CN207398091U - A kind of chip wafer processing unit (plant) - Google Patents
A kind of chip wafer processing unit (plant) Download PDFInfo
- Publication number
- CN207398091U CN207398091U CN201721536821.2U CN201721536821U CN207398091U CN 207398091 U CN207398091 U CN 207398091U CN 201721536821 U CN201721536821 U CN 201721536821U CN 207398091 U CN207398091 U CN 207398091U
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- CN
- China
- Prior art keywords
- platform
- chip
- processing
- station
- mounting table
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model provides a kind of chip wafer processing unit (plant), by setting security fence, and is provided in security fence conveying robot, into magazine, processing platform and goes out magazine；Processing platform will be transported to from into magazine for processing chip using manipulator, and complete the grinding operation of chip, then the chip after grinding is transported to out magazine, so as to complete the full-automatic grinding process of chip wafer.
Description
Technical field
The utility model is related to semiconductor applications more particularly to a kind of chip wafer processing unit (plant)s.
Background technology
It is in life now, under the progress of Science and Technology Day crescent benefit, robot and the arm maximum area for having the mankind
It is not that flexibility ratio and resistance to dynamics, that is, the sharpest edges of manipulator recursive do same action in the positive reason of machinery
It will not always feel tired under condition, the application of manipulator also will be more and more extensive.
The manufacture of semiconductor crystal wafer chip includes：Semiconductor crystal wafer is cut down from crystal, followed by many companies
The procedure of processing of continuous removal material.These procedure of processings be in order to obtain surface as smooth as possible, semiconductor crystal wafer it is flat
The semiconductor crystal wafer of row side and offer with rounding seamed edge.The procedure of processing of the removal material usually considered includes：Partly lead
Seamed edge rounding, grinding or twin grinding, etching and the polishing of body wafer.In the processing operation of semiconductor crystal wafer chip, exist
Substantial amounts of repeated labor, it is more demanding simultaneously for operating environment, manipulator is applied in the processing operation of chip wafer
It is the trend of current social development, while also needs to general sex chromosome mosaicism and safety problem in processing operation etc..
Utility model content
In order to solve the above-mentioned technical problem, the utility model provides a kind of chip wafer processing unit (plant).
The utility model is realized with following technical solution：
A kind of chip wafer processing unit (plant), including security fence and the conveying robot being arranged in security fence, into
Magazine, processing platform and go out magazine；The conveying robot and the processing platform are controlled by control device；The carrying implement
Tool hand is communicated to connect with the processing platform with the control device.
Further, it is described into magazine and it is described go out magazine be placed in the side of the processing platform, it is described into magazine, go out
Space where magazine and the processing platform is the working space of the conveying robot；The conveying robot is used for will
Processing platform is positioned over into the chip to be processed taking-up in magazine, and the finished chip taking-up after processing platform is processed is positioned over
Go out magazine；
The processing platform is used to be processed chip to be processed, and fixed frame is equipped on the processing platform, described
A grinding knife tool is disposed on fixed frame, the grinding knife tool is in the plane internal rotation parallel to the fixed frame, the fixed frame
On also set up single-revolution platform, multiple mounting tables are set on the revolving platform, can be placed on each mounting table one it is to be processed
Chip；
Sliding slot and sliding block are mounted at the top of the revolving platform, the mounting table bottom is fixedly connected with a slide block, the placement
Platform is moved by sliding block along sliding slot compared with the revolving platform；
Each sliding slot is set along the radial direction of the revolving platform, and the sliding block is close to the position at revolving platform center
For the first station, the position away from revolving platform center is second station；
The conveying robot includes hoistable platform, large arm, middle arm, forearm and end effector, the hoistable platform bag
A lifting shaft is included, the large arm is connected by the first revolute pair and lifting axis connection, the middle arm by the second revolute pair and large arm
It connects, the forearm is connected by the 3rd revolute pair with middle arm, and the end effector is connected by a prismatic pair with forearm, described
End effector crawl generation processing chip；
The revolving platform sets the first gravity sensor and the second gravity sensitive respectively at the first station and second station
Device, first gravity sensor and the second gravity sensor communicate to connect respectively with the control device；
When on the mounting table that generation processing chip is placed on revolving platform by conveying robot, mounting table is located at the first work at this time
Position, first gravity sensor are experienced and send feedback signal, the control device control to the control device after gravity
Slide block movement, so as to which mounting table be driven to be moved to second station；
Further, equally sent out after the second gravity sensor at second station experiences gravity to the control device
Go out feedback signal, the grinding knife tool operation of the control device control processing platform；
After machining, the control device control slide block movement, so as to which mounting table be driven to move again to the first station,
Revolving platform is rotated simultaneously, so as to which the finished chip after processing to be transferred out of to the scope of grinding knife tool operation, and will be subsequent
Generation processing chip is turned in the range of grinding knife tool operation；
The conveying robot obtains the finished chip after processing from the first station, is drawn off being positioned over out magazine；
Further, when the mounting table is in the first station or second station, the top view projection of the mounting table
It is entirely located within the top view projection of the revolving platform.
The beneficial effects of the utility model are：
The utility model provides a kind of chip wafer processing unit (plant), by setting security fence, and is set in security fence
It is equipped with conveying robot, into magazine, processing platform and goes out magazine；Using manipulator will for processing chip from being transported into magazine plus
Work platform completes the grinding operation of chip, then the chip after grinding is transported to out magazine, so as to complete chip wafer
Full-automatic grinding process.
Description of the drawings
Fig. 1 is a kind of chip wafer processing unit (plant) overall schematic provided in this embodiment；
Fig. 2 is conveying robot structure diagram provided in this embodiment；
Fig. 3 is revolving platform structure diagram provided in this embodiment.
Specific embodiment
It is new to this practicality below in conjunction with attached drawing to make the purpose of this utility model, technical solution and advantage clearer
Type is described in further detail.
A kind of chip wafer processing unit (plant) as shown in Figs. 1-3, including security fence 1 and is arranged in security fence
Conveying robot 2 into magazine 3, processing platform 4 and goes out magazine 5；The conveying robot 2 and the processing platform 4 are controlled by
Control device 100；The conveying robot 2 is communicated to connect with the processing platform 4 with the control device 100.
Further, it is described into magazine 3 and it is described go out magazine 5 be placed in the side of the processing platform 4, it is described into magazine
3rd, go out magazine 5 and 4 place space of the processing platform be the conveying robot 2 working space；The handling machinery
Hand into the taking-up of chip to be processed 6 in magazine 3 for that will be positioned over processing platform 4, and the finished product core after processing platform 4 is processed
Piece taking-up is positioned over out magazine；
The processing platform is used to be processed chip to be processed, and fixed frame 7 is equipped on the processing platform, described
A grinding knife tool 8 is disposed on fixed frame 7, the grinding knife tool 8 is in the plane internal rotation parallel to the fixed frame, the fixation
Single-revolution platform 9 is also set up on frame, multiple mounting tables 10 on the revolving platform 9 are set, one can be placed on each mounting table
Chip to be processed；
The conveying robot 2 includes hoistable platform 11, large arm 12, middle arm 13, forearm 14 and end effector 15, described
Hoistable platform 11 includes a lifting shaft 16, and the large arm 12 is connected by the first revolute pair with lifting shaft 61, and the middle arm 13 is logical
It crosses the second revolute pair to be connected with large arm 12, the forearm 14 is connected by the 3rd revolute pair with middle arm 13, the end effector
15 are connected by a prismatic pair with forearm 14；The end effector captures generation processing chip using sucker structure；
9 top of revolving platform is mounted with sliding slot 91 and sliding block 92, and 10 bottom of mounting table is fixedly connected with a slide block, institute
Mounting table is stated to move compared with the revolving platform along sliding slot by sliding block；
Each sliding slot is set along the radial direction of the revolving platform, and the sliding block is close to the position at revolving platform center
For the first station, i.e. sliding block is located at sliding slot close to the one end at revolving platform center, and the position away from revolving platform center is second station,
I.e. sliding block is located at the other end of the sliding slot away from revolving platform center；
The revolving platform sets the first gravity sensor and the second gravity sensitive respectively at the first station and second station
Device, first gravity sensor and the second gravity sensor communicate to connect respectively with the control device；
When on the mounting table that generation processing chip is placed on revolving platform by conveying robot, mounting table is located at the first work at this time
Position, first gravity sensor are experienced and send feedback signal, the control device control to the control device after gravity
Slide block movement will drive mounting table to be moved to second station；
Further, equally sent out after the second gravity sensor at second station experiences gravity to the control device
Go out feedback signal, the grinding knife tool operation of the control device control processing platform；
After machining, the control device control slide block movement, so as to which mounting table be driven to move again to the first station,
Revolving platform is rotated simultaneously, so as to which the finished chip after processing to be transferred out of to the scope of grinding knife tool operation, and will be subsequent
Generation processing chip is turned in the range of grinding knife tool operation；
The conveying robot obtains the finished chip after processing from the first station, is drawn off being positioned over out magazine.
