CN207978218U - A kind of cover board and electronic equipment - Google Patents
A kind of cover board and electronic equipment Download PDFInfo
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- CN207978218U CN207978218U CN201721616206.2U CN201721616206U CN207978218U CN 207978218 U CN207978218 U CN 207978218U CN 201721616206 U CN201721616206 U CN 201721616206U CN 207978218 U CN207978218 U CN 207978218U
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- film
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- substrate
- cover board
- film layer
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Abstract
The utility model is related to technical field of electronic equipment more particularly to a kind of cover boards and electronic equipment.The utility model provides a kind of cover board, including：Substrate and film plating layer；The film plating layer is covered in one side surface of the substrate；The film plating layer includes：The first film layer and the second film layer；The first film layer and second film layer are set gradually along the direction away from the substrate；The first film layer and second film layer have different refractive index；The first film layer is silicon thin film.In the utility model, the first film layer of film plating layer is silicon thin film, has good absorption to visible light, can stop substrate light transmission, second film layer further stops substrate light transmission, and the visuality that cover board stops electronic product inner body can be realized without applying black ink in substrate surface.
Description
Technical field
The utility model is related to technical field of electronic equipment more particularly to a kind of cover boards and electronic equipment.
Background technology
Currently, many electronic products replace the metal material used in the past as color using transparent light-weight material such as glass
Cover board, but often need to apply often in order to stop the visuality of interiors of products part when making cover board with the high light material of transparency
Black ink, it is complex manufacturing technology, of high cost.
Utility model content
In view of this, the utility model embodiment discloses a kind of cover board, it is high using transparency for solving the prior art
Light material as cover board need apply black ink, complex manufacturing technology the problem of.
Specific technical solution is as follows：
A kind of cover board, including：Substrate and film plating layer；
The film plating layer is covered in one side surface of the substrate；
The film plating layer includes：The first film layer and the second film layer；
The first film layer and second film layer are set gradually along the direction away from the substrate；
The first film layer and second film layer have different refractive index；
The first film layer is silicon thin film.
Preferably, second film layer is multi-layer film structure；
The multi-layer film structure includes：Cross layered the second film of multilayer the first film and multilayer；
The first film and second film have different refractive index.
Preferably, the film plating layer is covered in the substrate on the surface of observation side.
Preferably, the number of plies of the first film is identical as the number of plies of the second film.
Preferably, the first film is columbium oxide film；
Second film is silicon oxide film.
Preferably, along on the direction of the first film layer, the multi-layer film structure includes successively：10~60nm is thick
Columbium oxide film, the silicon oxide film of 60~160nm thickness, the columbium oxide film of 70~150nm thickness, 80~200nm thickness oxygen
The silicon oxide film of SiClx film, the columbium oxide film of 30~90nm thickness and 30~100nm thickness；
The thickness of the first film layer is 50~300nm.
Preferably, the substrate is transparent substrate.
Preferably, the transparent substrate is one kind in glass substrate, acrylic substrate and polycarbonate substrate.
Preferably, the thickness of the substrate is 0.1~3.0mm.
The utility model additionally provides a kind of electronic equipment, including the cover board described in above-mentioned technical proposal.
As can be seen from the above technical solutions, the utility model provides a kind of cover board, including：Substrate and film plating layer；Institute
It states film plating layer and is covered in one side surface of the substrate；The film plating layer includes：The first film layer and the second film layer；Described first
Film layer and second film layer are set gradually along the direction away from the substrate；The first film layer and described second thin
Film layer has different refractive index；The first film layer is silicon thin film.In the utility model, the first film layer of film plating layer is
Silicon thin film has good absorption to visible light, can stop that substrate light transmission, the second film layer further stop that substrate is saturating
The visuality that cover board stops electronic product inner body can be realized without applying black ink in substrate surface in light.
Description of the drawings
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is some embodiments of the utility model, for those of ordinary skill in the art, before not making the creative labor property
It puts, can also be obtained according to these attached drawings other attached drawings.
Fig. 1 is a kind of structural schematic diagram of the cover board provided in the utility model embodiment；
Fig. 2 is the structural schematic diagram of the film plating layer in a kind of cover board provided in the utility model embodiment；
1. substrate；2. film plating layer；3. silicon thin film；4. the first film；5. the second film.
Specific implementation mode
The utility model embodiment discloses a kind of cover board, light using the high glass of transparency etc. for solving the prior art
The problem of material needs to apply black ink, complex manufacturing technology as cover board.
Please refer to Fig.1 and Fig. 2, a kind of structural schematic diagram of the cover board respectively provided in the utility model embodiment and this
The structural schematic diagram of film plating layer in a kind of cover board provided in utility model embodiment.
A kind of cover board, including：Substrate 1 and film plating layer 2；
Film plating layer 2 is covered in 1 one side surface of substrate；
Film plating layer 2 includes：The first film layer and the second film layer；
The first film layer and the second film layer are set gradually along the direction away from the substrate；
The first film layer and the second film layer have different refractive index；
The first film layer is silicon thin film 3.
The first film layer of film plating layer 2 is silicon thin film 3, has good absorption to visible light, can stop that substrate 1 is saturating
Light, the second film layer further stop 1 light transmission of substrate, and cover board blocking electronics can be realized without applying black ink on 1 surface of substrate
The visuality of interiors of products part.Silicon-on 3, such nothing are plated before the second film layer that a variety of colors is plated on 1 surface of substrate
Black ink need to be applied again, can play the absorption effects of black ink.Black ink is not used in color cover board manufacturing process, but not
The performance that product can be reduced substantially reduces the production cost of a variety of colors cover board.
In the utility model embodiment, the second film layer is multi-layer film structure；
Multi-layer film structure includes：Cross layered multilayer the first film 4 and the second film of multilayer 5；
The first film 4 and the second film 5 have different refractive index.
In the utility model embodiment, film plating layer 2 is covered in substrate 1 on the surface of observation side.
It should be noted that film plating layer 2 can also be covered in substrate 1 towards observation side surface on.
In the utility model embodiment, the number of plies of the first film 4 is identical as the number of plies of the second film 5.
In the utility model embodiment, the first film 4 is columbium oxide film；
Second film 5 is silicon oxide film.
In the utility model embodiment, along on the direction of the first film layer, multi-layer film structure includes successively：10~
Columbium oxide film, the 80~200nm of the columbium oxide film of 60nm thickness, the silicon oxide film of 60~160nm thickness, 70~150nm thickness
The silicon oxide film of the columbium oxide film and 30~100nm thickness of thick silicon oxide film, 30~90nm thickness；
The thickness of the first film layer is 50~300nm.
In the utility model embodiment, substrate 1 is transparent substrate.
Transparent substrate is one kind in glass substrate, acrylic substrate and polycarbonate substrate.
In the utility model embodiment, transparent substrate is glass substrate.
In the utility model embodiment, the thickness of substrate 1 is 0.1~3.0mm.
In the utility model embodiment, it is covered on glass substrate in film plating layer 2；Film plating layer 2 includes：The first film layer and
Second film layer；The first film layer is silicon thin film 3, along the direction for deviating from the first film layer, the second film of multi-layer film structure
Layer include successively：The niobium oxide of the columbium oxide film of 10~60nm thickness, the silicon oxide film of 60~160nm thickness, 70~150nm thickness
The silicon oxide film of film, the silicon oxide film of 80~200nm thickness, the columbium oxide film of 30~90nm thickness and 30~100nm thickness.
The aobvious red of the second film layer of columbium oxide film and the multi-layer film structure of silicon oxide film composition, coated surface is red, certain thick
The silicon thin film 3 of degree has good absorption, the light of the blocking non-coated surface of glass substrate to penetrate visible light, and coated surface can be complete
Fully blocking glass substrate light transmission.Therefore, cover board takes on a red color for coated surface, and the light of the non-coated surface of cover board cannot penetrate coated surface.
The utility model embodiment additionally provides a kind of electronic equipment, includes the cover board of above-mentioned technical proposal.
A kind of cover board provided by the utility model is described in detail above, for the general technology people of this field
Member, based on the idea of the embodiment of the present invention, there will be changes in the specific implementation manner and application range, to sum up institute
It states, the content of the present specification should not be construed as a limitation of the present invention.
Claims (9)
1. a kind of cover board, which is characterized in that including：Substrate and film plating layer；
The film plating layer is covered in one side surface of the substrate；
The film plating layer includes：The first film layer and the second film layer；
The first film layer and second film layer are set gradually along the direction away from the substrate；
The first film layer and second film layer have different refractive index；
The first film layer is silicon thin film；
Second film layer is multi-layer film structure；
The multi-layer film structure includes：Cross layered the second film of multilayer the first film and multilayer；
The first film and second film have different refractive index.
2. cover board according to claim 1, which is characterized in that the film plating layer is covered in the substrate and observes side backwards
Surface on.
3. cover board according to claim 1, which is characterized in that the layer of the number of plies of the first film and second film
Number is identical.
4. cover board according to claim 1, which is characterized in that the first film is columbium oxide film；
Second film is silicon oxide film.
5. cover board according to claim 4, which is characterized in that described more along the direction for deviating from the first film layer
Film structure includes successively：The columbium oxide film of 10~60nm thickness, the silicon oxide film of 60~160nm thickness, 70~150nm are thick
The oxidation of columbium oxide film, the silicon oxide film of 80~200nm thickness, the columbium oxide film of 30~90nm thickness and 30~100nm thickness
Silicon thin film；
The thickness of the first film layer is 50~300nm.
6. cover board according to claim 1, which is characterized in that the substrate is transparent substrate.
7. cover board according to claim 6, which is characterized in that the transparent substrate be glass substrate, acrylic substrate and
One kind in polycarbonate substrate.
8. cover board according to claim 1, which is characterized in that the thickness of the substrate is 0.1~3.0mm.
9. a kind of electronic equipment, which is characterized in that including the cover board described in claim 1 to 8 any one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721616206.2U CN207978218U (en) | 2017-11-28 | 2017-11-28 | A kind of cover board and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721616206.2U CN207978218U (en) | 2017-11-28 | 2017-11-28 | A kind of cover board and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207978218U true CN207978218U (en) | 2018-10-16 |
Family
ID=63771309
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721616206.2U Active CN207978218U (en) | 2017-11-28 | 2017-11-28 | A kind of cover board and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207978218U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113710035A (en) * | 2021-09-09 | 2021-11-26 | Oppo广东移动通信有限公司 | Casing, casing subassembly and electronic equipment |
-
2017
- 2017-11-28 CN CN201721616206.2U patent/CN207978218U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113710035A (en) * | 2021-09-09 | 2021-11-26 | Oppo广东移动通信有限公司 | Casing, casing subassembly and electronic equipment |
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