CN207372924U - A kind of sapphire substrate sheet double-sided polisher - Google Patents
A kind of sapphire substrate sheet double-sided polisher Download PDFInfo
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- CN207372924U CN207372924U CN201720959000.3U CN201720959000U CN207372924U CN 207372924 U CN207372924 U CN 207372924U CN 201720959000 U CN201720959000 U CN 201720959000U CN 207372924 U CN207372924 U CN 207372924U
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- polishing
- sapphire substrate
- substrate sheet
- plummer
- ramming head
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Abstract
The utility model provides a kind of sapphire substrate sheet double-sided polisher, and described device from top to bottom includes upper polishing assembly, polishing locating template and lower polishing assembly successively；Wherein upper polishing assembly includes ramming head, and ramming head immobilising device and the rotational cylinder bearing being connected with ramming head immobilising device are equipped at the top of ramming head, and ramming head both ends are equipped with the abrasive material inlet port of the first ramming head of perforation；The lower polishing assembly includes mill and polishing plummer, and mill is placed on polishing plummer, and middle part is equipped with rolling bearing below the polishing plummer, and the polishing plummer one side is equipped with the abrasive reclaiming pipeline of perforation polishing plummer.Device described in the utility model can carry out single-sided polishing to the two panels sapphire substrate sheet of fitting, add the sapphire substrate sheet quantity disposably polished, improve production efficiency.
Description
Technical field
The utility model belongs to sapphire manufacture field, is related to a kind of sapphire substrate sheet double-sided polisher.
Background technology
With the continuous progress of electronics and photovoltaic industry downstream technique, for sapphire substrate sheet demand increasingly
It is high.While machining accuracy is ensured, production efficiency is also constantly improved.
It is current domestic, to the processing of wafer and sapphire substrate sheet to have based on the chemically mechanical polishing of wax (CMP).There is wax
Polishing is divided into solid state wax and liquid wax two ways, the mode of solid state wax make we for sapphire substrate sheet machining accuracy not
It is good to control, and liquid wax can uniformly and effectively control cere thickness with machining accuracy, but even wax machine meeting in coating procedure
A big chunk slop wax is caused, and is taken long, efficiency is low.In single-sided polishing technique, typically use and serve as a contrast sapphire
Egative film is adhered on ceramic wafer, and sapphire substrate sheet is achieved the effect that polishing on one side by the abrasive material of certain grain size.This
The productivity of sapphire substrate sheet single-sided polishing is limited in the very big degree of kind method.
CN 102513906A disclose a kind of sapphire substrate polishing device and glossing, and the indigo plant that will be polished is precious
Stone lining bottom is pasted onto with wax on substrate fixed disk, and polishing obtained surface roughness by single reaches nano level sapphire lining
Bottom.CN 101604666A disclose a kind of Sapphire Substrate and polishing method and application.But existing sapphire polishing is
Single-sided polishing technique, patch wax polishing time longer its greatly reduce sapphire production efficiency.Also, in process of production can
Substantial amounts of slop wax is generated, performance is also irregular.
Therefore, how single-sided polishing quickly to be carried out to sapphire substrate sheet, improves the problem of production efficiency is urgent need to resolve.
Utility model content
For the problem that the patch wax polishing time present in existing sapphire substrate sheet glossing is long, low production efficiency,
The utility model provides a kind of double-sided polisher of sapphire substrate sheet.Device described in the utility model can be to fitting
Two panels sapphire substrate sheet carries out single-sided polishing, adds the sapphire substrate sheet quantity disposably polished, improves production efficiency.
For this purpose, the utility model uses following technical scheme：
The utility model provides a kind of sapphire substrate sheet double-sided polisher, and described device from top to bottom includes successively
Upper polishing assembly, polishing locating template and lower polishing assembly；Wherein upper polishing assembly includes ramming head, consolidates at the top of ramming head equipped with ramming head
Determine device and the rotational cylinder bearing being connected with ramming head immobilising device, the abrasive material that ramming head both ends are equipped with the first ramming head of perforation enters
Mouthful；The lower polishing assembly includes mill and polishing plummer, and mill is placed on polishing plummer, below the polishing plummer
Middle part is equipped with rolling bearing, and the polishing plummer one side is equipped with the abrasive reclaiming pipeline of perforation polishing plummer.
Wherein, the abrasive reclaiming pipeline is used to recycle the abrasive material flowed down in polishing process；It is placed in polishing locating template
Polished sapphire substrate sheet.
Below as the preferred technical solution of the utility model, but not as the limit of technical solution provided by the utility model
System, by the following technical programs, can preferably reach and realize the technical purpose and advantageous effect of the utility model.
As the preferred technical solution of the utility model, abrasive material delivery pipe is equipped with above the abrasive material inlet port, is used for
To abrasive material inlet port conveying grinding material.
As the preferred technical solution of the utility model, the polishing locating template is fixed on throwing by template immobilising device
Between optical assembly and bearing assembly.
As the preferred technical solution of the utility model, pass through tooth between the polishing locating template and template immobilising device
Wheel occlusion.
As the preferred technical solution of the utility model, polishing cloth is posted on the ramming head and mill.
The processing method of device described in the utility model is as follows：
Fitting together on one side of need not polishing of the pending sapphire substrate sheet of two panels is placed in polishing locating template
Locating slot in, be placed between polishing assembly and lower polishing assembly, and pass through template immobilising device and be fixed.By rotational cylinder
Bearing and rolling bearing drive polishing assembly and lower polishing assembly to rotate respectively, and single-sided polishing is carried out to sapphire substrate sheet.
It is more specifically：
(1) liquid wax is coated without the one side of polishing in sapphire substrate sheet and toasted, obtain single side face and be covered with
The sapphire substrate sheet of liquid wax；
(2) step (1) described single side is covered with the one side of the coating liquid wax of the sapphire substrate sheet of liquid wax with it is another
Piece sapphire substrate sheet is bonded and is squeezed without the one side of polishing, and cooling is subsequently placed in the positioning of polishing locating template
It in slot, is placed between polishing assembly and lower polishing assembly, and passes through template immobilising device and be fixed.By rotational cylinder bearing and
Rolling bearing drives polishing assembly and lower polishing assembly to rotate respectively, and single-sided polishing is carried out to sapphire substrate sheet.
Wherein, the diameter of ramming head used about 600mm, in Twp-sided polishing machine rotational cylinder bearing rotating speed for 50rpm/min~
60rpm/min, rolling bearing rotating speed be 50rpm/min~70rpm/min, polish pressure be 20psi~30psi, polishing time
For 0.5h~3h.
The double-sided polisher can polish every time 94 inches sapphire substrate sheet or 38 2 inches of sapphire
Substrate slice.
Compared with prior art, the utility model has the advantages that：
The a piece of sapphire substrate sheet of each slot position is replaced with two panels sapphire substrate sheet by the utility model, can not only be obtained
It, can also be while saving has the usage amount of wax in wax polishing, further to the chip that apparent mass is good and flatness is superior
The production capacity of production is improved, improves production efficiency.
Description of the drawings
Fig. 1 is the structure diagram of sapphire substrate sheet double-sided polisher described in the utility model embodiment 1；
Wherein, 1- polishes locating template, 2- ramming heads, 3- ramming head immobilising devices, 4- rotational cylinder bearings, the entrance of 5- abrasive materials
Mouthful, 6- mills, 7- polishing plummers, 8- rolling bearings, 9- abrasive reclaiming pipelines, 10- abrasive material delivery pipes, 11- template fixators
Part.
Specific embodiment
For the utility model is better described, the technical solution of the utility model is readily appreciated, below to the utility model
It is further described.But following embodiments is only the simple example of the utility model, does not represent or limit this practicality
New rights protection scope, scope of protection of the utility model are subject to claims.
The utility model specific embodiment mode part provides a kind of sapphire substrate sheet double-sided polisher and its place
Reason method, described device from top to bottom include upper polishing assembly, polishing locating template 1 and lower polishing assembly successively；Wherein upthrow
Optical assembly includes ramming head 2, and 2 top of ramming head is equipped with ramming head immobilising device 3 and the rotational cylinder axis being connected with ramming head immobilising device 3
4 are held, 2 both ends of ramming head are equipped with the abrasive material inlet port 5 of perforation ramming head 2；The lower polishing assembly includes mill 6 and polishing plummer 7,
Mill 6 is placed on polishing plummer 7, and the 7 lower section middle part of polishing plummer is equipped with rolling bearing 8, the polishing plummer 7 one
Side is equipped with the abrasive reclaiming pipeline 9 of perforation polishing plummer 7.
It is below the utility model typical case but non-limiting example：
Embodiment 1：
A kind of sapphire substrate sheet double-sided polisher and its processing method are present embodiments provided, as shown in Figure 1, described
Device from top to bottom includes upper polishing assembly, polishing locating template 1 and lower polishing assembly successively；Wherein upper polishing assembly includes throwing
First 2,2 top of ramming head is equipped with ramming head immobilising device 3 and the rotational cylinder bearing 4 being connected with ramming head immobilising device 3,2 liang of ramming head
End is equipped with the abrasive material inlet port 5 of perforation ramming head 2；The lower polishing assembly includes mill 6 and polishing plummer 7, and mill 6 is placed in throwing
On light plummer 7, the 7 lower section middle part of polishing plummer is equipped with rolling bearing 8, and 7 one side of the polishing plummer is equipped with perforation
Polish the abrasive reclaiming pipeline 9 of plummer 7；5 top of abrasive material inlet port is equipped with abrasive material delivery pipe 10；The polishing positioning mould
Plate 1 is fixed on by template immobilising device 11 between polishing assembly and bearing assembly.
The present embodiment, by cutting into slices, being ground, after the throwing of chamfering, copper and annealing, selects 18 using 4 inches sapphire crystal bars
It is cleaned, selects to carry out patch wax using Machine for throwing wax, filled using above-mentioned CMP twin polishings skill sapphire substrate sheet twin polishing
It puts and sapphire substrate sheet is polished.
The present embodiment carries out at 35 DEG C~40 DEG C, and specific operation process is as follows：
(1) thickness of pending sapphire substrate sheet is measured, and records data one by one, in a piece of sapphire substrate sheet not
The one side spin coating liquid wax ABR-4016 being polished, wax spray rotating speed are 1500rpm/min, and even wax rotating speed is 3000rpm/min,
Wax used time 10s is got rid of in rotation, is obtained the liquid wax layer that thickness is 2.5 μm, is pasted wax used time 5min；To obtained liquid wax layer 220
Patch wax baking is carried out at DEG C, 30s is toasted, obtains the sapphire substrate sheet that single side face is covered with liquid wax；
(2) step (1) described single side is covered with the one side of the coating liquid wax of the sapphire substrate sheet of liquid wax with it is another
Piece sapphire substrate sheet is squeezed without one side patch merga pass air sac pressing sizing 10s, the squeeze pressure 0.2MPa of polishing
After finishing, coherent two panels sapphire substrate sheet is carried out to the cooling of 3min；
(3) 18 sapphire substrate sheets are bonded two-by-two using the method for step (1)-(2), are then placed in two-sided throwing
In hole slot on the polishing locating template 1 of ray machine, start to polish after loading whole hole slots, it is two-sided that each polishing template can put 9pcs
Coherent sapphire substrate sheet is fixed by template immobilising device 11.By rotational cylinder bearing 4 and rolling bearing 8
Upper polishing assembly and the rotation of lower polishing assembly are driven respectively, and single-sided polishing is carried out to sapphire substrate sheet.
Polish pressure 25psi is controlled in polishing process, rotating speed 55rpm/min, speed of grinding plate 60rpm/ on polishing machine
Min, polish abrasive grain size are 100nm, measure abrasive material proportion 1.257, pH value 10.8, and polish abrasive flow velocity about 0.8L/min is thrown
36.5 ± 0.5 DEG C of light temperature polishes 1 hour of duration.
After completing to the polishing of sapphire substrate sheet, sapphire substrate sheet is split with the mode of heating, and is cleaned, it is right
18 4 inches sapphire substrate pieces after cleaning carry out visual examination and mechanical parameter is examined.
Visual examination result：The burnishing surface of 18 sapphire substrate sheets has 2 to scratch, no pitting and other bad；
Mechanical parameter inspection result is：The burnishing surface removal amount of sapphire substrate sheet is at 3 μm~4 μm after polishing, TTV (total thickness deviation)
For parameter in 0.5 μm~3.2 μm, LTV parameters (the partly flat degree in surface) reach the ginseng of substrate slice in 0.5 μm~0.8 μm
Number processing criterion.
Entire work flow takes 68min, 4 inches sapphire substrate piece process time about 4min of monolithic, wastage in bulk or weight in total
Wax amount is 7.2mL.
As can be seen that a piece of sapphire substrate sheet of each slot position is replaced with two panels Sapphire Substrate by the utility model
Piece can not only obtain the chip that apparent mass is good and flatness is superior, can also save the usage amount that has wax in wax polishing
Meanwhile the production capacity of production is further improved, improve production efficiency.
Applicant states that the utility model illustrates the detailed process equipment of the utility model and work by above-described embodiment
Skill flow, but the utility model is not limited to above-mentioned detailed process equipment and technological process, that is, does not mean that the utility model
Having to rely on above-mentioned detailed process equipment and technological process could implement.Person of ordinary skill in the field is it will be clearly understood that right
Any improvement of the utility model, the adding of equivalence replacement and auxiliary element to each raw material of the utility model product, specific side
Selection of formula etc. is all fallen within the scope of protection of the utility model and the open scope.
Claims (5)
1. a kind of sapphire substrate sheet double-sided polisher, which is characterized in that described device from top to bottom includes upper polishing successively
Component, polishing locating template (1) and lower polishing assembly；Wherein upper polishing assembly includes ramming head (2), is equipped with and throws at the top of ramming head (2)
Cephalostat part (3) and the rotational cylinder bearing (4) being connected with ramming head immobilising device (3), ramming head (2) both ends are equipped with perforation and throw
The abrasive material inlet port (5) of head (2)；The lower polishing assembly includes mill (6) and polishing plummer (7), and mill (6) is placed in polishing
On plummer (7), middle part is equipped with rolling bearing (8) below the polishing plummer (7), and described polishing plummer (7) one side is set
There is the abrasive reclaiming pipeline (9) of perforation polishing plummer (7).
2. sapphire substrate sheet double-sided polisher according to claim 1, which is characterized in that the abrasive material inlet port
(5) top is equipped with abrasive material delivery pipe (10).
3. sapphire substrate sheet double-sided polisher according to claim 1, which is characterized in that the polishing locating template
(1) it is fixed on by template immobilising device (11) between polishing assembly and bearing assembly.
4. sapphire substrate sheet double-sided polisher according to claim 3, which is characterized in that the polishing locating template
(1) engaged gears are passed through between template immobilising device (11).
5. sapphire substrate sheet double-sided polisher according to claim 1, which is characterized in that the ramming head (2) and mill
Disk posts polishing cloth on (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720959000.3U CN207372924U (en) | 2017-08-02 | 2017-08-02 | A kind of sapphire substrate sheet double-sided polisher |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720959000.3U CN207372924U (en) | 2017-08-02 | 2017-08-02 | A kind of sapphire substrate sheet double-sided polisher |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207372924U true CN207372924U (en) | 2018-05-18 |
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ID=62341757
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| CN201720959000.3U Active CN207372924U (en) | 2017-08-02 | 2017-08-02 | A kind of sapphire substrate sheet double-sided polisher |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109333367A (en) * | 2018-11-13 | 2019-02-15 | 江苏利泷半导体科技有限公司 | The working method of full-automatic amorphous processing procedure polishing system |
| CN109722220A (en) * | 2018-12-18 | 2019-05-07 | 上海映智研磨材料有限公司 | The method of wax recycling and reusing in semiconductor substrate grinding and polishing |
| CN109732462A (en) * | 2018-12-28 | 2019-05-10 | 江苏澳洋顺昌集成电路股份有限公司 | A kind of processing method of large-sized wafer |
| CN113496868A (en) * | 2020-04-03 | 2021-10-12 | 重庆超硅半导体有限公司 | Method for cleaning polished silicon wafer |
-
2017
- 2017-08-02 CN CN201720959000.3U patent/CN207372924U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109333367A (en) * | 2018-11-13 | 2019-02-15 | 江苏利泷半导体科技有限公司 | The working method of full-automatic amorphous processing procedure polishing system |
| CN109722220A (en) * | 2018-12-18 | 2019-05-07 | 上海映智研磨材料有限公司 | The method of wax recycling and reusing in semiconductor substrate grinding and polishing |
| CN109732462A (en) * | 2018-12-28 | 2019-05-10 | 江苏澳洋顺昌集成电路股份有限公司 | A kind of processing method of large-sized wafer |
| CN113496868A (en) * | 2020-04-03 | 2021-10-12 | 重庆超硅半导体有限公司 | Method for cleaning polished silicon wafer |
| CN113496868B (en) * | 2020-04-03 | 2023-03-10 | 重庆超硅半导体有限公司 | Method for cleaning polished silicon wafer |
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Address after: 201616 No. 1-15, Lane 150, dingsong Road, Songjiang District, Shanghai Patentee after: Shanghai Chaosi Semiconductor Co.,Ltd. Address before: 201604 No. 158, Lane 258, Shuangjin Road, Shihudang Town, Songjiang District, Shanghai Patentee before: SHANGHAI ADVANCED SILICON TECHNOLOGY Co.,Ltd. |