Further, when the mounting table is in the first station or second station, the top view projection of the mounting table
It is entirely located within the top view projection of the revolving platform.
Above disclosed is only the utility model preferred embodiment, cannot limit the utility model with this certainly
Interest field, therefore equivalent variations made according to the utility model claims still belong to the scope that the utility model is covered.
Claims (4)
1. a kind of chip wafer processing unit (plant), it is characterised in that：Including security fence and the carrying being arranged in security fence
Manipulator into magazine, processing platform and goes out magazine；The conveying robot and the processing platform are controlled by control device；
The conveying robot is communicated to connect with the processing platform with the control device；
It is described into magazine and it is described go out magazine be placed in the side of the processing platform, it is described into magazine, go out magazine and described
Space where processing platform is the working space of the conveying robot；The conveying robot is used to treat into magazine
Processing chip taking-up is positioned over processing platform；
The processing platform is equipped with fixed frame, the fixation for being processed to chip to be processed on the processing platform
A grinding knife tool is disposed on frame, the grinding knife tool is gone back in the plane internal rotation parallel to the fixed frame, the fixed frame
Single-revolution platform is set, multiple mounting tables are set on the revolving platform, a chip to be processed can be placed on each mounting table；
The conveying robot includes hoistable platform, large arm, middle arm, forearm and end effector, and the hoistable platform includes one
Lifting shaft, the large arm are connected by the first revolute pair and lifting axis connection, the middle arm by the second revolute pair with large arm, institute
It states forearm to be connected with middle arm by the 3rd revolute pair, the end effector is connected by a prismatic pair with forearm, the end
Actuator crawl generation processing chip；
Sliding slot and sliding block are mounted at the top of the revolving platform, the mounting table bottom is fixedly connected with a slide block, and the mounting table leads to
Sliding block is crossed to move compared with the revolving platform along sliding slot；
Each sliding slot is set along the radial direction of the revolving platform, and the sliding block is the close to the position at revolving platform center
One station, the position away from revolving platform center are second station.
2. a kind of chip wafer processing unit (plant) according to claim 1, it is characterised in that：The revolving platform is in the first station
With the first gravity sensor and the second gravity sensor are set respectively at second station.
3. a kind of chip wafer processing unit (plant) according to claim 2, it is characterised in that：First gravity sensor and
Second gravity sensor communicates to connect respectively with the control device；When conveying robot will be placed on revolving platform for processing chip
Mounting table on, mounting table is located at the first station at this time, and first gravity sensor fills after experiencing gravity to the control
It puts and sends feedback signal, the control device control slide block movement will drive mounting table to be moved to second station；Work as second station
Second gravity sensor at place equally sends feedback signal, the control device control after experiencing gravity to the control device
The grinding knife tool operation of processing platform；After machining, the control device control slide block movement, so as to drive mounting table again
The first station is moved to, while revolving platform is rotated, so as to which the finished chip after processing is transferred out of grinding knife tool operation
Scope, and processing of subsequent generation chip is turned in the range of grinding knife tool operation；The conveying robot is from the first station
The finished chip after processing is obtained, is drawn off being positioned over out magazine.
4. a kind of chip wafer processing unit (plant) according to claim 3, it is characterised in that：
When the mounting table is in the first station or second station, the top view projection of the mounting table is entirely located in described return
Within the top view projection of turntable.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721536821.2U CN207398091U (en) | 2017-11-16 | 2017-11-16 | A kind of chip wafer processing unit (plant) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721536821.2U CN207398091U (en) | 2017-11-16 | 2017-11-16 | A kind of chip wafer processing unit (plant) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207398091U true CN207398091U (en) | 2018-05-22 |
Family
ID=62323817
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721536821.2U Expired - Fee Related CN207398091U (en) | 2017-11-16 | 2017-11-16 | A kind of chip wafer processing unit (plant) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207398091U (en) |
-
2017
- 2017-11-16 CN CN201721536821.2U patent/CN207398091U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180522 Termination date: 20191116 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |