CN207217509U - A kind of radiator structure of chip diode - Google Patents
A kind of radiator structure of chip diode Download PDFInfo
- Publication number
- CN207217509U CN207217509U CN201721189225.1U CN201721189225U CN207217509U CN 207217509 U CN207217509 U CN 207217509U CN 201721189225 U CN201721189225 U CN 201721189225U CN 207217509 U CN207217509 U CN 207217509U
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- Prior art keywords
- conducting strip
- plastic
- pin
- sealed body
- diode
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Abstract
The utility model system provides a kind of radiator structure of chip diode, including plastic-sealed body, the first conducting strip and the second conducting strip, in plastic-sealed body, the top welding diode chip for backlight unit of the first conducting strip, diode chip for backlight unit is welded in the bottom of the second conducting strip；Some radiating grooves are equipped with the top of the bottom of first conducting strip and the second conducting strip, first conducting strip and the second conducting strip connect the first connecting pin and the second connecting pin respectively, the bottom of first connecting pin is fixed with the first pin paster, the bottom of second connecting pin is fixed with second pin paster, first pin paster and second pin paster are respectively h with the difference in height of plastic-sealed body bottom, a height of H of plastic-sealed body, h >=0.3H, the interior obturator formed filled with megohmite insulant of plastic-sealed body.The utility model can effectively improve the heat dispersion of whole diode, it is ensured that diode can normal work, and extend the service life of diode, overall structure is simple, low manufacture cost.
Description
Technical field
Diode structure is the utility model is related to, specifically discloses a kind of radiator structure of chip diode.
Background technology
Diode, it is a kind of electronic device that can unidirectionally conduct electric current, is provided with PN junction inside diode, the two of PN junction
End is provided with lead terminal, if according to the direction of applied voltage, possesses the unilateral conductivity of electric current.Most of diode is possessed
The sense of current we be normally referred to as rectification function, single diode can produce heat during rectification, particularly big
Electric current power consumption in rectification is larger, causes the caloric value of diode also to increase, and influences the performance of diode.
With the continuous progress of science and technology, electronic product gradually develops to the direction of miniaturization, ultrathin type, diode also not example
Outside, the structure of existing diode is that diode chip for backlight unit is arranged in paster plastic-sealed body, due to the design of miniaturization, diode
Structure is extremely compact, and heat dispersion is poor, and diode chip for backlight unit is outer in addition, plastic-sealed body is interior is provided with obturator, and obturator is mostly heat conduction
The bad insulating materials of performance.Conventional diode chip is arranged on base station, is connected by wire with another electrode of plastic-sealed body,
The area of the diode chip for backlight unit overwhelming majority all directly contacts with obturator, causes the heat that diode chip for backlight unit is formed at work not
It can disperse in time, heat is accumulated in around diode chip for backlight unit, fails to disperse the property that can have a strong impact on diode chip for backlight unit for a long time
Energy and service life, and then the performance and used life of whole diode can be influenceed.
Utility model content
Based on this, it is necessary to for prior art problem, there is provided a kind of radiator structure of chip diode, can be effective
The heat dispersion of diode chip for backlight unit is improved, the performance of diode is improved, increases the service life, while overall structure is simple, manufacture
Cost is low.
To solve prior art problem, the utility model adopts the following technical scheme that：
The utility model discloses a kind of radiator structure of chip diode, including plastic-sealed body, the first conducting strip, second leads
Electric piece, diode chip for backlight unit, the first conducting strip and the second conducting strip are in plastic-sealed body, the top welding diode of the first conducting strip
The bottom electrode end of chip, the Top electrode end of the bottom welding diode chip for backlight unit of the second conducting strip；
Some radiating grooves are equipped with the top of the bottom of first conducting strip and the second conducting strip, the both sides of plastic-sealed body are set respectively
There are the first connecting pin and the second connecting pin, the first conducting strip and the second conducting strip connect the first company by conduction connecting structure respectively
Pin and the second connecting pin, the bottom of the first connecting pin are fixed with the first pin paster, and the bottom of the second connecting pin is fixed with
Two pin pasters, the first pin paster and second pin paster are h with the difference in height of plastic-sealed body bottom respectively, the height of plastic-sealed body
For H, h >=0.3H, the interior obturator formed filled with megohmite insulant of plastic-sealed body.
Further, the first pin paster and second pin paster the difference in height h=0.3H with plastic-sealed body bottom respectively.
Further, the bottom of plastic-sealed body and top are respectively and fixedly provided with fin.
Further, the thickness of fin is less than or equal to 0.2H.
Further, conduction connecting structure is conductor wire or conducting strip.
Further, conduction connecting structure is metallic copper or argent.
Further, obturator is epoxy resin.
Two electrodes of diode chip for backlight unit connect the first conducting strip and the second conducting strip respectively, can be by diode chip for backlight unit work
Heat exports in time caused by work, and expands the contact area of conducting strip and obturator by radiating groove, makes diode core
Heat in piece is more efficiently delivered in the obturator of surrounding, and pin paster is used to connect the electronics such as the circuit board of outside load
Body, the first pin paster and the bottom of second pin paster and plastic-sealed body have certain difference in height, i.e. plastic-sealed body and circuit board
Deng there are enough spaces between electron carrier radiating, reinforcement radiating effect are integrally realized for diode.
The beneficial effects of the utility model are：The utility model discloses a kind of radiator structure of chip diode, if
The strong conducting strip of heat-sinking capability is equipped with, the heat dispersion of diode chip for backlight unit can be effectively improved, while sets pin to erect
Plastic-sealed body, and then improve the heat dispersion of whole diode, can effectively ensure diode can normal work, and extend two
The service life of pole pipe, overall structure is simple, low manufacture cost.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model.
Reference is：Plastic-sealed body 10, the first connecting pin 11, the first pin paster 111, the second connecting pin 12, second are drawn
Hem facing piece 121, fin 13, the first conducting strip 20, the second conducting strip 30, diode chip for backlight unit 40, conduction connecting structure 50, filling
Body 60.
Embodiment
For feature of the present utility model, technological means and the specific purposes reached, function can be further appreciated that, below
The utility model is described in further detail with embodiment with reference to accompanying drawing.
Refer to Fig. 1：
The utility model embodiment provides a kind of radiator structure of chip diode, including the conduction of plastic-sealed body 10, first
Piece 20, the second conducting strip 30, diode chip for backlight unit 40, the first conducting strip 20 and the second conducting strip 30 are in plastic-sealed body 10, and first
The bottom electrode end of the top welding diode chip for backlight unit 40 of conducting strip 20, the bottom welding diode chip for backlight unit 40 of the second conducting strip 30
Top electrode end；
The bottom of first conducting strip 20 and the top of the second conducting strip 30 are equipped with some radiating grooves, the both sides of plastic-sealed body 10
The first connecting pin 11 and the second connecting pin 12 are respectively equipped with, the first conducting strip 20 and the second conducting strip 30 pass through conduction connecting structure
50 connect the first connecting pin 11 and the second connecting pin 12 respectively, and the bottom of the first connecting pin 11 is fixed with the first pin paster 111,
The bottom of second connecting pin 12 is fixed with second pin paster 121, and the first pin paster 111 and second pin paster 121 are distinguished
Difference in height with the bottom of plastic-sealed body 10 is h, a height of H of plastic-sealed body 10, h >=0.3H, and megohmite insulant is filled with plastic-sealed body 10
The obturator 60 of formation.
Two electrodes of diode chip for backlight unit 40 connect the first conducting strip 20 and the second conducting strip 30 respectively, can be by diode
Chip 40 work caused by heat export in time, and expand the contact area of conducting strip and obturator 60 by radiating groove,
The heat in diode chip for backlight unit 40 is set more efficiently to be delivered in the obturator 60 of surrounding, pin paster is used to connect outside
The bottom of the electron carriers such as circuit board, the first pin paster 111 and second pin paster 121 and plastic-sealed body 10 has certain height
Degree is poor, i.e., has enough spaces integrally to realize radiating for diode between the electron carrier such as plastic-sealed body 60 and circuit board, strengthens dissipating
Thermal effect.
The utility model is provided with the strong conducting strip of heat-sinking capability, can effectively improve the thermal diffusivity of diode chip for backlight unit 40
Can, while set pin to erect plastic-sealed body 10, and then the heat dispersion of whole diode is improved, it can effectively ensure two poles
Pipe can normal work, and extend the service life of diode, overall structure is simple, low manufacture cost.
Based on above-described embodiment, the first pin paster 111 and second pin paster 121 height with the bottom of plastic-sealed body 10 respectively
Spend poor h=0.3H, it is ensured that enough spaces are provided between the electron carrier such as plastic-sealed body 10 and the circuit board of external connection, for two
Pole pipe integrally realizes efficient radiating.
Based on above-described embodiment, the bottom and top of plastic-sealed body 10 are respectively and fixedly provided with fin 13, and fin 13 can be effective
The exchange rate of plastic-sealed body 10 and outside air is improved, so as to improve the overall radiating effect of diode, the thickness of fin 13
Degree is less than or equal to 0.2H, it is ensured that has enough spaces between the electron carrier such as fin 13 and the circuit board of external connection, it is ensured that
Radiating effect.
Based on above-described embodiment, conduction connecting structure 50 is conductor wire or conducting strip, it is preferable that conduction connecting structure 50 is
Conducting strip, conducting strip can effectively improve radiating effect.
Based on above-described embodiment, conduction connecting structure 50 is metallic copper or argent, it is preferable that conduction connecting structure 50 is
Argent, the radiating effect of argent are preferable.
Based on above-described embodiment, obturator 60 is epoxy resin, and epoxy resin is more typical lower-cost megohmite insulant.
Embodiment described above only expresses several embodiments of the present utility model, and its description is more specific and detailed,
But therefore it can not be interpreted as the limitation to the utility model patent scope.It should be pointed out that for the common of this area
For technical staff, without departing from the concept of the premise utility, various modifications and improvements can be made, these all belong to
In the scope of protection of the utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.
Claims (7)
1. a kind of radiator structure of chip diode, including plastic-sealed body (10), the first conducting strip (20), the second conducting strip
(30), diode chip for backlight unit (40), first conducting strip (20) and second conducting strip (30) are located at the plastic-sealed body (10)
It is interior, it is characterised in that the bottom electrode end of the diode chip for backlight unit (40) is welded at the top of first conducting strip (20), and described the
Weld the Top electrode end of the diode chip for backlight unit (40) in the bottom of two conducting strips (30)；
Some radiating grooves, the modeling are equipped with the top of the bottom of first conducting strip (20) and second conducting strip (30)
The both sides of envelope body (10) are respectively equipped with the first connecting pin (11) and the second connecting pin (12), first conducting strip (20) and described
Second conducting strip (30) connects first connecting pin (11) and second connecting pin respectively by conduction connecting structure (50)
(12), the bottom of first connecting pin (11) is fixed with the first pin paster (111), the bottom of second connecting pin (12)
Be fixed with second pin paster (121), the first pin paster (111) and the second pin paster (121) respectively with institute
The difference in height for stating plastic-sealed body (10) bottom is h, a height of H, the h >=0.3H of the plastic-sealed body (10), in the plastic-sealed body (10)
The obturator (60) formed filled with megohmite insulant.
A kind of 2. radiator structure of chip diode according to claim 1, it is characterised in that the first pin patch
Piece (111) and the second pin paster (121) the difference in height h=0.3H with the plastic-sealed body (10) bottom respectively.
A kind of 3. radiator structure of chip diode according to claim 1, it is characterised in that the plastic-sealed body (10)
Bottom and top be respectively and fixedly provided with fin (13).
A kind of 4. radiator structure of chip diode according to claim 3, it is characterised in that the fin (13)
Thickness be less than or equal to 0.2H.
5. the radiator structure of a kind of chip diode according to claim 1, it is characterised in that described to be conductively connected knot
Structure (50) is conductor wire or conducting strip.
6. the radiator structure of a kind of chip diode according to claim 1, it is characterised in that described to be conductively connected knot
Structure (50) is metallic copper or argent.
A kind of 7. radiator structure of chip diode according to claim 1, it is characterised in that the obturator (60)
For epoxy resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721189225.1U CN207217509U (en) | 2017-09-15 | 2017-09-15 | A kind of radiator structure of chip diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721189225.1U CN207217509U (en) | 2017-09-15 | 2017-09-15 | A kind of radiator structure of chip diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207217509U true CN207217509U (en) | 2018-04-10 |
Family
ID=61821291
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721189225.1U Expired - Fee Related CN207217509U (en) | 2017-09-15 | 2017-09-15 | A kind of radiator structure of chip diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207217509U (en) |
-
2017
- 2017-09-15 CN CN201721189225.1U patent/CN207217509U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180410 Termination date: 20210915 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |