CN207398158U - Photoelectric conversion device - Google Patents
Photoelectric conversion device Download PDFInfo
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- CN207398158U CN207398158U CN201721160679.6U CN201721160679U CN207398158U CN 207398158 U CN207398158 U CN 207398158U CN 201721160679 U CN201721160679 U CN 201721160679U CN 207398158 U CN207398158 U CN 207398158U
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- heat transfer
- optical module
- photoelectric conversion
- heat
- transfer piece
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Abstract
This application provides a kind of photoelectric conversion device, including：Housing, optical module and heat transfer piece；The housing has the accommodating chamber of one end open, and the accommodating chamber has inner surface；The optical module has correspondingly sets surface with the inner surface, the heat transfer piece is sticked on the setting surface of the optical module, the heat transfer piece has the wearing layer of the inner surface in face of the accommodating chamber, and the wearing layer and the inner surface of the accommodating chamber fit；And the optical module can insert or pull out the accommodating chamber through the opening, the wearing layer can substitute the setting surface and be in contact and rub with the inner surface.The photoelectric conversion device of the application can preferably solve the problems, such as because of abrasion the heat transfer piece capacity of heat transmission to be caused to decline, and the heat so as to which optical module is generated distributes, and heat dissipation effect is preferable.
Description
Technical field
This application involves field of communication technology more particularly to a kind of photoelectric conversion devices.
Background technology
The description of this part only provide with the relevant background information of disclosure, without form the prior art.
With the progress of mechanics of communication, Communication Equipment power becomes increasing, while machine volume is less and less, therefore
The heat dissipation problem of current optical module increasingly attracts attention.
At present, to the design method of pluggable optical module, the heat for making optical module is difficult to be distributed by light cage.Due to
Optical module needs to plug repeatedly during long term maintenance with repair, the anti-friction performance of common heat-conducting interface material compared with
Difference is very easy to be worn during plugging repeatedly, this abrasion causes the capacity of heat transmission of heat-conducting interface material to incur loss.
Current pluggable optical module solves heat dissipation problem without good heat-conducting interface material, but by radiator and optical module
It contacts directly and radiates, heat distributes extremely difficult.
It should be noted that the introduction of technical background is intended merely to above it is convenient the technical solution of the application is carried out it is clear,
Complete explanation, and facilitate the understanding of those skilled in the art and illustrate.Cannot merely because these schemes the application's
Background section is set forth and thinks that above-mentioned technical proposal is known to those skilled in the art.
Utility model content
Based on foregoing prior art defect, this application provides a kind of photoelectric conversion devices, can preferably solve
The problem of because of abrasion the heat transfer piece capacity of heat transmission being caused to decline.
To achieve these goals, this application provides following technical solutions.
A kind of photoelectric conversion device, including：Housing, optical module and heat transfer piece；The housing has the appearance of one end open
Receive chamber, the accommodating chamber has inner surface；The optical module has correspondingly sets surface, the heat transfer with the inner surface
Part is sticked on the setting surface of the optical module, and the heat transfer piece has the wearing layer of the inner surface in face of the accommodating chamber,
The wearing layer and the inner surface of the accommodating chamber fit；And the optical module can insert or pull out the appearance through the opening
Receive chamber, the wearing layer can substitute the setting surface and be in contact and rub with the inner surface.
Preferably, further include：Multiple radiating fins, multiple radiating fins are arranged on the roof of the housing.
Preferably, the wearing layer includes abrasion-resistant matrix and the first heat carrier being arranged in the abrasion-resistant matrix, institute
Abrasion-resistant matrix is stated as the mixed of any one or more in organic siliconresin, acrylic resin, epoxy resin, polyamide
It closes, first heat carrier is the set of heat conduction particle.
Preferably, the hardness of the wearing layer is Shore A hardness 60 to 90.
Preferably, the heat transfer piece also have with the wearing layer mutually back to viscous layer, the heat transfer piece passes through described
Viscous layer is pasted onto the setting surface.
Preferably, the viscous layer includes viscous matrix and the second heat carrier being arranged in the viscous matrix；Institute
Viscous matrix is stated as organic siliconresin, organic pressure-sensitive gel, acrylic resin, acrylate pressure sensitive adhesive, MQ resins, tackifying resin,
The mixing of any one or more in epoxy resin, polyamide, second heat carrier are the set of heat conduction particle.
