CN207498461U - A kind of three target of small size vacuum magnetic control sputtering plating Mo machines - Google Patents
A kind of three target of small size vacuum magnetic control sputtering plating Mo machines Download PDFInfo
- Publication number
- CN207498461U CN207498461U CN201721619812.XU CN201721619812U CN207498461U CN 207498461 U CN207498461 U CN 207498461U CN 201721619812 U CN201721619812 U CN 201721619812U CN 207498461 U CN207498461 U CN 207498461U
- Authority
- CN
- China
- Prior art keywords
- vacuum chamber
- magnetic control
- target
- vacuum
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Physical Vapour Deposition (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Abstract
A kind of three target of small size vacuum magnetic control sputtering plating Mo machines, it is related to a kind of plating Mo machines, the plating Mo machines include the upper cover of vacuum chamber, the board of support vacuum chambers, the electrical control system that is placed in inside board and vacuum chamber, three magnetic control targets being distributed on lid, two air pressure bracing sticks are connected on upper lid, exhaust tube is equipped with behind vacuum chamber, throttle valve is equipped in exhaust tube, the rear end of exhaust tube is connected by pneumatic gate valve with molecular pump, and the exhaust outlet of molecular pump is connected to mechanical pump by bellows；Uniformly distributed three magnetic control targets above vacuum chamber upper cover in every target head, are equipped with independent baffle mechanism；Glass window is equipped with before vacuum chamber；The vacuum chamber right side, the introducing interface equipped with floor light.The coating machine is an integral structure, and external water, electricity, gas can work, and user need to only set several parameters, such as plating Mo times and setting-out, sampling etc., it is possible to fully automatic operation.
Description
Technical field
The utility model is related to a kind of Vacuum Deposition Mo equipment, and plating Mo is sputtered more particularly to a kind of three target of small size vacuum magnetic control
Machine.
Background technology
The device of magnetron sputtering technique (high-speed low temperature sputtering) principle can prepare various hard films, metal film, half
The nano level individual layer such as electrically conductive film, deielectric-coating, ferromagnetic film and thin magnetic film and multilayer functional membrane.Its feature is：It can be prepared into
The a variety of materials of target can be used as thin-film material, including various metals, semiconductor, ferromagnetic material and insulation oxide,
The substances such as ceramics, polymer are especially suitable for the material deposition plating of high-melting-point and low-steam pressure.Multicomponent target material under proper condition
Cosputtering mode can deposit mixture, the compound film of required component；In the electric discharge atmosphere of sputtering add in oxygen, nitrogen or its
Its active gases can deposit compound film to form target material and gas molecule etc..It is the ideal of modern materials science research
Equipment, but existing instrument electrical equipment control is relatively simple, and mostly using manual hand manipulation, operator has to pass through the training of profession
Instruction could grasp complicated operative skill, this is highly difficult for the larger institutes at different levels of mobility of people, for this purpose,
We have developed a small-sized automatic three target magnetic control sputterings plating Mo equipment.
Invention content
The purpose of this utility model is to provide a kind of three targets of small size vacuum magnetic control to sputter plating Mo machines, which is integrated
Formula structure, external water, electricity, gas can work, and user need to only set several parameters, such as plating Mo times and setting-out, sampling
Deng, it is possible to fully automatic operation.
The purpose of this utility model is achieved through the following technical solutions：
A kind of three target of small size vacuum magnetic control sputtering plating Mo machines, the plating Mo machines include vacuum chamber, support vacuum chambers machine
Platform, the upper cover of the electrical control system being placed in inside board and vacuum chamber, three magnetic control targets being distributed on lid connect on upper lid
Two air pressure bracing sticks are connected to, exhaust tube is equipped with behind vacuum chamber, is equipped with throttle valve in exhaust tube, the rear end of exhaust tube passes through gas
Dynamic gate valve connects with molecular pump, and the exhaust outlet of molecular pump is connected to mechanical pump by bellows；It is uniformly distributed above vacuum chamber upper cover
Three magnetic control targets in every target head, are equipped with independent baffle mechanism；Glass window is equipped with before vacuum chamber；Vacuum chamber is right
Face, the introducing interface equipped with floor light；Vacuum chamber bottom centre position is equipped with the sample stage that can be heated, rotate.Vacuum chamber
Bottom surrounding branch has vacuum gauge access port, pre- bleeding point, two-way gas to be filled with mouth；Installation armouring inside rotary heating sample stage
Heating dish, rotary heating sample stage are surrounded by one piece of annular dust excluding plate, are inlayed on rotary heating sample stage one passive big
Gear engages a driver pinion, and passing through shaft coupling on magnet fluid sealing axis connects stepper motor, the board of support vacuum chambers
Touch screen and a set of electric-control system are equipped with, bottom is equipped with mobile lower margin.
Mo machines are plated in a kind of three target of small size vacuum magnetic control sputtering, and bleeding point is equipped with throttling behind the vacuum chamber
Valve, pneumatic gate valve and connection molecule pump.
A kind of three target of small size vacuum magnetic control sputtering plating Mo machines, the exhaust outlet of the molecular pump pass through shut-off valve and wave
Line pipe accesses mechanical pump.
A kind of three target of small size vacuum magnetic control sputtering plating Mo machines, the driver pinion are embedded in magnet fluid sealing axis
On.
The advantages of the utility model is with effect：
The utility model complete machine is integral structure, and wheel is arranged at board bottom, can easily move, and only needs external water, electricity, gas
Just has operating condition, the machine electric-control system is controlled using PLC+ touch screens.There is good operation program prepared in advance, user only needs
Set several parameters（Such as the plating Mo times）And setting-out, sampling, it is possible to fully automatic operation.Training on operation without profession.
The machine has perfect self-checking system, such as water shortage detection, vacuum pressure detection not up to standard, and reminds user in time with warning tones,
To protect equipment safety.
Description of the drawings
Fig. 1 is the front view of the utility model；
Fig. 2 is the left view of the utility model；
Fig. 3 is the vacuum chamber sectional view of the utility model；
Fig. 4 is the man-machine interface schematic diagram of the utility model；
Fig. 5 is the operational flow diagram of the utility model；
Serial number name in figure：1 be magnetic control target, 2 be upper cover, 3 be vacuum chamber, 4 be glass window, 5 be air pressure bracing stick,
6 it is touch screen, 7 be board, 8 be electric-control system, 9 be mobile lower margin, 10 be mechanical pump, 11 be molecular pump, 12 is pneumatic plate
Valve, 13 be throttle valve, 14 be rotary heating sample stage, 15 be armouring heating dish, 16 annular dust excluding plates, 17 floor light interfaces,
18 it is passive gear wheel, 19 be driver pinion, 20 is magnet fluid sealing axis.
Specific embodiment
The utility model is described in detail in illustrated embodiment below in conjunction with the accompanying drawings.
A kind of three target of small size vacuum magnetic control of the utility model sputtering plating Mo machines, including vacuum chamber, support vacuum chambers board,
It is placed in electrical control system, power supply inside board etc..Exhaust tube is equipped with behind the vacuum chamber, throttling is equipped in exhaust tube
Valve, the rear end of exhaust tube are connected by pneumatic gate valve with molecular pump, and the exhaust outlet of molecular pump is connected to machinery by bellows
Pump；Uniformly distributed three magnetic control targets above the vacuum chamber upper cover in every target head, are equipped with independent baffle mechanism；Described is true
Before empty room, equipped with glass window.The vacuum chamber right side, the introducing interface equipped with floor light；The vacuum chamber bottom,
The position at center be equipped with can heat, rotatable sample stage.There is vacuum gauge access port, pre- in vacuum chamber bottom surrounding branch
Bleeding point, two-way gas are filled with mouth.
Embodiment
A kind of three target of small size vacuum magnetic control sputtering plating Mo machines, including vacuum chamber 3, vacuum chamber upper cover 2, be distributed in upper cover 2
On three magnetic control targets 1, in order to offset gravity when upper cover 2 is opened, upper cover 2 connects two air pressure bracing sticks 5, before vacuum chamber 3
Face is equipped with glass window 4,3 right side of vacuum chamber is equipped with floor light interface 17, behind the vacuum chamber 2 on bleeding point, if
There is throttle valve 13, the angle for changing throttle valve 13 just changes the air-flow size for flowing into molecular pump 11, just plays adjusting vacuum
The effect of degree can also stop that the substance that a part sputters out enters molecular pump 11, so as to extend the use longevity of molecular pump 11
Life.The bleeding point of molecular pump 11 is connected to by pneumatic gate valve 12 on the bleeding point of vacuum chamber 3, the exhaust outlet of molecular pump 11 leads to
It crosses shut-off valve and bellows access mechanical pump 10, the vacuum chamber 3 is internally provided with rotary heating sample stage 14, rotary heating
The inside installation armouring heating dish 15 of sample stage 14, rotary heating sample stage 14 are surrounded by one piece of annular dust excluding plate 16, it
Effect be passive gear wheel 18, driver pinion 20, magnet fluid sealing axis 22 that the substance that sputters of blocking enters lower floor
On the sample stage rotating mechanism for waiting parts composition.The board 7 of support vacuum chambers be equipped with touch screen 6, be also equipped with it is a set of automatically controlled
System 8, for the ease of movement, bottom is equipped with mobile lower margin 9.
The man-machine interface of the utility model is as shown in Figure 4：It is divided into sputtering manually, sputters both of which automatically.Manual mode
It is suitble to use when exploring technique.Automatic mode is then needed the data obtained in a manual mode, such as process gas flow, electricity
In the parameter read-ins input frames such as source power, plating Mo times, system will be according to operational flow diagram（Fig. 5）In flow transport automatically
Row.
It is described as follows with reference to flow chart 5：Vacuum chamber cleaning, target installation, arrange parameter, places substrate etc. at substrate cleaning
After preparation well in advance, vacuum chamber is closed, presses automatic sputtering, system can be first turned on mechanical pump 10, and pumping timing is opened
Begin, after ten minutes, the vacuum degree of vacuum chamber 3 is to 3Pa, at this point, molecular pump 11 starts, starts to take out base vacuum, after 30 minutes
The vacuum degree of vacuum chamber 3 reaches 6.0*10- 4Pa both complete by base vacuum；Or after 30 minutes, the vacuum degree of vacuum chamber 3 could not
Reach 6.0*10- 4Pa, system think that vacuum chamber 3 has leak source, shut down and buzzing alarm, prompting user fix a breakdown.In next step,
System control throttle valve 13 is adjusted to a suitable angle, then mass flowmenter is controlled to be filled with a certain amount of process gas,
The vacustat of vacuum chamber 3 is in setting value.
According to technique initialization, start armouring heating dish 15, etc. after temperature reach setting value, met sputtering condition at this time,
It opens power supply and carries out pre-sputtering, pre-sputtering is for a period of time（Time can set）Rotary heating platform sample stage 14 rotates, current to sputter
Target baffle open, formally start to sputter.System is automatically closed after being splashed to setting time, and the entire flow that sputters terminates.
Claims (4)
1. a kind of three target of small size vacuum magnetic control sputtering plating Mo machines, which is characterized in that the plating Mo machines include vacuum chamber, support very
The board of empty room, the upper cover of the electrical control system being placed in inside board and vacuum chamber, three magnetic control targets being distributed on lid,
It is connected with two air pressure bracing sticks on upper lid, exhaust tube is equipped with behind vacuum chamber, be equipped with throttle valve in exhaust tube, after exhaust tube
End is connected by pneumatic gate valve with molecular pump, and the exhaust outlet of molecular pump is connected to mechanical pump by bellows；Vacuum chamber upper cover
It is evenly distributed with three magnetic control targets above, in every target head, is equipped with independent baffle mechanism；Glass window is equipped with before vacuum chamber；
The vacuum chamber right side, the introducing interface equipped with floor light；Vacuum chamber bottom centre position is equipped with the sample that can be heated, rotate
Platform；Vacuum chamber bottom surrounding branch has vacuum gauge access port, pre- bleeding point, two-way gas to be filled with mouth；In rotary heating sample stage
Armouring heating dish is installed in portion, and rotary heating sample stage is surrounded by one piece of annular dust excluding plate, is inlayed on rotary heating sample stage
One one passive gear wheel, engagement driver pinion, connect stepper motor on magnet fluid sealing axis by shaft coupling, and support is true
The board of empty room is equipped with touch screen and a set of electric-control system, and bottom is equipped with mobile lower margin.
A kind of 2. three target of small size vacuum magnetic control sputtering plating Mo machines according to claim 1, which is characterized in that the vacuum chamber
Bleeding point is equipped with throttle valve, pneumatic gate valve and connection molecule pump below.
A kind of 3. three target of small size vacuum magnetic control sputtering plating Mo machines according to claim 2, which is characterized in that the molecular pump
Exhaust outlet pass through shut-off valve and bellows and access mechanical pump.
4. a kind of three target of small size vacuum magnetic control sputtering plating Mo machines according to claim 1, which is characterized in that the active is small
Gear is embedded on magnet fluid sealing axis.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721619812.XU CN207498461U (en) | 2017-11-29 | 2017-11-29 | A kind of three target of small size vacuum magnetic control sputtering plating Mo machines |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721619812.XU CN207498461U (en) | 2017-11-29 | 2017-11-29 | A kind of three target of small size vacuum magnetic control sputtering plating Mo machines |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207498461U true CN207498461U (en) | 2018-06-15 |
Family
ID=62507386
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721619812.XU Active CN207498461U (en) | 2017-11-29 | 2017-11-29 | A kind of three target of small size vacuum magnetic control sputtering plating Mo machines |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207498461U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107815658A (en) * | 2017-11-29 | 2018-03-20 | 沈阳鹏程真空技术有限责任公司 | A kind of target of small size vacuum magnetic control three sputtering plating Mo machines |
-
2017
- 2017-11-29 CN CN201721619812.XU patent/CN207498461U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107815658A (en) * | 2017-11-29 | 2018-03-20 | 沈阳鹏程真空技术有限责任公司 | A kind of target of small size vacuum magnetic control three sputtering plating Mo machines |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201217685Y (en) | Magnetron sputtering and multi-sphere ion plating combined vacuum coating machine | |
| JP5532365B2 (en) | Measuring system and humidity measuring method for measuring volatile organic substances | |
| TWI261313B (en) | A method for a large dimension plasma enhanced atomic layer deposition cavity and an apparatus thereof | |
| CN207498461U (en) | A kind of three target of small size vacuum magnetic control sputtering plating Mo machines | |
| CN107815658A (en) | A kind of target of small size vacuum magnetic control three sputtering plating Mo machines | |
| CN102051581B (en) | Substrate film-coating processing system | |
| CN108315704B (en) | Magnetron sputtering optical coating equipment and coating method | |
| CN101514440A (en) | Method for preparation of indium oxide transparent film with high electron mobility | |
| CN205741206U (en) | Apparatus for atomic layer deposition at powder surface uniform coated | |
| CN214691215U (en) | High-precision chip factory building constant-temperature constant-humidity control cabinet | |
| CN202022972U (en) | Substrate film coating processing equipment | |
| CN212874428U (en) | Weak plasma etching equipment of normal position coating by vaporization | |
| CN108300968A (en) | Film build method and vacuum treatment installation | |
| CN111812017A (en) | Rice seedling cold resistance detection device of integral type | |
| CN105648409A (en) | Magnetron sputtering system with substrate water cooling and heating revolution table | |
| CN202322995U (en) | Magnetron sputtering system with substrate water-cooling heating revolution platform | |
| CN206069996U (en) | A kind of small-sized magnetron sputtering Mo machines | |
| CN203333745U (en) | Continuous type vacuum evaporation coating device | |
| CN109973703A (en) | Automatic ventilation system and automatic air interchanger | |
| CN114318285B (en) | Vacuum coating equipment and coating method thereof | |
| CN217895736U (en) | Small-size desk-top vacuum multitarget coating machine | |
| CN213933253U (en) | Device for detecting harmful substances in Tibetan incense ash | |
| CN103103486A (en) | Magnetron sputtering system | |
| CN201337972Y (en) | Rotating spin coater | |
| CN108277468B (en) | A kind of magnetron sputtering optical coating apparatus and film plating process with vacuum machine arm |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |