CN207219149U - The lamination contraposition structure and wiring board of wiring board - Google Patents
The lamination contraposition structure and wiring board of wiring board Download PDFInfo
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- CN207219149U CN207219149U CN201721082997.5U CN201721082997U CN207219149U CN 207219149 U CN207219149 U CN 207219149U CN 201721082997 U CN201721082997 U CN 201721082997U CN 207219149 U CN207219149 U CN 207219149U
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Abstract
It the utility model is related to a kind of lamination contraposition structure of wiring board, including at least three first positioning bodies being located on the first laminate, first positioning body forms the first locating surface, and the first positioning body is provided with positioning hole and first connecting portion, and first connecting portion is provided with the first network structure；At least three second positioning bodies being located on the second laminate, the second positioning body is formed is provided with positioning hole and second connecting portion with the second coplanar locating surface of the first locating surface, the second positioning body, and second connecting portion is provided with the second network structure；And the colloid that the first network structure and the second network structure link together.The first laminate and the second laminate are aligned in advance using positioning hole, and the first network structure and the second network structure are linked together using colloid, due to being more easy to accommodate colloid between the first network structure and the second network structure, and multiple mesh of network structure make it that bonding is more firm, it is not susceptible to off normal, lamination aligning accuracy is improved, reduces enterprise's production cost.
Description
Technical field
Wiring board techniques field is the utility model is related to, more particularly to the lamination contraposition structure and circuit of a kind of wiring board
Plate.
Background technology
With the continuous development of electronics industry, product is also increasingly stricter to the quality requirement of PCB, designs therewith
PCB the number of plies it is also more and more.The lamination contraposition of existing high-rise PCB using rivet interlacement mode,
This simple PCB positioning precision by rivet interlacement is poor, and for high-rise PCB, positioning precision difference can serious shadow
Ring to it and be laminated quality, not only result in the rise of product fraction defective, increase enterprise's production cost, also have a strong impact on the economy of enterprise
Benefit.
Utility model content
Based on this, it is necessary to for PCB lamination aligning accuracy difference the problem of, there is provided a kind of lamination of wiring board
Aligning structure and wiring board.
Its technical scheme is as follows：
A kind of lamination contraposition structure of wiring board, including at least three first positioning bodies being located on the first laminate, first
Positioning body forms the first locating surface, and the first positioning body is provided with positioning hole and first connecting portion, and it is netted that first connecting portion is provided with first
Structure；At least three second positioning bodies being located on the second laminate, the second positioning body form second coplanar with the first locating surface
Locating surface, the second positioning body are provided with positioning hole and the second connecting portion being connected with first connecting portion, and second connecting portion is provided with second
Network structure；And the colloid that the first network structure and the second network structure link together.
The lamination contraposition structure of above-mentioned wiring board, the first laminate and the second laminate are aligned in advance using positioning hole, and utilized
Colloid links together the first network structure and the second network structure, due between the first network structure and the second network structure
It is more easy to accommodate colloid, and multiple mesh of network structure make it that bonding is more firm, are not susceptible to off normal, improve lamination contraposition
Precision, reduce enterprise's production cost.
Technical scheme is illustrated further below：
In one of the embodiments, first connecting portion is provided with multiple first depressed parts, and multiple first depressed parts form the
One network structure, second connecting portion are provided with multiple second depressed parts, and multiple second depressed parts form the second network structure；Or first
Connecting portion is provided with multiple 3rd depressed parts, and multiple 3rd depressed parts form the first network structure, second connecting portion be provided with it is multiple with
3rd depressed part corresponds the 4th lug boss coordinated, and multiple 4th lug bosses form the second network structure.First laminate and
When second laminate carries out lamination contraposition, the presence of colloid may make to form projection between the first laminate and the second laminate and produce to answer
Power, in turn result in and misplaced between the first laminate and the second laminate, the setting of the first depressed part and the second depressed part so that glue
Body may be housed in the first depressed part and the second depressed part, improve lamination aligning accuracy；3rd depressed part and the 4th lug boss
Setting can not only be played a part of accommodating colloid and then improve lamination aligning accuracy, due also to the 3rd depressed part and the 4th projection
Cooperation contraposition between portion improves the precision of pre-determined bit between the first laminate and the second laminate, further improves lamination contraposition essence
Degree.
In one of the embodiments, the first plate face of the first laminate is provided with least three first positioning bodies, the first laminate
The second plate face be provided with least three first positioning bodies, the first plate face of the second laminate is provided with least three second positioning bodies,
Second plate face of two laminates is provided with least three second positioning bodies.Now, it is bonded to each other between the first laminate and the second laminate
First positioning body of two plate faces and the connection of the second positioning body corresponding matching, the first positioning body of another plate face of the first laminate
It is connected with third layer plate corresponding matching, the second positioning body of another plate face of the second laminate and the 4th laminate corresponding matching connect
Connect, the interconnection and contraposition being easy between multiple laminates, improve overall lamination aligning accuracy.
In one of the embodiments, the edges of boards of the first laminate are provided with least three first breach, and the first positioning body is located at
In first breach, the edges of boards of the second laminate are provided with least three second breach, and the second positioning body is located in the second breach.First is fixed
Position body is located at the first laminate by the first breach, and the second positioning body is located at the second laminate, this setup by the second breach
It is easy to fabricate, reduces production cost.
Further, the first positioning body and the first laminate be in integrally manufactured, without setting the first breach, the second positioning body with
Second laminate is in integrally manufactured, without setting the second breach.Now, the process without opening up the first breach and the second breach, system
Cause this further to reduce, improve Business Economic Benefit.
Further, the first positioning body is detachably located on the first laminate by the first breach, and the second positioning body passes through
Two breach are detachably located on the second laminate.After machining, the first positioning body and the recovery of the second positioning body can be continuing with
Or recovery focuses on, the utilization rate of material is improved, reduces production cost.
In one of the embodiments, one end of the first positioning body is connected with the edges of boards of the first laminate, the second positioning body
One end is connected with the edges of boards of the second laminate.Edges of boards of first positioning body directly with the first laminate are connected, the second positioning body directly with
The edges of boards connection of second laminate, it is easily manufactured quick, simultaneously as the first positioning body is located at the edges of boards position of the first laminate, the
Two positioning bodies are located at the edges of boards position of the second laminate, are easy to coordinate positioning by positioning hole and positioner, lift lamination accuracy,
And production efficiency is improved, improve the yields of wiring board.
In one of the embodiments, it is provided with the first resistance glue portion between the edges of boards of the first positioning body and the first laminate, second
The second resistance glue portion is provided between the edges of boards of positioning body and the second laminate.When first laminate and the second laminate are laminated, due to glue
The factor of body bonding, colloid may flow into the component region of wiring board, and then influence the normal work of later stage core component,
The defective products rate of wiring board is caused to raise, the setting in the first resistance glue portion and the second resistance glue portion can stop that colloid flows toward component region
Enter, improve the yields of product, reduce the production cost of enterprise.
In one of the embodiments, multiple first resistance glue that the first resistance glue portion includes setting in the same direction are raised；Or
Multiple second resistance glue that second resistance glue portion includes setting in the same direction are raised.First resistance glue is raised and second hinders setting for glue projection
Putting can effectively avoid colloid from flowing into component area, be the specific set-up mode in the first resistance glue portion and the second resistance glue portion, be processed into
This is low, reduces the production cost of enterprise.
In one of the embodiments, multiple 3rd resistance glue that the first resistance glue portion includes setting in the same direction are raised, the
Two resistance glue portions include the 4th resistance glue groove corresponding with the 3rd resistance glue projection.The raised setting with the 4th resistance glue groove of 3rd resistance glue
Glue can not only be played a part of hindering, the 3rd resistance glue is raised and the setting of the 4th resistance glue groove is it is furthermore achieved that the first laminate and the
The pre-determined bit precision of two laminates, to improve the precision of lamination contraposition, improve the yields of product.
