CN207410584U - A kind of intelligent solar conversion system integrates printed wiring board - Google Patents
A kind of intelligent solar conversion system integrates printed wiring board Download PDFInfo
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- CN207410584U CN207410584U CN201721414012.4U CN201721414012U CN207410584U CN 207410584 U CN207410584 U CN 207410584U CN 201721414012 U CN201721414012 U CN 201721414012U CN 207410584 U CN207410584 U CN 207410584U
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- layer
- wiring board
- printed wiring
- conversion system
- heat
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Abstract
The utility model provides a kind of intelligent solar conversion system and integrates printed wiring board, it is characterized in that, including ceramic substrate, the lower section of the ceramic substrate is equipped with metal buffer layer, metallic circuit figure layer, the first heat dissipating layer successively, and the top of the ceramic substrate is equipped with heat-conducting layer, the second heat dissipating layer successively；The metallic circuit figure layer is equipped with battery chip.By the effect of first heat dissipating layer, the second heat dissipating layer of the utility model, the heat conductivility that intelligent solar conversion system integrates printed wiring board is significantly improved, is remarkably improved its service life, while the utility model practicality ceramic substrate, it is more reliable and more stable.
Description
Technical field
The utility model is related to wiring board processing technique fields, and in particular to a kind of intelligent solar conversion system integrates
Printed wiring board.
Background technology
In light gathering photovoltaic power generating system, most important component is Condensation photovoltaic photoelectric conversion receiver circuit board, is made
Be the carrier of the electronic units such as Condensation photovoltaic battery, rapidly by the high temperature on Condensation photovoltaic battery surface（150 DEG C or more of temperature
Degree）Cooling fin is rapidly passed to up, so proposing requirements at the higher level to receiver circuit board material and its heat transfer property.Meanwhile
It is too thin to integrate printed wiring board material therefor layer for many intelligent solar conversion systems at present, in following process and fixed
It is easily deformed in journey, so as to cause the damage of Condensation photovoltaic battery chip.
Utility model content
In view of this, the present invention provide one kind can high efficiency and heat radiation, have efficient electric energy conversion capability the intelligent sun
Energy conversion system integrates printed wiring board.
The technical solution of the utility model is：A kind of intelligent solar conversion system integrates printed wiring board, feature
It is, including ceramic substrate, the lower section of the ceramic substrate is equipped with metal buffer layer, metallic circuit figure layer, the first heat dissipation successively
Layer, the top of the ceramic substrate are equipped with heat-conducting layer, the second heat dissipating layer successively；The metallic circuit figure layer is equipped with battery chip.
In the utility model, metal buffer layer can be such that metallic circuit figure layer is combined with ceramic circuit-board, pass through the effect energy of heat-conducting layer
Enough significantly improve the heat dissipation effect of the second heat dissipating layer.The heat-conducting layer is carbon alclad nano particle heat-conducting layer of the prior art.
Further, second heat dissipating layer is folding boron nitride heat sink.The second heat dissipating layer of the present invention, nitridation
Boron forms a kind of important III-V compound by triels boron (B) and pentels nitrogen (N).Boron nitride and stone
Ink is isoelectronic species, has the layer structure of similar graphite, the same with carbon nanomaterial, boron nitride nanometer material can also be by sky
Between dimension be roughly divided into：The nitridation of the boron nitride nanosheet (BNNNS), one-dimensional boron nitride nano-tube (BNNTs), zero dimension of two dimension
Boron fullerene.As Heat Conduction Material, boron nitride shows higher thermal conductivity (about 300 W/ (m K), and with relatively low heat
The coefficient of expansion and resistivity, good chemical stability and thermal stability (can bear 2000 DEG C), and can after surface treatment
The activating boron nitride that hydroxyl increases is obtained, excellent condition is provided for surface heat conduction processing].The utility model passes through folding nitrogen
Change the setting of boron heat sink, the cooling requirements under different working condition, more safety convenient can be met, while can be significantly improved
Heat dissipation effect.
Further, first heat dissipating layer is arranged with via hole, and the via hole electrically connects with the battery chip
It connects.
