CN207424311U - A kind of miniaturization closely spaced array optical module - Google Patents
A kind of miniaturization closely spaced array optical module Download PDFInfo
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- CN207424311U CN207424311U CN201721550555.9U CN201721550555U CN207424311U CN 207424311 U CN207424311 U CN 207424311U CN 201721550555 U CN201721550555 U CN 201721550555U CN 207424311 U CN207424311 U CN 207424311U
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- optical module
- miniaturization
- closely spaced
- circuit boards
- high density
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Abstract
The utility model is related to a kind of miniaturization closely spaced array optical modules, including high density arrays module, high density arrays module is using 24 paths as a cell array, high density arrays module includes shell and the PCBA circuit boards by positioning column setting inside the shell, the bottom surface of PCBA circuit boards is equipped with the connector for being interconnected between plate, laser, photodiode, MCU, limiting amplifier and driving chip are integrated on PCBA circuit boards, and lens array is posted on PCBA circuit boards.In the utility model, entire module it is small-sized, you can more products in the application region of unit area are installed, save space, light-weight, rate is high.
Description
Technical field
The utility model is related to optical module technologies, and in particular to a kind of miniaturization closely spaced array optical module.
Background technology
COB is exactly CHIP ON BOARD, is exactly mounting technology on plate.Decomposition is got off, and the core of COB patterns is DICE
BOUND and WIRE BOUND, the former is patch, and the latter is wiring.
COB is the technique come from IC package industry, and principle is by sticker blade technolgy (epoxy die bonding)
First chip or optical assembly are fixed on PCB, then gold thread bonding (wirebonding) is electrically connected, last top drop
Encapsulating seals.It will be apparent that this is a kind of non-hermetically sealed encapsulation.The benefit of this technique is can to use automation.Such as optical assembly
After the hybrid integrateds such as flip chip bonding, it can regard as one " chip ".Then PCB is fixed in using COB technologies again
On.COB technologies are largely used at present, and the situation of VCSEL array is particularly used in short-distance data communication.It is integrated
Spending high silicon light can also be packaged using COB technologies.
Optical communications industry must not think little of for COB, be because meeting with bottleneck, day in the encapsulation of 40G/100G Multichannel Parallels
I invented many years ago be very suitable for very much below 10G rates production TO encapsulation, later change can not be predicted very much many years ago
Change.High-speed optical module increasingly moves towards small size high density.
Utility model content
The technical problem to be solved by the utility model is to provide a kind of miniaturization closely spaced array optical modules, solve above-mentioned ask
Topic.
The technical solution that the utility model solves above-mentioned technical problem is as follows：A kind of miniaturization closely spaced array optical module, bag
High density arrays module is included, the high density arrays module is using 24 paths as a cell array, the high density arrays mould
Block includes shell and the PCBA circuit boards by positioning column setting inside the shell, and the bottom surface of the PCBA circuit boards, which is equipped with, to be used for
The connector interconnected between plate is integrated with laser, photodiode, MCU, limiting amplifier and driving on the PCBA circuit boards
Chip, and post lens array on PCBA circuit boards.
The beneficial effects of the utility model are：In the utility model, laser, photoelectricity two are integrated on PCBA circuit boards
Pole pipe, MCU, limiting amplifier and driving chip etc., driving chip full-size are no more than 1mm × 1mm, the ruler of PCBA circuit boards
It is very little for 13mm × 13mm, although array 24 road optical channels, its size are also limited in 9mm × 7mm × 2mm in lens array
It is interior so that entirely module is small-sized, you can more products in the application region of unit area are installed, save space,
Light-weight, rate is high.
Based on the above technical solutions, the utility model can also do following improvement.
Further, the optical module is made of COB techniques.
Advantageous effect using above-mentioned further scheme is：Optical module product is using COB process programs rather than often
Rule with TOSA or ROSA, make the smaller of optical module.
Further, the high density arrays module include 24*n paths, n=1,2,3 ....
Advantageous effect using above-mentioned further scheme is：Existing optical module designing scheme is usually that single-shot is penetrated
(TOSA), it is single to receive (ROSA), transceiver (TOSA+ROSA), the optical cable transmission for pasting VECSEL and PD chip bandings, have
One common ground is confined to an independent module, even if with cable assembly array optical channel, is also equally confined to an optical module
In product, the utility model, can multiple array then using 24 tunnels as an array element, you can with according to needed for oneself
Port number or rate selection array approaches.
Further, the transmission rate per passage described all the way is 10Gbit/s.
Advantageous effect using above-mentioned further scheme is：The optical channel of array is 24 tunnels in single lens array, single channel
Optical channel rate, along with the particular array pattern of the utility model, can have this optical module product up to 10Gbit/s
Superelevation rate transmits the information of more capacity in the application region of unit area.
Further, the connector uses SAMTEC connector of the specification for 200pin.
Advantageous effect using above-mentioned further scheme is：It, can using the connector of SAMTEC as transmission signal vector
So that the advantages that this optical module has lower loss in normal work, and distorted signals is very small, and crosstalk is small.
Further, the model TIDA-00774 of the driving chip.
Advantageous effect using above-mentioned further scheme is：TIDA-00774 driving chips have high power density, small ruler
The advantages of very little.
Description of the drawings
Fig. 1 is the utility model stereogram；
Fig. 2 is the utility model top view；
Fig. 3 is the utility model bottom view.
In attached drawing, parts list represented by the reference numerals is as follows：
1st, shell, 2, lens array, 3, PCBA circuit boards, 4, connector.
Specific embodiment
The principle and feature of the utility model are described below in conjunction with attached drawing, example is served only for explaining this practicality
It is new, it is not intended to limit the scope of the utility model.
Jointly shown with Fig. 3 as shown in Figure 1, Figure 2, a kind of miniaturization closely spaced array optical module is high including high density arrays module
Using 24 paths as a cell array, high density arrays module includes shell 1 and is set by positioning column density array module
PCBA circuit boards 3 inside the shell, the bottom surface of PCBA circuit boards 3 are equipped with the connector 4 for being interconnected between plate, PCBA circuit boards
Laser, photodiode, MCU, limiting amplifier and driving chip are integrated on 3, and lens are posted on PCBA circuit boards 3
Array 2.
In the utility model embodiment, in the utility model, laser, photoelectricity two are integrated on PCBA circuit boards 3
Pole pipe, MCU, limiting amplifier and driving chip etc., driving chip full-size are no more than 1mm × 1mm, PCBA circuit boards 3
Size is 13mm × 13mm, although 24 road optical channels of array in lens array 2, its size be also limited in 9mm × 7mm ×
In 2mm so that entirely module is small-sized, you can more products in the application region of unit area are installed, are saved empty
Between, light-weight, rate is high.
In the utility model embodiment, optical module is made of COB techniques；Optical module product is using COB techniques
Scheme rather than routine with TOSA or ROSA, make the smaller of optical module.
In the utility model embodiment, high density arrays module include 24*n paths, n=1,2,3 ...；Existing light
Module design is usually that single-shot penetrates (TOSA), single reception (ROSA), transceiver (TOSA+ROSA), patch VECSEL and PD
The optical cable transmission of chip banding all there are one common ground, is confined to an independent module, even if being led to cable assembly array light
Road is also equally confined in an optical module product, and the utility model is then using 24 tunnels as an array element, Ke Yiduo
Secondary array, you can with the port number according to needed for oneself or rate selection array approaches.
In the utility model embodiment, the transmission rate of each paths is 10Gbit/s；Battle array in single lens array 2
The optical channel of row is 24 tunnels, and single channel optical channel rate, can along with the particular array pattern of the utility model up to 10Gbit/s
So that this optical module product has superelevation rate, the information of more capacity is transmitted in the application region of unit area.
In the utility model embodiment, connector 4 uses SAMTEC connector of the specification for 200pin；Using SAMTEC
Connector as transmission signal vector, can cause this optical module that in normal work, there is lower loss, distorted signals
It is very small, the advantages that crosstalk is small.
In the utility model embodiment, the model TIDA-00774 of driving chip；TIDA-00774 driving chips have
There is the advantages of high power density, small size.
The specific work process of the utility model is：
Emitting portion：The electric signal for inputting a constant bit rate is transferred to PCBA circuit boards 3 by connector, through PCBA circuit boards
Driving chip driving laser on 3 launches the modulated optical signal of respective rate, and the light letter of output is coupled into lens array 2.
It is internal with automatic power control circuit, and difference current on-off circuit exports modulation electric current to laser, and bias current occurs
Device to laser provide DC bias current, automatic power control circuit can in different temperatures and the situation of laser ageing,
Change bias current, stablize output power, and with the supervisory circuit and failure of the parameters such as bias current, transmission power
Alarm, protection circuit.
Receiving portion：Electric signal is converted by photodiode after the optical signal input module of one constant bit rate, is put through amplitude limit
The electric signal of the output phase code rate after big device.
Numerical diagnostic part：It is mainly completed by MCU numerical diagnostic part.High-precision DAC in MCU can facilitate, essence
The true work that optical module is set and controlled, by MCU, network management unit can monitor the temperature of transceiver module in real time, supply
The parameters such as the luminous power of piezoelectric voltage, laser bias current and transmitting and reception.These parameters are adopted first by Acquisition Circuit
Collection conversion, after send to the ADC input terminals of MCU, the analog voltage amount sent is converted into digital signal by adc circuit, through decoding electricity
Road is stored on the appropriate address position of memory.Information passes through I2C two-wire serials interface (clock line SCL and data cable
SDA) realize.
The above is only the preferred embodiment of the present invention, is not intended to limit the utility model, all in this practicality
Within new spirit and principle, any modifications, equivalent replacements and improvements are made should be included in the guarantor of the utility model
Within the scope of shield.
Claims (6)
1. a kind of miniaturization closely spaced array optical module, which is characterized in that including high density arrays module, the high density arrays mould
Using 24 paths as a cell array, the high density arrays module includes shell (1) and is arranged on by positioning column outer block
PCBA circuit boards (3) in shell (1), the bottom surface of the PCBA circuit boards (3) are equipped with the connector (4) for being interconnected between plate,
Laser, photodiode, MCU, limiting amplifier and driving chip are integrated on the PCBA circuit boards (3), and in PCBA
Lens array (2) is posted on circuit board (3).
2. miniaturization closely spaced array optical module according to claim 1, which is characterized in that the optical module uses COB works
Skill is made.
3. miniaturization closely spaced array optical module according to claim 1, which is characterized in that the high density arrays module bag
Include 24*n paths, n=1,2,3 ....
4. miniaturization closely spaced array optical module according to claim 3, which is characterized in that the transmission per passage described all the way
Rate is 10Gbit/s.
5. miniaturization closely spaced array optical module according to claim 1, which is characterized in that the connector (4) is using rule
Lattice are the SAMTEC connectors of 200pin.
6. miniaturization closely spaced array optical module according to claim 1, which is characterized in that the model of the driving chip
TIDA-00774。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721550555.9U CN207424311U (en) | 2017-11-20 | 2017-11-20 | A kind of miniaturization closely spaced array optical module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721550555.9U CN207424311U (en) | 2017-11-20 | 2017-11-20 | A kind of miniaturization closely spaced array optical module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207424311U true CN207424311U (en) | 2018-05-29 |
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ID=62302862
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721550555.9U Active CN207424311U (en) | 2017-11-20 | 2017-11-20 | A kind of miniaturization closely spaced array optical module |
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| Country | Link |
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| CN (1) | CN207424311U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112615675A (en) * | 2020-12-14 | 2021-04-06 | 中航光电科技股份有限公司 | Parallel wireless optical module capable of emitting light perpendicular to bottom surface |
-
2017
- 2017-11-20 CN CN201721550555.9U patent/CN207424311U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112615675A (en) * | 2020-12-14 | 2021-04-06 | 中航光电科技股份有限公司 | Parallel wireless optical module capable of emitting light perpendicular to bottom surface |
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Address after: 621000 No. 36 Yuejin Road, Sichuan, Mianyang Patentee after: Sichuan Huafeng Technology Co.,Ltd. Address before: 621000 No. 36 Yuejin Road, Sichuan, Mianyang Patentee before: SICHUAN HUAFENG ENTERPRISE GROUP Co.,Ltd. |