CN207247617U - A kind of refrigeration heat pipe device of semiconductor driving - Google Patents
A kind of refrigeration heat pipe device of semiconductor driving Download PDFInfo
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- CN207247617U CN207247617U CN201720942318.0U CN201720942318U CN207247617U CN 207247617 U CN207247617 U CN 207247617U CN 201720942318 U CN201720942318 U CN 201720942318U CN 207247617 U CN207247617 U CN 207247617U
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- pipe
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Abstract
The utility model provides a kind of refrigeration heat pipe device of semiconductor driving, is mainly used for permanent frozen soil foundation thermostabilization maintenance, it can also be used to the refrigeration of air-conditioning, freezer etc..The refrigeration heat pipe of the utility model is to be provided with semiconductor cooling device in the changeover portion of general heat pipe, by the forced refrigeration of semiconductor, forces the evaporator section and radiating segment of general heat pipe（Or changeover portion）It is poor to produce subzero temperature, so that heat pipe can not only strengthen circularly cooling in dead season, and heat pipe is forced to start work in warm season, solving the problems, such as heat pipe can not work normally or low in dead season refrigerating efficiency in warm season, annual operation and cycle operation, the particularly warm season in ever-frozen ground thawing season of heat pipe are realized, can realize active refrigeration, the heat that permanent frozen soil foundation roadbed can effectively be prevented melts the diseases such as sinking, inclination, cracking, has stronger practicality.
Description
Technical field
A kind of refrigeration heat pipe, more particularly to a kind of refrigerating plant of semiconductor driving are the utility model is related to, is mainly used for
Permanent frozen soil foundation thermostabilization is safeguarded, it can also be used to the refrigeration of air-conditioning, freezer etc..
Background technology
Permanent frozen soil foundation, roadbed thermostabilization operation maintenance in, largely employ heat-pipe refrigerating device.Heat pipe is one
The seal pipe heat-transfer device of kind vehicle repair major convection circulation, is mainly made of, evaporator section is placed in evaporator section and radiating segment two parts
In permafrost, radiating segment is placed in air, and refrigeration working medium is charged in wherein.In dead season, when the temperature of evaporator section is higher than scattered
During hot arc temperature, refrigeration working medium starts the cycle over work；In thermal etching warm season the most serious, radiate when the temperature of evaporator section is higher than
During Duan Wendu, refrigeration working medium stops circulation, and heat pipe is then stopped, then can not protect ever-frozen ground.
Utility model content
The purpose of this utility model be for common refrigeration heat pipe there are the problem of, there is provided a kind of refrigeration of semiconductor driving
Device, to solve the problems, such as that heat pipe can not work normally or low in dead season refrigerating efficiency in warm season.
A kind of refrigerating plant of semiconductor driving of the utility model, including connected by radiating segment, changeover portion, evaporator section siphunculus
The heat pipe of composition, the radiating segment of the heat pipe are externally provided with outer heat sink, interior heat sink, the evaporator section of heat pipe are equipped with heat pipe changeover portion
It is interior filled with liquid refrigerant, semiconductor cooling device is installed in heat pipe changeover portion.
The semiconductor cooling device include be installed on heat pipe changeover portion outside semiconductor cooler, be arranged on semiconductor system
The protective cover outside insulating layer and insulating layer outside cooler.The both ends of the semiconductor cooling device are fixed on by fixing pipe cap
On heat pipe changeover portion.
The semiconductor cooler includes semiconductor chilling plate, and water cooler is equipped with the side of semiconductor chilling plate, another
Side is equipped with heat insulating mattress, and the contact change-over panel being adapted with heat pipe heat radiation section outer edge surface is provided with the outside of heat insulating mattress；It is described every
Heat pad, semiconductor chilling plate, water cooler and contact change-over panel by press strip and are bolted fixation.In order to integrally-built compact
Property, is provided with the semiconductor chilling plate preformed hole and electric wire preformed hole being adapted with semiconductor chilling plate on heat insulating mattress.Water cooler
Top be equipped with cooling fluid circulation pipe, be connected with the circulation pipe of semiconductor control.
The insulating layer includes the first insulating layer being arranged on outside heat pipe changeover portion（Not comprising semiconductor cooler）, and set
Put the second insulating layer outside the first insulating layer and semiconductor cooler；Outer protective cover is outside the second insulating layer.
Semiconductor control is installed in heat pipe heat radiation section, semiconductor system device processed includes the water cooling box of closing, water cooling box
Top radiator fan is installed, the bottom of water cooling box is provided with circulating pump, the circulating pump pass through circulation fluid pumping line with heat dissipation
Fan unicom；The bottom of radiator fan is respectively arranged with the circulation fluid being connected with the cooling fluid circulation pipe of semiconductor cooler and goes out stream
Pipe, circulation fluid return duct；The bottom of radiator fan is additionally provided with falls into pipe with water cooling box unicom；Filling circulation fluid in water cooling box；
Water cooling box is provided outside automatic controller control semiconductor cooler and radiator fan, the working time of circulating pump, live load
And the flow direction of circulation fluid.Wherein circulation fluid outflow tube, circulation fluid return duct through water cooling box respectively with semiconductor cooler into
Outlet connection.In order to protect its trouble free service, semiconductor control is installed in semiconductor control cabinet, and is fixed by anchor ear
In heat pipe heat radiation section.
The principle of the utility model：The semiconductor cooler of semiconductor cooler and the side wall of heat pipe are in close contact, and are partly led
The cold of chiller is conducted in heat pipe at interior radiated rib, and occur with refrigerant vapour by the tube wall of heat pipe side wall
Heat exchange, condenses the steam into liquid.The heat that semiconductor cooler is swapped out is carried out by the circulation fluid in cooling fluid circulation pipe
Circulation, and convection circulation and heat dissipation are controlled by semiconductor control.
The advantages of the utility model：By the forced refrigeration of semiconductor cooling device, make the evaporator section of general heat pipe with dissipating
Hot arc（Or changeover portion）It is poor to produce subzero temperature, so that heat pipe can not only strengthen circularly cooling in dead season, and heat is forced in warm season
Pipe starts work, realizes annual operation and cycle operation, the particularly warm season in ever-frozen ground thawing season of heat pipe, Neng Goushi
Existing active refrigeration, the heat that can effectively prevent permanent frozen soil foundation roadbed melt the diseases such as sinking, inclination, cracking, have stronger reality
The property used.
Brief description of the drawings
Fig. 1 is the outside drawing of general heat pipe.
Fig. 2 is the refrigerating plant outside drawing of semiconductor driving.
Fig. 3 is the partial sectional view of the refrigerating plant of semiconductor driving.
Fig. 4 is the structure and installation diagram of semiconductor cooling device.
Fig. 5 is the structure chart of semiconductor cooler in semiconductor cooling device.
Fig. 6 is the installation diagram of semiconductor cooler in semiconductor cooling device.
Fig. 7 is the structure chart of semiconductor refrigeration controller.
Embodiment
With reference to Fig. 1,2, a kind of refrigerating plant of semiconductor driving, including by radiating segment 2, changeover portion 3,4 siphunculus of evaporator section
The heat pipe 1 of composition is connected, the radiating segment 2 of heat pipe is externally provided with outer heat sink, and the evaporator section 4 of heat pipe is interior filled with liquid refrigerant 9.Heat
Interior heat sink 10 is installed in the changeover portion 3 of pipe, semiconductor cooling device 7 is installed outside the changeover portion 3 of heat pipe；The heat dissipation of heat pipe
Section 2 is provided with semiconductor control 13（Semiconductor control 13 is installed in semiconductor control cabinet 5, and is fixed on by anchor ear 6
Heat pipe heat radiation section 2）.
With reference to Fig. 3,4, semiconductor cooling device 7 includes the semiconductor cooler 11 being installed on outside heat pipe changeover portion, and
The insulating layer 12 and outer protective cover 16 being arranged on outside semiconductor cooler 11.Wherein insulating layer 12 includes being arranged on heat pipe changeover portion
Outside 3（Not comprising semiconductor cooler 11）The first insulating layer 14, be arranged on outside the first insulating layer 14 and semiconductor cooler 11
The second insulating layer 15；Outer protective cover 16 is outside the second insulating layer.The both ends of semiconductor cooling device 7 are fixed by fixing pipe cap 17
On heat pipe changeover portion 3.
