CN207264544U - Photo taking type mixed flame detector - Google Patents
Photo taking type mixed flame detector Download PDFInfo
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- CN207264544U CN207264544U CN201721203568.9U CN201721203568U CN207264544U CN 207264544 U CN207264544 U CN 207264544U CN 201721203568 U CN201721203568 U CN 201721203568U CN 207264544 U CN207264544 U CN 207264544U
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Abstract
It the utility model is related to a kind of photo taking type mixed flame detector, it is characterised in that：Equipped with MCU Main Processing Unit, ultraviolet flame detection system, image capturing system, infra red flame detection system and power-supply management system.The utility model is low in energy consumption, the antijamming capability and adaptable of wild environment application, can closely point-to-point transmission high-definition image data, solve the problem of forest fire prevention and evidence obtaining.
Description
Technical field
The utility model belongs to fire alarming device, is a kind of photo taking type mixed flame detector specifically.
Background technology
The traditional forest fire protection means of traditional forest fire protection means are mainly patrolled including forest ranger, monitoring camera-shooting.Protect a forest
Member, which patrols, is unable to all area of fire protection of real-time monitoring, and too many by manpower fire prevention uncontrollable factor；Monitoring camera-shooting power consumption is big, needs
Limited power, installation site are limited, and the early stage fire monitoring of surface-fire, hayashishita fire is more difficult.Traditional forest fire evidence obtaining is main
It is that scene of fire is reconnoitred by investigator, fire zone periphery personnel is visited, inquired, investigated etc. with means, it is past
Shirk responsibility toward due to the various stratagems of suspect, escape subjective factor and the present subjects to severe risks of damage of fire such as strike, mix
Disorderly it can't bear, it is difficult to search the objective factors such as valuable clue and make fire case have reached an impasse, finally because lack of evidence is removed
Case processing, causes the fire case rate that concludes extremely low.More than fire prevention means all suffer from collecting evidence difficulty the problem of.
Related photo taking type mixed flame detector domestic at present and its patent of detection method application are few, and all exist
Certain limitation.Existing purple infrared flame detector is all based on the indoor fire safety application of building's fire on the market, needs
Wired power supply and communication are wanted, the demand of low-power consumption and the work of field complex environment is not considered and can not realize visualization and evidence obtaining
The problem of.Built-in image collection is mainly used in field hunting camera, not for the application of forest fire protection, can't resolve open country
The accuracy and reliability problem of outer long-term forest fires real-time detection evidence obtaining.
With the fast development of information technology and sensing technology, the flame identification sensing technology of low-power consumption and embedded is used
The problem of Image Acquisition identification technology, wireless networking transmission technology just can effectively solve the problem that forest fire prevention and difficult evidence obtaining.
Utility model content
For above-mentioned technical problem, the present invention provides a kind of flame knowledge of low-power consumption combination built-in image collection technology
Individual sensor, the problem of efficiently solving forest fire prevention and collect evidence.
The technical solution of the utility model is as follows：
A kind of photo taking type mixed flame detector, it is characterised in that：Equipped with MCU Main Processing Unit, ultraviolet flame detection system,
Image capturing system, infra red flame detection system and power-supply management system, it is characterised in that：The purple of the MCU Main Processing Unit
Outer input terminal connects the ultraviolet flame detection system；
The ultraviolet flame detection system is equipped with UV driven circuit, described in the input terminal connection of the UV driven circuit
The ultraviolet output terminal of Power Management Unit, the input terminal of the output terminal connection ultraviolet flame sensor of the UV driven circuit,
The output terminal of the ultraviolet flame sensor connects the input terminal of ultraviolet Acquisition Circuit, and the output terminal of the ultraviolet Acquisition Circuit connects
Connect the ultraviolet input terminal of the MCU main control units.
Using the above scheme, ultraviolet flame sensor detects ultraviolet flame of the wavelength in 185~260nm, by power management
Unit provides power supply, starts UV driven circuit, UV driven circuit drives Ultraviolet sensor, and Ultraviolet sensor will detect
Flame information sends MCU Main Processing Unit to by ultraviolet Acquisition Circuit.
The ultraviolet flame drive circuit includes transformer B1, one end connection of the first primary coil of the transformer B1
The Power Management Unit, the collector of the other end connecting triode of the first primary coil of the transformer B1, the change
The 28th capacitance C28 of both ends parallel connection of the first primary coil of depressor B1, the base stage of the triode connect the transformer
One end of the second primary coil of B1, the other end of the second primary coil of the transformer B1 pass through the 28th resistance R28
Ground connection, the other end of the second primary coil of the transformer B1 pass through the 27th resistance R27 connections power management list
Member, the other end of the second primary coil of the transformer B1 are grounded by the 29th capacitance C29, the transmitting of the triode
Pole is grounded by the 29th resistance R29, and one end of the first primary coil of the transformer B1 passes through the second electrolytic capacitor Cs2
Ground connection；
One end ground connection of the secondary coil of the transformer B1, the other end of the secondary coil of the transformer B1 pass through respectively
Cross the 8th zener diode D8, the 30th resistance R30, the 31st resistance R31 ground connection, the 30th resistance R30 and the 3rd
The common port of 11 resistance R31 connects the drive end of the ultraviolet flame sensor, and the signal of the ultraviolet flame sensor is defeated
Outlet is grounded by the 32nd resistance R32, and the signal output part of the ultraviolet flame sensor (8) is through the 33rd resistance
R33 connects the normal phase input end of four-operational amplifier UID, which is grounded through the 30th capacitance C30, positive input
End is also connected with the anode of the 9th zener diode D9, the plus earth of the 9th zener diode D9, and the 4th computing is put
The negative-phase input ground connection of big device UID；
The output terminal of the four-operational amplifier UID connects the MCU Main Processing Unit by the 34th resistance R34
I/O port is gathered, the output terminal of the four-operational amplifier UID is grounded by the 31st capacitance C31；
Wherein, the ultraviolet flame sensor is ultraviolet flame of the detection wave-length coverage in 185~260nm.
The Image Acquisition input terminal connection described image acquisition system of the MCU Main Processing Unit；
Described image acquisition system is equipped with image driver circuitry, and the input terminal of described image drive circuit connects the power supply
The image control end of administrative unit, the output terminal connection imaging sensor of described image drive circuit, described image sensor
Output terminal connects the input terminal of picture recognition module, and the output terminal of described image identification module connects the MCU Main Processing Unit
Image input, described image identification module are bi-directionally connected with image storage unit.
Using above-mentioned technical proposal, image driver circuitry is waken up by Power Management Unit, so that imaging sensor is driven,
Imaging sensor sends image information to image recognition circuit, and image recognition circuit identification image information, image information is passed
Image storage unit preservation is defeated by, while is sent to MCU Main Processing Unit；Image recognition circuit can also transfer image storage at any time
The image information of unit storage.
