CN209374479U

CN209374479U - Full resigning light emitting diode support plate

Info

Publication number: CN209374479U
Application number: CN201821909482.2U
Authority: CN
Inventors: 李家铭
Original assignee: Yuxiong Semiconductor Co Ltd
Current assignee: Norpei Semiconductor Co., Ltd
Priority date: 2018-11-20
Filing date: 2018-11-20
Publication date: 2019-09-10
Anticipated expiration: 2028-11-20

Abstract

The utility model provides a kind of full resigning light emitting diode support plate, it includes a substrate, substrate has multiple LED carrying items extended in a first direction, there is a fluting between wantonly two adjacent and arranged side by side LED carrier strips, each LED carrier strip has multiple LED carrying areas arranged in the first direction and multiple faces to be cut between wantonly two adjacent LEDs supporting region, and each LED supporting region has at least a pair of electric contact being electrically connected for an at least LED crystal particle and the circuit structure being electrically connected with electric contact.Wherein, those faces to be cut LED carrier strip where it out of the ordinary, and those electric contacts and those circuit structures are not through those faces to be cut, avoid generating metal burr in subsequent cutting whereby.

Description

Full resigning light emitting diode support plate

Technical field

The utility model is about a kind of optical diode support plate, especially with regard to a kind of surface adhesion type light-emitting diode (SMD LED) support plate.

Background technique

Being made for light emitting diode (hereinafter referred to as LED) can be divided into the manufacture of upstream epitaxy, the manufacture of middle reaches crystal grain and downstream envelope Dress test and system assembles, wherein when LED grain manufacture after the completion of, LED grain can be adhered to light emitting diode support plate (with Lower abbreviation LED support plate) on, after a series of production processes such as die bond, solidification, routing, sealing, cutting, light-emitting diodes are made Tube assembly (hereinafter referred to as LED component).

Fig. 1, Fig. 2 are please referred to, existing LED support plate has (the hereinafter referred to as LED carrying of multiple LED carrying areas Area), a face to be cut is had between adjacent LED supporting region, it, can will along face to be cut with cutter after the completion of die package LED support plate is cut into multiple LED components.

However, can not be removed in existing LED support plate for fear of the circuit structure in cell wall with exposure development technology, therefore Before cutting, it will form the circuit structure across multiple faces to be cut in cell wall, and after this causes LED support plate to cut, LED component Edge is easy to produce metal burr (as shown in Figure 3), increases fraction defective.

Utility model content

In view of this, the main purpose of the utility model is to provide a kind of LED support plates that can improve metal burr problem.

In order to reach above-mentioned purpose, the utility model provides a kind of full resigning light emitting diode support plate comprising a base Plate, substrate have multiple LED carrying items (hereinafter referred to as LED carrier strip) extended in a first direction, and wantonly two is adjacent And there is a fluting between LED carrier strip arranged side by side, each LED carrier strip has multiple light emitting diodes arranged in the first direction Supporting region (hereinafter referred to as LED supporting region) and multiple faces to be cut between wantonly two adjacent LEDs supporting region, each LED carrying Area has at least a pair of electric contact being electrically connected for an at least LED crystal particle (hereinafter referred to as LED grain) and connects with electricity The circuit structure that point is electrically connected.Wherein, those faces to be cut distinctly LED carrier strip where it, and those electric contacts And those circuit structures are not through those faces to be cut.

The utility model is by making way for face to be cut for the circuit structure in LED support plate, to be formed such as in cell wall Bit architecture is allowed entirely as zebra-stripe, so can avoid generating metal burr in subsequent cutting, solves puzzlement industry for a long time Burr Problem.

The detailed content of other effects and embodiment in relation to the utility model, cooperation schema are described as follows.

Detailed description of the invention

In order to illustrate the technical solutions in the embodiments of the present application or in the prior art more clearly, to embodiment or will show below There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this The some embodiments recorded in application, for those of ordinary skill in the art, without creative efforts, It can also be obtained according to these attached drawings other attached drawings.

Fig. 1 is the schematic diagram of prior art LED support plate.

Fig. 2 is the partial enlarged view of prior art LED support plate.

Fig. 3 is the schematic diagram after the cutting of prior art LED support plate.

Fig. 4 is the schematic diagram of the utility model resigning LED support plate entirely.

Figure the 5th is the partial enlarged view of the utility model resigning LED support plate entirely.

Symbol description

10 substrate, 11 LED carrier strip

111 cell walls 12 fluting

13 electric contact, 14 circuit structure

15 LED supporting region D first directions

S face to be cut

Specific embodiment

Positional relationship described in embodiment below, comprising: on, under, left and right, if being all without specializing On the basis of the direction that component in schema is painted.

Please refer to Fig. 4, Fig. 5, a disclosed wherein embodiment for the utility model resigning LED support plate entirely, the full resigning LED support plate for example can be applied to the encapsulation procedure of SMD LED component, which includes a substrate 10, with multiple one There is between wantonly two adjacent and arranged side by side LED carrier strips 11 the LED carrier strip 11 that first direction D extends 12, the LED that slots to hold Carrier strip 11 has the cell wall 111 for defining those flutings 12, and substrate 10 may have the LED carrier strip 11 on a column or a column one, The both ends of each column LED carrier strip 11 can be connected by substrate frame.Substrate 10 itself has one layer or more insulating layer and one Or multilayer circuit layer, these insulation layers epoxy resin in this way, glass cloth (woven glas s), polyester or other it is usually used in making Make the material of board substrate, circuit layer includes the electric contact 13 being electrically connected for LED grain and electrically connects with electric contact 13 The circuit structure 14 connect.

Each LED carrier strip 11 have multiple LED supporting regions 15 along first direction D arrangement and it is multiple be located at it is wantonly two adjacent Face S to be cut between LED supporting region 15, each LED supporting region 15 have at least a pair of electric contact 13 and with electric contact 13 The circuit structure 14 of electric connection, the logarithm of electric contact 13 is depending on the LED grain quantity carried needed for each LED component, often One of them in a pair of of electric contact 13 is electrically connected for the pole p of LED grain, and another one then extremely electrically connects for the n of LED grain It connects, some of circuit structure 14 is formed in LED carrier strip 11 then equally spaced from each otherly and defines on the cell wall 111 of fluting 12.

Wherein, LED carrier strip of those face S to be cut where it and abut the flutings of the LED carrier strip two sides 12, those face S to be cut are typically normal to first direction D, increase the service efficiency of substrate whereby, but are not limited thereto.Its In, electric contact 13 and circuit structure 14 do not pass through those face S to be cut.In possible embodiment, each LED carrier strip The part of non-metal reinforcement substrate (figure is not painted) or other metals for circuit may be contained in 11 or LED supporting region 15, But the part of these metals also without pass through face S to be cut.

It is aobvious to expose during production electric contact 13 and circuit structure 14 in a kind of possible embodiment Shadow technology collocation scattering light (and non-normal light), and improve exposure energy and expose pattern required out, cell wall 111 will be located at whereby On partial metal layers (such as layers of copper) removed in subsequent development step, to be formed on cell wall 111 such as zebra Bit architecture is allowed entirely as line, so can avoid generating metal burr in subsequent cutting, solves the burr of puzzlement industry for a long time Problem.

Embodiment described above and/or embodiment are only the preferable realities to illustrate to realize the utility model technology Example and/or embodiment are applied, not the embodiment of the utility model technology is made any form of restriction, any this field Technical staff, in the range for not departing from technological means disclosed in the content of the present invention, when can make a little change or modification For other equivalent embodiments, but still it should be regarded as technology identical with the utility model in essence or embodiment.

Claims

1. a kind of full resigning light emitting diode support plate characterized by comprising

One substrate, with multiple LED carrying items extended in a first direction, the wantonly two adjacent and arranged side by side hairs There is a fluting, respectively the LED carrying item has multiple hairs along first direction arrangement between optical diode carrier strip Optical diode supporting region and multiple faces to be cut between the wantonly two adjacent LED carrying areas, respectively this shines Diode supporting region is electric at least a pair of electric contact being electrically connected for an at least LED crystal particle and with the electric contact Property connection circuit structure；

Wherein, those faces to be cut LED carrying item where it out of the ordinary, those electric contacts and those circuit knots Structure is not through those faces to be cut.

2. full resigning light emitting diode support plate as described in claim 1, which is characterized in that have no any metal in the substrate Part passes through those faces to be cut.

3. resigning light emitting diode support plate as described in claim 1 complete, which is characterized in that those faces to be cut perpendicular to this One direction.

4. full resigning light emitting diode support plate as described in claim 1, which is characterized in that respectively the LED carrying item has There is the cell wall for defining those flutings, some of those circuit structures is to be formed in the cell wall at each interval along the first direction Do not pass through those faces to be cut above but.