CN207440324U - A kind of cover board and electronic equipment - Google Patents
A kind of cover board and electronic equipment Download PDFInfo
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- CN207440324U CN207440324U CN201721616959.3U CN201721616959U CN207440324U CN 207440324 U CN207440324 U CN 207440324U CN 201721616959 U CN201721616959 U CN 201721616959U CN 207440324 U CN207440324 U CN 207440324U
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Abstract
The utility model is related to technical field of electronic equipment more particularly to a kind of cover boards and electronic equipment.The utility model provides a kind of cover board, including：Substrate and film plating layer；The film plating layer is covered in one side surface of substrate；The film plating layer includes：The first film layer, the second film layer and the 3rd film layer；The first film layer, the second film layer and the 3rd film layer are set gradually along the direction away from the substrate；The reflected light wave band of the first film layer is Chong Die with the absorption optical band of second film layer；Second film layer and the 3rd film layer have different refractive index.
Description
Technical field
The utility model is related to technical field of electronic equipment more particularly to a kind of cover boards and electronic equipment.
Background technology
At present, many electronic products are using metal material as cover board, although specious, metal has to signal
Disturb strong, easy the shortcomings of scratching.In order to avoid interference of the metal to signal, most of cell phone rear cover products are had to using three sections
Formula designs, and design is complicated, affects integraty.The transparent materials such as glass are noiseless to signal, utilize the transparent materials systems such as glass
Make the cover board with metal effect, integraty is strong, and quality is lighter.But making cover board using transparent materials such as glass will reach
The two-sided effect that light tone is all presented of cover board needs two-sided coating, technique respectively in cover board cumbersome.
Utility model content
In view of this, it is existing using the making of the transparent materials such as glass for solving the utility model discloses a kind of cover board
Cover board to achieve the effect that cover board it is two-sided all present light tone needs cover board it is two-sided distinguish coating, technique is cumbersome the problem of.
Specific technical solution is as follows：
A kind of cover board, including：Substrate and film plating layer；
The film plating layer is covered in one side surface of substrate；
The film plating layer includes：The first film layer, the second film layer and the 3rd film layer；
The first film layer, the second film layer and the 3rd film layer are set gradually along the direction away from the substrate；
The reflected light wave band of the first film layer is Chong Die with the absorption optical band of second film layer；
Second film layer and the 3rd film layer have different refractive index.
Preferably, the first film layer be the first film, second film layer be the second film, the 3rd film
Layer is multi-layer film structure；
The multi-layer film structure includes：Cross layered the 3rd film of multilayer and the 4th film of multilayer；
3rd film and the 4th film have different refractive index.
Preferably, the film plating layer is covered in the substrate on the surface for observing one side.
Preferably, the number of plies of the 3rd film is identical with the number of plies of the 4th film.
Preferably, the first film is the first columbium oxide film；
Second film is silicon thin film；
3rd film is the second columbium oxide film；
4th film is silicon oxide film.
Preferably, along on the direction of second film layer, the multi-layer film structure includes successively：10~80nm is thick
The second columbium oxide film, the silicon oxide film of 60~150nm thickness, the second columbium oxide film of 60~150nm thickness, 90~
Silicon oxide film, the second columbium oxide film of 30~80nm thickness and the silicon oxide film of 30~90nm thickness of 200nm thickness.
Preferably, the thickness of the first film layer is 40~200nm；
The thickness of second film layer is 40~300nm；
The thickness of the substrate is 0.1~3.0mm.
Preferably, the substrate is transparent substrate；
The transparent substrate is one kind in glass substrate, acrylic substrate and polycarbonate substrate.
Preferably, further include：Fingerprint proof membrane；
The fingerprint proof membrane is covered in the non-coated surface of the film plating layer or the substrate.
The utility model also provides a kind of electronic equipment, including the cover board described in above-mentioned technical proposal.
As can be seen from the above technical solutions, the utility model provides a kind of cover board, including：Substrate and film plating layer；Institute
It states film plating layer and is covered in one side surface of substrate；The film plating layer includes：The first film layer, the second film layer and the 3rd film
Layer；The first film layer, the second film layer and the 3rd film layer are set gradually along the direction away from the substrate；Described first
The reflected light wave band of film layer is Chong Die with the absorption optical band of second film layer；Second film layer and described 3rd thin
Film layer has different refractive index.In the utility model, the 3rd film layer makes the coated surface of cover board show light tone；The first film
The reflected light wave band of layer is Chong Die with the absorption optical band of the second film layer, and the non-coated surface of cover board shows the face of the first film layer
Color, and because the reflected light wave band of the first film layer and the absorption optical band of the second film layer are Chong Die, the reflection of the first film layer
Light will not impact the 3rd film layer, and the second film layer and the 3rd film layer have different refractive index, and cover board is two-sided all
Light tone is presented.
Description of the drawings
It in order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is some embodiments of the utility model, for those of ordinary skill in the art, before not making the creative labor property
It puts, can also be obtained according to these attached drawings other attached drawings.
Fig. 1 is a kind of structure diagram of the cover board provided in the utility model embodiment；
Fig. 2 is the structure diagram of the film plating layer in a kind of cover board provided in the utility model embodiment；
1. substrate；2. film plating layer；3. the first film；4. the second film；5. the 3rd film；6. the 4th film.
Specific embodiment
The utility model embodiment discloses a kind of cover board, existing using the transparent materials such as glass making cover board for solving
Achieve the effect that cover board it is two-sided all present light tone needs cover board it is two-sided distinguish coating, technique is cumbersome the problem of.
Please refer to Fig.1 and Fig. 2, be respectively a kind of cover board provided in the utility model embodiment structure diagram and this
The structure diagram of film plating layer in a kind of cover board provided in utility model embodiment.
A kind of cover board, including：Substrate 1 and film plating layer 2；
Film plating layer 2 is covered in 1 one side surface of substrate；
Film plating layer 2 includes：The first film layer, the second film layer and the 3rd film layer；
The first film layer, the second film layer and the 3rd film layer are set gradually along the direction away from substrate 1；
The reflected light wave band of the first film layer is Chong Die with the absorption optical band of the second film layer；
Second film layer and the 3rd film layer have different refractive index.
In the utility model, the 3rd film layer makes the coated surface of cover board show light tone；The reflecting light of the first film layer
Section is Chong Die with the absorption optical band of the second film layer, and the non-coated surface of cover board shows the color of the first film layer, and because of the
The reflected light wave band of one film layer is Chong Die with the absorption optical band of the second film layer, and the light of the first film layer reflection will not be to the 3rd
Film layer impacts, and the second film layer and the 3rd film layer have different refractive index, and cover board is two-sided to be all presented light tone.
In the utility model embodiment, the first film layer is the first film 3, and the second film layer is the second film 4, and the 3rd is thin
Film layer is multi-layer film structure；
Multi-layer film structure includes：Cross layered the 3rd film 5 of multilayer and the 4th film 6 of multilayer；
3rd film 5 and the 4th film 6 have different refractive index.
In the utility model embodiment, film plating layer 2 is covered in substrate 1 on the surface for observing one side.
It should be noted that film plating layer 2 can also be covered in substrate 1 towards observation one side surface on.
In the utility model embodiment, the number of plies of the 3rd film 5 is identical with the number of plies of the 4th film 6.
The first film 3 is the first columbium oxide film；
Second film 4 is silicon thin film；
3rd film 5 is the second columbium oxide film；
4th film 6 is silicon oxide film.
In the utility model embodiment, along on the direction of the second film layer, multi-layer film structure includes successively：10~
Second columbium oxide film of 80nm thickness, the silicon oxide film of 60~150nm thickness, the second columbium oxide film of 60~150nm thickness, 90
Silicon oxide film, the second columbium oxide film of 30~80nm thickness and the silicon oxide film of 30~90nm thickness of~200nm thickness.
The thickness of the first film layer is 40~200nm；
The thickness of second film layer is 40~300nm；
The thickness of substrate 1 is 0.1~3.0mm.
Substrate 1 is transparent substrate；
Transparent substrate is one kind in glass substrate, acrylic substrate and polycarbonate substrate.
In the utility model embodiment, transparent substrate is glass substrate.
Hardness is high after glass substrate has many advantages, such as, tempering noiseless to signal, and being made using glass substrate has metal
The cover board of effect, integraty is strong, light weight.
Further, further include：Fingerprint proof membrane；
Fingerprint proof membrane is covered in the non-coated surface of film plating layer 2 or substrate 1, and fingerprint proof membrane can effectively avoid cover board from using process
Fingerprint pollution.