Further, the via hole penetrates through first heat dissipating layer.The via hole can be with electric power storage of the prior art
The electrical energy storages such as pond connect.
Further, the via hole inner wall is equipped with graphene-based conductive coating.Graphene-based conductive coating is according to existing
There is technology to use carbon dioxide as raw material, metal magnesium powder is reducing agent, and nano magnesia is template, by magnesium powder in titanium dioxide
Self-propagating combustion mode in carbon atmosphere, successfully prepares the graphene rich in meso-hole structure.
Further, the thickness of the heat-conducting layer is 0.3-0.5 times of the second heat dissipation layer thickness.
Further, first heat dissipating layer is diamond particles and the composite bed of calcium carbonate tiny balloon.
Further, the mass ratio of the diamond particles and calcium carbonate tiny balloon is 3:7.
The first heat dissipating layer in the present invention has high heat using the composite bed of diamond particles and calcium carbonate tiny balloon
Conductance and adjustable coefficient of thermal expansion are a kind of New Materials for Electric Packing of great competitiveness, and heat sink material can be used as extensive
Applied to high power, high packaging density device in.
With electronic product widely use and electronics it is integrated, cooling electronic component problem becomes increasingly conspicuous.Make
With in the process, heat conductivility difference can steeply rise electrical work environment temperature, influence electronic device operation stability and even make
Into device failure.The temperature of electronic component often raises 2 DEG C, reliability decrease 10%.By the present invention the first heat dissipating layer,
The effect of second heat dissipating layer significantly improves the heat conductivility that intelligent solar conversion system integrates printed wiring board, can be notable
Its service life, while the practical ceramic substrate of the present invention are improved, it is more reliable and more stable.
Description of the drawings
Fig. 1 is the structure diagram of the utility model.
Specific embodiment
The following is a combination of the drawings in the embodiments of the present utility model, and the technical scheme in the embodiment of the utility model is carried out
It clearly and completely describes, it is clear that the described embodiments are only a part of the embodiments of the utility model rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are without making creative work
All other embodiments obtained shall fall within the protection scope of the present invention.
Embodiment 1
A kind of intelligent solar conversion system integrates printed wiring board, which is characterized in that described including ceramic substrate 1
The lower section of ceramic substrate successively be equipped with metal buffer layer 2, metallic circuit figure layer 3, the first heat dissipating layer 4, the ceramic substrate it is upper
Fang Yici is equipped with heat-conducting layer 5, the second heat dissipating layer 6；The metallic circuit figure layer is equipped with battery chip 31.In the utility model, gold
Belonging to buffer layer can be such that metallic circuit figure layer is combined with ceramic circuit-board, and can significantly improve second by the effect of heat-conducting layer dissipates
The heat dissipation effect of thermosphere.The heat-conducting layer is carbon alclad nano particle heat-conducting layer of the prior art.
Further, second heat dissipating layer is folding boron nitride heat sink.The second heat dissipating layer of the present invention, nitridation
Boron forms a kind of important III-V compound by triels boron (B) and pentels nitrogen (N).Boron nitride and stone
Ink is isoelectronic species, has the layer structure of similar graphite, the same with carbon nanomaterial, boron nitride nanometer material can also be by sky
Between dimension be roughly divided into：The nitridation of the boron nitride nanosheet (BNNNS), one-dimensional boron nitride nano-tube (BNNTs), zero dimension of two dimension
Boron fullerene.As Heat Conduction Material, boron nitride shows higher thermal conductivity (about 300 W/ (m K), and with relatively low heat
The coefficient of expansion and resistivity, good chemical stability and thermal stability (can bear 2000 DEG C), and can after surface treatment
The activating boron nitride that hydroxyl increases is obtained, excellent condition is provided for surface heat conduction processing].The utility model passes through folding nitrogen
Change the setting of boron heat sink, the cooling requirements under different working condition, more safety convenient can be met, while can be significantly improved
Heat dissipation effect.
Further, first heat dissipating layer is arranged with via hole 41, and the via hole and the battery chip are electrical
Connection.
Further, the via hole penetrates through first heat dissipating layer.The via hole can be with electric power storage of the prior art
The electrical energy storages such as pond connect.
Further, the via hole inner wall is equipped with graphene-based conductive coating 411.Graphene-based conductive coating is basis
The prior art uses carbon dioxide as raw material, and metal magnesium powder is reducing agent, and nano magnesia is template, by magnesium powder in dioxy
Change self-propagating combustion mode in carbon atmosphere, successfully prepare the graphene rich in meso-hole structure.
Further, the thickness of the heat-conducting layer is 0.4 times of the second heat dissipation layer thickness.
Further, first heat dissipating layer is diamond particles and the composite bed of calcium carbonate tiny balloon.
Further, the mass ratio of the diamond particles and calcium carbonate tiny balloon is 3:7.
The first heat dissipating layer in the present invention has high heat using the composite bed of diamond particles and calcium carbonate tiny balloon
Conductance and adjustable coefficient of thermal expansion are a kind of New Materials for Electric Packing of great competitiveness, and heat sink material can be used as extensive
Applied to high power, high packaging density device in.
With electronic product widely use and electronics it is integrated, cooling electronic component problem becomes increasingly conspicuous.Make
With in the process, heat conductivility difference can steeply rise electrical work environment temperature, influence electronic device operation stability and even make
Into device failure.The temperature of electronic component often raises 2 DEG C, reliability decrease 10%.By the present invention the first heat dissipating layer,
The effect of second heat dissipating layer significantly improves the heat conductivility that intelligent solar conversion system integrates printed wiring board, can be notable
Its service life, while the practical ceramic substrate of the present invention are improved, it is more reliable and more stable.
Embodiment 2
A kind of intelligent solar conversion system integrates printed wiring board, which is characterized in that described including ceramic substrate 1
The lower section of ceramic substrate successively be equipped with metal buffer layer 2, metallic circuit figure layer 3, the first heat dissipating layer 4, the ceramic substrate it is upper
Fang Yici is equipped with heat-conducting layer 5, the second heat dissipating layer 6；The metallic circuit figure layer is equipped with battery chip 31.In the utility model, gold
Belonging to buffer layer can be such that metallic circuit figure layer is combined with ceramic circuit-board, and can significantly improve second by the effect of heat-conducting layer dissipates
The heat dissipation effect of thermosphere.The heat-conducting layer is carbon alclad nano particle heat-conducting layer of the prior art.
Further, second heat dissipating layer is folding boron nitride heat sink.
Further, first heat dissipating layer is arranged with via hole 41, and the via hole and the battery chip are electrical
Connection.
Further, the via hole penetrates through first heat dissipating layer.The via hole can be with electric power storage of the prior art
The electrical energy storages such as pond connect.
Further, the via hole inner wall is equipped with graphene-based conductive coating 411.Graphene-based conductive coating is basis
The prior art uses carbon dioxide as raw material, and metal magnesium powder is reducing agent, and nano magnesia is template, by magnesium powder in dioxy
Change self-propagating combustion mode in carbon atmosphere, successfully prepare the graphene rich in meso-hole structure.
Further, the thickness of the heat-conducting layer is 0.5 times of the second heat dissipation layer thickness.
Further, first heat dissipating layer is diamond particles and the composite bed of calcium carbonate tiny balloon.
Further, the mass ratio of the diamond particles and calcium carbonate tiny balloon is 3:7.
Embodiment 3
A kind of intelligent solar conversion system integrates printed wiring board, which is characterized in that described including ceramic substrate 1
The lower section of ceramic substrate successively be equipped with metal buffer layer 2, metallic circuit figure layer 3, the first heat dissipating layer 4, the ceramic substrate it is upper
Fang Yici is equipped with heat-conducting layer 5, the second heat dissipating layer 6；The metallic circuit figure layer is equipped with battery chip 31.In the utility model, gold
Belonging to buffer layer can be such that metallic circuit figure layer is combined with ceramic circuit-board, and can significantly improve second by the effect of heat-conducting layer dissipates
The heat dissipation effect of thermosphere.The heat-conducting layer is carbon alclad nano particle heat-conducting layer of the prior art.
Further, second heat dissipating layer is folding boron nitride heat sink.