Described image drive circuit includes image collection chip U8, the AVDD ends connection of described image acquisition chip U8 the
The output terminal of one voltage-stablizer U6, the input terminal of the first voltage-stablizer U6 connect the Power Management Unit, first voltage stabilizing
The GND ends ground connection of device U6, the Enable Pin of the first voltage-stablizer U6 pass through the 35th resistance R35 connections power management list
Member, the FB ends of the first voltage-stablizer U6 are grounded by the 32nd capacitance C32, and the output terminal of the first voltage-stablizer U6 passes through
33rd capacitance C33 is grounded, and the output terminal of the first voltage-stablizer U6 is steady by the 3rd electrolytic capacitor Cs3 ground connection described first
The output terminal connection 2.8V power supplys of depressor U6；
The DVDD ends of described image acquisition chip U8 connect the output terminal of the second voltage-stablizer U7, the second voltage-stablizer U7's
Input terminal connects the Power Management Unit, and the GND ends ground connection of the second voltage-stablizer U7, the second voltage-stablizer U7's is enabled
End passes through the 36th resistance R36 connections Power Management Unit, and the FB ends of the second voltage-stablizer U7 pass through the 34th
Capacitance C34 is grounded, and the output terminal of the second voltage-stablizer U7 is grounded by the 35th capacitance C35, the second voltage-stablizer U7
Output terminal be grounded by the 4th electrolytic capacitor Cs4, the output terminal of the second voltage-stablizer U7 connection 1.5V power supplys；
The resetting pin of described image acquisition chip U8 is defeated by the 37th resistance R37 connections the first voltage-stablizer U6's
Outlet, the DOVDD ports of described image acquisition chip U8 connect the output terminal of the first voltage-stablizer U7, described image collection core
The output terminal of the clock pins connection crystal oscillator X1 of piece U8, the VCC ends of the crystal oscillator X1 connect the output of the first voltage-stablizer U7
End, the GND ends ground connection of the crystal oscillator X1, the first input of the HREF pins connection NAND gate U9 of described image acquisition chip U8
End, the second input terminal of the PCLK pins connection NAND gate U9 of described image acquisition chip U8, the GND terminations of the NAND gate U9
Ground, the VCC ends of the NAND gate U9 connect the output terminal of the first voltage-stablizer U6, the output terminal connection institute of the NAND gate U9
State picture recognition module, the upper described image identification module of IO ends connection of described image acquisition chip U8.
Wherein, described image sensor gathers image for high-definition camera, and described image drive circuit utilizes high-speed dsp core
Piece is driven described image sensor, and the image that described image identification module gathers described image sensor is known
Not.
The infrared input terminal of the MCU Main Processing Unit connects the infra red flame detection system；
The infra red flame detection system is equipped with infra red flame sensor, the output terminal connection of the infra red flame sensor
The input terminal of the multistage amplifier circuit, the input terminal of the output terminal connection bandwidth-limited circuit of the multistage amplifier circuit, institute
The master control output terminal for stating bandwidth-limited circuit connects the MCU Main Processing Unit, the I/O output terminals connection of the bandwidth-limited circuit
I/O interrupt circuits, the output terminal of the I/O interrupt circuits connect the MCU Main Processing Unit.
Using the above scheme, infra red flame sensor detects surrounding environment medium wavelength in 4.1~4.9 μ ms at any time
Infra red flame, when the infra red flame being detected with the range of this, communicate information to multistage amplifier circuit and be amplified, put
Signal after big sends bandwidth-limited circuit to and is screened, and when signal reaches certain range value, triggers and is powered off in I/O
Road, I/O interrupt circuits wake up the I/O ports of MCU Main Processing Unit, MCU Main Processing Unit is performed interrupt routine.
The infra red flame detection system includes infra red flame sensor, the first output terminal of the infra red flame sensor
Ground connection, the 3rd output terminal of the infra red flame sensor are grounded by the 15th capacitance C15, the infra red flame sensing
Second output terminal of device passes through the 16th capacitance C16, the 17th capacitance C17 and the 15th resistance C15 the first computings of connection respectively
The normal phase input end of amplifier U1A, the normal phase input end of the first operational amplifier U1A pass through the 15th resistance respectively
R15, the 13rd resistance R13 are grounded, and the second output terminal of the infra red flame sensor is grounded by the 12nd resistance R12, red
Second output terminal of outer flame sensor is by the 16th capacitance C16, the 16th resistance R16 connections first operational amplifier
The output terminal of U1A, the output terminal of the first operational amplifier U1A is respectively by the 17th resistance R17, the 14th resistance
R14, the 18th capacitance C18 are grounded, and the output terminal of the first operational amplifier U1A is by described in the 17th resistance R17 connections
The inverting input of first operational amplifier U1A, the 17th resistance R17 both ends parallel connection the 19th capacitance C19, described first
The positive power source terminal connection 3.3V power supplys of operational amplifier U1A, the negative power end ground connection of the first operational amplifier U1A；
The output terminal of the first operational amplifier U1A is respectively by the 18th resistance R18, the 20th resistance R20 connections
The normal phase input end of second operational amplifier U1B, the normal phase input end of the second operational amplifier U1B pass through the 20th respectively
Resistance R20, the 19th resistance R19 are grounded, and the normal phase input end of the second operational amplifier U1B passes through the 21st capacitance
C21 is grounded, and the inverting input of the second operational amplifier U1B is respectively through the 21st resistance R21 and the 22nd capacitance
C22 is grounded, and the output terminal of the second operational amplifier U1B passes through the 22nd resistance R22 connections second operation amplifier
The inverting input of device U1B, the output terminal of the second operational amplifier U1B is by the 24th capacitance C24 connections described the
The inverting input of two operational amplifier U1B, the output terminal of the second operational amplifier U1B pass through the 23rd capacitance C23
Connect the common port of the 18th resistance R18 and the 20th resistance R20, the output terminal warp of the second operational amplifier U1B
Cross the collection I/O port that the 23rd resistance connects the MCU Main Processing Unit；
The output terminal of the second operational amplifier U1B connects the 3rd operational amplifier U1C's by the 23rd resistance
Normal phase input end, the normal phase input end of the 3rd operational amplifier U1C are grounded by the 25th capacitance C25, and the described 3rd
The inverting input of operational amplifier U1C is grounded through the 24th resistance R24 and the 26th capacitance C26, the 3rd computing
The output terminal of amplifier U1C connects the inverting input of the 3rd operational amplifier U1C through the 25th resistance, and described the
Inverting input of the output terminal through the 3rd operational amplifier U1C of the 27th capacitance C27 connections of three operational amplifier U1C, institute
The output terminal for stating the 3rd operational amplifier U1C passes through the interruption IO of the 26th resistance R26 connections MCU Main Processing Unit
Mouthful；
Wherein, infra red flame of the infra red flame sensor collection wavelength in 4.1~4.9 μ ms.
The MCU Main Processing Unit is bi-directionally connected the power-supply management system；
The power-supply management system is equipped with solar energy collecting and storage unit, the solar energy collecting and storage unit it is defeated
Outlet connects Power Management Unit, and the Power Management Unit is ultraviolet flame detection system, image capturing system and the MCU
Main control unit is powered, the state output end connection status indicator lamp unit of the MCU Main Processing Unit.
Using above-mentioned technical proposal, solar energy collecting is converted solar energy into electrical energy with storage unit and stored, by electricity
Source control unit gives electric energy smart allocation to required system.