Preferably, the heat transfer piece further includes carrier supported layer, and the viscous layer and the wearing layer are separately positioned on
The both sides of the carrier supported layer.
Preferably, the carrier supported layer is Kapton, polyethylene naphthalate, PET film, PP films, copper
Any one in paper tinsel, aluminium foil, glass-fiber-fabric.
By above technical solution, the advantageous effect of the application is：Pass through the heat transfer piece that is sticked on optical module, heat transfer
Part has the wearing layer in face of accommodating inner cavity surface, thus when optical module inserts or pull out accommodating chamber through opening, wearing layer energy
Enough substitute the setting surface of heat transfer piece and the inner surface of accommodating chamber be in contact and rub, so as to avoid heat transfer piece directly with receiving
The inner surface of chamber is in contact and rubs, to prevent heat transfer piece because causing the situation that the capacity of heat transmission of heat transfer piece declines during abrasion；
Also, when optical module is plugged in accommodating chamber, wearing layer can fit with the inner surface of accommodating chamber, can reduce interface heat
Resistance, the heat so as to which optical module is generated distribute, and heat dissipation effect is preferable.
Other application field will become apparent according to description provided herein.The description of the utility model content and tool
Body example is only intended to the purpose illustrated, it is not intended that limitation the scope of the utility model.
Description of the drawings
Task of explanation is only used for attached drawing described here, and is not intended in any way limit model disclosed in the present application
It encloses.In addition, shape and proportional sizes of each component in figure etc. are only schematical, the understanding to the application is used to help, and
It is not the specific shape and proportional sizes for limiting each component of the application.Those skilled in the art, can under teachings of the present application
Various possible shapes and proportional sizes to be selected to implement the application as the case may be.In the accompanying drawings：
Fig. 1 is the dimensional structure diagram of the photoelectric conversion device of the application embodiment；
Fig. 2 is the photoelectric conversion device sectional view of the application embodiment.
Specific embodiment
It should be noted that when a parts are referred to as " being arranged at " another parts, it can be directly another
On a parts or there may also be parts placed in the middle.When a parts are considered as " connection " another parts,
It can be directly to another parts or may be simultaneously present parts placed in the middle.Term as used herein " is hung down
Directly ", " level ", "left", "right" and similar statement are for illustrative purposes based on Figure of description, are not offered as being only
One embodiment.
Unless otherwise defined, all of technologies and scientific terms used here by the article and the technical field of the application is belonged to
The normally understood meaning of technical staff is identical.The term used in the description of the present application is intended merely to description tool herein
The purpose of the embodiment of body, it is not intended that in limitation the application.Term as used herein "and/or" includes one or more
The arbitrary and all combination of relevant Listed Items.
Also referring to Fig. 1 and Fig. 2, the application embodiment provides a kind of photoelectric conversion device, can include：Shell
Body 1, optical module 2 and heat transfer piece 3, the housing 1 have the accommodating chamber 11 of one end open, and the accommodating chamber 11 has interior table
Face 12；The optical module 2 has correspondingly sets surface 21 with the inner surface 12, and the heat transfer piece 3 is sticked in the light
On the setting surface 21 of module 2, the heat transfer piece 3 has the wearing layer 31 of the inner surface 12 in face of the accommodating chamber 11, described
Wearing layer 31 and the inner surface 12 of the accommodating chamber 11 fit；And the optical module 2 can insert or pull out institute through the opening
Accommodating chamber 11 is stated, the wearing layer 31 can substitute the setting surface 21 and be in contact and rub with the inner surface 12.
The photoelectric conversion device of the application embodiment, by the heat transfer piece 3 that is sticked on optical module 2, heat transfer piece 3 has face
To the wearing layer 31 of 11 inner surface 12 of accommodating chamber, thus when optical module 2 inserts or pull out accommodating chamber 11 through opening, wearing layer
31 can substitute the setting surface 21 of heat transfer piece 3 and the inner surface 12 of accommodating chamber 11 is in contact and rubs, so as to avoid conducting heat
Part 3 is directly in contact and rubs with the inner surface of accommodating chamber 11 12, to prevent heat transfer piece 3 because causing heat transfer piece 3 during abrasion
The situation that the capacity of heat transmission declines；Also, when optical module 2 is plugged in accommodating chamber 11, wearing layer 31 can be with accommodating chamber 11
Inner surface 12 fits, and can reduce interface resistance, and the heat so as to which optical module 2 is generated distributes, heat dissipation effect
Preferably.