In one of the embodiments, the first positioning body is provided with the first docking section, and the second positioning body is provided with and docked with first
Second docking section of portion's butt junction location.First docking section and the setting of the second docking section, improve the first laminate and the second laminate is pre-
The precision of positioning, the precision of follow-up lamination contraposition is improved, improve the yields of product.
A kind of wiring board, including at least the first laminate and the second laminate, in addition to described in any of the above-described technical scheme
The lamination contraposition structure of wiring board.By using the lamination contraposition structure of the wiring board so that the first laminate, the layer of the second laminate
Press aligning accuracy to improve, improve the yields of product, improve the economic benefit of enterprise.
Brief description of the drawings
Fig. 1 is the overall structure diagram of positioning body；
Fig. 2 is a kind of embodiment schematic diagram using the wiring board of lamination contraposition structure；
Fig. 3 is another embodiment schematic diagram using the wiring board of lamination contraposition structure.
100th, lamination contraposition structure, 110, positioning body, 111, positioning hole, 112, network structure, 120, resistance glue portion, 200, layer
Plate.
Embodiment
Embodiment of the present utility model is described in detail below in conjunction with the accompanying drawings：
It should be noted that when alleged element is with another element " fixation " in text, it can be directly in another element
Above or there may also be element placed in the middle.When an element is considered as with another element " connection ", it can be straight
Another element is connected in succession or may be simultaneously present centering elements.On the contrary, when element is referred to as " directly existing " another element
" on " when, in the absence of intermediary element.Term as used herein " vertically ", " horizontal ", "left", "right" and similar table
State for illustrative purposes only, it is unique embodiment to be not offered as.
Unless otherwise defined, all of technologies and scientific terms used here by the article is led with belonging to technology of the present utility model
The implication that the technical staff in domain is generally understood that is identical.It is simply in term used in the description of the present utility model herein
The purpose of description specific embodiment, it is not intended that in limitation the utility model.Term as used herein " and/or " bag
Include the arbitrary and all combination of the Listed Items of one or more correlations.
A kind of lamination contraposition structure 100 of wiring board, by the setting of positioning body 110, positioning body 110 is provided with positioning hole
111st, network structure 112, during production, multiple laminates 200 carry out pre-determined bit by the positioning hole 111 of positioning body 110 thereon, so
Network structure 112 corresponding to two neighboring laminate 200 is bonded together using hot melt bonding machines gluing afterwards, is finally laminated
Contraposition, completes the operation of lamination stages, due to the setting of network structure so that and colloid is contained in the mesh of network structure 112,
And due to the setting of pre-determined bit and network structure 112 cause bonding more firmly uniformly, even if between laminate 200 occur harmomegathus or
The drilling off normal in later stage etc., do not influence its fastness being bonded each other, be not susceptible to off normal, improve between laminate 200
Lamination aligning accuracy, improve yields.Resistance glue portion 120 is additionally provided between positioning body 110 and laminate 200, prevents colloid from entering
To the component working region of laminate 200, the service behaviour of parts is influenceed.
As shown in figure 1, resistance glue portion 120 can be also directly arranged on positioning body 110, resistance glue portion 120 is located at the He of network structure 112
On positioning body 110 between laminate 200.
To distinguish the positioning body 110, positioning hole 111, the network structure that are set on different laminate 200 and different laminates 200
112 and resistance glue portion 120, the laminate 200 of wiring board is divided into the first laminate (not shown), the second laminate (does not show in figure
Go out), positioning body 110 divides into the first positioning body (not shown), the second positioning body (not shown), network structure 112
The first network structure (not shown), the second network structure (not shown) are divided into, resistance glue portion 120 divides into the first resistance
Glue portion (not shown), the second resistance glue portion (not shown), the differentiation simply to illustrate that convenience, do not form to skill
Any restrictions of art scheme, and those skilled in the art according to the explanation of this specification it will be appreciated that and knowing the technical scheme.
A kind of lamination contraposition structure of wiring board, including at least three first positioning bodies being located on the first laminate, first
Positioning body forms the first locating surface, and the first positioning body is provided with positioning hole and first connecting portion, and it is netted that first connecting portion is provided with first
Structure；At least three second positioning bodies being located on the second laminate, the second positioning body form second coplanar with the first locating surface
Locating surface, the second positioning body are provided with positioning hole and the second connecting portion being connected with first connecting portion, and second connecting portion is provided with second
Network structure；And the colloid that the first network structure and the second network structure link together.
The first laminate and the second laminate are aligned in advance using positioning hole, and utilize colloid by the first network structure and the second net
Shape structure links together, due to being more easy to accommodate colloid, and network structure between the first network structure and the second network structure
Multiple mesh make it that bonding is more firm, are not susceptible to off normal, improve lamination aligning accuracy, reduce enterprise's production cost.
It should be noted that colloid herein not only refers to the colloid that tradition is referred to, it not only includes tradition and referred to
Colloid, such as be bonded glue, in addition to：Be solid when unused using when be the convered structure of liquid, use when be that liquid glues
Connect the non-colloid of agent.No sticky when it is in raw state such as aqueous binder, only it is heated to certain on paste line
During temperature, it can just become a kind of tough adhesive, its colloid not thought for tradition；And for example aqueous emulsion type adhesive,
It can be a kind of natural or modified natural polymer aqueous solution.
Further preferably colloid is PUR, and using binding machine operation gluing is heated, production efficiency is high, and cost is low
Honest and clean, adhesive effect is good.
On the basis of any of the above-described individual embodiment, first connecting portion is provided with multiple first depressed parts, multiple first depressions
Portion forms the first network structure, and second connecting portion is provided with multiple second depressed parts, and multiple second depressed parts form the second netted knot
Structure；Or first connecting portion is provided with multiple 3rd depressed parts, multiple 3rd depressed parts form the first network structure, and second connecting portion is set
There are multiple the 4th lug bosses that cooperation is corresponded with the 3rd depressed part, multiple 4th lug bosses form the second network structure.The
When one laminate and the second laminate carry out lamination contraposition, the presence of colloid may make to form projection between the first laminate and the second laminate
And stress is produced, in turn result in and misplaced between the first laminate and the second laminate, the first depressed part and the second depressed part are set
Put so that colloid may be housed in the first depressed part and the second depressed part, improve lamination aligning accuracy；3rd depressed part and the 4th
The setting of lug boss can not only play a part of accommodate colloid so that improve lamination aligning accuracy, due also to the 3rd depressed part and
Cooperation contraposition between 4th lug boss improves the precision of pre-determined bit between the first laminate and the second laminate, further improves lamination
Aligning accuracy.
Further, the height of projection of the 4th lug boss is less than the cup depth of the 3rd depressed part, in order to accommodate colloid.
On the basis of any of the above-described individual embodiment, the first plate face of the first laminate is provided with least three first positioning bodies,
Second plate face of the first laminate is provided with least three first positioning bodies, and the first plate face of the second laminate is provided with least three second and determined
Position body, the second plate face of the second laminate are provided with least three second positioning bodies.Now, between the first laminate and the second laminate mutually
First positioning body of two plate faces of fitting and the connection of the second positioning body corresponding matching, the first of another plate face of the first laminate
Positioning body is connected with third layer plate corresponding matching, and the second positioning body of another plate face of the second laminate is corresponding with the 4th laminate to match somebody with somebody
Connection is closed, the interconnection and contraposition being easy between multiple laminates, improves overall lamination aligning accuracy.
Further, the first plate face of the first laminate is provided with four the first positioning bodies, and the second plate face of the first laminate is provided with
Four the first positioning bodies, the first plate face of the second laminate are provided with four the second positioning bodies, and the second plate face of the second laminate is provided with four
Individual second positioning body, the second plate face of the first laminate and the first plate face of the second laminate are close to press during lamination, the first laminate
First plate face and the plate face of third layer plate are fitted and connected, and the second plate face and the plate face of the 4th laminate of the second laminate are fitted and connected,
Now, the first laminate is close to be located between third layer plate and the second laminate, and the second laminate is close to be located at the first laminate and the 4th layer
Between plate.The two sides of such a laminate is equipped with multiple positioning bodies, the pressing contraposition connection being not only convenient between different laminates,
Overall lamination aligning accuracy can also be improved.
On the basis of any of the above-described individual embodiment, the edges of boards of the first laminate are provided with least three first breach, and first is fixed
Position body is located in the first breach, and the edges of boards of the second laminate are provided with least three second breach, and the second positioning body is located at the second breach
It is interior.First positioning body is located at the first laminate by the first breach, and the second positioning body is located at the second laminate by the second breach, this
Set-up mode is easy to fabricate, and reduces production cost.
Further, the first positioning body and the first laminate be in integrally manufactured, without setting the first breach, the second positioning body with
Second laminate is in integrally manufactured, without setting the second breach.Now, the process without opening up the first breach and the second breach, system
Cause this further to reduce, improve Business Economic Benefit.
As shown in Fig. 2 the first positioning body is detachably located on the first laminate by the first breach, the second positioning body passes through
Two breach are detachably located on the second laminate.After machining, the first positioning body and the recovery of the second positioning body can be continuing with
Or recovery focuses on, the utilization rate of material is improved, reduces production cost.
As shown in figure 3, one end of the first positioning body is connected with the edges of boards of the first laminate, one end of the second positioning body and second
The edges of boards connection of laminate.Edges of boards of first positioning body directly with the first laminate are connected, the second positioning body directly with the second laminate
Edges of boards are connected, and easily manufactured quick, simultaneously as the first positioning body is located at the edges of boards position of the first laminate, the second positioning body is set
In the edges of boards position of the second laminate, it is easy to coordinate positioning by positioning hole and positioner, lifts lamination accuracy, and improve production
Efficiency, improve the yields of wiring board.
The first resistance glue is provided with the basis of any of the above-described individual embodiment, between the edges of boards of the first positioning body and the first laminate
The second resistance glue portion is provided between the edges of boards of portion, the second positioning body and the second laminate.When first laminate and the second laminate are laminated,
Due to the factor of colloid bonding, colloid may flow into the component region of wiring board, and then influence later stage core component just
Often work, causes the defective products rate of wiring board to raise, and the setting in the first resistance glue portion and the second resistance glue portion can stop colloid toward first device
Part region flows into, and improves the yields of product, reduces the production cost of enterprise.
On the basis of any of the above-described individual embodiment, the first resistance glue portion includes the multiple first resistance glue set in the same direction
It is raised；Or second resistance glue portion multiple second resistances glue for including setting in the same direction it is raised.First resistance glue is raised and second hinders glue
Raised setting can effectively avoid colloid from flowing into component area, be the specific setting side in the first resistance glue portion and the second resistance glue portion
Formula, processing cost is low, reduces the production cost of enterprise.
On the basis of any of the above-described individual embodiment, the first resistance glue portion includes the multiple 3rd resistance glue set in the same direction
Projection, the second resistance glue portion include the 4th resistance glue groove corresponding with the 3rd resistance glue projection.3rd resistance glue is raised and the 4th resistance glue is recessed
The setting of groove can not only be played a part of hindering glue, and the 3rd resistance glue is raised and the setting of the 4th resistance glue groove is it is furthermore achieved that first
The pre-determined bit precision of laminate and the second laminate, to improve the precision of lamination contraposition, improve the yields of product.
Further, the 4th resistance glue groove is provided with multiple, and the 4th resistance glue groove and the 3rd resistance glue projection correspond.
In addition, the 4th resistance glue groove can also be a long striped groove, and when being laminated in such cases, multiple three
Resistance glue projection is respectively positioned in the 4th resistance glue groove, and colloid can also be made to enter in the 4th resistance glue groove to avoid enter into component
Region, simultaneously as the setting of the 4th resistance glue groove, can also avoid the 3rd resistance glue projection from forming projection in lamination with to first
Laminate and the second laminate produce top pressure function influence lamination aligning accuracy.
On the basis of any of the above-described individual embodiment, the first positioning body is provided with the first docking section, the second positioning body be provided with
Second docking section of the first docking section butt junction location.First docking section and the setting of the second docking section, improve the first laminate and the
The precision of two laminate pre-determined bits, the precision of follow-up lamination contraposition is improved, improve the yields of product.
Further, the first docking section is the 5th projection, and the second docking section is recessed to dock the coordinate the 5th with the 5th projection
Groove；Or first docking section be the 6th groove, the second docking section is the 6th projection for dock cooperation with the 6th groove.
Specifically, 200 rounded setting of laminate, three or more positioning bodies 110 are in the axis shaft of circle where along laminate 200
It is symmetrical, to improve lamination aligning accuracy.
In addition, laminate 200 can be with rectangular setting, now, three or more edges of boards of positioning body 110 along laminate 200
Set, at least one positioning body 110 is located at the first edges of boards of laminate 200, and at least two positioning bodies 110 are located at the of laminate 200
Two edges of boards, to improve lamination aligning accuracy.
Specifically, the first edges of boards and the second edges of boards of laminate 200 are oppositely arranged, the setting of positioning body 110 is set to form one
Locating surface, and positioning body 110 is distributed in the diverse location of laminate 200, improves lamination aligning accuracy.
As shown in Figures 2 and 3, the utility model also provides a kind of wiring board, including at least the first laminate and the second laminate,
Also include the lamination contraposition structure 100 of the wiring board described in above-mentioned any embodiment.By using the lamination contraposition of the wiring board
Structure 100 so that the first laminate, the lamination aligning accuracy of the second laminate improve, and improve the yields of product, improve the warp of enterprise
Ji benefit.
The lamination contraposition structure of the wiring board can be applicable to common pcb board, on large-scale PNL plates, and it is fixed to be set in PNL edges of boards
Position body 110, to reach the precision for ensureing pcb board in pressing, avoid pcb board in bonding processes due to the harmomegathus of sheet material, layer
Pressure off normal or drilling off normal etc. cause quality problem, lift the product quality of pcb board, reduce production cost and improve the warp of enterprise
Ji benefit.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality
Apply all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, the scope that this specification is recorded all is considered to be.
Embodiment described above only expresses several embodiments of the present utility model, and its description is more specific and detailed,
But therefore it can not be interpreted as the limitation to utility model patent scope.It should be pointed out that the common skill for this area
For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to
The scope of protection of the utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.
Claims (10)
- A kind of 1. lamination contraposition structure of wiring board, it is characterised in that including：At least three first positioning bodies being located on the first laminate, the first locating surface of the first positioning body formation, described first Positioning body is provided with positioning hole and first connecting portion, and the first connecting portion is provided with the first network structure；At least three second positioning bodies being located on the second laminate, second positioning body form coplanar with first locating surface The second locating surface, second positioning body is provided with the positioning hole and the second connecting portion that is connected with the first connecting portion, The second connecting portion is provided with the second network structure；AndThe colloid that first network structure and second network structure are linked together.