With reference to Fig. 4,5, semiconductor cooler 11, including semiconductor chilling plate 11-3, are arranged on semiconductor chilling plate 11-3
The heat insulating mattress 11-2 and water cooler 11-4 of both sides, and be provided with heat insulating mattress 11-2 sides and be adapted with heat pipe heat radiation section outer edge surface
Contact change-over panel 11-1；And heat insulating mattress 11-2, semiconductor chilling plate 11-3, water cooler 11-4 and contact change-over panel 11-1 pass through
Press strip 11-5 and bolt 11-6 are connected into one.The top of water cooler 11-4 is equipped with cooling fluid circulation pipe 11-7.In order to just
Reserved in being provided with assembling, the adiabatic backing plate of heat insulating mattress 11-2 with the semiconductor chilling plate 11-3 semiconductor chilling plates being adapted
Hole and electric wire preformed hole.Smear heat-conducting silicone grease on the contact arc surface of contact surface change-over panel after assembling, make contact arc surface with
Heat pipe side wall is in close contact；Then it is fixed on heat pipe side wall by welding or being bonded radiation.
Semiconductor cooler 11 installs the first insulating layer 14 after installation is complete in the gamut of the changeover portion 3 of heat pipe 1,
Insulating layer is set to go deep into the next depthkeeping degree in ground.The second insulating layer 15 is installed in 14 outside gamut of the first insulating layer again, and is made
Its fully wrapped around firmly semiconductor cooler 11, makes the second insulating layer 15 go deep into the next depthkeeping degree in ground.Finally in the second insulating layer
15 outside installation outer protective covers 16, finally in the fixed pipe cap 17 of upper and lower side installation of protective cover 16.
With reference to Fig. 6, semiconductor refrigeration controller 13 includes the water cooling box 13-1 of closing, and heat dissipation is provided with above water cooling box
Fan 13-2, the bottom of water cooling box are provided with circulating pump 13-3, which passes through circulation fluid pumping line 13-6 and radiator fan
13-2 unicom；The bottom of radiator fan 13-2 is respectively arranged with the cooling fluid circulation pipe with semiconductor cooler（11-7）Connection
Circulation fluid outflow tube 13-7, circulation fluid return duct 13-8（In order to save space, circulation fluid outflow tube 13-7, circulation fluid return duct
13-8 passes through water cooling box 13-1）；The bottom of radiator fan 13-2 is additionally provided with falls into pipe 13-9 with water cooling box unicom；In water cooling box
Fill circulation fluid 13-4；Water cooling box is provided outside automatic controller 13-5 control semiconductor coolers and radiator fan, circulating pump
Working time, the flow direction of live load and circulation fluid.
During installation, the evaporator section 4 of formula heat pipe 1 is embedded in soil layer, and changeover portion 3, radiating segment 2 are placed in air.
Claims (10)
1. a kind of refrigerating plant of semiconductor driving, including by radiating segment（2）, changeover portion（3）, evaporator section（4）Siphunculus connection group
Into heat pipe（1）, the radiating segment of heat pipe（2）It is externally provided with outer heat sink, the changeover portion of heat pipe（3）Interior heat sink is inside installed
（10）, evaporator section（4）It is interior filled with liquid refrigerant（9）；It is characterized in that：In heat pipe changeover portion（3）Semiconductor refrigerating is installed
Device（7）.
2. the refrigerating plant of semiconductor driving as claimed in claim 1, it is characterised in that：The semiconductor cooling device（7）Bag
Include and be installed on heat pipe changeover portion（3）Outer semiconductor cooler（11）, it is arranged on semiconductor cooler（11）Outer insulating layer
（12）, and it is arranged on insulating layer（12）Outer protective cover（16）.
3. the refrigerating plant of semiconductor driving as claimed in claim 2, it is characterised in that：The semiconductor cooler（11）Including
Semiconductor chilling plate（11-3）, in semiconductor chilling plate（11-3）Side be equipped with water cooler（11-4）, opposite side is equipped with heat-insulated
Pad（11-2）, and in heat insulating mattress（11-2）Outside is provided with the contact change-over panel being adapted with heat pipe heat radiation section outer edge surface（11-
1）；The heat insulating mattress（11-2）, semiconductor chilling plate（11-3）, water cooler（11-4）And contact change-over panel（11-1）Pass through press strip
（11-5）And bolt（11-6）Connection is fixed；Water cooler（11-4）Top be equipped with cooling fluid circulation pipe（11-7）.
4. the refrigerating plant of semiconductor driving as claimed in claim 3, it is characterised in that：The heat insulating mattress（11-2）On be provided with
The semiconductor chilling plate preformed hole and electric wire preformed hole being adapted with semiconductor chilling plate.
5. the refrigerating plant of semiconductor driving as claimed in claim 2, it is characterised in that：The insulating layer（12）Including being arranged on
Heat pipe changeover portion（3）The first outer insulating layer（14）, it is arranged on the first insulating layer（14）And semiconductor cooler（11）Outer
Two insulating layers（15）；Outer protective cover（16）Outside the second insulating layer.
6. such as the refrigerating plant of the claim 1 ~ 5 any type semiconductor driving, it is characterised in that：The semiconductor refrigerating
Device（7）Both ends by fixing pipe cap（17）It is fixed on heat pipe changeover portion（3）On.
7. such as the refrigerating plant of the claim 1 ~ 5 any type semiconductor driving, it is characterised in that：In heat pipe heat radiation section
（2）Semiconductor control is installed（13）, and semiconductor control（13）With semiconductor cooler（11）Cooling fluid circulation pipe
（11-7）Connection.
8. the refrigerating plant of semiconductor driving as claimed in claim 7, it is characterised in that：The semiconductor refrigeration controller（13）
Water cooling box including closing（13-1）, radiator fan is installed above water cooling box（13-2）, the bottom of water cooling box, which is provided with, to be followed
Ring pumps（13-3）, which passes through circulation fluid pumping line（13-6）With radiator fan（13-2）Unicom；Radiator fan（13-2）
Bottom be respectively arranged with cooling fluid circulation pipe with semiconductor cooler（11-7）The circulation fluid outflow tube of connection（13-7）, follow
Ring liquid return duct（13-8）；Radiator fan（13-2）Bottom be additionally provided with and fall into pipe with water cooling box unicom（13-9）；Water cooling box
Interior filling circulation fluid（13-4）；Water cooling box is provided outside automatic controller（13-5）Control semiconductor cooler and radiator fan,
The flow direction of working time of circulating pump, live load and circulation fluid.
9. the refrigerating plant of semiconductor driving as claimed in claim 8, it is characterised in that：The circulation fluid outflow tube（13-7）、
Circulation fluid return duct（13-8）Through water cooling box（13-1）Respectively with semiconductor cooler（11）Inlet and outlet connection.
10. the refrigerating plant of semiconductor driving as claimed in claim 8, it is characterised in that：The semiconductor control（13）Peace
Mounted in semiconductor control cabinet（5）It is interior, and pass through anchor ear（6）It is fixed on heat pipe heat radiation section（2）.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720942318.0U CN207247617U (en) | 2017-07-31 | 2017-07-31 | A kind of refrigeration heat pipe device of semiconductor driving |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720942318.0U CN207247617U (en) | 2017-07-31 | 2017-07-31 | A kind of refrigeration heat pipe device of semiconductor driving |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207247617U true CN207247617U (en) | 2018-04-17 |
Family
ID=61878774
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720942318.0U Active CN207247617U (en) | 2017-07-31 | 2017-07-31 | A kind of refrigeration heat pipe device of semiconductor driving |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207247617U (en) |
-
2017
- 2017-07-31 CN CN201720942318.0U patent/CN207247617U/en active Active
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