CN207183316U - A kind of COB light source - Google Patents
A kind of COB light source Download PDFInfo
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- CN207183316U CN207183316U CN201720854645.0U CN201720854645U CN207183316U CN 207183316 U CN207183316 U CN 207183316U CN 201720854645 U CN201720854645 U CN 201720854645U CN 207183316 U CN207183316 U CN 207183316U
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- light source
- cob light
- phosphor
- films
- source according
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Abstract
The utility model discloses a kind of COB light source, its substrate and the LED chip being arranged on substrate, covered with UV films in the LED chip, the surface of the UV films is covered with phosphor powder layer.The utility model substitutes fluorescer film by using the UV moulds covered with phosphor powder layer, because UV film heat resistances are stronger, reduce the heat that fluorescent material is subject to, the probability that fluorescent material chemically reacts reduces, LED light source colour consistency is protected, and colour temperature concentration degree is high.UV films have been effectively isolated extraneous UV simultaneously, reduce injury of the external environment to LED, extend LED etc. service life.
Description
Technical field
It the utility model is related to integrated semiconductor lighting component technical field, more particularly to a kind of COB light source.
Background technology
LED(Light Emitting Diode), it is a kind of luminous semiconductor element, because its controllability is good, structure
Simply, the features such as compact, color is pure, abundant, impact resistance, vibration resistance, and the response time is fast, be recognized be 21 century most
One of high-tech product of development prospect, while illumination revolution is triggered, also make weight for promotion energy-saving and emission-reduction, environmental protection
Big contribution.
COB is Chip On Boarding(Chip on board directly fills)English abbreviation, be one kind by adhesive or solder
LED chip is adhered directly onto PCB(Printed Circuit Board)On plate, then chip and PCB realized by wire bonding
The encapsulation technology being electrically interconnected between plate.COB technologies are mainly used in the LED dresses of high-power multi-core chip arrays, same to SMT(Surface
Mounted Technology surface mounting technologies)Compare, not only substantially increase encapsulation power density, and reduce envelope
Fill thermal resistance.
In known technology in the field of business, fluorescent adhesive layer is generally set in LED chip in COB products, passes through fluorescent glue
Carry out compound with the light that LED chip is sent and produce white light.At that time, the heatproof for the fluorescent glue being commonly used is limited, works as temperature
When spending high, product radiating can be deteriorated, and the fluorescent material inside fluorescent glue can volatilize, and product colour temperature (CCT) produces drift, color one
Cause property is deteriorated.Also, when LED light source works out of doors, UV can be received for a long time, UV reacts with silica gel, makes fluorescent glue
Colloid surface cracking, influence life-span of LED.
Thus prior art could be improved and improve.
The content of the invention
The technical problems to be solved in the utility model is, in view of the shortcomings of the prior art, there is provided a kind of COB light source, with
Solve the problems, such as existing LED because contacted with UV and caused by service life it is low.
In order to solve the above-mentioned technical problem, technical scheme is as follows used by the utility model:
A kind of COB light source, it includes:Substrate and at least one LED chip being arranged on substrate, in the LED chip
Covered with transparent colloid, covered with UV films on the transparent colloid, the surface of the UV films is covered with phosphor powder layer.
The COB light source, wherein, the substrate is transparency carrier, to cause light caused by the LED chip to pass through institute
State substrate.
The COB light source, wherein, the light transmittance of the transparency carrier is more than or equal to 50%.
The COB light source, wherein, the phosphor powder layer includes some first phosphor strips and some second phosphor strips;
Some first phosphor strips and some second phosphor strips are arranged alternately, and the first phosphor strip and the second phosphor strip
Intersection is provided with white vermicelli.
The COB light source, wherein, first phosphor strip is fluorescent orange vermicelli, and the second phosphor strip is that yellow is glimmering
Light vermicelli.
The COB light source, wherein, the number of first phosphor strip and the second phosphor strip is equal.
The COB light source, wherein, the LED chip is blue chip, described in the blue light transmission that the LED chip is sent
In double color temperature white lights after phosphor powder layer.
The COB light source, wherein, box dam is provided with the substrate, the box dam surrounds the LED chip.
The COB light source, wherein, the box dam is printing opacity box dam, and the UV films are arranged on printing opacity box dam.
The COB light source, wherein, the top in the UV films vertical section is convex arcuate structure.
Beneficial effect:Compared with prior art, the utility model provides a kind of COB products, its substrate and is arranged at base
LED chip on plate, covered with UV films in the LED chip, the surface of the UV films is covered with phosphor powder layer.The utility model
Fluorescer film is substituted by using the UV moulds covered with phosphor powder layer, because UV film heat resistances are stronger, makes what fluorescent material was subject to
Heat is reduced, and the probability that fluorescent material chemically reacts reduces, and LED light source colour consistency is protected, and colour temperature concentration degree is high.
UV films have been effectively isolated extraneous UV simultaneously, reduce injury of the external environment to LED, extend LED etc. service life.
Brief description of the drawings
Fig. 1 is the plan view that COB light source provided by the utility model is preferably implemented;
Fig. 2 is the plan view for not installing UV films of COB light source provided by the utility model.
Embodiment
The utility model provides a kind of COB light source, to make the purpose of this utility model, technical scheme and effect more clear
Chu, clearly, the embodiment that develops simultaneously referring to the drawings to the utility model be further described.It is it should be appreciated that described herein
Specific embodiment only explaining the utility model, be not used to limit the utility model.
Below in conjunction with the accompanying drawings, by the description to embodiment, utility model content is described further.
A kind of COB light source is present embodiments provided, as shown in Figure 1-2, its substrate 100, electrode, LED chip 200 and UV
Film;The front surface region of substrate 100 is device rest area, and electrode is arranged on the substrate 100, and the LED chip 200 is set
In the front of substrate 200, and its side away from substrate 100 is provided with UV covered with transparent colloid, the transparent colloid
Film, and the surface of the UV films is covered with phosphor powder layer.The UV films have good heat-resisting quantity, it is possible to reduce are arranged at it
On the heat that is subject to of phosphor powder layer reduce, so as to reduce the probability reduction that fluorescent material chemically reacts so that LED light source face
Color uniformity is protected.
The substrate 100 is transparent substrates so that light can pass through transparent substrates 100 caused by the LED chip 200
Project, i.e., described COB light source with bottom-emission, can increase the lighting angle of the light source.Preferably, the transparent substrates is saturating
Light rate can be more than or equal to 50%.In the present embodiment, the transparent substrates are transparent alumina ceramics substrate so that substrate
Good heat conductivity, make the COB light source rapid heat dissipation, improve the service life of UV films.Also, reduce the thermal resistance and light of product
Decline, and can adapt to the COB packaging technologies in heavy-power LED product.
As shown in Fig. 2 the phosphor powder layer includes some first phosphor strips 401 and some second phosphor strips 402;Institute
State some first phosphor strips 401 and some second phosphor strips 402 are arranged alternately, and the first phosphor strip 401 and second is glimmering
The intersection of light vermicelli 402 is provided with white fluorescent vermicelli 403.In the present embodiment, first phosphor strip 401 is orange
Phosphor strip, the second phosphor strip 402 are yellow fluorescence vermicelli.That is, the fluorescent orange vermicelli and yellow fluorescent powder
Bar is arranged alternately, and white fluorescent vermicelli 403 are provided between fluorescent orange vermicelli and yellow fluorescence vermicelli.Preferably, institute
State on phosphor powder layer phosphor strip according to fluorescent orange vermicelli, white fluorescent vermicelli, yellow fluorescence vermicelli, white fluorescent vermicelli,
The order of fluorescent orange vermicelli is arranged in order.The double-colored temperature regulation of the COB light source can so be realized.
Further, the LED chip 200 is blue chip, and the blue chip is provided with phosphor powder layer, the blue core
The blue light excitated fluorescent powder of piece hair forms white light.Also, according to the set-up mode of the phosphor powder layer, the blue chip hair
Blue light can excite orange fluorescent powder to excite yellow fluorescent powder, so that excitated fluorescent powder forms double-colored temperature
White light.In this embodiment, the fluorescent orange vermicelli are identical with the quantity of yellow fluorescence vermicelli.
The formation of the UV films can be arranged as required into arbitrary shape.In the present embodiment, the UV films are shaped as justifying
Shape, the top in UV films vertical section is convex arcuate structure, its surface is formed micro- convex architecture with certain surface tension force, with
Further expand its light emitting region.Meanwhile UV films can also be arranged on substrate side end face, further to increase illumination effect.
Accordingly, the phosphor powder layer is shaped as circle, and white is arranged at the diameter of the circular fluorescent bisque in the horizontal direction
Phosphor strip, and the width of fluorescent orange vermicelli equidistant with the white fluorescent vermicelli and yellow fluorescence vermicelli is consistent.
Further, as shown in figure 1, being also provided with box dam 40 on the substrate 100, the box dam 40 surrounds described
Gelatin layer is with the shape of the fixation substratum transparent, and the box dam surrounds the LED chip, it is preferred that the UV films are set
In on the box dam.In the present embodiment, the box dam is using light transmissive material is chosen, i.e., described box dam is printing opacity box dam, so
After UV films are completed to make, removing box dam or not removing box dam does not influence light efficiency.In the variant embodiment of the present embodiment, institute
Printing opacity box dam can also be not provided with by stating the edge of UV films so that and the UV films are detachable assembling with the LED chip, so as to
In the replacing of the UV films.
Finally it should be noted that:Above example is only to illustrate the technical solution of the utility model, rather than its limitations;
Although the utility model is described in detail with reference to the foregoing embodiments, it will be understood by those within the art that:
It can still modify to the technical scheme described in foregoing embodiments, or which part technical characteristic is carried out etc.
With replacement;And these modifications or replacement, the essence of appropriate technical solution is departed from various embodiments of the utility model technology
The spirit and scope of scheme.
Claims (10)
1. a kind of COB light source, it is characterised in that it includes:Substrate and at least one LED chip being arranged on substrate, it is described
Covered with transparent colloid in LED chip, covered with UV films on the transparent colloid, the surface of the UV films is covered with fluorescent material
Layer.
2. COB light source according to claim 1, it is characterised in that the substrate is transparency carrier, to cause the LED core
Light caused by piece passes through the substrate.
3. COB light source according to claim 2, it is characterised in that the light transmittance of the transparency carrier be more than or equal to
50%。
4. COB light source according to claim 1, it is characterised in that the phosphor powder layer include some first phosphor strips and
Some second phosphor strips;Some first phosphor strips and some second phosphor strips are arranged alternately, and the first fluorescent material
The intersection of bar and the second phosphor strip is provided with white vermicelli.
5. COB light source according to claim 4, it is characterised in that first phosphor strip is fluorescent orange vermicelli, second
Phosphor strip is yellow fluorescence vermicelli.
6. COB light source according to claim 4, it is characterised in that of first phosphor strip and the second phosphor strip
Number is equal.
7. COB light source according to claim 5, it is characterised in that the LED chip is blue chip, the LED chip hair
The blue light gone out is in double color temperature white lights after passing through the phosphor powder layer.
8. COB light source according to claim 1, it is characterised in that box dam is provided with the substrate, the box dam surrounds institute
State LED chip.
9. COB light source according to claim 8, it is characterised in that the box dam is printing opacity box dam, and the UV films are arranged at
On printing opacity box dam.
10. COB light source according to claim 1, it is characterised in that the top in the UV films vertical section is convex arc knot
Structure.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201720854645.0U CN207183316U (en) | 2017-07-14 | 2017-07-14 | A kind of COB light source |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201720854645.0U CN207183316U (en) | 2017-07-14 | 2017-07-14 | A kind of COB light source |
Publications (1)
Publication Number | Publication Date |
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CN207183316U true CN207183316U (en) | 2018-04-03 |
Family
ID=61735887
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201720854645.0U Active CN207183316U (en) | 2017-07-14 | 2017-07-14 | A kind of COB light source |
Country Status (1)
Country | Link |
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CN (1) | CN207183316U (en) |
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2017
- 2017-07-14 CN CN201720854645.0U patent/CN207183316U/en active Active
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