CN207402587U - A kind of grinding wafer system - Google Patents
A kind of grinding wafer system Download PDFInfo
- Publication number
- CN207402587U CN207402587U CN201721525877.8U CN201721525877U CN207402587U CN 207402587 U CN207402587 U CN 207402587U CN 201721525877 U CN201721525877 U CN 201721525877U CN 207402587 U CN207402587 U CN 207402587U
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- CN
- China
- Prior art keywords
- magazine
- conveying robot
- processing platform
- platform
- processed
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Mechanical Treatment Of Semiconductor (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model provides a kind of grinding wafer system, it is characterised in that：Including security fence, multiple IR intrusion detectors and the conveying robot being arranged in security fence are provided on the security fence, into magazine, processing platform and goes out magazine；The conveying robot and the processing platform are controlled by control device；It is described into magazine for storing for processed wafer, it is described go out magazine for storing the chip processed；The conveying robot is used into magazine, processing platform and go out operation between magazine, and by being provided with manipulator control unit in the conveying robot, the manipulator control unit is communicated to connect with the control device, so that the conveying robot is controlled by the control device, so as to complete the full-automatic grinding process of chip.
Description
Technical field
The utility model is related to semiconductor applications more particularly to a kind of grinding wafer systems.
Background technology
It is in life now, under the progress of Science and Technology Day crescent benefit, robot and the arm maximum area for having the mankind
It is not that flexibility ratio and resistance to dynamics, that is, the sharpest edges of manipulator recursive do same action in the positive reason of machinery
It will not always feel tired under condition, the application of manipulator also will be more and more extensive.
The manufacture of semiconductor wafer includes：Semiconductor crystal wafer is cut down from crystal, followed by many continuous
Remove the procedure of processing of material.These procedure of processings are to obtain the parallel sides on surface as smooth as possible, semiconductor wafer
The semiconductor wafer of face and offer with rounding seamed edge.The procedure of processing of the removal material usually considered includes：Semiconductor die
Seamed edge rounding, grinding or twin grinding, etching and the polishing of piece.In the processing operation of semiconductor wafer, there are substantial amounts of weights
Renaturation is worked, more demanding simultaneously for operating environment, and it is today's society hair manipulator to be applied in the processing operation of chip
The trend of exhibition, while also need to general sex chromosome mosaicism and safety problem in processing operation etc..
Utility model content
In order to solve the above-mentioned technical problem, the utility model provides a kind of grinding wafer system.
The utility model is realized with following technical solution：
A kind of grinding wafer system, including security fence, be provided on the security fence multiple IR intrusion detectors and
The conveying robot that is arranged in security fence into magazine, processing platform and goes out magazine；The conveying robot and the processing
Platform is controlled by control device；It is described into magazine for storing for processed wafer, it is described go out magazine for storing what is processed
Chip；The conveying robot is used into magazine, processing platform and go out operation between magazine, the conveying robot with it is described
Processing platform communicates to connect with the control device and is controlled by the control device；
The conveying robot includes hoistable platform, large arm, middle arm, forearm and end effector, the hoistable platform bag
A lifting shaft is included, the large arm is connected by the first revolute pair and lifting axis connection, the middle arm by the second revolute pair and large arm
It connects, the forearm is connected by the 3rd revolute pair with middle arm, and the end effector is connected by a prismatic pair with forearm, described
End effector crawl for processed wafer, the conveying robot using multiple servomotors come drive hoistable platform, large arm,
Middle arm, forearm and end effector movement.
Further, it is described into magazine and it is described go out magazine be placed in the side of the processing platform, it is described into magazine, go out
Space where magazine and the processing platform is the working space of the conveying robot；The conveying robot is used for will
Processing platform is positioned over into the chip to be processed in magazine, and the finished product chip after processing platform is processed is positioned over out magazine；
The processing platform is processed for treating processed wafer, and fixed frame is equipped on the processing platform, described
A grinding knife tool is disposed on fixed frame, the grinding knife tool is in the plane internal rotation parallel to the fixed frame, the fixed frame
On also set up single-revolution platform, multiple mounting tables are set on the revolving platform, can be placed on each mounting table one it is to be processed
Chip；
Manipulator control unit, the manipulator control unit and the control device are provided in the conveying robot
Communication connection, so that the conveying robot is controlled by the control device.
Further, the manipulator control unit includes programmable controller, joint sensors, data acquisition and processing
Unit and servo-driver, the joint sensors, data acquisition and processing unit and servo-driver are and PLC technology
Device communication connects and is controlled by programmable controller, and the joint sensors are used to detect revolute pair and the movement of conveying robot
Secondary motion data, and detection data are sent to the data acquisition and processing unit, the data acquisition and processing unit will
The data sending handled well gives the programmable controller, and the programmable controller controls servo-driver to drive servo electric
Machine operation.
Preferably, the programmable controller is PLC controller.
The beneficial effects of the utility model are：
The utility model provides a kind of grinding wafer system, including security fence, is provided on the security fence multiple
IR intrusion detector and the conveying robot being arranged in security fence into magazine, processing platform and go out magazine；The carrying
Manipulator and the processing platform are controlled by control device；It is described into magazine for storing for processed wafer, it is described go out magazine
For storing the chip processed；The conveying robot is used into magazine, processing platform and go out operation between magazine, and leads to
It crosses in the conveying robot and is provided with manipulator control unit, the manipulator control unit communicates with the control device
Connection, so that the conveying robot is controlled by the control device, so as to complete the full-automatic grinding process of chip.
Description of the drawings
Fig. 1 is a kind of grinding wafer system overall schematic provided in this embodiment；
Fig. 2 is conveying robot structure diagram provided in this embodiment；
Fig. 3 is the schematic diagram of manipulator control unit provided in this embodiment.
Specific embodiment
It is new to this practicality below in conjunction with attached drawing to make the purpose of this utility model, technical solution and advantage clearer
Type is described in further detail.
A kind of grinding wafer system as shown in Figs. 1-3, including security fence 1, is provided with multiple red on the security fence
Outer alarm 111 and the conveying robot 2 being arranged in security fence into magazine 3, processing platform 4 and go out magazine 5；It is described
Conveying robot and the processing platform are controlled by control device 100；It is described to be used to store for processed wafer 6, institute into magazine
State out magazine for store the chip that processes；The conveying robot is used into magazine, processing platform and go out between magazine
Operation, the conveying robot communicate to connect with the control device with the processing platform and are controlled by the control and fill
It puts；
The conveying robot 2 includes hoistable platform 11, large arm 12, middle arm 13, forearm 14 and end effector 15, described
Hoistable platform 11 includes a lifting shaft 16, and the large arm 12 is connected by the first revolute pair with lifting shaft 61, and the middle arm 13 is logical
It crosses the second revolute pair to be connected with large arm 12, the forearm 14 is connected by the 3rd revolute pair with middle arm 13, the end effector
15 are connected by a prismatic pair with forearm 14；The end effector is captured using sucker structure for processed wafer, described to remove
Fortune manipulator drives hoistable platform, large arm, middle arm, forearm and end effector to move using multiple servomotors 205.
It is described into magazine and it is described go out magazine be placed in the side of the processing platform, it is described into magazine, go out magazine and
Space where the processing platform is the working space of the conveying robot；The conveying robot is for will be into magazine
Chip to be processed be positioned over processing platform, and the finished product chip after processing platform is processed is positioned over out magazine.
The processing platform is processed for treating processed wafer, and fixed frame 7 is equipped on the processing platform, described
A grinding knife tool 8 is disposed on fixed frame 7, the grinding knife tool 8 is in the plane internal rotation parallel to the fixed frame, the fixation
Single-revolution platform 9 is also set up on frame, multiple mounting tables 10 on the revolving platform 9 are set, one can be placed on each mounting table
Chip to be processed；
Manipulator control unit, the manipulator control unit and the control device are provided in the conveying robot
Communication connection, so that the conveying robot is controlled by the control device.
Further, the manipulator control unit 200 includes programmable controller 201, joint sensors 202, data
Acquisition and processing unit 203 and servo-driver 204, the joint sensors, data acquisition and processing unit and servo-drive
Device communicates with programmable controller and connects and be controlled by programmable controller, and the joint sensors are used to detect handling machinery
The revolute pair of hand and prismatic pair exercise data, and detection data are sent to the data acquisition and processing unit, the data
Acquisition and processing unit give the data sending handled well to the programmable controller, and the programmable controller control servo is driven
Dynamic device drives servomotor operation.
Preferably, the programmable controller is PLC controller.
Above disclosed is only the utility model preferred embodiment, cannot limit the utility model with this certainly
Interest field, therefore equivalent variations made according to the utility model claims still belong to the scope that the utility model is covered.
Claims (3)
1. a kind of grinding wafer system, it is characterised in that：Including security fence, multiple infrared reports are provided on the security fence
Alert device and the conveying robot being arranged in security fence into magazine, processing platform and go out magazine；The conveying robot
Control device is controlled by with the processing platform；It is described into magazine for storing for processed wafer, it is described go out magazine for depositing
Put the chip processed；The conveying robot is used into magazine, processing platform and go out operation between magazine, the carrying implement
Tool hand communicates to connect with the control device with the processing platform and is controlled by the control device；
The conveying robot includes hoistable platform, large arm, middle arm, forearm and end effector, and the hoistable platform includes one
Lifting shaft, the large arm are connected by the first revolute pair and lifting axis connection, the middle arm by the second revolute pair with large arm, institute
It states forearm to be connected with middle arm by the 3rd revolute pair, the end effector is connected by a prismatic pair with forearm, the end
Actuator crawl for processed wafer, the conveying robot using multiple servomotors come drive hoistable platform, large arm, in
Arm, forearm and end effector movement；
Manipulator control unit is provided in the conveying robot, the manipulator control unit communicates with the control device
Connection, so that the conveying robot is controlled by the control device；The manipulator control unit includes PLC technology
Device, joint sensors, data acquisition and processing unit and servo-driver, the joint sensors, data acquisition and processing are single
Member and servo-driver are communicated with programmable controller to be connected and is controlled by programmable controller, and the joint sensors are used for
The revolute pair of conveying robot and prismatic pair exercise data are detected, and detection data are sent to the data acquisition and processing list
Member, the data acquisition and processing unit are by the data sending handled well to the programmable controller, the PLC technology
Device controls servo-driver to drive servomotor operation.
2. a kind of grinding wafer system according to claim 1, it is characterised in that：
It is described into magazine and it is described go out magazine be placed in the side of the processing platform, it is described into magazine, go out magazine and described
Space where processing platform is the working space of the conveying robot；The conveying robot is used to treat into magazine
Processed wafer is positioned over processing platform, and the finished product chip after processing platform is processed is positioned over out magazine；
The processing platform is processed for treating processed wafer, and fixed frame, the fixation are equipped on the processing platform
A grinding knife tool is disposed on frame, the grinding knife tool is gone back in the plane internal rotation parallel to the fixed frame, the fixed frame
Single-revolution platform is set, multiple mounting tables are set on the revolving platform, a chip to be processed can be placed on each mounting table.
3. a kind of grinding wafer system according to claim 1, it is characterised in that：
The programmable controller is PLC controller.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721525877.8U CN207402587U (en) | 2017-11-16 | 2017-11-16 | A kind of grinding wafer system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721525877.8U CN207402587U (en) | 2017-11-16 | 2017-11-16 | A kind of grinding wafer system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207402587U true CN207402587U (en) | 2018-05-25 |
Family
ID=62317493
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721525877.8U Expired - Fee Related CN207402587U (en) | 2017-11-16 | 2017-11-16 | A kind of grinding wafer system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207402587U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109358862A (en) * | 2018-10-09 | 2019-02-19 | 盐城盈信通科技有限公司 | A kind of burning device for software storage |
| CN114654118A (en) * | 2022-03-22 | 2022-06-24 | 无锡星微科技有限公司 | High-acceleration air floatation platform capable of being used for bearing large-size heavy load |
-
2017
- 2017-11-16 CN CN201721525877.8U patent/CN207402587U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109358862A (en) * | 2018-10-09 | 2019-02-19 | 盐城盈信通科技有限公司 | A kind of burning device for software storage |
| CN114654118A (en) * | 2022-03-22 | 2022-06-24 | 无锡星微科技有限公司 | High-acceleration air floatation platform capable of being used for bearing large-size heavy load |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180525 Termination date: 20191116 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |