CN113630987A - Soft board alignment method of soft and hard combined board - Google Patents
Soft board alignment method of soft and hard combined board Download PDFInfo
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- CN113630987A CN113630987A CN202110820605.5A CN202110820605A CN113630987A CN 113630987 A CN113630987 A CN 113630987A CN 202110820605 A CN202110820605 A CN 202110820605A CN 113630987 A CN113630987 A CN 113630987A
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- soft
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
The invention discloses a soft board contraposition method of a rigid-flexible printed circuit board, which comprises the following steps: preparing, primarily positioning, adjusting, secondarily positioning and fixing; preparing, selecting two soft boards, wherein the soft boards are provided with a fixed area and a registration area; preliminarily positioning, aligning the two soft boards, and respectively sticking first fixing glue at three or more corners of the alignment area of one of the soft boards to fix the two soft boards; adjusting, namely checking the interlayer alignment precision of the two soft boards by using a detection tool, and adjusting the positions of the two soft boards; secondary positioning, namely adhering second fixing glue to the fixing area to fix the two soft boards, and cleaning the first fixing glue; fixing, namely welding two soft plates by using welding equipment; and cleaning the soft board. The invention can improve the interlayer alignment precision of the rigid-flex board product and improve the working efficiency.
Description
Technical Field
The invention relates to the field of circuit board manufacturing, in particular to a soft board alignment method of a rigid-flex board.
Background
With the rapid development of the manufacturing technology in the printed circuit board industry, the flexible printed circuit board and the soft and hard combined printed circuit board are widely applied, and the fineness and the complexity of circuit design are greatly improved, so that higher requirements are provided for the manufacturing process of the printed circuit board.
The inner-layer flexible boards of the existing flexible printed circuit board, soft and hard combined board and multilayer product need to be produced in an alignment mode, the interlayer alignment precision of the flexible boards is a main difficulty in the processing process, the traditional manual alignment is directly aligned and fixed through alignment points on the flexible boards, the lamination precision is low, and the interlayer alignment precision cannot be effectively controlled; the full-automatic alignment cost is high, the equipment is depreciated and the equipment cost is increased, and the existing customer products do not relate to the products of the type, so that the cost is wasted.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides a soft board alignment method of the rigid-flexible board, which can improve the interlayer alignment precision of the rigid-flexible board product and improve the working efficiency.
According to the embodiment of the first aspect of the invention, a soft board alignment method for a rigid-flex board comprises the following steps: preparing, primarily positioning, adjusting, secondarily positioning and fixing; preparing, selecting two soft boards, wherein the soft boards are provided with a fixed area and a registration area; preliminarily positioning, aligning the two soft boards, and respectively sticking first fixing glue at three or more corners of the alignment area of one of the soft boards to fix the two soft boards; adjusting, namely checking the interlayer alignment precision of the two soft boards by using a detection tool, and adjusting the positions of the two soft boards; secondary positioning, namely adhering second fixing glue to the fixing area to fix the two soft boards, and cleaning the first fixing glue; fixing, namely welding two soft plates by using welding equipment; and cleaning the soft board.
The soft board aligning method of the rigid-flex board according to the embodiment of the invention at least has the following beneficial effects: in the preliminary positioning, the first fixing glue is small in sticking area and stuck at the corner of the alignment area, the sticking areas of the two soft boards are small, the two soft boards are easy to separate, the position between the two soft boards is convenient to adjust, and the internal circuit of the soft boards cannot be influenced; adhering a plurality of first fixing glues in the alignment area to fix the two soft boards, detecting the interlayer alignment precision of the two soft boards through a detection tool, finely adjusting the positions of the soft boards, and reducing errors between the soft boards; in the secondary positioning, the second fixing glue of the strip is pasted to fixedly connect the two soft boards, so that the two soft boards are prevented from being dislocated in the subsequent welding operation to influence the position precision; the first fixing glue is cleaned, and the problem that the two soft boards are uneven and influence the interlayer alignment precision during welding is solved.
According to some embodiments of the present invention, the first fixing glue and the second fixing glue are both double-sided glue.
According to some embodiments of the invention, the area of the first fixing glue is adapted to the area of the corner of the alignment area and the length of the second fixing glue is adapted to the length of the fixing area.
According to some embodiments of the invention, in the adjusting step, the detection means detects a mirror or a quadratic element ten times.
According to some embodiments of the invention, in the adjusting step, the positions of the two soft plates are adjusted so that the interlayer offset precision between the two soft plates is less than 0.05 mm.
According to some embodiments of the present invention, in the secondary positioning step, after the second fixing glue is applied, the second fixing glue is detected again by using a detection tool.
According to some embodiments of the present invention, the cleaning step is performed by dipping the soft board with alcohol using dust-free cloth.
According to some embodiments of the invention, the alignment area is provided with a plurality of alignment points, and the alignment points are used for aligning two soft boards.
According to some embodiments of the invention, in the fixing step, the welding device is a spot welder that welds 3 spots every 2cm along the long side of the flexible board and 1 spot every 2mm along the short side.
According to some embodiments of the invention, in the fixing step, after welding, the welding point is repaired by using a cutter so that the welding position is flat and smooth.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a schematic structural diagram of a flexible printed circuit board according to an embodiment of the present invention;
fig. 2 is a side view of the flexible board structure shown in fig. 1.
A flexible board 100, a fixed area 110 and a positioning area 120;
a first fixing glue 210 and a second fixing glue 220;
for position 300.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
In the description of the present invention, it should be understood that the orientation or positional relationship referred to in the description of the orientation, such as the upper, lower, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, the meaning of a plurality of means is one or more, the meaning of a plurality of means is two or more, and larger, smaller, larger, etc. are understood as excluding the number, and larger, smaller, inner, etc. are understood as including the number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present invention, unless otherwise explicitly limited, terms such as arrangement, installation, connection and the like should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific contents of the technical solutions.
Referring to fig. 1 and 2, a soft board 100 alignment method for a hard-soft combined board according to an embodiment of a first aspect of the present invention includes the following steps: preparing, primarily positioning, adjusting, secondarily positioning and fixing; preparing, selecting two soft boards 100, wherein the soft boards 100 are provided with a fixed area 110 and an alignment area 120; performing primary positioning, aligning the two soft boards 100, and respectively sticking first fixing glue 210 at three or more corners of the alignment area 120 of one soft board 100 to fix the two soft boards 100; adjusting, namely checking the interlayer alignment precision of the two soft boards 100 by using a detection tool, and adjusting the positions of the two soft boards 100; performing secondary positioning, namely adhering second fixing glue 220 to fix the two soft boards 100 in the fixing area 110, and cleaning the first fixing glue 210; fixing, namely welding two soft boards 100 by using welding equipment; and cleaning and clearing the soft board 100.
In the preparation step, two soft boards with consistent expansion and contraction coefficients are selected, and the soft boards cannot be jointed by a jump layer or the soft boards with different expansion and contraction coefficients are jointed.
The circuit of the flexible printed circuit board 100 is distributed in the middle of the alignment area 120, no circuit is arranged at the edges of the fixed area 110 and the alignment area 120, and the first fixing glue 210 and the second fixing glue 220 are pasted on the circuit without influencing the operation of the flexible printed circuit board 100.
The alignment method of the soft board 100 of the rigid-flex board according to the embodiment of the invention at least has the following beneficial effects: in the preliminary positioning, the first fixing glue 210 has a small adhering area, the first fixing glue 210 is adhered to the corner of the alignment area 120, the adhering areas of the two soft boards 100 are small, the two soft boards are easy to separate, the position adjustment between the two soft boards 100 is convenient, and the internal circuit of the soft board 100 is not influenced; adhering a plurality of first fixing glues 210 to the alignment area 120 to fix the two soft boards 100, detecting the interlayer alignment precision of the two soft boards 100 through a detection tool, finely adjusting the positions of the soft boards 100, and reducing errors between the soft boards 100; in the secondary positioning, the second fixing glue 220 is adhered to the two soft boards 100, so that the two soft boards 100 are fixedly connected, and the situation that the position accuracy is influenced by the dislocation of the two soft boards 100 in the subsequent welding operation is prevented; the first fixing glue 210 is cleaned, and the problem that the interlayer alignment precision is influenced when the two soft boards 100 are welded due to unevenness is solved.
In some embodiments of the present invention, the first fixing glue 210 and the second fixing glue 220 are both double-sided glue. The double-sided adhesive tape is a roll-shaped adhesive tape which is prepared by using paper, cloth and a plastic film as base materials and uniformly coating an elastomer pressure-sensitive adhesive or a resin pressure-sensitive adhesive on the base materials, and consists of the base materials, an adhesive and barrier paper. The double-sided adhesive tape can quickly adhere the two flexible boards 100 together, and the double-sided adhesive tape with different lengths can be adhered to the corners and the positioning area of the alignment area 120 by cutting the double-sided adhesive tape; the double-sided adhesive tape can be quickly cleaned by alcohol after being used.
In some embodiments of the present invention, the first fixing adhesive 210 and the second fixing adhesive 220 are both pressure-sensitive adhesives, and the pressure-sensitive adhesives have the following characteristics: the product has excellent weather resistance and heat resistance without adding antioxidant, no phase separation and migration, high transparency, high oil resistance and no influence on skin.
In some embodiments of the present invention, the area of the first fixing glue 210 is adapted to the area of the corner of the alignment area 120, and the length of the second fixing glue 220 is adapted to the length of the fixing area 110. The area of the first fixing glue 210 is adapted to the area of the corner of the alignment area 120, it can be understood that, due to the different sizes of the rigid-flexible circuit boards and the different lengths of the edges of the flexible boards 100, the fixing glue with the appropriate length is cut out, so that the fixing glue can be adhered to the corner of the alignment area 120 of the flexible board 100, and because the joint area of the corner is smaller, the two flexible boards 100 are easy to separate after being jointed, thereby facilitating the adjustment of the positions of the two flexible boards 100; the length of the second fixing glue 220 is adapted to the length of the fixing area, it can be understood that the length of the fixing area 110 is the length of the longer side of the fixing area 110 of the soft board 100, the second fixing glue 220 close to the length is cut out, so that the second fixing glue 220 is adhered to the fixing area 110, and because the length of the second fixing glue 220 is longer, the two soft boards 100 are not easy to separate, and the two soft boards 100 are fixedly connected.
In some embodiments of the invention, in the adjusting step, the detection means is a ten-fold detection mirror or a two-dimensional meter. The alignment area 120 can be enlarged by the detection tool, and when the accuracy of the interlayer shift is too high, the position of the flexible printed circuit board 100 is adjusted to improve the positional accuracy. Ten times of detection mirrors are simple detection tools, are common laboratory instruments and are similar to cup shapes, can be placed on the surfaces of the soft boards 100, and can visually see the deviation of the two soft boards 100 after being aligned with the alignment points 300; the two-dimensional measuring instrument is used for measuring two-dimensional plane dimensions, is widely applied to various different precision industries, and can detect displacement deviation of two flexible boards 100 with high precision.
In some embodiments of the present invention, in the adjusting step, the positions of the two flexible boards 100 are adjusted so that the interlayer offset precision between the two flexible boards 100 is less than 0.05 mm.
In some embodiments of the present invention, in the secondary positioning step, after the second fixing glue 220 is pasted, the second fixing glue needs to be inspected again by using an inspection tool. The method can prevent errors from occurring in the secondary positioning operation process, and the errors are caused.
In some embodiments of the present invention, the cleaning step is performed by dipping alcohol on the soft board 100 with dust-free cloth. Most glue or sticky tape dissolve in alcohol, use alcohol can clear up the vestige on the soft board 100 fast, and the circuit on the soft board 100 can not influenced when the dustless cloth is cleaned.
In some embodiments of the present invention, the alignment area 120 is provided with a plurality of alignment points 300, and the alignment points 300 are used for aligning two flexible boards 100 thereof. The alignment points 300 of the alignment area 120 include alignment Mark points and alignment marks butterfly pad, and the positions of the two flexible boards 100 can be checked by a detection tool to detect the interlayer alignment accuracy of the two flexible boards 100.
In some embodiments of the present invention, in the fixing step, the welding device is a spot welder that welds 3 welding spots every 2cm along the long side of the flexible board 100 and 1 welding spot every 2mm along the short side.
In some embodiments of the present invention, in the fixing step, after welding, the welding point is repaired by using a cutter so that the welding position is flat and smooth. After welding, raised welding spots can appear on the surface of the soft board 100, and the cutter can be used for scraping the raised welding spots, so that the surface of the soft board 100 is smooth, and the influence on the matching of other subsequent steps is avoided.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the gist of the present invention.
Claims (10)
1. A soft board alignment method of a soft and hard combined board is characterized by comprising the following steps:
preparing, selecting two soft boards, wherein the soft boards are provided with a fixed area and a registration area;
preliminarily positioning, aligning the two soft boards, and respectively pasting first fixing glue at three or more corners of the alignment area of one soft board to fix the two soft boards;
adjusting, namely checking the interlayer alignment precision of the two soft boards by using a detection tool, and adjusting the positions of the two soft boards;
secondary positioning, namely adhering second fixing glue to the fixing area to fix the two soft boards, and cleaning the first fixing glue;
fixing, namely welding two soft plates by using welding equipment;
and cleaning the soft board.
2. The flexible printed circuit board alignment method of the rigid-flex board according to claim 1, wherein the first fixing glue and the second fixing glue are both double-sided glue.
3. The flexible printed circuit board alignment method of the rigid-flex board according to claim 1, wherein the area of the first fixing glue is adapted to the area of the corner of the alignment area, and the length of the second fixing glue is adapted to the length of the fixing area.
4. The flexible printed circuit board alignment method of flexible-rigid printed circuit board according to claim 1, wherein the adjusting step is performed by using a detection tool to measure a lens or a quadratic element by ten times.
5. The soft board aligning method for the rigid-flexible printed circuit board according to claim 1, wherein in the adjusting step, the positions of the two soft boards are adjusted so that the interlayer offset precision between the two soft boards is less than 0.05 mm.
6. The soft board alignment method for the rigid-flexible printed circuit board according to claim 1, wherein in the secondary positioning step, after the second fixing glue is applied, the second fixing glue is inspected again by using an inspection tool.
7. The soft board alignment method for soft and hard combination boards according to claim 1, wherein in the cleaning step, the soft boards are cleaned by dipping alcohol with dust-free cloth.
8. The flexible printed circuit board alignment method of the rigid-flexible printed circuit board according to claim 1, wherein the alignment area is provided with a plurality of alignment points for aligning two flexible printed circuit boards.
9. The flexible printed circuit board alignment method according to claim 1, wherein in the fixing step, the welding device is a spot welder, and 3 welding spots are welded at intervals of 2cm along the long side of the flexible printed circuit board, and 1 welding spot is welded at intervals of 2mm along the short side of the flexible printed circuit board.
10. The method for soft board alignment of a rigid-flex board according to claim 1, wherein in the step of fixing, after welding, a tool is used to repair the welding point, so that the welding position is flat and smooth.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110820605.5A CN113630987B (en) | 2021-07-20 | 2021-07-20 | Soft board alignment method of soft and hard combined board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110820605.5A CN113630987B (en) | 2021-07-20 | 2021-07-20 | Soft board alignment method of soft and hard combined board |
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| Publication Number | Publication Date |
|---|---|
| CN113630987A true CN113630987A (en) | 2021-11-09 |
| CN113630987B CN113630987B (en) | 2023-05-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110820605.5A Active CN113630987B (en) | 2021-07-20 | 2021-07-20 | Soft board alignment method of soft and hard combined board |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116423857A (en) * | 2023-06-13 | 2023-07-14 | 江苏科美声学科技有限公司 | Sound insulation board production device, microcrystal damping type environment-friendly sound insulation board and production process |
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| JP2013165158A (en) * | 2012-02-10 | 2013-08-22 | Panasonic Corp | Position identifier mark of multilayer printed wiring board and manufacturing method of multilayer printed wiring board |
| CN205611049U (en) * | 2016-04-27 | 2016-09-28 | 赵文雄 | Prepositioning film circuit board |
| CN207219149U (en) * | 2017-08-25 | 2018-04-10 | 广州兴森快捷电路科技有限公司 | The lamination contraposition structure and wiring board of wiring board |
| US20200154559A1 (en) * | 2018-11-09 | 2020-05-14 | Qing Ding Precision Electronics (Huaian) Co.,Ltd | Rigid-flex circuit board and method for making same |
| CN112040638A (en) * | 2020-09-22 | 2020-12-04 | 柏承科技(昆山)股份有限公司 | Novel PCB (printed circuit board) base material structure and PCB laminating manufacturing method using same |
-
2021
- 2021-07-20 CN CN202110820605.5A patent/CN113630987B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013165158A (en) * | 2012-02-10 | 2013-08-22 | Panasonic Corp | Position identifier mark of multilayer printed wiring board and manufacturing method of multilayer printed wiring board |
| CN205611049U (en) * | 2016-04-27 | 2016-09-28 | 赵文雄 | Prepositioning film circuit board |
| CN207219149U (en) * | 2017-08-25 | 2018-04-10 | 广州兴森快捷电路科技有限公司 | The lamination contraposition structure and wiring board of wiring board |
| US20200154559A1 (en) * | 2018-11-09 | 2020-05-14 | Qing Ding Precision Electronics (Huaian) Co.,Ltd | Rigid-flex circuit board and method for making same |
| CN112040638A (en) * | 2020-09-22 | 2020-12-04 | 柏承科技(昆山)股份有限公司 | Novel PCB (printed circuit board) base material structure and PCB laminating manufacturing method using same |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116423857A (en) * | 2023-06-13 | 2023-07-14 | 江苏科美声学科技有限公司 | Sound insulation board production device, microcrystal damping type environment-friendly sound insulation board and production process |
| CN116423857B (en) * | 2023-06-13 | 2023-08-18 | 江苏科美声学科技有限公司 | Sound insulation board production device, microcrystal damping type environment-friendly sound insulation board and production process |
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| CN113630987B (en) | 2023-05-02 |
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