CN207301626U - A kind of litho machine zonal control vacuum cup - Google Patents
A kind of litho machine zonal control vacuum cup Download PDFInfo
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- CN207301626U CN207301626U CN201721248211.2U CN201721248211U CN207301626U CN 207301626 U CN207301626 U CN 207301626U CN 201721248211 U CN201721248211 U CN 201721248211U CN 207301626 U CN207301626 U CN 207301626U
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Abstract
The utility model discloses a kind of litho machine zonal control vacuum cup, it is related to the vacuum cup field of litho machine.The vacuum cup includes sucker body, vacuum generator, pipeline, some solenoid valves, and the cross section of sucker body is circle, and using the midpoint of cross section as together circle center, sucker body is according to some concentric circles zonal controls:The smallest circular region of middle is a region, and the annular region along radius per a ring outward respectively forms a region, and each region is provided with multiple stomatas, is vacuum ring below stomata, which forms region of no pressure;All regions of no pressure share a vacuum generator, and the pipeline of each region of no pressure is equipped with a solenoid valve, controls the opening and closing of the region of no pressure air entry.By controlling the quantity into vacuum adsorbed annular region, the size in control vacuum suction area.The utility model can rationally utilize resource, effectively adsorb various sizes of III V compound semiconductor disk.
Description
Technical field
The vacuum cup field of litho machine is the utility model is related to, is specifically related to a kind of litho machine zonal control vacuum
Sucker.
Background technology
Litho machine also known as mask registration exposure machine, exposure system, etching system etc..General photoetching process will undergo disk
Surface clean drying, linging, spin coating photoresist, it is soft dry, alignment exposure, it is rear dry, development, it is hard dry, the process such as etching.Photoetching process
It is to use up to make a figure, in III-V compound semiconductor disk surfaces spin coating, by the pattern transfer on mask to light
In photoresist, litho machine adsorbs III-V compound semiconductor disk by vacuum cup, and device or circuit structure is interim " duplication "
Onto III-V compound semiconductor disk.
All it is all areas during III-V compound semiconductor disk of the vacuum cup absorption different size of existing litho machine
The stomata or compression ring in domain are opened at the same time, cause to cause resource unrestrained when adsorbing III-V compound semiconductor disk of reduced size
Take.
Utility model content
The purpose of this utility model is to overcome the deficiency of above-mentioned background technology, there is provided a kind of litho machine zonal control
Vacuum cup, zonal control, III-V compound half of vacuum cup absorption different size are carried out by the solenoid valve of each region of no pressure
During conductor disk, the solenoid valve of each region of no pressure controls the air entry of the region of no pressure to open, close respectively, and vacuum is carried out by controlling
The quantity of the annular region of absorption, the size in control vacuum suction area, according to the reality for adsorbing III-V compound semiconductor disk
Border size, flexibly reasonably utilizes resource, avoids the wasting of resources.
The utility model provides a kind of zonal control vacuum cup of litho machine, the vacuum cup include sucker body,
Vacuum generator, pipeline, the vacuum cup further include some solenoid valves, and the cross section of the sucker body is circle, with transversal
The midpoint in face is together circle center, and some concentric circles are planned on cross section, and sucker body is some same according to what is planned on cross section
Heart circle carries out zonal control:The smallest circular region of middle is a region, along the radial direction of cross section per a ring outward
One region of each self-forming of annular region, each region is provided with multiple stomatas, is vacuum ring below stomata, which forms very
Dead zone;All regions of no pressure share a vacuum generator, and the air entry of each region of no pressure is connected by pipeline with vacuum generator,
The pipeline of each region of no pressure is provided with a solenoid valve, controls the opening and closing of the region of no pressure air entry, and vacuum suction is carried out by controlling
The quantity of attached annular region, the size in control vacuum suction area.
Based on the above technical solutions, the spacing of adjacent rings is one inch on the cross section of the sucker body.
Based on the above technical solutions, on the cross section of the sucker body adjacent rings spacing be one inch, 6
Inch and III-V compound semiconductor disk of following specification are determined by the straight line position line of the concentric rounded edge of corresponding specification
Position alignment.
Based on the above technical solutions, on the cross section of the sucker body adjacent rings spacing be one inch, 6
III-V compound semiconductor disk of inch above specification is positioned by the circular arc position line of the concentric rounded edge of corresponding specification
Alignment.
Compared with prior art, it is as follows the advantages of the utility model:
(1) vacuum cup in the utility model includes sucker body, vacuum generator, pipeline, some solenoid valves, sucker
The cross section of body is circle, and using the midpoint of cross section as together circle center, some concentric circles, sucker body are planned on cross section
Zonal control is carried out according to some concentric circles planned on cross section:The smallest circular region of middle is a region, along horizontal stroke
For the radial direction in section per one region of each self-forming of annular region of a ring outward, each region is provided with multiple stomatas, stomata
Lower section is vacuum ring, which forms region of no pressure;All regions of no pressure share a vacuum generator, and the air entry of each region of no pressure is equal
It is connected by pipeline with vacuum generator, the pipeline of each region of no pressure is provided with a solenoid valve, controls the region of no pressure air entry
Opening and closing, by controlling the quantity into vacuum adsorbed annular region, the size in control vacuum suction area.In the utility model
The vacuum cup of litho machine zonal control is carried out by the solenoid valve of each region of no pressure, vacuum cup absorption different size III-
During V compound semiconductor disk, the solenoid valve of each region of no pressure controls the air entry of the region of no pressure to open, close respectively, passes through control
The quantity into vacuum adsorbed annular region is made, the size in control vacuum suction area, partly leads according to III-V compound is adsorbed
The actual size of body disk, flexibly reasonably utilizes resource, avoids the wasting of resources.
(2) on the cross section of the sucker body in the utility model adjacent rings spacing be one inch when, 6 inches and with
III-V compound semiconductor disk of lower specification can carry out positioning pair by the straight line position line of the concentric rounded edge of corresponding specification
Standard, III-V compound semiconductor disk of more than 6 inches specifications can pass through the circular arc position line of the concentric rounded edge of corresponding specification
Carry out positioning alignment.
Brief description of the drawings
Fig. 1 is the stereochemical structure of the sucker body of the zonal control vacuum cup of litho machine in the utility model embodiment
Schematic diagram.
Fig. 2 is the side view of Fig. 1.
Fig. 3 is the top view of Fig. 1.
Reference numeral:1- sucker bodies, 2- stomatas, 3- straight line position lines, 4- circular arc position lines.
Embodiment
Below in conjunction with the accompanying drawings and specific embodiment is described in further detail the utility model.
Referring to shown in Fig. 1, Fig. 2, the utility model embodiment provides a kind of zonal control vacuum cup of litho machine, bag
Sucker body 1, vacuum generator, pipeline, some solenoid valves are included, the cross section of sucker body 1 is circle, with the midpoint of cross section
For together circle center, some concentric circles are planned on cross section, sucker body 1 is carried out according to some concentric circles planned on cross section
Zonal control:Shown in Figure 3, the smallest circular region of middle is a region, along the radial direction of cross section per outward
One region of each self-forming of annular region of one ring, each region are provided with multiple stomatas 2, and the lower section of stomata 2 is vacuum ring, the region
Form region of no pressure;All regions of no pressure share a vacuum generator, and the air entry of each region of no pressure is occurred by pipeline and vacuum
Device is connected, and the pipeline of each region of no pressure is provided with a solenoid valve, controls the opening and closing of the region of no pressure air entry, is carried out by controlling
The quantity of the annular region of vacuum suction, the size in control vacuum suction area.
It is shown in Figure 3, when the spacing of adjacent rings is one inch on the cross section of sucker body 1,6 inches and following rule
III-V compound semiconductor disk of lattice can carry out positioning alignment by the straight line position line 3 of the concentric rounded edge of corresponding specification,
III-V compound semiconductor disk of more than 6 inches specifications can by the circular arc position line 4 of the concentric rounded edge of corresponding specification into
Row positioning alignment.
The vacuum cup of litho machine in the utility model embodiment carries out zonal control by the solenoid valve of each region of no pressure,
When vacuum cup adsorbs III-V compound semiconductor disk of different size, the solenoid valve of each region of no pressure controls the vacuum respectively
The air entry in area is opened, closure, by controlling the quantity into vacuum adsorbed annular region, controls the big of vacuum suction area
It is small, according to the actual size for adsorbing III-V compound semiconductor disk, resource is flexibly reasonably utilized, avoids the wasting of resources.
Those skilled in the art can carry out various modifications and variations to the utility model embodiment, if these are changed
With modification within the scope of the utility model claims and its equivalent technologies, then these modifications and variations are also new in this practicality
Within the protection domain of type.
The prior art that the content not being described in detail in specification is known to the skilled person.
Claims (4)
1. a kind of litho machine zonal control vacuum cup, which includes sucker body (1), vacuum generator, pipeline,
It is characterized in that:The vacuum cup further includes some solenoid valves, and the cross section of the sucker body (1) is circle, with cross section
Midpoint be together circle center, plan some concentric circles on cross section, sucker body (1) is some same according to what is planned on cross section
Heart circle carries out zonal control:The smallest circular region of middle is a region, along the radial direction of cross section per a ring outward
One region of each self-forming of annular region, each region is provided with multiple stomatas (2), is vacuum ring below stomata (2), the region
Form region of no pressure;All regions of no pressure share a vacuum generator, and the air entry of each region of no pressure is occurred by pipeline and vacuum
Device is connected, and the pipeline of each region of no pressure is provided with a solenoid valve, to control the opening and closing of the region of no pressure air entry, by control into
The quantity of vacuum adsorbed annular region, the size in control vacuum suction area.
2. litho machine as claimed in claim 1 zonal control vacuum cup, it is characterised in that:The sucker body (1)
The spacing of adjacent rings is one inch on cross section.
3. litho machine as claimed in claim 2 zonal control vacuum cup, it is characterised in that:The sucker body (1)
When the spacing of adjacent rings is one inch on cross section, it is right that III-V compound semiconductor disk of 6 inches and following specification passes through
The straight line position line (3) of the concentric rounded edge of specification is answered to carry out positioning alignment.
4. litho machine as claimed in claim 2 zonal control vacuum cup, it is characterised in that:The sucker body (1)
When the spacing of adjacent rings is one-inch on cross section, III-V compound semiconductor disk of more than 6 inches specifications is advised by corresponding
The circular arc position line (4) of the concentric rounded edge of lattice carries out positioning alignment.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201721248211.2U CN207301626U (en) | 2017-09-26 | 2017-09-26 | A kind of litho machine zonal control vacuum cup |
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CN201721248211.2U CN207301626U (en) | 2017-09-26 | 2017-09-26 | A kind of litho machine zonal control vacuum cup |
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CN207301626U true CN207301626U (en) | 2018-05-01 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109513584A (en) * | 2019-01-03 | 2019-03-26 | 南方佛吉亚汽车部件有限公司 | A kind of glue spraying fixture |
CN111002248A (en) * | 2019-12-19 | 2020-04-14 | 中国科学院光电技术研究所 | Vacuum adsorption machining tool and clamping method |
CN115231286A (en) * | 2022-06-16 | 2022-10-25 | 苏州镁伽科技有限公司 | Panel adsorption and fixation control device and method and panel detection equipment |
-
2017
- 2017-09-26 CN CN201721248211.2U patent/CN207301626U/en active Active
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109513584A (en) * | 2019-01-03 | 2019-03-26 | 南方佛吉亚汽车部件有限公司 | A kind of glue spraying fixture |
CN111002248A (en) * | 2019-12-19 | 2020-04-14 | 中国科学院光电技术研究所 | Vacuum adsorption machining tool and clamping method |
CN115231286A (en) * | 2022-06-16 | 2022-10-25 | 苏州镁伽科技有限公司 | Panel adsorption and fixation control device and method and panel detection equipment |
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