized in that including：
Groove body (1), silicon chip (5) can be moved along the bottom surface of the groove body (1)；
Ozone spraying component (3) is set in the groove body (1), for spraying ozone to the silicon chip (5), with described in oxidation
Silicon chip (5), the ozone spraying component (3) are provided with the first cover body (33) outside；And
Spray assemblies (2) are dried, are set in the groove body (1), for spraying hot wind, the drying spray to the silicon chip (5)
The second cover body (22) is provided with outside leaching component (2).
2. drying oxidation unit as described in claim 1, which is characterized in that the ozone spraying component (3) includes more edges
The spray tube (31) of the moving direction arrangement of the silicon chip (5), the bottom surface of the spray tube (31) offers spray port, the spray
The length of shower pipe (31) is adapted with the silicon chip (5) perpendicular to the length of side of moving direction.
3. drying oxidation unit as claimed in claim 2, which is characterized in that the spray port is convexly equipped with spray nozzle (32).
4. drying oxidation unit as claimed in claim 3, which is characterized in that the area of section of the spray nozzle (32) is arrived from above
Lower gradually increase.
5. as described in claim 1 drying oxidation unit, which is characterized in that the ozone spraying component (3) respectively with ozone
Generating means is connected with oxygen generator.
6. the drying oxidation unit as described in any one of claim 1-5, which is characterized in that the drying spray assemblies (2)
It is arranged in order with the ozone spraying component (3) along the moving direction of the silicon chip (5).
7. the drying oxidation unit as described in any one of claim 1-5, which is characterized in that the drying spray assemblies (2)
Including spraying box, the bottom surface of the spraying box is shower plate (21), and spray apertures (211) are provided on the shower plate (21).
8. drying oxidation unit as claimed in claim 7, which is characterized in that be provided on the bottom surface of the spraying box in matrix
Multiple spray apertures (211) of arrangement.
9. the drying oxidation unit as described in any one of claim 1-5, which is characterized in that further include transmission assembly, set
In the groove body (1), it is used to support silicon chip (5) and drives silicon chip (5) mobile；The drying spray assemblies (2) and described smelly
Oxygen spray assemblies (3) are respectively positioned on the top of the transmission assembly.
10. drying oxidation unit as claimed in claim 9, which is characterized in that the transmission assembly includes roller conveyor
(41)。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721378276.9U CN207572340U (en) | 2017-10-24 | 2017-10-24 | A kind of silicon chip drying oxidation unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721378276.9U CN207572340U (en) | 2017-10-24 | 2017-10-24 | A kind of silicon chip drying oxidation unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207572340U true CN207572340U (en) | 2018-07-03 |
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ID=62695997
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721378276.9U Expired - Fee Related CN207572340U (en) | 2017-10-24 | 2017-10-24 | A kind of silicon chip drying oxidation unit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207572340U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110922970A (en) * | 2019-11-29 | 2020-03-27 | 南京纳鑫新材料有限公司 | PERC battery back polishing additive and technology |
| CN114121730A (en) * | 2021-11-23 | 2022-03-01 | 无锡思锐电子设备科技有限公司 | High-temperature ozone oxidation device for silicon wafer production |
-
2017
- 2017-10-24 CN CN201721378276.9U patent/CN207572340U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110922970A (en) * | 2019-11-29 | 2020-03-27 | 南京纳鑫新材料有限公司 | PERC battery back polishing additive and technology |
| CN114121730A (en) * | 2021-11-23 | 2022-03-01 | 无锡思锐电子设备科技有限公司 | High-temperature ozone oxidation device for silicon wafer production |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: No. 199, deer mountain road, Suzhou high tech Zone, Jiangsu Province Patentee after: CSI CELLS Co.,Ltd. Patentee after: Funing atlas sunshine Power Technology Co.,Ltd. Address before: No. 199, deer mountain road, Suzhou high tech Zone, Jiangsu Province Patentee before: CSI Cells Co.,Ltd. Patentee before: CSI-GCL SOLAR MANUFACTURING (YANCHENG) Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180703 Termination date: 20211024 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |