CN207369408U - A kind of circuit board and a kind of net substrate - Google Patents
A kind of circuit board and a kind of net substrate Download PDFInfo
- Publication number
- CN207369408U CN207369408U CN201720248358.5U CN201720248358U CN207369408U CN 207369408 U CN207369408 U CN 207369408U CN 201720248358 U CN201720248358 U CN 201720248358U CN 207369408 U CN207369408 U CN 207369408U
- Authority
- CN
- China
- Prior art keywords
- net
- circuit board
- layer
- substrate
- metal pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 36
- 239000010410 layer Substances 0.000 claims abstract description 36
- 239000002184 metal Substances 0.000 claims abstract description 30
- 229910052751 metal Inorganic materials 0.000 claims abstract description 30
- 239000012790 adhesive layer Substances 0.000 claims abstract description 20
- 238000004080 punching Methods 0.000 claims abstract description 6
- 238000004026 adhesive bonding Methods 0.000 claims abstract description 5
- 238000013213 extrapolation Methods 0.000 claims abstract description 4
- 238000003825 pressing Methods 0.000 claims abstract description 3
- 238000005520 cutting process Methods 0.000 claims description 11
- 238000003698 laser cutting Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 3
- 238000003801 milling Methods 0.000 claims description 3
- 238000012545 processing Methods 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- 239000010432 diamond Substances 0.000 claims description 2
- 239000012528 membrane Substances 0.000 claims description 2
- 238000007747 plating Methods 0.000 claims description 2
- 239000002356 single layer Substances 0.000 claims description 2
- 238000009941 weaving Methods 0.000 claims description 2
- 125000006850 spacer group Chemical group 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 238000003486 chemical etching Methods 0.000 abstract description 2
- 230000000694 effects Effects 0.000 abstract description 2
- 230000017525 heat dissipation Effects 0.000 abstract description 2
- 230000007613 environmental effect Effects 0.000 abstract 1
- 239000000126 substance Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000003912 environmental pollution Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- VIKNJXKGJWUCNN-XGXHKTLJSA-N norethisterone Chemical compound O=C1CC[C@@H]2[C@H]3CC[C@](C)([C@](CC4)(O)C#C)[C@@H]4[C@@H]3CCC2=C1 VIKNJXKGJWUCNN-XGXHKTLJSA-N 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Laminated Bodies (AREA)
Abstract
The utility model is on a kind of circuit board and a kind of net substrate.The circuit board includes：Metal pattern layer, is to cut out circuitous pattern in metallic film；Adhesive layer, for the gluing piece that insulate；Metal pattern layer and the adhesive layer pressing is bonded as one.The net substrate includes：Hollow out conductive layer, is that circuitous pattern one spacing of extrapolation of the circuit board along the metal pattern layer is cut the adhesive layer to form；Substrate web, is the woven wire or metallic plate punching net of high density braided.The advantages of circuit board avoids chemical etching technology, reduces cost environmental protection, and the net substrate has good heat dissipation effect, light-weight, flexibility, low manufacture cost, can be used in the field of circuit boards that positional precision is less than 0.1mm.
Description
Technical field
A kind of circuit board is the utility model is related to, more particularly to the circuit board that chemical attack is not required and using net as base
The circuit board at bottom.
Background technology
Printed circuit board (PCB) is a kind of basic material of electronics industry, its processing technology is complicated, of high cost, especially there is chemistry
Corrosion, welding.Analyze its production technology, and consider the cutting of existing milling machine, punching machine cutting, laser cutting precision
The precision of chemical attack is approached, so the existing production technology using chemical attack as core has fallen under suspicion.
CN201520963598.4 is it is proposed that a kind of printed circuit board (PCB) using net as substrate in the prior art, but it is made
Make the limitation that method does not jump out chemical attack PCB Production still, cause of high cost, pollution environment.
It can be seen from the above that existing printed circuit board (PCB), it is clear that there are environmental pollution, it is of high cost the defects of, and be urgently subject into
One step is improved.Therefore, the designer proposes a kind of circuit board of new structure, and a kind of electricity using net as substrate of new structure
Road plate, i.e. net substrate, solve the problems, such as that existing printed circuit board (PCB) cost is high, pollutes environment, solve available circuit plate heat dissipation effect
The problem of bad.By constantly research, design, and after studying sample repeatedly and improving, the practical valency of really tool is created finally
The utility model of value.
Utility model content
The main purpose of the utility model is that the problem of overcoming high existing printed circuit board (PCB) cost, pollution environment, together
When solve the difficulties of CN201520963598.4 productions, and provide a kind of circuit board of new structure, and new structure with net
For the printed circuit board (PCB) of substrate, net substrate is named as.
The purpose of this utility model and its technical problem is solved using following technical scheme to realize.According to this practicality
A kind of circuit board of new proposition, it is characterised in that it includes：Metal pattern layer, is to cut out circuitous pattern in metallic film；
Adhesive layer, for the gluing piece that insulate；And the metal pattern layer and adhesive layer pressing are bonded as one.
Further, the adhesive layer is several layers of prepreg or high temperature resistant glued membrane.
Further, the metal pattern layer can pass through welding resistance, gold-plated, tin plating, organic guarantor welds film（OSP）, punching processing.
Further, the cutting method of the metal pattern layer has milling machine cutting, punching machine cutting, laser cutting.
Further, the metal pattern layer is the circuitous pattern or multi-disc metal that piece of metal film is cut out
Film cuts out circuitous pattern and is composed.
The utility model proposes a kind of net substrate, including the described circuit board of such scheme, it is characterised in that including：
Substrate web and closely bond the hollow out conductive layer in the substrate web, the hollow out conductive layer be by the circuit board described in
Circuitous pattern one spacing of extrapolation of metal pattern layer is cut the adhesive layer and is formed.
Further, the substrate web is metal net or Metal-Piercing net, its mesh is square or diamond shape, its weaving square
Formula is plain weave or tiltedly knits or satin weave that its net type is plain weave net or seat type net or hooks flower net or stretching nets, its number of plies netted is
Monolayer net or multiple-level stack net, its mesh density are -60 mesh of 5 mesh, and string diameter is 0.05 millimeter -1 millimeter.
Further, the thickness of the circuit board, which is subject to facilitate, is welded needs and component that substrate web directly contacts, is
0.1-0.3 millimeters.
Further, the adhesive layer had both been bonded the metal pattern layer, was also bonded the substrate web.
From above technical scheme, a kind of the utility model-circuit board and a kind of net substrate are at least with following excellent
Point：Circuit board and the net substrate avoids chemical etching technology, cost-effective, free from environmental pollution.At the same time the net substrate after
Held CN201520963598.4 heat-sinking capability it is strong, light, soft the advantages that, while the adhesive layer had both been bonded the metallic pattern
Layer, is also bonded the substrate web, the manufacture craft of the net substrate greatly simplifies.
Described above is only the general introduction of technical solutions of the utility model, in order to better understand the skill of the utility model
Art means, and being practiced according to the content of specification, with the preferred embodiment of the utility model and coordinate attached drawing detailed below
Describe in detail bright as after.
Brief description of the drawings
Fig. 1 is a kind of metal pattern layer top view illustration of circuit board of the utility model first embodiment.
Fig. 2 is a kind of circuit board top view illustration of the utility model first embodiment.
Fig. 3 is a kind of net substrate top view illustration of the utility model second embodiment.
Fig. 4 is a kind of net substrate front view schematic diagram of the utility model second embodiment.
1st, the blank parts 4 after metal pattern layer 2, adhesive layer 3, adhesive layer hollow out, the sky after metal pattern layer hollow out
5 substrate web of white part
Embodiment
Such as a kind of metal pattern layer top view signal for circuit board that the first embodiment that Fig. 1 is the utility model proposes
Figure, metal pattern layer（1）Using the copper foil of 0.1mm thickness, by cutting, the square of centre is cut off, forms metal pattern layer
Cut the blank parts after hollow out（4）.Metal pattern layer as shown in Figure 1 is bonded in whole adhesive layer, is formed such as Fig. 2 institutes
Show the utility model proposes circuit board, black is illustrated as adhesive layer（2）.
Again along metal pattern layer on the basis of circuit board as shown in Figure 2（1）Circuitous pattern extrapolate spacing cutting institute
State adhesive layer and form such as Fig. 3 figures,（1）For metal pattern layer,（2）Black edge strip is illustrated as remaining adhesive layer after cutting, black
The width of color edge strip is exactly " one spacing of extrapolation ", this spacing is exactly to insulate spacing for 0.2 millimeter,（3）For gluing
Blank parts after layer hollow out.Figure as shown in Figure 3 is bonded in whole substrate web（5）On, form this practicality as shown in Figure 4
The net substrate of new proposition.Substrate web in the present embodiment（5）Using copper mesh, mesh density is 60 mesh, and string diameter is 0.1 milli
Rice, adhesive layer（3）0.1 millimeter of thickness.
The above, is only two embodiments of the utility model, and not the utility model is made in any form
Limitation, any person skilled in the art, is not departing from the range of technical solutions of the utility model, when using above-mentioned
The technology contents of announcement make a little change or are modified to the equivalent embodiment of equivalent variations, as long as being without departing from the utility model
The content of technical solution, any simple modification, the equivalent change made according to the technical essence of the utility model to above example
Change and modification, in the range of still falling within technical solutions of the utility model.
Claims (9)
1. a kind of circuit board, it is characterised in that it includes：Metal pattern layer, is to cut out circuitous pattern in metallic film；Gluing
Layer, for the gluing piece that insulate；And the metal pattern layer and adhesive layer pressing are bonded as one.
2. circuit board according to claim 1, it is characterised in that the adhesive layer is several layers of prepreg or high temperature resistant
Glued membrane.
3. circuit board according to claim 1, it is characterised in that the metal pattern layer can pass through welding resistance, it is gold-plated, tin plating,
Organic guarantor welds film, punching processing.
4. circuit board according to claim 1, it is characterised in that the cutting method of the metal pattern layer have milling machine cutting,
Punching machine cutting, laser cutting.
5. circuit board according to claim 1, it is characterised in that the metal pattern layer is that piece of metal film is cut out
Circuitous pattern or multi-disc metallic film cut out circuitous pattern and be composed.
6. a kind of net substrate, including any circuit boards of the claims 1-5, it is characterised in that including：Substrate web and
Closely bond the hollow out conductive layer in the substrate web, the hollow out conductive layer is along the metallic pattern by the circuit board
Circuitous pattern one spacing of extrapolation of layer is cut the adhesive layer and is formed.
7. net substrate according to claim 6, it is characterised in that the substrate web is metal net or Metal-Piercing net,
Its mesh is square or diamond shape, its weaving manner is plain weave or tiltedly knits or satin weave, its net type be plain weave net or seat type net or
Flower net or stretching nets is hooked, its number of plies netted is monolayer net or multiple-level stack net, its mesh density is -60 mesh of 5 mesh, string diameter 0.05
- 1 millimeter of millimeter.
8. net substrate according to claim 6, it is characterised in that the thickness of the circuit board is to facilitate be welded needs and base
Subject to the component that spacer screen directly contacts, 0.1-0.3 millimeters.
9. net substrate according to claim 6, it is characterised in that the adhesive layer had both been bonded the metal pattern layer, also glued
Connect the substrate web.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720248358.5U CN207369408U (en) | 2017-03-15 | 2017-03-15 | A kind of circuit board and a kind of net substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720248358.5U CN207369408U (en) | 2017-03-15 | 2017-03-15 | A kind of circuit board and a kind of net substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207369408U true CN207369408U (en) | 2018-05-15 |
Family
ID=62424306
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720248358.5U Expired - Fee Related CN207369408U (en) | 2017-03-15 | 2017-03-15 | A kind of circuit board and a kind of net substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207369408U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107072037A (en) * | 2017-03-15 | 2017-08-18 | 西华大学 | A kind of circuit board and a kind of net substrate |
-
2017
- 2017-03-15 CN CN201720248358.5U patent/CN207369408U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107072037A (en) * | 2017-03-15 | 2017-08-18 | 西华大学 | A kind of circuit board and a kind of net substrate |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108495456A (en) | A kind of single layer wiring board flexible LED rope light and its production method | |
| CN105263259B (en) | It is a kind of using net as the printed circuit board of substrate | |
| CN101630716B (en) | Platy LED metal substrate, platy LED light emitting device and manufacturing method thereof | |
| CN207369408U (en) | A kind of circuit board and a kind of net substrate | |
| CN206879195U (en) | A kind of heat radiating type heat conducting circuit board | |
| CN104363707A (en) | Method for manufacturing high-heat-dissipativity LED baseplate | |
| CN103906344A (en) | Heat-conductive two-side circuit board | |
| CN105657965A (en) | Printed circuit boards having profiled conductive layer and methods of manufacturing same | |
| CN103249265B (en) | A kind of blind hole filling perforation method | |
| CN107072037A (en) | A kind of circuit board and a kind of net substrate | |
| CN205305215U (en) | Use printed circuit board of net as basement | |
| CN108184310A (en) | The production method of transparent flexible multi-layer PCB | |
| CN105407637A (en) | Flexible printed circuit (FPC) jointed board and jointed board design method thereof | |
| CN209358825U (en) | A kind of circuit network of self-forming conductive path | |
| CN209374479U (en) | Full resigning light emitting diode support plate | |
| CN201306682Y (en) | Heat-dissipating LED module plate | |
| CN203896578U (en) | Heat conduction-type double-sided circuit board | |
| CN108712815A (en) | A kind of circuit network of self-forming conductive path | |
| CN105228339A (en) | Reverse side main line is double-faced flexible LED circuit board and the production technology of metal wire knitted | |
| CN204558531U (en) | Light-emitting type packaging structure | |
| US20220377888A1 (en) | Transparent package for use with printed circuit boards | |
| CN204291576U (en) | A kind of integrated circuit board | |
| CN212876194U (en) | Flexible circuit board | |
| CN102913791B (en) | Distributed type safety setting method of LED (light emitting diode) daylight light source board driven by IC (integrated circuit) | |
| CN218975087U (en) | Glass substrate for local dimming |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180515 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |