CN207503972U - Fan-out-type antenna packages structure - Google Patents
Fan-out-type antenna packages structure Download PDFInfo
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- CN207503972U CN207503972U CN201721662883.8U CN201721662883U CN207503972U CN 207503972 U CN207503972 U CN 207503972U CN 201721662883 U CN201721662883 U CN 201721662883U CN 207503972 U CN207503972 U CN 207503972U
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6661—High-frequency adaptations for passive devices
- H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/12105—Bump connectors formed on an encapsulation of the semiconductor or solid-state body, e.g. bumps on chip-scale packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
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Abstract
The utility model provides a kind of fan-out-type antenna packages structure, including chip structure, contact pad that the chip structure includes bare chip and is electrically connected on the bare chip and with the bare chip；The plastic packaging layer on surface where surrounding the chip structure and exposing the contact pad；The plastic packaging layer and the re-wiring layer of the chip structure upper surface and individual layer antenna structure are formed in, wherein, the re-wiring layer is electrically connected with the contact pad, and the antenna structure is electrically connected with the re-wiring layer；It is formed in the soldered ball lower metal layer of the re-wiring layer upper surface；And it is formed in the soldered ball convex block of the soldered ball lower metal layer upper surface.By fan-out-type antenna packages structure provided by the utility model, solves the problem of existing radio frequency chip needs external antenna, becomes larger so as to cause area when in use.
Description
Technical field
The utility model is related to technical field of semiconductor encapsulation, more particularly to a kind of fan-out-type antenna packages structure.
Background technology
It is more inexpensive, more reliable, faster and more highdensity circuit be integrated antenna package pursue target.In future,
The integration density that integrated antenna package will improve various electronic components by constantly reducing minimum feature size.At present, first
Into packaging method include：Wafer chip level chip-scale package (Wafer Level Chip Scale Packaging,
WLCSP), fan-out-type wafer-level packaging (Fan-Out Wafer Level Package, FOWLP), flip-chip (Flip
Chip), stacked package (Package on Package, POP) etc..
Fan-out-type wafer-level packaging is a kind of embedded chip packaging method of wafer level processing, be at present it is a kind of input/
One of preferable Advanced Packaging method of more, the integrated flexibility of output port (I/O).Fan-out-type wafer-level packaging is compared to routine
Wafer-level packaging have the advantages that its uniqueness：1. I/O spacing is flexible, independent of chip size；2. only use effective bare die
(die), product yield improves；3. with flexible 3D package paths, you can to form the figure of General Cell at top；4. have
There are preferable electrical property and hot property；5. frequency applications；6. high-density wiring is easily realized in re-wiring layer (RDL).
At present, the fan-out-type wafer-level packaging method of radio frequency chip is generally：Carrier is provided, is formed and discharged in carrier surface
Layer；On releasing layer photoetching, re-wiring layer (Redistribution Layers, RDL) is electroplated out；Using chip bonding work
Radio frequency chip is installed on re-wiring layer by skill；Using Shooting Technique by chip plastic packaging in capsulation material layer；Remove carrier
And releasing layer；Photoetching, plating form Underbump metallization layer (UBM) on re-wiring layer；It carries out planting ball reflux, shape on UBM
Into soldered ball convex block；Then it carries out wafer and sticks piece, cutting scribing.The considerations of for communication efficiency, radio frequency chip all can when in use
Antenna is set, and existing radio-frequency antenna is all developer when carrying out layout designs to radio-frequency enabled module, directly in pcb board
Upper layout antennas or the interface for reserving external antenna；But due to the inconvenience of external antenna, existing radio-frequency antenna is mostly direct
The layout antennas on pcb board, and such method will ensure antenna gain, it just must be to sacrifice PCB surface product as cost.
In consideration of it, it is necessary to design a kind of new fan-out-type antenna packages structure to solve above-mentioned technical problem.
Utility model content
In view of the foregoing deficiencies of prior art, the purpose of this utility model is to provide a kind of fan-out-type antenna packages
Structure, for solving the problem of that existing radio frequency chip needs external antenna to become larger so as to cause area when in use.
In order to achieve the above objects and other related objects, the utility model provides a kind of system of fan-out-type antenna packages structure
Preparation Method, the preparation method include：
Step 1) provides a carrier, and forms releasing layer in the carrier upper surface；
Step 2) forms chip structure in the releasing layer upper surface, and the chip structure includes bare chip and positioned at institute
The contact pad stated on bare chip and be electrically connected with the bare chip, wherein, the contact pad connects with the releasing layer
It touches；
Step 3) forms plastic packaging layer in the releasing layer upper surface, wherein, the plastic packaging layer coats the chip structure；
Step 4) removes the carrier and the releasing layer, to expose the contact pad；
Step 5) forms individual layer antenna structure while surface where the contact pad forms re-wiring layer,
In, the re-wiring layer is electrically connected with the contact pad, and the antenna structure is electrically connected with the re-wiring layer；
Step 6) forms soldered ball lower metal layer in the re-wiring layer upper surface；And
Step 7) forms soldered ball convex block in the soldered ball lower metal layer upper surface.
Preferably, the method for forming the re-wiring layer and the antenna structure includes：
Step 5.1a) surface where the contact pad forms dielectric layer, and carries out photoetching to the dielectric layer, in
The first opening and the second opening are formed in the dielectric layer, wherein, first opening exposes the contact pad；
Step 5.2a) in described first opening and it is described second opening in form metal line layer, wherein, it is described first opening
In metal line layer and the contact pad be electrically connected, to form re-wiring layer, the metal line layer in second opening
It is electrically connected with the re-wiring layer, to form antenna structure.
Preferably, the method for forming the re-wiring layer and the antenna structure includes：
Step 5.1b) surface where the contact pad forms first medium layer, and the first medium layer is carried out
Photoetching, to form the first opening and the second opening in the first medium layer, wherein, first opening exposes described connect
Touch pad；
Step 5.2b) in described first opening and it is described second opening in form the first metal line layer, wherein, described first
The first metal line layer in opening is electrically connected with the contact pad, and the first metal line layer in second opening forms day
Cable architecture；
Step 5.3b) in the first metal line layer upper surface formed at least one layer by second dielectric layer and the second metal wire
The laminated construction of layer composition, to form the re-wiring layer, wherein, during second metal line layer is open with described first
First metal line layer is electrically connected, and the antenna structure is electrically connected with the re-wiring layer.
Preferably, the antenna structure is formed in the outside of the soldered ball lower metal layer, wherein, the antenna structure is in square
Shape winding-type and the encirclement soldered ball lower metal layer.
Preferably, the antenna structure is formed in the outside of the soldered ball lower metal layer, wherein, the antenna structure includes
At least one antenna element, the rectangular winding-type of antenna element.
Preferably, the antenna structure is formed in the inside of the soldered ball lower metal layer, wherein, the antenna structure includes
At least one antenna element, the rectangular winding-type of antenna element.
The utility model additionally provides a kind of fan-out-type antenna packages structure, and the fan-out-type antenna packages structure includes：
Chip structure, the chip structure include bare chip and on the bare chip and electrical with the bare chip
The contact pad of connection；
The plastic packaging layer on surface where surrounding the chip structure and exposing the contact pad；
The plastic packaging layer and the re-wiring layer of the chip structure upper surface and individual layer antenna structure are formed in, wherein,
The re-wiring layer is electrically connected with the contact pad, and the antenna structure is electrically connected with the re-wiring layer；
It is formed in the soldered ball lower metal layer of the re-wiring layer upper surface；And
It is formed in the soldered ball convex block of the soldered ball lower metal layer upper surface.
Preferably, the re-wiring layer includes being formed at least the one of the plastic packaging layer and the chip structure upper surface
Layer stacked structure, wherein, the laminated construction includes dielectric layer and metal line layer.
Preferably, the antenna structure is formed on the outside of the soldered ball lower metal layer, and described in the encirclement of rectangular winding-type
Soldered ball lower metal layer.
Preferably, the antenna structure includes being formed at least one antenna element on the outside of the soldered ball lower metal layer,
Wherein, the rectangular winding-type of the antenna element.
Preferably, the antenna structure includes being formed at least one antenna element on the inside of the soldered ball lower metal layer,
Wherein, the rectangular winding-type of the antenna element.
As described above, the fan-out-type antenna packages structure of the utility model, has the advantages that：The utility model leads to
The formation individual layer antenna structure while re-wiring layer is formed is crossed, i.e., forms the rewiring using same reticle
Layer and antenna structure, substantially reduce manufacture cost；And it by Antenna Construction Design described in the utility model, greatly reduces
The size of antenna structure while antenna structure line width is reduced, also substantially increases the gain of antenna structure；More by by day
Cable architecture integration packaging is in the conformability on chip structure, improving chip-packaging structure.
Description of the drawings
Fig. 1 is shown as the preparation method flow chart of fan-out-type antenna packages structure described in the utility model.
Fig. 2~Figure 10 is shown as each step structure diagram of fan-out-type antenna packages structure described in the utility model.
Figure 11~Figure 14 is shown as the structural representation of antenna structure in fan-out-type antenna packages structure described in the utility model
Figure.
Component label instructions
10 carriers
20 releasing layers
30 chip structures
31 bare chips
32 contact pads
40 plastic packaging layers
50 dielectric layers
51 first openings
52 second openings
60 re-wiring layers
70 antenna structures
80 soldered ball lower metal layers
81 dielectric layers
82 metal line layers
90 soldered ball convex blocks
91 metal columns
92 soldered balls
Specific embodiment
Illustrate the embodiment of the utility model by particular specific embodiment below, those skilled in the art can be by this
Content disclosed by specification understands other advantages and effect of the utility model easily.
It please refers to Fig.1 to Figure 14.It should be clear that structure, ratio, size depicted in this specification institute accompanying drawings etc., is only used
To coordinate the revealed content of 1 specification of carrier, so that those skilled in the art understands and reads, it is not limited to this reality
With novel enforceable qualifications, therefore do not have technical essential meaning, the modification of any structure, the change of proportionate relationship or
The adjustment of size in the case where not influencing the effect of the utility model can be generated and the purpose that can reach, should all be still fallen in this reality
It is obtained with novel revealed technology contents in the range of covering.Meanwhile in this specification it is cited as " on ", " under ",
The term of "left", "right", " centre " and " one " etc., be merely convenient to narration understand rather than can to limit the utility model
The range of implementation, relativeness are altered or modified, can when being also considered as the utility model in the case where changing technology contents without essence
The scope of implementation.
Embodiment one
As shown in Figure 1, the present embodiment provides a kind of preparation method of fan-out-type antenna packages structure, the preparation method packet
It includes：
Step 1) provides a carrier 10, and forms releasing layer 20 in 10 upper surface of carrier；
Step 2) forms chip structure 30 in 20 upper surface of releasing layer, and the chip structure 30 includes bare chip 31,
And the contact pad 32 being electrically connected on the bare chip 31 and with the bare chip 31, wherein, the contact pad 32
It is contacted with the releasing layer 20；
Step 3) forms plastic packaging layer 40 in 20 upper surface of releasing layer, wherein, the plastic packaging layer 40 coats the chip
Structure 30；
Step 4) removes the carrier 10 and the releasing layer 20, to expose the contact pad 32；
Step 5) forms individual layer antenna structure while the 32 place surface of contact pad forms re-wiring layer 60
70, wherein, the re-wiring layer 60 is electrically connected with the contact pad 32, the antenna structure 70 and the rewiring
Layer 60 is electrically connected；
Step 6) forms soldered ball lower metal layer 80 in 60 upper surface of re-wiring layer；And
Step 7) forms soldered ball convex block 90 in 80 upper surface of soldered ball lower metal layer.
Fig. 2 to Figure 10 is please referred to below to carry out in detail the preparation method of fan-out-type antenna packages structure described in the present embodiment
Explanation.
As shown in Figures 2 and 3, a carrier 10 is provided, and releasing layer 20 is formed in 10 upper surface of carrier.
As an example, the material of the carrier 10 includes but not limited to silicon, glass, silica, ceramics, polymer and gold
The composite material one or more of belonged to, shape can be wafer shape, it is rectangular or it is other it is arbitrary needed for shape.
As an example, the material of the releasing layer 20 includes but not limited to adhesive tape, adhesive glue, epoxy resin (Epoxy), silicon
One kind in rubber (silicone rubber), polyimides (PI), polybenzoxazoles (PBO) or benzocyclobutene (BCB),
It is formed by (ultraviolet) curings of UV or heat cure, using the separating layer as the carrier 10 and the chip structure 30.
As shown in figure 4, forming chip structure 30 in 20 upper surface of releasing layer, the chip structure 30 includes bare chip
31 and on the bare chip 31 and with the bare chip 31 be electrically connected contact pad 32, wherein, the Contact welding
Disk 32 is contacted with the releasing layer 20.
As an example, the chip structure 30 can be existing any radio communication chip, for sending and receiving
The communication information.
As an example, the material of the contact pad 32 includes but not limited to one kind in copper, aluminium, nickel, gold, silver, tin, titanium
It is or two or more.
As shown in figure 5, plastic packaging layer 40 is formed in 20 upper surface of releasing layer, wherein, the plastic packaging layer 40 coats described
Chip structure 30.
As an example, using compressing and forming process, transfer shaping technology, hydraulic seal moulding process, vacuum lamination process,
Or spin coating proceeding forms the plastic packaging layer 40, it is made tightly to be enclosed in the sidewall surfaces of the chip structure 30, prevents the core
There is gap in the sidewall surfaces of chip architecture 30, can effectively avoid the appearance of interface debonding, and then improve the steady of the encapsulating structure
It is qualitative；Wherein, the material of the plastic packaging layer 40 includes but not limited to one kind in polyimides, silica gel or epoxy resin.
As shown in fig. 6, the carrier 10 and the releasing layer 20 are removed using grinding technics or reduction process, to expose
The contact pad 32.
As shown in Figure 7 and Figure 8, individual layer is formed while the 32 place surface of contact pad forms re-wiring layer 60
Antenna structure 70, wherein, the re-wiring layer 60 is electrically connected with the contact pad 32, the antenna structure 70 with it is described
Re-wiring layer 60 is electrically connected.
As an example, the method for forming the re-wiring layer 60 and the antenna structure 70 includes：
As shown in fig. 7, dielectric layer 50 is formed, and light is carried out to the dielectric layer 50 in the 32 place surface of contact pad
It carves, to form the first opening 51 and the second opening 52 in the dielectric layer 50, wherein, first opening 51 exposes described
Contact pad 32；
As shown in figure 8, metal line layer is formed in the described first opening 51 and second opening 52, wherein, described the
Metal line layer in one opening 51 is electrically connected with the contact pad 32, to form re-wiring layer 60, second opening
Metal line layer in 52 is electrically connected with the re-wiring layer 60, to form antenna structure 70.
As another example, the method for forming the re-wiring layer 60 and the antenna structure 70 includes：
First medium layer is formed, and photoetching is carried out to the first medium layer in the 32 place surface of contact pad, with
The first opening and the second opening are formed in the first medium layer, wherein, first opening exposes the contact pad
32；
The first metal line layer is formed in the described first opening and second opening, wherein, in first opening
First metal line layer is electrically connected with the contact pad 32, and the first metal line layer in second opening forms antenna structure
70；
Form what at least one layer was made of second dielectric layer and the second metal line layer in the first metal line layer upper surface
Laminated construction, to form the re-wiring layer 60, wherein, second metal line layer and the first gold medal in the described first opening
Belong to line layer to be electrically connected, the antenna structure 70 is electrically connected with the re-wiring layer 60.
It should be noted that the re-wiring layer can include at least one layer of metal line layer, when the re-wiring layer
During including one layer of metal line layer, the antenna structure is formed with the re-wiring layer using same reticle；When it is described again
When wiring layer includes more than two layers of metal line layer, the antenna structure uses same reticle shape with first layer metal line layer
Into.
As shown in figure 9, form soldered ball lower metal layer 80 in 60 upper surface of re-wiring layer.
As an example, the step of forming soldered ball lower metal layer 80 includes：In the 60 upper surface shape of re-wiring layer
Photoetching is carried out into dielectric layer 81, and to the dielectric layer 81, to form the opening for exposing the re-wiring layer 60；In described
Metal line layer 82 is formed in opening, using as soldered ball lower metal layer 80.
As shown in Figure 10, soldered ball convex block 90 is formed in 80 upper surface of soldered ball lower metal layer.
As an example, the method for forming the soldered ball convex block 90 includes：It is formed in 80 upper surface of soldered ball lower metal layer
Metal column 91, and form soldered ball 92 in 91 upper surface of metal column.
As an example, using physical gas-phase deposition (PVD), chemical vapor deposition method (CVD), sputtering, plating or
Chemical plating forms the metal column 91, and the soldered ball 92 is formed using ball reflux technique is planted.
As an example, as shown in figure 11, the antenna structure 70 is formed in the outside of the soldered ball lower metal layer 80,
In, the 70 rectangular winding-type of antenna structure and the encirclement soldered ball lower metal layer 80.
As an example, as shown in figure 12, the antenna structure 70 is formed in the outside of the soldered ball lower metal layer 80,
In, the antenna structure 70 includes at least one antenna element, the rectangular winding-type of antenna element.
As an example, as shown in Figure 13 and Figure 14, the antenna structure 70 is formed in the interior of the soldered ball lower metal layer 80
Side, wherein, the antenna structure 70 includes at least one antenna element, the rectangular winding-type of antenna element.
Embodiment two
As shown in Figure 10, a kind of fan-out-type antenna packages structure, the fan-out-type antenna packages knot are present embodiments provided
Structure includes：
Chip structure 30, the chip structure 30 include bare chip 31 and on the bare chip 31 and with it is described naked
The contact pad 32 that chip 31 is electrically connected；
It surrounds the chip structure 30 and exposes the plastic packaging layer 40 on the 32 place surface of contact pad；
It is formed in the re-wiring layer 60 and individual layer antenna structure of 30 upper surface of the plastic packaging layer 40 and the chip structure
70, wherein, the re-wiring layer 60 is electrically connected with the contact pad 32, the antenna structure 70 and the rewiring
Layer 60 is electrically connected；
It is formed in the soldered ball lower metal layer 80 of 60 upper surface of re-wiring layer；And
It is formed in the soldered ball convex block 90 of 80 upper surface of soldered ball lower metal layer.
As an example, the chip structure 30 can be existing any radio communication chip, for sending and receiving
The communication information.
As an example, the material of the contact pad 32 includes but not limited to one kind in copper, aluminium, nickel, gold, silver, tin, titanium
It is or two or more.
As an example, the material of the plastic packaging layer 40 includes but not limited to one in polyimides, silica gel or epoxy resin
Kind；By the way that the plastic packaging layer 40 to be tightly enclosed in the sidewall surfaces of the chip structure 30, the side wall of chip structure 30 is prevented
Surface occurs gap, effectively avoiding the appearance of interface debonding, substantially increases the stability of the encapsulating structure.
As an example, the re-wiring layer 60 includes being formed in 30 upper surface of the plastic packaging layer 40 and the chip structure
At least one layer of laminated construction, wherein, the laminated construction include dielectric layer and metal line layer.
Specifically, the material of the dielectric layer includes but not limited to silica, the material of the metal line layer include but
It is not limited to one or more of copper, aluminium, nickel, gold, silver, tin, titanium.
As an example, as shown in figure 11, the antenna structure 70 is formed in 80 outside of soldered ball lower metal layer, and in square
Shape winding-type surrounds the soldered ball lower metal layer 80.
As an example, as shown in figure 12, the antenna structure 70 includes being formed in 80 outside of soldered ball lower metal layer
At least one antenna element, wherein, the rectangular winding-type of antenna element.
As an example, as shown in Figure 13 and Figure 14, the antenna structure 70 includes being formed in the soldered ball lower metal layer 80
At least one antenna element of inside, wherein, the rectangular winding-type of antenna element.
As an example, the soldered ball lower metal layer 80 includes：It is formed in the re-wiring layer upper surface and with opening
Dielectric layer 81 and the metal line layer 82 that is formed in the opening.
Specifically, the material of the dielectric layer includes but not limited to silica, the material of the metal line layer include but
It is not limited to one or more of copper, aluminium, nickel, gold, silver, tin, titanium.
As an example, shown soldered ball convex block 90 includes the metal column 91 for being formed in 80 upper surface of soldered ball lower metal layer,
And it is formed in the soldered ball 92 of 91 upper surface of metal column.
Specifically, the material of the metal column 91 and soldered ball 92 includes but not limited in copper, aluminium, nickel, gold, silver, tin, titanium
One or more.
In conclusion the fan-out-type antenna packages structure of the utility model, has the advantages that：The utility model leads to
The formation individual layer antenna structure while re-wiring layer is formed is crossed, i.e., forms the rewiring using same reticle
Layer and antenna structure, substantially reduce manufacture cost；And it by Antenna Construction Design described in the utility model, greatly reduces
The size of antenna structure while antenna structure line width is reduced, also substantially increases the gain of antenna structure；More by by day
Cable architecture integration packaging is in the conformability on chip structure, improving chip-packaging structure.So the utility model effectively overcomes
Various shortcoming of the prior art and have high industrial utilization.
The above embodiments are only illustrative of the principle and efficacy of the utility model, new not for this practicality is limited
Type.Any person skilled in the art can all carry out above-described embodiment under the spirit and scope without prejudice to the utility model
Modifications and changes.Therefore, such as those of ordinary skill in the art without departing from the revealed essence of the utility model
All equivalent modifications completed under refreshing and technological thought or change, should be covered by the claim of the utility model.
Claims (6)
1. a kind of fan-out-type antenna packages structure, which is characterized in that the fan-out-type antenna packages structure includes：
Chip structure, the chip structure include bare chip and are electrically connected on the bare chip and with the bare chip
Contact pad；
The plastic packaging layer on surface where surrounding the chip structure and exposing the contact pad；
The plastic packaging layer and the re-wiring layer of the chip structure upper surface and individual layer antenna structure are formed in, wherein, it is described
Re-wiring layer is electrically connected with the contact pad, and the antenna structure is electrically connected with the re-wiring layer；
It is formed in the soldered ball lower metal layer of the re-wiring layer upper surface；And
It is formed in the soldered ball convex block of the soldered ball lower metal layer upper surface.
2. fan-out-type antenna packages structure according to claim 1, which is characterized in that the re-wiring layer includes being formed
At least one layer of laminated construction in the plastic packaging layer and the chip structure upper surface, wherein, the laminated construction includes medium
Layer and metal line layer.
3. fan-out-type antenna packages structure according to claim 1 or 2, which is characterized in that the antenna structure is formed in
On the outside of the soldered ball lower metal layer, and rectangular winding-type surrounds the soldered ball lower metal layer.
4. fan-out-type antenna packages structure according to claim 1 or 2, which is characterized in that the antenna structure includes shape
At least one antenna element described in Cheng Yu on the outside of soldered ball lower metal layer, wherein, the rectangular winding-type of antenna element.
5. fan-out-type antenna packages structure according to claim 1 or 2, which is characterized in that the antenna structure includes shape
At least one antenna element described in Cheng Yu on the inside of soldered ball lower metal layer, wherein, the rectangular winding-type of antenna element.
6. fan-out-type antenna packages structure according to claim 1, which is characterized in that shown soldered ball convex block includes being formed in
The metal column of the soldered ball lower metal layer upper surface and the soldered ball for being formed in the metal column upper surface.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721662883.8U CN207503972U (en) | 2017-12-04 | 2017-12-04 | Fan-out-type antenna packages structure |
| US16/209,799 US10714435B2 (en) | 2017-12-04 | 2018-12-04 | Fan-out antenna packaging structure and method making the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721662883.8U CN207503972U (en) | 2017-12-04 | 2017-12-04 | Fan-out-type antenna packages structure |
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| Publication Number | Publication Date |
|---|---|
| CN207503972U true CN207503972U (en) | 2018-06-15 |
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| CN201721662883.8U Active CN207503972U (en) | 2017-12-04 | 2017-12-04 | Fan-out-type antenna packages structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107887366A (en) * | 2017-12-04 | 2018-04-06 | 中芯长电半导体（江阴）有限公司 | Fan-out-type antenna packages structure and preparation method thereof |
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2017
- 2017-12-04 CN CN201721662883.8U patent/CN207503972U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107887366A (en) * | 2017-12-04 | 2018-04-06 | 中芯长电半导体（江阴）有限公司 | Fan-out-type antenna packages structure and preparation method thereof |
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