Further, first heat dissipating layer is arranged with via hole 41, and the via hole and the battery chip are electrical
Connection.
Further, the via hole penetrates through first heat dissipating layer.The via hole can be with electric power storage of the prior art
The electrical energy storages such as pond connect.
Further, the via hole inner wall is equipped with graphene-based conductive coating 411.Graphene-based conductive coating is basis
The prior art uses carbon dioxide as raw material, and metal magnesium powder is reducing agent, and nano magnesia is template, by magnesium powder in dioxy
Change self-propagating combustion mode in carbon atmosphere, successfully prepare the graphene rich in meso-hole structure.
Further, the thickness of the heat-conducting layer is 0.3 times of the second heat dissipation layer thickness.
Further, first heat dissipating layer is diamond particles and the composite bed of calcium carbonate tiny balloon.
Further, the mass ratio of the diamond particles and calcium carbonate tiny balloon is 3:7.
It is obvious to a person skilled in the art that the utility model is not limited to the details of above-mentioned exemplary embodiment, and
And in the case of the spirit or essential attributes without departing substantially from the utility model, it can realize that this practicality is new in other specific forms
Type.Therefore, in all respects, the present embodiments are to be considered as illustrative and not restrictive, this practicality is new
The scope of type is indicated by the appended claims rather than the foregoing description, it is intended that will fall containing in the equivalent requirements of the claims
All changes in justice and scope are embraced therein.Any reference numeral in claim should not be considered as limitation
Involved claim.
Moreover, it will be appreciated that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
Using specification as an entirety, the technical solutions in each embodiment can also be properly combined, forms those skilled in the art
It is appreciated that other embodiment.It is noted that the technical characteristic not being described in detail in the utility model, can lead to
Cross any prior art realization.
Claims (8)
1. a kind of intelligent solar conversion system integrates printed wiring board, which is characterized in that including ceramic substrate, the ceramics
The lower section of substrate is equipped with metal buffer layer, metallic circuit figure layer, the first heat dissipating layer successively, and the top of the ceramic substrate is set successively
There are heat-conducting layer, the second heat dissipating layer；The metallic circuit figure layer is equipped with battery chip.
2. intelligent solar conversion system according to claim 1 integrates printed wiring board, which is characterized in that described
Two heat dissipating layers are folding boron nitride heat sink.
3. intelligent solar conversion system according to claim 1 integrates printed wiring board, which is characterized in that described
One heat dissipating layer is arranged with via hole, and the via hole is electrically connected with the battery chip.
4. intelligent solar conversion system according to claim 3 integrates printed wiring board, which is characterized in that described to lead
Through hole penetrates through first heat dissipating layer.
5. intelligent solar conversion system according to claim 4 integrates printed wiring board, which is characterized in that described to lead
Through-hole wall is equipped with graphene-based conductive coating.
6. intelligent solar conversion system according to claim 1 integrates printed wiring board, which is characterized in that described to lead
The thickness of thermosphere is 0.3-0.5 times of the second heat dissipation layer thickness.
7. intelligent solar conversion system according to claim 1 integrates printed wiring board, which is characterized in that described
One heat dissipating layer is diamond particles and the composite bed of calcium carbonate tiny balloon.
8. intelligent solar conversion system according to claim 7 integrates printed wiring board, which is characterized in that the gold
The mass ratio of hard rock particle and calcium carbonate tiny balloon is 3:7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721414012.4U CN207410584U (en) | 2017-10-30 | 2017-10-30 | A kind of intelligent solar conversion system integrates printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721414012.4U CN207410584U (en) | 2017-10-30 | 2017-10-30 | A kind of intelligent solar conversion system integrates printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207410584U true CN207410584U (en) | 2018-05-25 |
Family
ID=62408230
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721414012.4U Expired - Fee Related CN207410584U (en) | 2017-10-30 | 2017-10-30 | A kind of intelligent solar conversion system integrates printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207410584U (en) |
-
2017
- 2017-10-30 CN CN201721414012.4U patent/CN207410584U/en not_active Expired - Fee Related
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| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180525 Termination date: 20201030 |
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| CF01 | Termination of patent right due to non-payment of annual fee |