- 2. the lamination contraposition structure of wiring board according to claim 1, it is characterised in that the first connecting portion is provided with more Individual first depressed part, multiple first depressed parts form first network structure, and the second connecting portion is provided with multiple the Two depressed parts, multiple second depressed parts form second network structure；Or the first connecting portion is provided with multiple three Depressed part, multiple 3rd depressed parts form first network structure, and the second connecting portion is provided with multiple with described the Three depressed parts correspond the 4th lug boss coordinated, and multiple 4th lug bosses form the second network structure.
- 3. the lamination contraposition structure of wiring board according to claim 1, it is characterised in that the first plate face of the first laminate is set There are at least three first positioning bodies, the second plate face of the first laminate is provided with least three first positioning bodies, the second layer First plate face of plate is provided with least three second positioning bodies, and the second plate face of the second laminate is provided with least three described second Positioning body.
- 4. the lamination contraposition structure of wiring board according to claim 1, it is characterised in that the edges of boards of the first laminate are provided with extremely Few three the first breach, first positioning body are located in first breach, and the edges of boards of second laminate are provided with least three Individual second breach, second positioning body are located in second breach.
- 5. the lamination contraposition structure of wiring board according to claim 1, it is characterised in that one end of first positioning body It is connected with the edges of boards of the first laminate, one end of second positioning body is connected with the edges of boards of the second laminate.
- 6. the lamination contraposition structure of the wiring board according to claim any one of 1-5, it is characterised in that first positioning Be provided with the first resistance glue portion between the edges of boards of body and first laminate, the edges of boards of second positioning body and second laminate it Between be provided with the second resistance glue portion.
- 7. the lamination contraposition structure of wiring board according to claim 6, it is characterised in that the first resistance glue portion includes edge Multiple first resistance glue that same direction is set are raised；Or the second resistance glue portion includes multiple second resistances for setting in the same direction Glue is raised.
- 8. the lamination contraposition structure of wiring board according to claim 6, it is characterised in that the first resistance glue portion includes edge Multiple 3rd resistance glue that same direction is set are raised, and the second resistance glue portion includes and the described 3rd resistance glue projection the corresponding 4th Hinder glue groove.
- 9. the lamination contraposition structure of wiring board according to claim 1, it is characterised in that first positioning body is provided with the A docking part, second positioning body are provided with the second docking section with first docking section butt junction location.
- 10. a kind of wiring board, it is characterised in that including at least the first laminate and the second laminate, in addition to as claim 1-9 appoints The lamination contraposition structure of wiring board described in one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721082997.5U CN207219149U (en) | 2017-08-25 | 2017-08-25 | The lamination contraposition structure and wiring board of wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721082997.5U CN207219149U (en) | 2017-08-25 | 2017-08-25 | The lamination contraposition structure and wiring board of wiring board |
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| Publication Number | Publication Date |
|---|---|
| CN207219149U true CN207219149U (en) | 2018-04-10 |
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| CN201721082997.5U Active CN207219149U (en) | 2017-08-25 | 2017-08-25 | The lamination contraposition structure and wiring board of wiring board |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109600940A (en) * | 2018-11-29 | 2019-04-09 | 广东骏亚电子科技股份有限公司 | Multi-layer board compression method |
| CN113630987A (en) * | 2021-07-20 | 2021-11-09 | 珠海达汉电子科技有限公司 | Soft board alignment method of soft and hard combined board |
-
2017
- 2017-08-25 CN CN201721082997.5U patent/CN207219149U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109600940A (en) * | 2018-11-29 | 2019-04-09 | 广东骏亚电子科技股份有限公司 | Multi-layer board compression method |
| CN109600940B (en) * | 2018-11-29 | 2021-02-05 | 广东骏亚电子科技股份有限公司 | Multi-layer board pressing method |
| CN113630987A (en) * | 2021-07-20 | 2021-11-09 | 珠海达汉电子科技有限公司 | Soft board alignment method of soft and hard combined board |
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