CN207247616U - A kind of semiconductor cooler for heat-pipe refrigerating - Google Patents
A kind of semiconductor cooler for heat-pipe refrigerating Download PDFInfo
- Publication number
- CN207247616U CN207247616U CN201720942316.1U CN201720942316U CN207247616U CN 207247616 U CN207247616 U CN 207247616U CN 201720942316 U CN201720942316 U CN 201720942316U CN 207247616 U CN207247616 U CN 207247616U
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- heat
- semiconductor
- chilling plate
- cooler
- insulating mattress
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Abstract
The utility model provides a kind of semiconductor cooler for heat-pipe refrigerating, is mainly used in permanent frozen soil foundation thermostabilization maintenance.The semiconductor cooler includes semiconductor chilling plate, and heat insulating mattress is equipped with the outside of semiconductor chilling plate, and opposite side is equipped with water cooler, and the contact change-over panel being adapted with heat pipe outer edge surface is provided with the outside of heat insulating mattress.Wherein heat insulating mattress effect is to separate semiconductor chilling plate surrounding, and the temperature and heat for making refrigeration or heat-insulated single side are not interfered with each other or influenced；Water cooler reduces the temperature in semiconductor chilling plate hot junction by radiating mode, effectively increases the refrigerating efficiency of semiconductor cooler；Contact change-over panel makes semiconductor chilling plate preferably with heat pipe contact and heat transfer, further increase the refrigerating efficiency of semiconductor cooler；It is set very firm to be installed on heat pipe at the same time.
Description
Technical field
It the utility model is related to a kind of semiconductor cooler, more particularly to a kind of semiconductor refrigerating for heat-pipe refrigerating
Device, is mainly used in permanent frozen soil foundation thermostabilization maintenance, it can also be used to the refrigeration of air-conditioning, freezer etc..
Background technology
Permanent frozen soil foundation, roadbed thermostabilization operation maintenance in, largely employ hot pin refrigerating plant.Hot pin is one
The seal pipe heat-transfer device of kind vehicle repair major convection circulation, is mainly made of, evaporator section is placed in evaporator section and radiating segment two parts
In permafrost, radiating segment is placed in air, and refrigeration working medium is charged in wherein.In dead season, when the temperature of evaporator section is higher than scattered
During hot arc temperature, refrigeration working medium starts the cycle over work；In thermal etching warm season the most serious, radiate when the temperature of evaporator section is higher than
During Duan Wendu, refrigeration working medium stops circulation, and hot pin is then stopped, then can not protect ever-frozen ground.For this problem, general
The changeover portion of logical heat pipe is provided with semiconductor cooler, by the forced refrigeration of semiconductor, force the evaporator section of general heat pipe with
Radiating segment（Or changeover portion）It is poor to produce subzero temperature, and heat pipe is strengthened circularly cooling in dead season, and heat is forced in warm season
Pipe starts work, realizes annual operation and cycle operation, the particularly warm season in ever-frozen ground thawing season of heat pipe, Neng Goushi
Existing active refrigeration, the heat that can effectively prevent permanent frozen soil foundation roadbed melt the diseases such as sinking, inclination, cracking, have stronger reality
The property used.
Semiconductor cooler, is the device that cold is produced using the thermo-electrically effect of semiconductor, also known as thermo-electrically refrigerator, half
Conductor refrigerating appliance has noiseless, without friction, the features such as being not required to refrigerant, is small, is light-weight, and reliable operation, operation letter
Just, it is easy to carry out cold regulation.But semiconductor itself will produce heat there are resistance when electric current passes through semiconductor, from
And heat transfer can be influenced.And the heat between two pole plates also can carry out reverse heat by air and semi-conducting material itself and pass
Pass.When hot and cold side reaches certain temperature difference, when the amount of both heat transfers is equal, an equalization point will be reached, just reverse heat passes
Pass and cancel out each other.The temperature of hot and cold side would not continue to change at this time, so as to have impact on the refrigeration effect of semiconductor cooler
Rate and effect.
The content of the invention
The purpose of this utility model be for existing semiconductor cooler there are the problem of, there is provided one kind can reduce hot junction temperature
The semiconductor cooler of degree, to improve the refrigerating efficiency of semiconductor cooler.
The utility model is used for the semiconductor cooler of heat-pipe refrigerating, including semiconductor chilling plate, in semiconductor chilling plate
Outside be equipped with heat insulating mattress, opposite side is equipped with water cooler.Heat insulating mattress can completely cut off the heat transmission of semiconductor cooler, and water cooler leads to
Crossing radiating mode reduces the temperature in semiconductor chilling plate hot junction.
In order to make semiconductor chilling plate preferably with heat pipe contact and heat transfer, be provided with the side of heat insulating mattress with outside heat pipe
The contact change-over panel that edge face is adapted.The contact change-over panel to the one side of heat insulating mattress be plane, backwards to heat insulating mattress one side be with
The arc surface that heat pipe outer edge surface is adapted.
For integrally-built compactedness, the semiconductor system being adapted with semiconductor chilling plate is provided with the heat insulating mattress
Cold preformed hole and electric wire preformed hole.In order to further improve refrigerating efficiency, it is provided with the adiabatic backing plate of heat insulating mattress up and down
Two groups of semiconductor chilling plate preformed holes and electric wire preformed hole being adapted with semiconductor chilling plate, install semiconductor system in it respectively
Cold and its electric wire.
The heat insulating mattress, semiconductor chilling plate, water cooler and contact change-over panel are by press strip and are bolted integral.
The utility model compared with the prior art have it is following a little：
1st, the utility model is respectively equipped with heat insulating mattress and water cooler in the both sides of semiconductor chilling plate, heat insulating mattress effect be by
Semiconductor chilling plate surrounding separates, and the temperature and heat for making refrigeration or heat-insulated single side are not interfered with each other or influenced；Water cooler passes through
Radiating mode reduces the temperature in semiconductor chilling plate hot junction, effectively increases the refrigerating efficiency of semiconductor cooler；
2nd, the utility model is provided with the contact change-over panel being adapted with heat pipe outer edge surface on the outside of heat insulating mattress, makes partly to lead
Body cooling piece preferably with heat pipe contact and heat transfer, further increases the refrigerating efficiency of semiconductor cooler；Make it can at the same time
It is installed on very firm on heat pipe.
Brief description of the drawings
Fig. 1 is the exploded view of the utility model semiconductor cooler.
Fig. 2 is the installation diagram of the utility model semiconductor cooler.
Fig. 3 is the structure chart of the utility model heat insulating mattress.
Fig. 4 is the installation diagram of the utility model semiconductor cooler and heat pipe.
Embodiment
With reference to Fig. 1, a kind of semiconductor cooler for heat-pipe refrigerating, including semiconductor chilling plate 3, in semiconductor refrigerating
The both sides of piece 3 are respectively equipped with heat insulating mattress 2 and water cooler 4, and are equipped with the outside of heat insulating mattress 2 and are connect with what heat pipe outer edge surface was adapted
Touch change-over panel 1.Wherein contact change-over panel 1 towards heat insulating mattress 2 one side be plane, backwards to heat insulating mattress 2 one side for outside heat pipe
The arc surface that edge face is adapted.Heat insulating mattress 2, semiconductor chilling plate 3, water cooler 4 and contact change-over panel 1 pass through press strip 5 and bolt 6
It is connected into one.Two groups of semiconductor chilling plate preformed holes being adapted with semiconductor chilling plate 3 up and down are set on heat insulating mattress 2
And electric wire preformed hole, semiconductor chilling plate and its electric wire are installed respectively in it.
The material of contact surface change-over panel 1 is the metal with high-termal conductivity, and the material of heat insulating mattress is with low compressibility, low
The fine pore material that thermal conductivity and performance are stablized.
When semiconductor cooler assembles based on contact surface change-over panel 1, then according to sequencing by heat insulating mattress 2, half
Conductor cooling piece 3, water cooler 4 are placed in the plane of contact surface change-over panel 1 successively；Two side planes of semiconductor chilling plate 3 are equal
Heat-conducting silicone grease is smeared, and the plane with contact surface change-over panel 1, water cooler 4 are in close contact respectively, then using press strip 5 and bolt 6
Contact surface change-over panel 1, heat insulating mattress 2, semiconductor chilling plate 3, water cooler 4 are closely connected.Semiconductor refrigerating after being completed
Device is in close contact with heat pipe side wall, and smears heat-conducting silicone grease on the contact arc surface of contact surface change-over panel 1, makes contact arc surface
It is in close contact with heat pipe side wall.Semiconductor cooler and heat pipe side wall are by welding or be bonded.
Claims (5)
1. a kind of semiconductor cooler for heat-pipe refrigerating, including semiconductor chilling plate（3）, it is characterised in that：In semiconductor
Cooling piece（3）Side be equipped with heat insulating mattress（2）, opposite side is equipped with water cooler（4）.
2. it is used for the semiconductor cooler of heat-pipe refrigerating as claimed in claim 1, it is characterised in that：In heat insulating mattress（2）Outside
It is provided with the contact change-over panel being adapted with heat pipe outer edge surface（1）.
3. it is used for the semiconductor cooler of heat-pipe refrigerating as claimed in claim 2, it is characterised in that：The contact change-over panel（1）
Towards heat insulating mattress（2）One side be plane, backwards to heat insulating mattress（2）One side be the arc surface that is adapted with heat pipe outer edge surface.
4. it is used for the semiconductor cooler of heat-pipe refrigerating as claimed in claim 1 or 2, it is characterised in that：The heat insulating mattress（2）On
It is provided with and semiconductor chilling plate（3）The semiconductor chilling plate preformed hole and electric wire preformed hole being adapted.
5. it is used for the semiconductor cooler of heat-pipe refrigerating as claimed in claim 1 or 2, it is characterised in that：The heat insulating mattress（2）、
Semiconductor chilling plate（3）, water cooler（4）And contact change-over panel（1）Pass through press strip（5）And bolt（6）Connection is fixed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720942316.1U CN207247616U (en) | 2017-07-31 | 2017-07-31 | A kind of semiconductor cooler for heat-pipe refrigerating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720942316.1U CN207247616U (en) | 2017-07-31 | 2017-07-31 | A kind of semiconductor cooler for heat-pipe refrigerating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207247616U true CN207247616U (en) | 2018-04-17 |
Family
ID=61878749
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720942316.1U Active CN207247616U (en) | 2017-07-31 | 2017-07-31 | A kind of semiconductor cooler for heat-pipe refrigerating |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207247616U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111520930A (en) * | 2020-05-07 | 2020-08-11 | 中国民航大学 | Frozen soil area refrigerating device adopting semiconductor heat pipe |
-
2017
- 2017-07-31 CN CN201720942316.1U patent/CN207247616U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111520930A (en) * | 2020-05-07 | 2020-08-11 | 中国民航大学 | Frozen soil area refrigerating device adopting semiconductor heat pipe |
| CN111520930B (en) * | 2020-05-07 | 2021-11-16 | 中国民航大学 | Frozen soil area refrigerating device adopting semiconductor heat pipe |
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