CN207182333U - Fingerprint recognition component and electronic installation - Google Patents
Fingerprint recognition component and electronic installation Download PDFInfo
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- CN207182333U CN207182333U CN201721188607.2U CN201721188607U CN207182333U CN 207182333 U CN207182333 U CN 207182333U CN 201721188607 U CN201721188607 U CN 201721188607U CN 207182333 U CN207182333 U CN 207182333U
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- fingerprint sensor
- recognition component
- fingerprint
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Abstract
The utility model discloses a kind of fingerprint recognition component and electronic installation.The fingerprint recognition component includes optical finger print identification module and capacitive fingerprint identification module.Optical finger print identification module includes optical fingerprint sensor.Capacitive fingerprint identification module includes capacitive fingerprint sensor, optical fingerprint sensor and capacitive fingerprint sensor and is arranged at intervals with layer, and the position between optical fingerprint sensor and capacitive fingerprint sensor forms S type spacer portions.Fingerprint recognition component and electronic installation of the present utility model have optical finger print identification module and capacitive fingerprint identification module, so as to identify the fingerprint of wet finger using optical finger print identification module, the fingerprint of dry finger is identified using capacitive fingerprint identification module, in addition, optical fingerprint sensor and capacitive fingerprint sensor are arranged at intervals the adverse effect between the size that can reduce fingerprint recognition component and reduction optical fingerprint sensor and capacitive fingerprint sensor with layer.
Description
Technical field
Biological identification technology is the utility model is related to, more particularly to a kind of fingerprint recognition component and electronic installation.
Background technology
In the related art, capacitive fingerprint identification module is poor to the recognition capability of wet finger, optical finger print identification module pair
The recognition capability of dry finger is poor, and the experience of safety verification is carried out so as to influence user using fingerprint identification function.
Utility model content
Embodiment of the present utility model provides a kind of fingerprint recognition component and electronic installation.
A kind of fingerprint recognition component of the utility model embodiment, including：
Optical finger print identifies module, and the optical finger print identification module includes optical fingerprint sensor；With
Capacitive fingerprint identifies module, and the capacitive fingerprint identification module includes capacitive fingerprint sensor, the optical finger print
Sensor and the capacitive fingerprint sensor are arranged at intervals with layer, the optical fingerprint sensor and the capacitive fingerprint sensor
Between position formed S type spacer portions.
The fingerprint recognition component of the utility model embodiment has optical finger print identification module and capacitive fingerprint identification mould
Group, so as to identify the fingerprint of wet finger using optical finger print identification module, dry hand is identified using capacitive fingerprint identification module
The fingerprint of finger, in addition, optical fingerprint sensor and capacitive fingerprint sensor are arranged at intervals with layer can reduce fingerprint recognition component
Size and reduce adverse effect between optical fingerprint sensor and capacitive fingerprint sensor.
In some embodiments, the spacer portion is filled with insulating materials.
So, it is ensured that optical fingerprint sensor be mutually independent of each other with capacitive fingerprint sensor other side's sensor fingerprint letter
Breath collection.
In some embodiments, the optical finger print identification module includes light source and light guide, and the light guide is set
In the lower section of the optical fingerprint sensor, the light source is arranged on the side of the light guide.
In this way, using the cooperation of light source and optical fingerprint sensor, optical finger print identification module can realize fingerprint recognition
Function, on the other hand, it can send light source by the light conduction of light source transmitting to optical fingerprint sensor using light guide
Uniform light be incident to optical fingerprint sensor.
In some embodiments, the fingerprint recognition component includes cover plate, the optical fingerprint sensor and the electricity
Hold the lower surface that fingerprint sensor is fitted in the cover plate by optical cement.
In this way, optical fingerprint sensor and capacitive fingerprint sensor can be closer to cover plates, so as to shorten optical finger print
The distance of module and capacitive fingerprint identification module identification fingerprint is identified, and then strengthens optical finger print and identifies that module and capacitive fingerprint are known
The fingerprint capacity of other module.Further, since optical cement has good viscosity and a light transmittance, therefore can be with using optical cement
Optical fingerprint sensor and cover plate are strongly adhered to together, and do not influence the work of optical fingerprint sensor.