In the utility model embodiment, along on the direction of the second film layer, multi-layer film structure includes successively：10~
Second columbium oxide film of 80nm thickness, the silicon oxide film of 60~150nm thickness, the second columbium oxide film of 60~150nm thickness, 90
Silicon oxide film, the second columbium oxide film of 30~80nm thickness and the silicon oxide film of 30~90nm thickness of~200nm thickness, second
3rd film layer of the multi-layer film structure of columbium oxide film and silicon oxide film composition shows red.The first film 3 is the first oxidation
Niobium pentoxide film, the second film 4 be silicon thin film, certain thickness first columbium oxide film purple wave band reflectivity highest, individual layer
Silicon thin film has good absorption in purple wave band, and the non-coated surface of cover board shows the color i.e. purple of the first film layer.Also, silicon
Film can reduce influence of the purple light of the first columbium oxide film reflection to the 3rd film layer, and cover board is two-sided to be all presented light tone, lid
Red, the non-coated surface presentation purple of cover board is presented in the coated surface of plate.
The utility model embodiment also provides a kind of electronic equipment, the cover board including above-mentioned technical proposal.
A kind of cover board provided by the utility model is described in detail above, for the general technology people of this field
Member, based on the idea of the embodiment of the present invention, there will be changes in specific embodiments and applications, to sum up institute
It states, this specification content should not be construed as the limitation to the utility model.
Claims (10)
1. a kind of cover board, which is characterized in that including：Substrate and film plating layer；
The film plating layer is covered in one side surface of substrate；
The film plating layer includes：The first film layer, the second film layer and the 3rd film layer；
The first film layer, the second film layer and the 3rd film layer are set gradually along the direction away from the substrate；
The reflected light wave band of the first film layer is Chong Die with the absorption optical band of second film layer；
Second film layer and the 3rd film layer have different refractive index.
2. cover board according to claim 1, which is characterized in that the first film layer is the first film, and described second is thin
Film layer is the second film, and the 3rd film layer is multi-layer film structure；
The multi-layer film structure includes：Cross layered the 3rd film of multilayer and the 4th film of multilayer；
3rd film and the 4th film have different refractive index.
3. cover board according to claim 1, which is characterized in that the film plating layer is covered in the substrate and observes one side backwards
Surface on.
4. cover board according to claim 2, which is characterized in that the number of plies of the 3rd film and the layer of the 4th film
Number is identical.
5. cover board according to claim 2, which is characterized in that the first film is the first columbium oxide film；
Second film is silicon thin film；
3rd film is the second columbium oxide film；
4th film is silicon oxide film.
6. cover board according to claim 5, which is characterized in that edge is described more on the direction of second film layer
Film structure includes successively：The second columbium oxide film, silicon oxide film, the 60~150nm of 60~150nm thickness of 10~80nm thickness
Thick the second columbium oxide film, the silicon oxide film of 90~200nm thickness, the second columbium oxide film of 30~80nm thickness and 30~
The silicon oxide film of 90nm thickness.
7. cover board according to claim 1, which is characterized in that the thickness of the first film layer is 40~200nm；
The thickness of second film layer is 40~300nm；
The thickness of the substrate is 0.1~3.0mm.
8. cover board according to claim 1, which is characterized in that the substrate is transparent substrate；
The transparent substrate is one kind in glass substrate, acrylic substrate and polycarbonate substrate.
9. cover board according to claim 1, which is characterized in that further include：Fingerprint proof membrane；
The fingerprint proof membrane is covered in the non-coated surface of the film plating layer or the substrate.
10. a kind of electronic equipment, which is characterized in that including the cover board described in claim 1 to 9 any one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721616959.3U CN207440324U (en) | 2017-11-28 | 2017-11-28 | A kind of cover board and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721616959.3U CN207440324U (en) | 2017-11-28 | 2017-11-28 | A kind of cover board and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207440324U true CN207440324U (en) | 2018-06-01 |
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ID=62284725
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721616959.3U Active CN207440324U (en) | 2017-11-28 | 2017-11-28 | A kind of cover board and electronic equipment |
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| CN (1) | CN207440324U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111049959A (en) * | 2019-12-30 | 2020-04-21 | Oppo广东移动通信有限公司 | Shell assembly, preparation method of shell assembly and electronic equipment |
-
2017
- 2017-11-28 CN CN201721616959.3U patent/CN207440324U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111049959A (en) * | 2019-12-30 | 2020-04-21 | Oppo广东移动通信有限公司 | Shell assembly, preparation method of shell assembly and electronic equipment |
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