The solar energy collecting includes solar panels with storage unit, and the negative output terminal ground connection of the solar panels is described
The positive output end of solar panels passes through the cathode of first resistor R1 the first zener diodes of connection D1, first zener diode
The anode of D1 connects the cathode of the 3rd zener diode D3, and the anode of the 3rd zener diode D3 connects the power management
Unit, the solar energy collecting further include storage battery with storage unit, and the anode ground connection of the storage battery, the storage battery is just
Pole connects the cathode of the second zener diode D2, and the anode of the second zener diode D2 connects first zener diode
The anode of D1, the anode that the solar energy collecting further includes electrolytic capacitor Cs1, the electrolytic capacitor Cs1 with storage unit are grounded,
Cathode connects the cathode of the 3rd zener diode D3；
The Power Management Unit includes image power supply unit, DSP power supply units, ultraviolet power supply unit and main MCU power supplies
Unit；
The input terminal that described image power supply unit includes the first buck converter U1, the first buck converter U1 connects
The solar energy collecting and storage unit are connect, the VIN ports of the first buck converter U1 are grounded by the first capacitance C1, institute
The enabled control terminal for stating the first buck converter U1 connects the enabled I/O port of the MCU Main Processing Unit, the first decompression conversion
The VH ports of device U1 connect the other end connection described image drive circuit of the first inductance L1, the first inductance L1, and described the
The GND ports of one buck converter U1 connect the cathode of the 4th zener diode D4, the anode of the 4th zener diode D4
The first inductance L1 is connected, the BOOT ports of the first buck converter U1 pass through the second capacitance C2 connections first drop
The VH ports of pressure converter U1, the output terminal of the first buck converter U1 are driven by second resistance R2 connections described image
Circuit, the output terminal of the first buck converter U1 are grounded by 3rd resistor R3, and the first buck converter U1's is defeated
Outlet passes through the GND ports of 3rd resistor R3 connections the first buck converter U1, the second resistance R2 and 3rd resistor
Free end difference parallel connection the 3rd capacitance C3, the 4th capacitance C4 of R3, both ends the first transient voltage in parallel of the 4th capacitance C4
Suppress diode D5, the 3rd capacitance C3, the 4th capacitance C4, the first transient voltage suppressor D5 and first inductance
The common port connection 5V power supplys of L1；
The DSP power supply units are included described in the input terminal connection of the first power supply chip U2, the first power supply chip U2
Solar energy collecting and storage unit, the input terminal of the first power supply chip U2 are grounded by the 5th capacitance C5, first electricity
The output terminal connection dsp chip of source chip U2, the Enable Pin of the first power supply chip U2 pass through described in the 4th resistance R4 connections
The enabled I/O port of MCU Main Processing Unit, the GND ends ground connection of the first power supply chip U2, the BYP ends of the first power supply chip U2
It is grounded by the 6th capacitance C6, the output terminal of the first power supply chip U2 is grounded by the 7th capacitance C7, the 7th capacitance
C7 is connected 3.3V power supplys with the common port of the dsp chip；
The input terminal that the ultraviolet power supply unit includes the second buck converter U3, the second buck converter U3 connects
The solar energy collecting and storage unit, the input terminal of the second buck converter U3 is grounded by the 9th capacitance C9, described
The first inductance L1 connections UV driven circuit, second buck converter are passed through in the VH ends of second buck converter U3
The GND ends of U3 pass through the 6th zener diode D6, the BOOT of the 8th capacitance C8 connections the second buck converter U3 respectively
End, the GND ends ground connection of the second buck converter U3, the Enable Pin of the second buck converter U3 connect the MCU master
The I/O port of unit is controlled, the output terminal of the second buck converter U3 passes through the 5th resistance R5 connections UV driven circuit,
The output terminal of the second buck converter U3 by the 6th resistance R6 be grounded, the 5th resistance R5 and the 6th resistance R6 from
By holding the second transient voltage suppressor D7, the second transient voltage suppressor D7 and the 5th resistance R5 of parallel connection
Common port connection 5V power supplys；
The main MCU power supply units include the input terminal connection institute of second source chip U4, the second source chip U4
Solar energy collecting and storage unit are stated, the input terminal of the second source chip U4 is grounded by the tenth capacitance C10, and described
The Enable Pin of two power supply chip U4 passes through the 7th resistance R7 connections solar energy collecting and storage unit, the second source core
The GND ends ground connection of piece U4, the BYP ends of the second source chip U4 are grounded by the 11st capacitance C11, the second source
The output terminal of chip U4 connects the MCU Main Processing Unit, and the output terminal connection 3.3V power supplys of the second source chip U4 are described
The output terminal of second source chip U4 is grounded by the 12nd capacitance C12.
The MCU Main Processing Unit is that the RST mouths of low-power scm U5, the low-power scm U5 pass through the 11st
Resistance R11 connection 3.3V power supplys, the infrared collecting end of the low-power scm U5 connect the infrared bandwidth-limited circuit,
The ultraviolet collection terminal of the low-power scm U5 connects the ultraviolet Acquisition Circuit, the AVcc1 of the low-power scm U5
Mouth passes through the first tantalum by the tenth resistance R10 connections Power Management Unit, the AVcc1 mouths of the low-power scm U5
Capacitance E1 connects simulation ground, and the AVcc1 mouths of the low-power scm U5 are connect by the tenth resistance R10, the second tantalum capacitance E2 respectively
Ground, the AVss1 mouths of the low-power scm U5 connect simulation ground, and the DVcc1 mouths of the low-power scm U5 pass through the second tantalum
Capacitance E2 is grounded, and the DVcc1 mouths of the low-power scm U5 are grounded by the 13rd capacitance C13, the low-power scm
The DVss1 mouths ground connection of U5, the wake-up I/O port of the low-power scm U5 connect the infrared I/O interrupt circuit, the low-power consumption
The power management end of microcontroller U5 connects the Power Management Unit, the environment collection terminal connection of the low-power scm U5
The environmental sensor component, the image recognition end connection described image recognition unit of the low-power scm U5 are described low
The instruction I/O port of power consumption microcontroller U5 is grounded by the 8th resistance R8, the second Light-emitting diode LED 2 respectively, the low-power consumption list
The instruction I/O port of piece machine U5 is grounded by the 9th resistance R9, the first Light-emitting diode LED 1 respectively, the low-power scm U5
DVss2 mouths ground connection, the DVcc2 connection 3.3V power supplys of the low-power scm U5, the low-power scm U5's
DVcc2 is grounded by the 14th capacitance C14, and the image storage end of the low-power scm U5 is connected with image storage unit,
The communication ends of the low-power scm U5 connect the wireless communication unit.
Its advantage is：The utility model is low in energy consumption, the antijamming capability and adaptable of wild environment application, can be near
Apart from point-to-point transmission high-definition image data, forest fire prevention and the problem collected evidence are solved.
Brief description of the drawings
Fig. 1 is the hardware structure diagram of the utility model；
Fig. 2 is Power Management Unit circuit diagram；
Fig. 3 is ultraviolet acquisition system circuit diagram；
Fig. 4 is image driver circuitry figure；
Fig. 5 is infrared collecting system circuit diagram；
Fig. 6 connects circuit diagram for MCU Main Processing Unit.
Embodiment
The utility model is described in further detail with reference to the accompanying drawings and embodiments：A kind of photo taking type mixed flame detection
Device, its key are：Equipped with MCU Main Processing Unit 10, ultraviolet flame detection system, image capturing system, infra red flame detection system
System and power-supply management system, it is characterised in that：The ultraviolet input terminal of the MCU Main Processing Unit 10 connects the ultraviolet flame and visits
Examining system；
The ultraviolet flame detection system is equipped with UV driven circuit 7, the input terminal connection of the UV driven circuit 7
The ultraviolet output terminal of the Power Management Unit 2, the output terminal connection ultraviolet flame sensor 8 of the UV driven circuit 7
Input terminal, the output terminal of the ultraviolet flame sensor 8 connect the input terminal of ultraviolet Acquisition Circuit 9, the ultraviolet Acquisition Circuit
9 output terminal connects the ultraviolet input terminal of the MCU Main Processing Unit 10.
The ultraviolet flame drive circuit 7 includes transformer B1, and one end of the first primary coil of the transformer B1 connects
The Power Management Unit 2 is connect, the collector of the other end connecting triode of the first primary coil of the transformer B1 is described
The 28th capacitance C28 of both ends parallel connection of the first primary coil of transformer B1, the base stage of the triode connect the transformation
One end of the second primary coil of device B1, the other end of the second primary coil of the transformer B1 pass through the 28th resistance
R28 is grounded, and the other end of the second primary coil of the transformer B1 passes through the 27th resistance R27 connections power management
Unit 2, the other end of the second primary coil of the transformer B1 are grounded by the 29th capacitance C29, the triode
Emitter is grounded by the 29th resistance R29, and one end of the first primary coil of the transformer B1 passes through the second electrolysis electricity
Hold Cs2 ground connection；
One end ground connection of the secondary coil of the transformer B1, the other end of the secondary coil of the transformer B1 pass through respectively
Cross the 8th zener diode D8, the 30th resistance R30, the 31st resistance R31 ground connection, the 30th resistance R30 and the 3rd
The common port of 11 resistance R31 connects the drive end of the ultraviolet flame sensor 8, the signal of the ultraviolet flame sensor 8
Output terminal is grounded by the 32nd resistance R32, and the signal output part of the ultraviolet flame sensor (8) is through the 33rd resistance
R33 connects the normal phase input end of four-operational amplifier UID, which is grounded through the 30th capacitance C30, positive input
End is also connected with the anode of the 9th zener diode D9, the plus earth of the 9th zener diode D9, and the 4th computing is put
The negative-phase input ground connection of big device UID；
The output terminal of the four-operational amplifier UID connects the MCU Main Processing Unit 10 by the 34th resistance R34
Collection I/O port, the output terminal of the four-operational amplifier UID is grounded by the 31st capacitance C31；
Wherein, the ultraviolet flame sensor 8 is ultraviolet flame of the detection wave-length coverage in 185~260nm.
The Image Acquisition input terminal connection described image acquisition system of the MCU Main Processing Unit 10；
Described image acquisition system is equipped with image driver circuitry 11, the input terminal connection institute of described image drive circuit 11
State the image control end of Power Management Unit 2, the output terminal connection imaging sensor 12 of described image drive circuit 11, the figure
As the input terminal of the output terminal connection picture recognition module 14 of sensor 12, the output terminal connection institute of described image identification module 14
The image input of MCU Main Processing Unit 10 is stated, described image identification module 14 is bi-directionally connected with image storage unit 13.
Described image drive circuit 11 includes image collection chip U8, the AVDD ends connection of described image acquisition chip U8
The output terminal of first voltage-stablizer U6, the input terminal of the first voltage-stablizer U6 connect the Power Management Unit 2, and described first is steady
The GND ends ground connection of depressor U6, the Enable Pin of the first voltage-stablizer U6 pass through the 35th resistance R35 connections power management
Unit 2, the FB ends of the first voltage-stablizer U6 are grounded by the 32nd capacitance C32, the output terminal of the first voltage-stablizer U6
It is grounded by the 33rd capacitance C33, the output terminal of the first voltage-stablizer U6 is by the 3rd electrolytic capacitor Cs3 ground connection described the
The output terminal connection 2.8V power supplys of one voltage-stablizer U6；
The DVDD ends of described image acquisition chip U8 connect the output terminal of the second voltage-stablizer U7, the second voltage-stablizer U7's
Input terminal connects the Power Management Unit 2, and the GND ends ground connection of the second voltage-stablizer U7, the second voltage-stablizer U7's makes
Energy end passes through the 30th by the 36th resistance R36 connections Power Management Unit 2, the FB ends of the second voltage-stablizer U7
Four capacitance C34 are grounded, and the output terminal of the second voltage-stablizer U7 is grounded by the 35th capacitance C35, second voltage-stablizer
The output terminal of U7 is grounded by the 4th electrolytic capacitor Cs4, the output terminal connection 1.5V power supplys of the second voltage-stablizer U7；
The resetting pin of described image acquisition chip U8 is defeated by the 37th resistance R37 connections the first voltage-stablizer U6's
Outlet, the DOVDD ports of described image acquisition chip U8 connect the output terminal of the first voltage-stablizer U7, described image collection core
The output terminal of the clock pins connection crystal oscillator X1 of piece U8, the VCC ends of the crystal oscillator X1 connect the output of the first voltage-stablizer U7
End, the GND ends ground connection of the crystal oscillator X1, the first input of the HREF pins connection NAND gate U9 of described image acquisition chip U8
End, the second input terminal of the PCLK pins connection NAND gate U9 of described image acquisition chip U8, the GND terminations of the NAND gate U9
Ground, the VCC ends of the NAND gate U9 connect the output terminal of the first voltage-stablizer U6, the output terminal connection institute of the NAND gate U9
State picture recognition module 14, the upper described image identification module 14 of IO ends connection of described image acquisition chip U8.
Wherein, described image sensor 12 gathers image for high-definition camera, and described image drive circuit 11 is using at a high speed
Dsp chip is driven described image sensor 12, and described image identification module 14 gathers described image sensor 12
Image is identified.
The infrared input terminal of the MCU Main Processing Unit 10 connects the infra red flame detection system；
The infra red flame detection system is equipped with infra red flame sensor 3, and the output terminal of the infra red flame sensor 3 connects
Connect the input terminal of the multistage amplifier circuit 4, the input of the output terminal connection bandwidth-limited circuit 5 of the multistage amplifier circuit 4
End, the master control output terminal of the bandwidth-limited circuit 5 connect the MCU Main Processing Unit 10, the I/O of the bandwidth-limited circuit 5
Output terminal connects I/O interrupt circuits, and the output terminal of the I/O interrupt circuits connects the MCU main control units 10.
The infra red flame detection system includes infra red flame sensor 3, the first output of the infra red flame sensor 3
End ground connection, the 3rd output terminal of the infra red flame sensor 3 are grounded by the 15th capacitance C15, the infra red flame
Second output terminal of sensor 3 passes through the 16th capacitance C16, the 17th capacitance C17 and the 15th resistance C15 connections first respectively
The normal phase input end of operational amplifier U1A, the normal phase input end of the first operational amplifier U1A pass through the 15th resistance respectively
R15, the 13rd resistance R13 are grounded, and the second output terminal of the infra red flame sensor 3 is grounded by the 12nd resistance R12, red
Second output terminal of outer flame sensor 3 is by the 16th capacitance C16, the 16th resistance R16 connections first operation amplifier
The output terminal of device U1A, the output terminal of the first operational amplifier U1A is respectively by the 17th resistance R17, the 14th resistance
R14, the 18th capacitance C18 are grounded, and the output terminal of the first operational amplifier U1A is by described in the 17th resistance R17 connections
The inverting input of first operational amplifier U1A, the 17th resistance R17 both ends parallel connection the 19th capacitance C19, described first
The positive power source terminal connection 3.3V power supplys of operational amplifier U1A, the negative power end ground connection of the first operational amplifier U1A；
The output terminal of the first operational amplifier U1A is respectively by the 18th resistance R18, the 20th resistance R20 connections
The normal phase input end of second operational amplifier U1B, the normal phase input end of the second operational amplifier U1B pass through the 20th respectively
Resistance R20, the 19th resistance R19 are grounded, and the normal phase input end of the second operational amplifier U1B passes through the 21st capacitance
C21 is grounded, and the inverting input of the second operational amplifier U1B is respectively through the 21st resistance R21 and the 22nd capacitance
C22 is grounded, and the output terminal of the second operational amplifier U1B passes through the 22nd resistance R22 connections second operation amplifier
The inverting input of device U1B, the output terminal of the second operational amplifier U1B is by the 24th capacitance C24 connections described the
The inverting input of two operational amplifier U1B, the output terminal of the second operational amplifier U1B pass through the 23rd capacitance C23
Connect the common port of the 18th resistance R18 and the 20th resistance R20, the output terminal warp of the second operational amplifier U1B
Cross the collection I/O port that the 23rd resistance connects the MCU Main Processing Unit 10；
The output terminal of the second operational amplifier U1B connects the 3rd operational amplifier U1C's by the 23rd resistance
Normal phase input end, the normal phase input end of the 3rd operational amplifier U1C are grounded by the 25th capacitance C25, and the described 3rd
The inverting input of operational amplifier U1C is grounded through the 24th resistance R24 and the 26th capacitance C26, the 3rd computing
The output terminal of amplifier U1C connects the inverting input of the 3rd operational amplifier U1C through the 25th resistance, and described the
Inverting input of the output terminal through the 3rd operational amplifier U1C of the 27th capacitance C27 connections of three operational amplifier U1C, institute
The output terminal for stating the 3rd operational amplifier U1C passes through the interruption IO of the 26th resistance R26 connections MCU Main Processing Unit 10
Mouthful；
Wherein, the infra red flame sensor 3 gathers infra red flame of the wavelength in 4.1~4.9 μ ms.
The MCU Main Processing Unit 10 is bi-directionally connected the power-supply management system；
The power-supply management system is equipped with solar energy collecting and storage unit 1, the solar energy collecting and storage unit 1
Output terminal connects Power Management Unit 2, and the Power Management Unit 2 is the ultraviolet flame detection system, image capturing system
And MCU Main Processing Unit 10 is powered, the state output end connection status indicator lamp unit 16 of the MCU Main Processing Unit 10.
The solar energy collecting includes solar panels with storage unit 1, and the negative output terminal ground connection of the solar panels is described
The positive output end of solar panels passes through the cathode of first resistor R1 the first zener diodes of connection D1, first zener diode
The anode of D1 connects the cathode of the 3rd zener diode D3, and the anode of the 3rd zener diode D3 connects the power management
Unit 2, the solar energy collecting further include storage battery with storage unit 1, and the anode of the storage battery is grounded, the storage battery
Cathode connects the cathode of the second zener diode D2, and the anode of the second zener diode D2 connects two pole of the first voltage stabilizing
The anode of pipe D1, the solar energy collecting further include electrolytic capacitor Cs1 with storage unit, and the anode of the electrolytic capacitor Cs1 connects
Ground, cathode connect the cathode of the 3rd zener diode D3；
The Power Management Unit 2 includes image power supply unit, DSP power supply units, ultraviolet power supply unit and main MCU power supplies
Unit；
The input terminal that described image power supply unit includes the first buck converter U1, the first buck converter U1 connects
The solar energy collecting and storage unit 1 are connect, the VIN ports of the first buck converter U1 are grounded by the first capacitance C1,
The enabled control terminal of the first buck converter U1 connects the enabled I/O port of the MCU Main Processing Unit 10, first decompression
The VH ports of converter U1 connect the other end connection described image drive circuit 11 of the first inductance L1, the first inductance L1,
The GND ports of the first buck converter U1 connect the cathode of the 4th zener diode D4, the 4th zener diode D4
Anode connect the first inductance L1, the BOOT ports of the first buck converter U1 pass through described in the second capacitance C2 connections
The VH ports of first buck converter U1, the output terminal of the first buck converter U1 pass through the second resistance R2 connections figure
As drive circuit 11, the output terminal of the first buck converter U1 is grounded by 3rd resistor R3, the first decompression conversion
The output terminal of device U1 by the GND ports of 3rd resistor R3 connections the first buck converter U1, the second resistance R2 and
Free end difference parallel connection the 3rd capacitance C3, the 4th capacitance C4 of 3rd resistor R3, the both ends parallel connection first of the 4th capacitance C4
Transient voltage suppressor D5, the 3rd capacitance C3, the 4th capacitance C4, the first transient voltage suppressor D5 with it is described
The common port connection 5V power supplys of first inductance L1；
The DSP power supply units are included described in the input terminal connection of the first power supply chip U2, the first power supply chip U2
Solar energy collecting and storage unit 1, the input terminal of the first power supply chip U2 are grounded by the 5th capacitance C5, and described first
The output terminal connection dsp chip of power supply chip U2, the Enable Pin of the first power supply chip U2 pass through the 4th resistance R4 connections institute
The enabled I/O port of MCU Main Processing Unit 10 is stated, the GND ends of the first power supply chip U2 are grounded, the first power supply chip U2's
BYP ends are grounded by the 6th capacitance C6, and the output terminal of the first power supply chip U2 is grounded by the 7th capacitance C7, and the described 7th
Capacitance C7 is connected 3.3V power supplys with the common port of the dsp chip；
The input terminal that the ultraviolet power supply unit includes the second buck converter U3, the second buck converter U3 connects
The solar energy collecting and storage unit 1, the input terminal of the second buck converter U3 is grounded by the 9th capacitance C9, described
The first inductance L1 connections UV driven circuit 7, second buck converter are passed through in the VH ends of second buck converter U3
The GND ends of U3 respectively by the BOOT ends of the 6th zener diode D6, the 8th capacitance C8 connections the second buck converter U3,
The GND ends ground connection of the second buck converter U3, the Enable Pin of the second buck converter U3 connect the MCU master controls list
The I/O port of member, the output terminal of the second buck converter U3 pass through the 5th resistance R5 connections UV driven circuit 7, institute
The output terminal of the second buck converter U3 is stated to be grounded by the 6th resistance R6, the 5th resistance R5 and the 6th resistance R6 from
By holding the second transient voltage suppressor D7, the second transient voltage suppressor D7 and the 5th resistance R5 of parallel connection
Common port connection 5V power supplys；
The main MCU power supply units include the input terminal connection institute of second source chip U4, the second source chip U4
Solar energy collecting and storage unit 1 are stated, the input terminal of the second source chip U4 is grounded by the tenth capacitance C10, and described
The Enable Pin of two power supply chip U4 passes through the 7th resistance R7 connections solar energy collecting and storage unit 1, the second source
The GND ends ground connection of chip U4, the BYP ends of the second source chip U4 are grounded by the 11st capacitance C11, the second source
The output terminal of chip U4 connects the MCU Main Processing Unit 10, the output terminal connection 3.3V power supplys of the second source chip U4, institute
The output terminal for stating second source chip U4 is grounded by the 12nd capacitance C12.
The MCU Main Processing Unit 10 is that the RST mouths of low-power scm U5, the low-power scm U5 pass through the tenth
One resistance R11 connection 3.3V power supplys, the infrared collecting end of the low-power scm U5 connect the infrared bandwidth-limited circuit
The ultraviolet collection terminal of 5, the low-power scm U5 connect the ultraviolet Acquisition Circuit 9, the low-power scm U5's
AVcc1 mouthfuls pass through by the tenth resistance R10 connections Power Management Unit 2, the AVcc1 mouths of the low-power scm U5
One tantalum capacitance E1 connects simulation ground, and the AVcc1 mouths of the low-power scm U5 pass through the tenth resistance R10, the second tantalum capacitance respectively
E2 is grounded, and with connecing simulation, the DVcc1 mouths of the low-power scm U5 pass through for AVss1 mouths of the low-power scm U5
Two tantalum capacitance E2 are grounded, and the DVcc1 mouths of the low-power scm U5 are grounded by the 13rd capacitance C13, the low-power consumption list
The DVss1 mouths ground connection of piece machine U5, the wake-up I/O port of the low-power scm U5 connects the infrared I/O interrupt circuit 6, described
The power management end of low-power scm U5 connects the Power Management Unit 2, the environment collection of the low-power scm U5
End connects the environmental sensor component 15, and the image recognition end connection described image identification of the low-power scm U5 is single
Member, the instruction I/O port of the low-power scm U5 are grounded by the 8th resistance R8, the second Light-emitting diode LED 2 respectively, institute
The instruction I/O port for stating low-power scm U5 is grounded by the 9th resistance R9, the first Light-emitting diode LED 1 respectively, the low work(
Consume the DVss2 mouths ground connection of microcontroller U5, the DVcc2 connection 3.3V power supplys of the low-power scm U5, the low-power consumption monolithic
The DVcc2 of machine U5 is grounded by the 14th capacitance C14, and the image storage end of the low-power scm U5 and image storage are single
Member connection, the communication ends of the low-power scm U5 connect the wireless communication unit.
Claims (9)
- A kind of 1. photo taking type mixed flame detector, it is characterised in that：Equipped with MCU Main Processing Unit (10), ultraviolet flame detection system System, image capturing system, infra red flame detection system and power-supply management system, it is characterised in that：The MCU Main Processing Unit (10) ultraviolet input terminal connects the ultraviolet flame detection system；The ultraviolet flame detection system is equipped with UV driven circuit (7), the input terminal connection institute of the UV driven circuit (7) State the ultraviolet output terminal of Power Management Unit (2), the output terminal connection ultraviolet flame sensor of the UV driven circuit (7) (8) input terminal, the output terminal of the ultraviolet flame sensor (8) connects the input terminal of ultraviolet Acquisition Circuit (9), described ultraviolet The output terminal of Acquisition Circuit (9) connects the ultraviolet input terminal of the MCU Main Processing Unit (10).
- 2. photo taking type mixed flame detector according to claim 1, it is characterised in that：The ultraviolet flame drive circuit (7) transformer B1 is included, one end of the first primary coil of the transformer B1 connects the Power Management Unit (2), described The collector of the other end connecting triode of the first primary coil of transformer B1, the first primary coil of the transformer B1 The 28th capacitance C28 of both ends parallel connection, the base stage of the triode connect one end of the second primary coil of the transformer B1, The other end of the second primary coil of the transformer B1 is grounded by the 28th resistance R28, and the second of the transformer B1 The other end of primary coil is by the 27th resistance R27 connections Power Management Unit (2), and the second of the transformer B1 The other end of primary coil is grounded by the 29th capacitance C29, and the emitter of the triode passes through the 29th resistance R29 Ground connection, one end of the first primary coil of the transformer B1 is grounded by the second electrolytic capacitor Cs2；One end ground connection of the secondary coil of the transformer B1, the other end of the secondary coil of the transformer B1 is respectively by the Eight zener diode D8, the 30th resistance R30, the 31st resistance R31 ground connection, the 30th resistance R30 and the 31st The common port of resistance R31 connects the drive end of the ultraviolet flame sensor (8), the signal of the ultraviolet flame sensor (8) Output terminal is grounded by the 32nd resistance R32, and the signal output part of the ultraviolet flame sensor (8) is through the 33rd resistance R33 connects the normal phase input end of four-operational amplifier UID, which is grounded through the 30th capacitance C30, positive input End is also connected with the anode of the 9th zener diode D9, the plus earth of the 9th zener diode D9, and the 4th computing is put The negative-phase input ground connection of big device UID；The output terminal of the four-operational amplifier UID connects the MCU Main Processing Unit (10) by the 34th resistance R34 I/O port is gathered, the output terminal of the four-operational amplifier UID is grounded by the 31st capacitance C31；Wherein, the ultraviolet flame sensor (8) is ultraviolet flame of the detection wave-length coverage in 185~260nm.
- 3. photo taking type mixed flame detector according to claim 1, it is characterised in that：The MCU Main Processing Unit (10) Image Acquisition input terminal connection described image acquisition system；Described image acquisition system is equipped with image driver circuitry (11), described in the input terminal connection of described image drive circuit (11) The image control end of Power Management Unit (2), the output terminal connection imaging sensor (12) of described image drive circuit (11), institute State imaging sensor (12) output terminal connection picture recognition module (14) input terminal, described image identification module (14) it is defeated Outlet connects the image input of the MCU Main Processing Unit (10), described image identification module (14) and image storage unit (13) it is bi-directionally connected.
- 4. photo taking type mixed flame detector according to claim 3, it is characterised in that：Described image drive circuit (11) Including image collection chip U8, the AVDD ends of described image acquisition chip U8 connect the output terminal of the first voltage-stablizer U6, and described the The input terminal of one voltage-stablizer U6 connects the Power Management Unit (2), the GND ends ground connection of the first voltage-stablizer U6, and described the The Enable Pin of one voltage-stablizer U6 passes through the 35th resistance R35 connections Power Management Unit (2), the first voltage-stablizer U6 FB ends be grounded by the 32nd capacitance C32, the output terminal of the first voltage-stablizer U6 is connect by the 33rd capacitance C33 Ground, the output terminal of the first voltage-stablizer U6 are grounded the output terminal company of the first voltage-stablizer U6 by the 3rd electrolytic capacitor Cs3 Connect 2.8V power supplys；The DVDD ends of described image acquisition chip U8 connect the output terminal of the second voltage-stablizer U7, the input of the second voltage-stablizer U7 End connects the Power Management Unit (2), and the GND ends ground connection of the second voltage-stablizer U7, the second voltage-stablizer U7's is enabled End passes through the 36th resistance R36 connections Power Management Unit (2), and the FB ends of the second voltage-stablizer U7 pass through the 30th Four capacitance C34 are grounded, and the output terminal of the second voltage-stablizer U7 is grounded by the 35th capacitance C35, second voltage-stablizer The output terminal of U7 is grounded by the 4th electrolytic capacitor Cs4, the output terminal connection 1.5V power supplys of the second voltage-stablizer U7；The output that the resetting pin of described image acquisition chip U8 passes through the 37th resistance R37 connections the first voltage-stablizer U6 End, the DOVDD ports of described image acquisition chip U8 connect the output terminal of the first voltage-stablizer U7, described image acquisition chip The output terminal of the clock pins connection crystal oscillator X1 of U8, the VCC ends of the crystal oscillator X1 connect the output terminal of the first voltage-stablizer U7, The GND ends ground connection of the crystal oscillator X1, the first input end of the HREF pins connection NAND gate U9 of described image acquisition chip U8, The second input terminal of the PCLK pins connection NAND gate U9 of described image acquisition chip U8, the GND ends ground connection of the NAND gate U9, The VCC ends of the NAND gate U9 connect the output terminal of the first voltage-stablizer U6, described in the output terminal connection of the NAND gate U9 Picture recognition module (14), the upper described image identification module (14) of IO ends connection of described image acquisition chip U8；Wherein, described image sensor (12) gathers image for high-definition camera, and described image drive circuit (11) is using at a high speed Dsp chip is driven described image sensor (12), and described image identification module (14) is to described image sensor (12) The image of collection is identified.
- 5. photo taking type mixed flame detector according to claim 1, it is characterised in that：The MCU Main Processing Unit (10) Infrared input terminal connect the infra red flame detection system；The infra red flame detection system is equipped with infra red flame sensor (3), and the output terminal of the infra red flame sensor (3) connects The input terminal of multistage amplifier circuit (4) is connect, the output terminal of the multistage amplifier circuit (4) connects the defeated of bandwidth-limited circuit (5) Enter end, the master control output terminal of the bandwidth-limited circuit (5) connects the MCU Main Processing Unit (10), the bandwidth-limited circuit (5) I/O output terminals connection I/O interrupt circuits, the output terminal of the I/O interrupt circuits connect the MCU Main Processing Unit (10).
- 6. photo taking type mixed flame detector according to claim 5, it is characterised in that：The infra red flame detection system Including infra red flame sensor (3), the first output head grounding of the infra red flame sensor (3), the infra red flame sensing 3rd output terminal of device (3) is grounded by the 15th capacitance C15, the second output terminal difference of the infra red flame sensor (3) Inputted by the positive of the 16th capacitance C16, the 17th capacitance C17 and the 15th resistance C15 the first operational amplifiers of connection U1A End, the normal phase input end of the first operational amplifier U1A are grounded by the 15th resistance R15, the 13rd resistance R13 respectively, Second output terminal of the infra red flame sensor (3) is grounded by the 12nd resistance R12, and the of infra red flame sensor (3) Two output terminals are described by the 16th capacitance C16, the output terminal of the 16th resistance R16 connections the first operational amplifier U1A The output terminal of first operational amplifier U1A connects by the 17th resistance R17, the 14th resistance R14, the 18th capacitance C18 respectively Ground, the output terminal of the first operational amplifier U1A is by the 17th resistance R17 connections the first operational amplifier U1A's Inverting input, the 19th capacitance C19 of the 17th resistance R17 both ends parallel connection, the positive electricity of the first operational amplifier U1A Source connects 3.3V power supplys, the negative power end ground connection of the first operational amplifier U1A；The output terminal of the first operational amplifier U1A is respectively by the 18th resistance R18, the 20th resistance R20 connections second The normal phase input end of operational amplifier U1B, the normal phase input end of the second operational amplifier U1B pass through the 20th resistance respectively R20, the 19th resistance R19 are grounded, and the normal phase input end of the second operational amplifier U1B connects by the 21st capacitance C21 Ground, the inverting input of the second operational amplifier U1B connect through the 21st resistance R21 and the 22nd capacitance C22 respectively Ground, the output terminal of the second operational amplifier U1B pass through the 22nd resistance R22 connections the second operational amplifier U1B Inverting input, the output terminal of the second operational amplifier U1B passes through the 24th capacitance C24 connections second computing The inverting input of amplifier U1B, the output terminal of the second operational amplifier U1B pass through the 23rd capacitance C23 connections institute The common port of the 18th resistance R18 and the 20th resistance R20 are stated, the output terminal of the second operational amplifier U1B passes through second 13 resistance connect the collection I/O port of the MCU Main Processing Unit (10)；The output terminal of the second operational amplifier U1B connects the positive of the 3rd operational amplifier U1C by the 23rd resistance Input terminal, the normal phase input end of the 3rd operational amplifier U1C are grounded by the 25th capacitance C25, the 3rd computing The inverting input of amplifier U1C is grounded through the 24th resistance R24 and the 26th capacitance C26, the 3rd operation amplifier The output terminal of device U1C connects the inverting input of the 3rd operational amplifier U1C, the 3rd computing through the 25th resistance Inverting input of the output terminal of amplifier U1C through the 3rd operational amplifier U1C of the 27th capacitance C27 connections, the described 3rd The output terminal of operational amplifier U1C passes through the interruption I/O port of the 26th resistance R26 connections MCU Main Processing Unit (10)；Wherein, infra red flame of infra red flame sensor (3) the collection wavelength in 4.1~4.9 μ ms.
- 7. photo taking type mixed flame detector according to claim 1, it is characterised in that：The MCU Main Processing Unit (10) It is bi-directionally connected the power-supply management system；The power-supply management system is equipped with solar energy collecting and storage unit (1), the solar energy collecting and storage unit (1) Output terminal connection Power Management Unit (2), the Power Management Unit (2) is the ultraviolet flame detection system, Image Acquisition System and MCU Main Processing Unit (10) power supply, the state output end connection status indicator lamp unit of the MCU Main Processing Unit (10) (16)。
- 8. photo taking type mixed flame detector according to claim 7, it is characterised in that：The solar energy collecting and storage Unit (1) includes solar panels, the negative output terminal ground connection of the solar panels, and the positive output end of the solar panels passes through first The cathode of resistance R1 the first zener diodes of connection D1, the anode of the first zener diode D1 connect the 3rd zener diode The cathode of D3, the anode of the 3rd zener diode D3 connect the Power Management Unit (2), and the solar energy collecting is with depositing Storage unit (1) further includes storage battery, the anode ground connection of the storage battery, and the cathode of the storage battery connects the second zener diode The cathode of D2, the anode of the second zener diode D2 connect the anode of the first zener diode D1, the solar energy The anode ground connection that electrolytic capacitor Cs1, the electrolytic capacitor Cs1 are further included with storage unit is collected, cathode connection the described 3rd is steady Press the cathode of diode D3；It is single that the Power Management Unit (2) includes image power supply unit, DSP power supply units, ultraviolet power supply unit and main MCU power supplies Member；Described image power supply unit includes the input terminal connection institute of the first buck converter U1, the first buck converter U1 Solar energy collecting and storage unit (1) are stated, the VIN ports of the first buck converter U1 are grounded by the first capacitance C1, institute The enabled control terminal for stating the first buck converter U1 connects the enabled I/O port of the MCU Main Processing Unit (10), first decompression The VH ports of converter U1 connect the other end connection described image drive circuit of the first inductance L1, the first inductance L1 (11), the GND ports of the first buck converter U1 connect the cathode of the 4th zener diode D4, two pole of the 4th voltage stabilizing The anode of pipe D4 connects the first inductance L1, and the BOOT ports of the first buck converter U1 pass through the second capacitance C2 connections The VH ports of the first buck converter U1, the output terminal of the first buck converter U1 pass through second resistance R2 connections institute Image driver circuitry (11) is stated, the output terminal of the first buck converter U1 is grounded by 3rd resistor R3, first drop The output terminal of pressure converter U1 passes through the GND ports of 3rd resistor R3 connections the first buck converter U1, second electricity Free end difference parallel connection the 3rd capacitance C3, the 4th capacitance C4 of R2 and 3rd resistor R3 is hindered, the both ends of the 4th capacitance C4 are simultaneously Join the first transient voltage suppressor D5, the 3rd capacitance C3, the 4th capacitance C4, the first transient voltage suppressor D5 5V power supplys are connected with the common port of the first inductance L1；The input terminal that the DSP power supply units include the first power supply chip U2, the first power supply chip U2 connects the sun It can collect and be grounded with storage unit (1), the input terminal of the first power supply chip U2 by the 5th capacitance C5, first power supply The output terminal connection dsp chip of chip U2, the Enable Pin of the first power supply chip U2 pass through the 4th resistance R4 connections MCU The enabled I/O port of main control unit (10), the GND ends ground connection of the first power supply chip U2, the BYP of the first power supply chip U2 End is grounded by the 6th capacitance C6, and the output terminal of the first power supply chip U2 is grounded by the 7th capacitance C7, the 7th electricity Hold C7 and be connected 3.3V power supplys with the common port of the dsp chip；The ultraviolet power supply unit is included described in the input terminal connection of the second buck converter U3, the second buck converter U3 Solar energy collecting and storage unit (1), the input terminal of the second buck converter U3 are grounded by the 9th capacitance C9, and described the The first inductance L1 connections UV driven circuit (7), second buck converter are passed through in the VH ends of two buck converter U3 The GND ends of U3 respectively by the BOOT ends of the 6th zener diode D6, the 8th capacitance C8 connections the second buck converter U3, The GND ends ground connection of the second buck converter U3, the Enable Pin of the second buck converter U3 connect the MCU master controls list The I/O port of member, the output terminal of the second buck converter U3 pass through the 5th resistance R5 connections UV driven circuit (7), institute The output terminal for stating the second buck converter U3 is grounded by the 6th resistance R6, the freedom of the 5th resistance R5 and the 6th resistance R6 Hold the second transient voltage suppressor D7's, the second transient voltage suppressor D7 and the 5th resistance R5 of parallel connection Common port connects 5V power supplys；The main MCU power supply units are included described in the input terminal connection of second source chip U4, the second source chip U4 too Sun can be collected to be grounded with storage unit (1), the input terminal of the second source chip U4 by the tenth capacitance C10, and described second The Enable Pin of power supply chip U4 passes through the 7th resistance R7 connections solar energy collecting and storage unit (1), the second source The GND ends ground connection of chip U4, the BYP ends of the second source chip U4 are grounded by the 11st capacitance C11, the second source The output terminal of chip U4 connects the MCU Main Processing Unit (10), and the output terminal of the second source chip U4 connects 3.3V power supplys, The output terminal of the second source chip U4 is grounded by the 12nd capacitance C12.
- 9. photo taking type mixed flame detector according to claim 1, it is characterised in that：The MCU Main Processing Unit (10) For low-power scm U5, the RST mouths of the low-power scm U5 pass through the 11st resistance R11 connection 3.3V power supplys, described The infrared collecting end of low-power scm U5 connects the infrared bandwidth-limited circuit (5), the purple of the low-power scm U5 Outer collection terminal connects the ultraviolet Acquisition Circuit (9), and the AVcc1 mouths of the low-power scm U5 are connected by the tenth resistance R10 The Power Management Unit (2) is connect, the AVcc1 mouths of the low-power scm U5 meet simulation ground, institute by the first tantalum capacitance E1 The AVcc1 mouths for stating low-power scm U5 are grounded by the tenth resistance R10, the second tantalum capacitance E2 respectively, the low-power consumption monolithic The AVss1 mouths of machine U5 connect simulation ground, and the DVcc1 mouths of the low-power scm U5 are grounded by the second tantalum capacitance E2, described low The DVcc1 mouths of power consumption microcontroller U5 are grounded by the 13rd capacitance C13, the DVss1 mouths ground connection of the low-power scm U5, institute The wake-up I/O port for stating low-power scm U5 connects the infrared I/O interrupt circuit (6), the power supply of the low-power scm U5 Management end connects the Power Management Unit (2), and the environment collection terminal of the low-power scm U5 connects the environmentally sensitive Device assembly (15), the image recognition end connection described image recognition unit of the low-power scm U5, the low-power consumption monolithic The instruction I/O port of machine U5 is grounded by the 8th resistance R8, the second Light-emitting diode LED 2 respectively, the low-power scm U5's Instruction I/O port is grounded by the 9th resistance R9, the first Light-emitting diode LED 1 respectively, the DVss2 mouths of the low-power scm U5 Ground connection, the DVcc2 connection 3.3V power supplys of the low-power scm U5, the DVcc2 of the low-power scm U5 pass through the tenth Four capacitance C14 are grounded, and the image storage end of the low-power scm U5 is connected with image storage unit, the low-power consumption monolithic The communication ends connection wireless communication unit of machine U5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721203568.9U CN207264544U (en) | 2017-09-19 | 2017-09-19 | Photo taking type mixed flame detector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721203568.9U CN207264544U (en) | 2017-09-19 | 2017-09-19 | Photo taking type mixed flame detector |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207264544U true CN207264544U (en) | 2018-04-20 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721203568.9U Active CN207264544U (en) | 2017-09-19 | 2017-09-19 | Photo taking type mixed flame detector |
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| Country | Link |
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| CN (1) | CN207264544U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115273385A (en) * | 2022-07-11 | 2022-11-01 | 杭州海康威视数字技术股份有限公司 | Camera for flame detection |
-
2017
- 2017-09-19 CN CN201721203568.9U patent/CN207264544U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115273385A (en) * | 2022-07-11 | 2022-11-01 | 杭州海康威视数字技术股份有限公司 | Camera for flame detection |
| CN115273385B (en) * | 2022-07-11 | 2024-03-26 | 杭州海康威视数字技术股份有限公司 | A camera for flame detection |
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