Solve the problem of that the heat-conducting interface material that optical module surface is arranged in optical module swapping process is easy to wear, it is open
It is entitled number for CN106932865A《A kind of stent for being used to plug optical module》A kind of optical module is provided in plug,
The technical solution that surface can be isolated with the surface of radiator base plate, the particular technique means of realization are in the same of radiator base plate
One side sets two support plates, gap adjusting mechanism is set between support plate and substrate at two, which can
The distance between optical module upper surface and stent substrate inner surface are adjusted according to actual needs.Specially：
During optical module inserts or pull out the accommodation space of stent, which can make on optical module
Surface is isolated with stent substrate inner surface, to mitigate the abrasion of the two apparent surface.
During in the accommodation space for being located in stent in optical module and in febrile state, which can make light
The upper surface of the module inner surface basic with stent is in contact, to improve radiating efficiency.
Also, in order to improve radiating efficiency, the upper surface of optical module and/or the inner surface of stent substrate are provided with interface material
Material.
The known embodiments in optical module by being used to plug the improvement in the stent progress structure of optical module, plugging
Cheng Zhong does not make the mode that heat-conducting interface material is in contact substantially with stent to avoid the abrasion of heat-conducting interface material.
And the application is designed by improving the layer structure of heat transfer piece 3, makes it have wear-resisting property preferably wearing layer
31, so as to which in 2 swapping process of optical module, wearing layer 31 substitutes the inner surface for setting surface 21 and accommodating chamber 11 of optical module 2
The mode being in contact reduces the abrasion of heat transfer piece 3, without by the gap adjusting mechanism in above-described embodiment, reaching
In the case of identical heat-conducting effect so that the structure of final products greatly simplifies.
In the present embodiment, housing 1 can substantially be square 1 shape of housing, can be made of metal material.In a reality
It applies in mode, multiple radiating fins 13 can be provided on the outer wall of housing 1, multiple radiating fins 13 can be with multiple lines and multiple rows
Form is arranged, alternatively, being arranged in the form of annular or rectangular array.
Radiating fin 13 is generally cylindrical, for example, cylindric or prism-shaped or can also be in lath-shaped, can be by gold
Belong to material to be made.By setting multiple radiating fins 13, can radiating efficiency be improved with increasing heat radiation area.
In one embodiment, wearing layer 31 can include abrasion-resistant matrix and what is be arranged in abrasion-resistant matrix first lead
Hot body.Wherein, abrasion-resistant matrix can be any one in organic siliconresin, acrylic resin, epoxy resin, polyamide
Or a variety of mixing, after above-mentioned one or more resin mixing, physical crosslinking reaction can occur, so that material hardness increases
Greatly, what surface became is smooth, is used suitable for wear-resisting.First heat carrier can be heat conduction particle set, the first heat carrier with it is wear-resisting
The volume ratio of matrix can be 40:60 to 80:Between 20.
In practice, wearing layer 31 specifically can be in organic siliconresin, acrylic resin, epoxy resin, polyamide
Any one in mixing add in one or more formation in aluminium oxide, zinc oxide, boron nitride, aluminium nitride, carborundum etc..
Further, the hardness of wearing layer 31 made of the above embodiment is larger, is specifically as follows Shore A hardness and is
Between 60 to 90, so as to provide preferably wearability.Also, the coefficient of friction of wearing layer 31 is smaller, so as in optical module 2
In swapping process, reduce frictional resistance, further reduce the abrasion generated due to frictional resistance.
As shown in Fig. 2, heat transfer piece 3 can also include with 31 phase of wearing layer back to viscous layer 32, heat transfer piece 3 can pass through
The viscous layer 32, which is pasted onto, sets surface 21.In this way, heat transfer piece 3 can reduce heat transfer preferably with surface 21 is set to fit
Interface resistance between part 3 and setting surface 21.
In one embodiment, viscous layer 32 can include viscous matrix and what is be arranged in viscous matrix second lead
Hot body.Wherein, viscous matrix can be organic siliconresin, organic pressure-sensitive gel, acrylic resin, acrylate pressure sensitive adhesive, MQ trees
The mixing of any one or more in fat, tackifying resin, epoxy resin, polyamide, above-mentioned one or more resin mix
After conjunction, physical crosslinking reaction can occur, so as to generate viscosity.Second heat carrier can be heat conduction particle set, second
The volume ratio of heat-conducting part and viscous matrix can be 50:50-85:Between 15.
In practice, viscous layer 32 specifically can be in machine silicones, organic pressure-sensitive gel, acrylic resin, acrylic pressure sensitive
Mixing adds in aluminium oxide, zinc oxide, nitrogen in any one in glue, MQ resins, tackifying resin, epoxy resin, polyamide
Change one or more formation in boron, aluminium nitride, aluminium powder, silver powder, carbon fiber, carborundum etc..
As shown in Fig. 2, heat transfer piece 3 can also include carrier supported layer 33, viscous layer 32 and wearing layer 31 are set respectively
In the both sides of carrier supported layer 33.Carrier supported layer 33 is made for providing intensity by viscous layer 32 and wearing layer 31, one
In a embodiment, carrier supported layer 33 can be Kapton, polyethylene naphthalate, PET film, PP films, copper
Any one in paper tinsel, aluminium foil, glass-fiber-fabric.
It is demonstrated experimentally that the heat transfer piece 3 of the application embodiment is fitted on optical module 2, by 50 tests of plug, pass
3 surface of warmware occurs without breakage, no dropping situations.
It is simulated by emulation experiment, 3 lower part of the heat transfer piece punching of the application embodiment is added on electric heating heater,
Heater punches respectively with radiator, inserts temperature transducer, measures metal heater after constant temperature and metal heat sink is straight
The hot temperature difference of contact, the temperature difference after heat transfer piece 3 with adding the application embodiment is compared, as shown in the table.
1 Experimental comparison's example of table
| Room temperature | Heater temperature | Radiator temperature | The temperature difference | |
| Heat transfer piece 3 without the application embodiment | 25 | 75 | 63 | 12 |
| There is the heat transfer piece 3 of the application embodiment | 25 | 71 | 65 | 6 |
Simulated experiment is found, when being not added with the heat transfer piece 3 of the application embodiment between heater and radiator, fever
Device is 12 degrees Celsius with spreader surface temperature difference.After heat transfer piece 3 of the application embodiment are added, after constant temperature,
Heater temperature is 6 degrees Celsius with the radiator temperature temperature difference, and the additional cooling extent that product is brought is up to 6 degrees Celsius, to product
Performance, reliability and stability have very big promotion.
Herein cited any digital value all include between lower limiting value to upper limit value with the lower value of an incremented and
The all values of upper value, there are the intervals of at least two units between any lower value and any much higher value.For example, such as
Fruit elaborates that the quantity of component or the value of process variable are from 1 to 90, preferably from 21 to 80, more preferably from 30 to 70, then
Purpose is equivalent in order to illustrate also clearly listing such as 15 to 85,22 to 68,43 to 51,30 to 32 in the specification.It is right
In the value less than 1, it is 0.0001,0.001,0.01,0.1 suitably to think a unit.These are only intended to clearly express
Example, it is believed that all possible combinations for the numerical value enumerated between minimum and peak are all in a similar manner at this
What specification was expressly set forth.
Unless otherwise indicated, all scopes all include all numbers between endpoint and endpoint.It is used together with scope
" about " or " approximation " be suitable for two endpoints of the scope.Thus, " about 20 to 30 " are intended to covering " about 20 to about
30 ", including at least the endpoint indicated.
It should be understood that above description is to illustrate rather than to be limited.By reading above-mentioned retouch
It states, many embodiments and many applications outside the example provided all will be aobvious and easy for a person skilled in the art
See.Therefore, the scope of this introduction should not be determined with reference to foregoing description, but should with reference to preceding claims and this
The four corner of the equivalent that a little claims are possessed determines.It is for comprehensive purpose, all articles and special with reference to including
The disclosure of profit application and bulletin is all by reference to being incorporated herein.Theme disclosed herein is omitted in preceding claims
Any aspect is not intended to abandon the body matter, also should not be considered as applicant the theme is not thought of as it is disclosed
Apply for a part for theme.
Claims (8)
1. a kind of photoelectric conversion device, which is characterized in that including：Housing, optical module and heat transfer piece；The housing has one end
The accommodating chamber of opening, the accommodating chamber have inner surface；The optical module has correspondingly sets surface with the inner surface,
The heat transfer piece is sticked on the setting surface of the optical module, and the heat transfer piece has the inner surface in face of the accommodating chamber
Wearing layer, the wearing layer and the inner surface of the accommodating chamber fit；And the optical module can be inserted into or pull out through the opening
Go out the accommodating chamber, the wearing layer can substitute the setting surface and be in contact and rub with the inner surface.
2. photoelectric conversion device as described in claim 1, which is characterized in that further include：Multiple radiating fins are multiple described scattered
Hot fin is arranged on the roof of the housing.
3. photoelectric conversion device as described in claim 1, which is characterized in that the wearing layer includes abrasion-resistant matrix and setting
The first heat carrier in the abrasion-resistant matrix, first heat carrier are the set of heat conduction particle.
4. photoelectric conversion device as described in claim 1, which is characterized in that the hardness of the wearing layer is Shore A hardness 60
To 90.
5. photoelectric conversion device as described in claim 1, which is characterized in that the heat transfer piece also has and the wearing layer phase
Back to viscous layer, the heat transfer piece is pasted onto the setting surface by the viscous layer.
6. photoelectric conversion device as claimed in claim 5, which is characterized in that the viscous layer includes viscous matrix and setting
The second heat carrier in the viscous matrix；Second heat carrier is the set of heat conduction particle.
7. photoelectric conversion device as claimed in claim 5, which is characterized in that the heat transfer piece further includes carrier supported layer, institute
It states viscous layer and the wearing layer is separately positioned on the both sides of the carrier supported layer.
8. photoelectric conversion device as claimed in claim 7, which is characterized in that the carrier supported layer for Kapton,
Any one in polyethylene naphthalate, PET film, PP films, copper foil, aluminium foil, glass-fiber-fabric.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721160679.6U CN207398158U (en) | 2017-09-12 | 2017-09-12 | Photoelectric conversion device |
| US16/127,853 US10566262B2 (en) | 2017-09-12 | 2018-09-11 | Thermal interface materials with wear-resisting layers and/or suitable for use between sliding components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721160679.6U CN207398158U (en) | 2017-09-12 | 2017-09-12 | Photoelectric conversion device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207398158U true CN207398158U (en) | 2018-05-22 |
Family
ID=62416169
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721160679.6U Active CN207398158U (en) | 2017-09-12 | 2017-09-12 | Photoelectric conversion device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207398158U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107611213A (en) * | 2017-09-12 | 2018-01-19 | 天津莱尔德电子材料有限公司 | Photoelectric conversion device |
| US10555439B2 (en) | 2017-11-02 | 2020-02-04 | Laird Technologies, Inc. | Thermal interface materials with reinforcement for abrasion resistance and/or suitable for use between sliding components |
| WO2022218203A1 (en) * | 2021-04-13 | 2022-10-20 | 华为技术有限公司 | Thermally conductive member, optical module, radiator and preparation method for thermally conductive member |
-
2017
- 2017-09-12 CN CN201721160679.6U patent/CN207398158U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107611213A (en) * | 2017-09-12 | 2018-01-19 | 天津莱尔德电子材料有限公司 | Photoelectric conversion device |
| CN107611213B (en) * | 2017-09-12 | 2024-02-23 | 天津莱尔德电子材料有限公司 | Photoelectric conversion device |
| US10555439B2 (en) | 2017-11-02 | 2020-02-04 | Laird Technologies, Inc. | Thermal interface materials with reinforcement for abrasion resistance and/or suitable for use between sliding components |
| WO2022218203A1 (en) * | 2021-04-13 | 2022-10-20 | 华为技术有限公司 | Thermally conductive member, optical module, radiator and preparation method for thermally conductive member |
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