In some embodiments, the fingerprint recognition component includes sealing, and the sealing encapsulates the optical finger print and passed
The side of the side of sensor, the side of the capacitive fingerprint sensor and the optical cement.
In this way, sealing can fix optical cement, optical fingerprint sensor and capacitive fingerprint sensor, optical finger print is avoided
Sensor and capacitive fingerprint sensor rock.
In some embodiments, the optical fingerprint sensor includes optical layer and is arranged on the optical layer lower surface
Photosensitive layer, the optical layer is fitted in the lower surface of the cover plate and formed with microlens array by the optical cement.
In this way, optical layer can by microlens array by light-ray condensing into photosensitive layer, so as to increase the intensity of light, enter
And electric signal is formed after facilitating the photo-sensitive cell (such as photodiode) in photosensitive layer photosensitive.
In some embodiments, the fingerprint recognition component includes printed circuit board (PCB), the optical fingerprint sensor and
The capacitive fingerprint sensor is respectively provided with the printed circuit board.
In this way, optical fingerprint sensor and capacitive fingerprint sensor are easily provided on printed circuit board (PCB), optical finger print passes
, can be respectively by electric signal transmission to printing after sensor and capacitive fingerprint sensor detect electric signal corresponding to acquisition fingerprint respectively
Circuit board, printed circuit board (PCB) handle the electric signal of optical fingerprint sensor and the electric signal of capacitive fingerprint sensor so as to build respectively
The model of vertical fingerprint.
In some embodiments, the fingerprint recognition component includes connecting line, the optical fingerprint sensor and described
Capacitive fingerprint sensor is connected by the connecting line with the printed circuit board (PCB), and the fingerprint recognition component includes sealing,
The sealing encapsulates the junction of the connecting line, the printed circuit board (PCB) and the connecting line, the optical fingerprint sensor
The junction of junction, the capacitive fingerprint sensor and the connecting line with the connecting line, the optical finger print sense
The side of device and the side of the capacitive fingerprint sensor.
In this way, optical fingerprint sensor and capacitive fingerprint sensor can be connected by connecting line and printed circuit board (PCB)
Connect, so as to facilitate optical fingerprint sensor and capacitive fingerprint sensor to detect the electric signal transmission obtained to printed circuit board (PCB).
In addition, can be encapsulated connecting line and junction using sealing, connecting line and junction is avoided to be easily damaged.
In some embodiments, the fingerprint recognition component includes flexible PCB, one end of the flexible PCB
The lower section of the printed circuit board (PCB) is arranged on, the other end of the flexible PCB is provided with connector.
Part circuit structure (such as connector) is arranged on flexible PCB in this way, can utilize, so as to avoid printing
Circuit board size is excessive.In addition, using the flexible nature of flexible PCB, flexible circuit plate benging can be arranged on one
It is adjusted to be adapted to the position being connected with outer member in less space or by flexible PCB.
In some embodiments, the fingerprint recognition component includes stiffening plate, and the stiffening plate is arranged on the flexibility
The lower surface of one end of circuit board.
In this way, stiffening plate can be used for the intensity for strengthening flexible PCB.
A kind of electronic installation of embodiment of the present utility model, including the fingerprint recognition component.
In this way, electronic installation has optical finger print identification module and capacitive fingerprint identification module, so as to utilize optics
Fingerprint recognition module identifies the fingerprint of wet finger, and the fingerprint of dry finger is identified using capacitive fingerprint identification module.
Additional aspect and advantage of the present utility model will be set forth in part in the description, partly by from following description
In become obvious, or by it is of the present utility model practice recognize.
Brief description of the drawings
In description of the of the present utility model above-mentioned and/or additional aspect and advantage from combination accompanying drawings below to embodiment
It will be apparent and be readily appreciated that, wherein：
Fig. 1 is the structural representation of the fingerprint recognition component of the utility model embodiment；
Fig. 2 is the optical fingerprint sensor and capacitive fingerprint sensor of the fingerprint recognition component of the utility model embodiment
Connection diagram.
Main element symbol description：
Fingerprint recognition component 100, cover plate 10, optical finger print identification module 20, light source 22, optical fingerprint sensor 24, light
Learn layer 242, microlens array 2422, photosensitive layer 244, light guide 26, capacitive fingerprint identification module 30, capacitive fingerprint sensor
34th, optical cement 40, connecting line 50, sealing 60, spacer portion 70, printed circuit board (PCB) 81, solder joint 82, flexible PCB 83, connector
84th, stiffening plate 85.
Embodiment
Embodiment of the present utility model is described below in detail, the example of the embodiment is shown in the drawings, wherein
Same or similar label represents same or similar element or the element with same or like function from beginning to end.Lead to below
It is exemplary to cross the embodiment being described with reference to the drawings, and is only used for explaining the utility model, and it is not intended that to this practicality
New limitation.
In description of the present utility model, it is to be understood that term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width
Degree ", " thickness ", " on ", " under ", "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom ", " interior ", " outer ",
The orientation or position relationship of the instructions such as " clockwise ", " counterclockwise " be based on orientation shown in the drawings or position relationship, be only for
Be easy to describe the utility model and simplify to describe, rather than instruction or imply signified device or element must have it is specific
Orientation, with specific azimuth configuration and operation, therefore it is not intended that to limitation of the present utility model.In addition, term " first ",
" second " is only used for describing purpose, and it is not intended that indicating or implying relative importance or imply the technology indicated by indicating
The quantity of feature.Thus, " first " is defined, the feature of " second " can be expressed or implicitly include one or more
The feature.In description of the present utility model, " multiple " are meant that two or more, unless otherwise clearly specific
Limit.
, it is necessary to which explanation, unless otherwise clearly defined and limited, term " are pacified in description of the present utility model
Dress ", " connected ", " connection " should be interpreted broadly, for example, it may be fixedly connected or be detachably connected, or integratedly
Connection.Can be mechanical connection or electrical connection.Can be joined directly together, can also be indirectly connected by intermediary,
Can be connection or the interaction relationship of two elements of two element internals.For one of ordinary skill in the art
Speech, can understand concrete meaning of the above-mentioned term in the utility model as the case may be.
Referring to Fig. 1, a kind of fingerprint recognition component 100 of the utility model embodiment, including optical finger print identification mould
Group 20 and capacitive fingerprint identification module 30.Optical finger print identification module 20 includes optical fingerprint sensor 24, capacitive fingerprint identification
Module 30 includes capacitive fingerprint sensor 34.Optical fingerprint sensor 24 and capacitive fingerprint sensor 34 are arranged at intervals with layer, light
The position learned between fingerprint sensor 24 and capacitive fingerprint sensor 34 forms S types spacer portion 70.
The fingerprint recognition component 100 of the utility model embodiment can apply to the electronics of the utility model embodiment
Device, in other words, the electronic installation of the utility model embodiment include the fingerprint recognition component of the utility model embodiment
100。
There is the fingerprint recognition component 100 and electronic installation of the utility model embodiment optical finger print to identify the He of module 20
Capacitive fingerprint identifies module 30, so as to identify the fingerprint of wet finger using optical finger print identification module 20, is referred to using electric capacity
Line identification module 30 identifies the fingerprint of dry finger, in addition, optical fingerprint sensor 24 and capacitive fingerprint sensor 34 with interlayer every
The size that fingerprint recognition component 100 can be reduced is set and reduced between optical fingerprint sensor 24 and capacitive fingerprint sensor 34
Adverse effect.
Referring to Fig. 2, the position between optical fingerprint sensor 24 and capacitive fingerprint sensor 34 forms S type spacer portions
70, so that optical fingerprint sensor 24 and capacitive fingerprint sensor 34 can relatively closely be set together, and then can be with
Further reduce the size of fingerprint recognition component 100.
In some embodiments, optical fingerprint sensor 24 and capacitive fingerprint sensor 34 are arranged at intervals with layer, can be with
Be interpreted as, with layer set optical fingerprint sensor 24 and capacitive fingerprint sensor 34 be mutually independent of each other other side's sensor collection refer to
Line information.In addition, with layer set it is to be understood that optical fingerprint sensor 24 and capacitive fingerprint sensor 34 can be placed in it is same
Or on different supporters, the supporting surface that supporter is provided is in identical height or in the range of manufacturing process allowable error
Substantially the same height.
In some embodiments, spacer portion 70 is filled with insulating materials.So, it is ensured that the He of optical fingerprint sensor 24
The phase of capacitive fingerprint sensor 34 be independent of each other other side's sensor finger print information collection.
Specifically, insulating materials can be air, that is to say, that spacer portion 70 forms airspace.Insulating materials is alternatively
The on-gaseous insulating materials being filled between optical fingerprint sensor 24 and capacitive fingerprint sensor 34.
In some embodiments, electronic installation includes mobile phone, tablet personal computer, gate control system etc..It is real in the utility model
Apply in mode, electronic installation is mobile phone.
In some embodiments, optical fingerprint sensor 24 can use cmos sensor.
Referring to Fig. 1, in some embodiments, optical finger print identification module 20 includes light source 22 and light guide
26, light guide 26 is arranged on the lower section of optical fingerprint sensor 24, and light source 22 is arranged on the side of light guide 26.
In this way, using the cooperation of light source 22 and optical fingerprint sensor 24, optical finger print identification module 20, which can be realized, to be referred to
Line identification function, on the other hand, using light guide 26 can by the light conduction that light source 22 is launched to optical fingerprint sensor 24,
The uniform light that can send light source 22 is incident to optical fingerprint sensor 24.
In some embodiments, light source 22 is point source of light, and point source of light is emitted as flat light source by light guide 26.Point
Shape light source is, for example, LED light source.Light guide 26 is, for example, light guide plate.
Referring to Fig. 1, in some embodiments, fingerprint recognition component 100 includes cover plate 10, optical finger print sensing
Device 24 and capacitive fingerprint sensor 34 are fitted in the lower surface of cover plate 10 by optical cement 40.
In this way, optical fingerprint sensor 24 and capacitive fingerprint sensor 34 can be closer to cover plates 10, so as to shorten light
Learn fingerprint recognition module 20 and capacitive fingerprint identification module 30 identifies the distance of fingerprint, and then strengthen optical finger print identification module 20
With the fingerprint capacity of capacitive fingerprint identification module 30.Further, since optical cement 40 has good viscosity and light transmittance, because
Optical fingerprint sensor 24 and cover plate 10 can be strongly adhered to together by this using optical cement 40, and are not influenceed optics and referred to
The work of line sensor 24.Meanwhile cover plate 10 can also protect optical fingerprint sensor 24 and capacitive fingerprint sensor 34.
In the illustrated embodiment, the light that light source 22 is launched is transmitted to optical fingerprint sensor by light guide 26
24, cover plate 10 is reached after being passed through from optical fingerprint sensor 24, then the outside of fingerprint recognition component 100 is emitted to from cover plate 10.
When user's finger is touched in the upper surface of cover plate 10, the light of finger print reflection from the outgoing of the side of cover plate 10 forms reflected light
Line, reflection light are transmitted to optical fingerprint sensor 24, so as to which optical fingerprint sensor 24 can be according to the light detected
Light intensity is to gather the finger print information of user.
It should be noted that when light passes through optical fingerprint sensor 24 for the first time, (light that light source 22 is launched passes through
Light guide 26 is transmitted to optical fingerprint sensor 24), now light, which has not arrived, touches user's finger, does not possess fingerprint letter
Breath, therefore the electric signal that the now detection of optical fingerprint sensor 24 light obtains can remove this without preserving by algorithm
When the electric signal that transmits of optical fingerprint sensor 24, such as by judging optical fingerprint sensor 24 whether after light source 22 is luminous
The scheduled time in obtain electric signal, if so, then judge light first time pass through optical fingerprint sensor 24；If it is not, then judge
Light passes through optical fingerprint sensor 24 for the second time.When light second passes through optical fingerprint sensor 24 (reflection light from
The lateral reflection of cover plate 10 returns optical fingerprint sensor 24), now light has finger print information, therefore can retain now optical finger print
Sensor 24 detects the model that the electric signal that light obtains obtains user fingerprints for subsequent treatment.
It is of course also possible to during subsequent treatment electric signal, the electric signal that optical fingerprint sensor 24 is collected carries out subtraction
Processing, remove the light that light source 22 is launched and pass through the electric signal formed during optical fingerprint sensor 24 and retain and believe with fingerprint
The electric signal of breath.
In some embodiments, when the application of fingerprint recognition component 100 is with electronic installation, electronic installation includes housing
(not shown), cover plate 10 form receiving space with housing, and receiving space is used to housing and protecting optical finger print identification module 20, electricity
Hold the other elements of fingerprint recognition module 30 and electronic installation (such as mainboard, battery, loudspeaker, shooting are first-class).Utilize receiving space
Water proof and dust proof ability can protect all elements in receiving space not by external interference, so as to which all elements can be normal
Work.In one embodiment, cover plate 10 can be cover-plate glass.
Referring to Fig. 1, in some embodiments, fingerprint recognition component 100 includes sealing 60, and sealing 60 encapsulates light
Learn side, the side of capacitive fingerprint sensor 34 and the side of optical cement 40 of fingerprint sensor 24.
In this way, sealing 60 can fix optical cement 30, optical fingerprint sensor 24 and capacitive fingerprint sensor 34, avoid
Optical fingerprint sensor 24 and capacitive fingerprint sensor 34 rock.
Specifically, the optical fingerprint sensor 24 with optical cement 30 and capacitive fingerprint sensor 34 are being fitted into cover plate
During 10 lower surface, the quality of optical cement 30 belongs to semi-cured state, so causes what is be bonded by optical cement 30 than relatively soft
Optical fingerprint sensor 24 and capacitive fingerprint sensor 34 easily rock, therefore utilize the encapsulating optical fingerprint sensor 24 of sealing 60
Side, capacitive fingerprint sensor 34 side and the side of optical cement 30 can be by optical fingerprint sensor 24 and capacitive fingerprint
Sensor 34 is fixed.After the completion of fitting, then optical cement 30 is solidified.In addition, sealing 60 can be coloured and light tight
, therefore sealing 60 can play interception, prevent ambient light from entering in optical fingerprint sensor 24 and disturbing optical finger print
Sensor 24 identifies fingerprint.Sealing 60 includes the glue such as low temperature hot-setting adhesive, moisture-curable glue, is not specifically limited herein.
Referring to Fig. 1, in some embodiments, optical fingerprint sensor 24 includes optical layer 242 and is arranged on
The photosensitive layer 244 of the lower surface of optical layer 242, optical layer 242 by optical cement 40 be fitted in cover plate 10 lower surface and formed with
Microlens array 2422.
In this way, optical layer 242 can by microlens array 2422 by light-ray condensing into photosensitive layer 244, so as to increase
The intensity of light, and then form electric signal after facilitating the photo-sensitive cell (such as photodiode) in photosensitive layer 244 photosensitive.
It is appreciated that optical layer 242 is mainly used in gathering reflection light in photosensitive layer 244, in some embodiments
In, optical finger print identification module 20 can also omit optical layer 242.It should be noted that photosensitive layer 244 can include photo-sensitive cell
Array, such as the photodiode being arranged in array, in addition, the photo-sensitive cell of light-sensing element array can and microlens array
Lenticule in 2422 corresponds, i.e. the corresponding lenticule of a photo-sensitive cell, is not specifically limited herein.It is preferred that
The size of microlens array 2422 is more than the size of photosensitive layer 244, more light is entered photosensitive layer 244.
In some embodiments, optical layer 242 includes antireflective coating (not shown), and antireflective coating is formed in lenticule battle array
The top of row 2422.
In some embodiments, photosensitive layer 244 includes substrate, the light-sensing element array being arranged in substrate and connecting line
Road.Connection line connects light-sensing element array.Light shield layer can be set between each photo-sensitive cell and substrate of photosensitive layer 244,
The light that light source 22 is launched is emitted to the outside of optical layer 242 and fingerprint recognition component 100 through the gap between multiple light shield layers.
In this way, when light passes through optical fingerprint sensor 24 for the first time, photosensitive layer 244 or will not will not produce corresponding telecommunications substantially
Number；When reflection light is through optical fingerprint sensor 24, photosensitive layer 222 can detect light and form the electricity with finger print information
Signal.
Referring to Fig. 1, in some embodiments, fingerprint recognition component 100 includes printed circuit board (PCB) 81, and optics refers to
Line sensor 24 and capacitive fingerprint sensor 34 are arranged on printed circuit board (PCB) 81.
In this way, optical fingerprint sensor 24 and capacitive fingerprint sensor 34 are easily provided on printed circuit board (PCB) 81, optics
, can be respectively by electric signal after fingerprint sensor 24 and capacitive fingerprint sensor 34 detect electric signal corresponding to acquisition fingerprint respectively
Printed circuit board (PCB) 81 is transferred to, printed circuit board (PCB) 81 handles the electric signal and capacitive fingerprint sensing of optical fingerprint sensor 24 respectively
The electric signal of device 34 is so as to establishing the model of fingerprint.
It is appreciated that printed circuit board (PCB) 81 is hardboard, quality is more strong, and printed circuit board (PCB) 81 may be regarded as supporter, because
Optical fingerprint sensor 24 and capacitive fingerprint sensor 34 are easily arranged on printed circuit board (PCB) 81 by this.
In the utility model embodiment, capacitive fingerprint identification module 30 and optical finger print identification module 20 share printing
Circuit board 81.It is appreciated that in other embodiments, capacitive fingerprint identification module 30 and optical finger print identification module 20 can be with
Two separated printed circuit boards 81 are corresponded to respectively, are not specifically limited herein.
Referring to Fig. 1, in some embodiments, fingerprint recognition component includes connecting line 50, optical finger print sensing
Device 24 and capacitive fingerprint sensor 34 are connected by connecting line 50 and printed circuit board (PCB) 81, and fingerprint recognition component 100 includes envelope
Glue 60, sealing 60 encapsulate connecting line 50, the junction of printed circuit board (PCB) 81 and connecting line 50, optical fingerprint sensor 24 with being connected
The junction of line 50, the junction of capacitive fingerprint sensor 34 and connecting line 50, the side of optical fingerprint sensor 24 and electric capacity
The side of fingerprint sensor 34.
In this way, optical fingerprint sensor 24 and capacitive fingerprint sensor 34 can pass through connecting line 50 and printed circuit board (PCB)
81 are attached, so as to facilitate optical fingerprint sensor 24 and capacitive fingerprint sensor 34 will detect obtain electric signal transmission to
Printed circuit board (PCB) 81.In addition, connecting line 50 and junction can be encapsulated using sealing 60, avoid connecting line 50 and connection
Place is easily damaged.
Connecting line 50 can engage (wire bonding) technique connection sensor and printed circuit board (PCB) 81 by routing.
In some embodiments, fingerprint recognition component 100 includes flexible PCB 83, and one end of flexible PCB 83 is set
Put and the lower section of printed circuit board (PCB) 81, the other end of flexible PCB 83 are provided with connector 84.
Part circuit structure (such as connector 84) is arranged on flexible PCB 83 in this way, can utilize, so as to avoid
Printed circuit board (PCB) 81 is oversized.In addition, using the flexible nature of flexible PCB 83, flexible PCB 83 can be bent with
It is arranged in a less space or is adjusted to flexible PCB 83 to be adapted to the position being connected with outer member.
Specifically, if all circuit structures of fingerprint recognition component 100 are all disposed within printed circuit board (PCB) 81, easily lead
The oversized of printed circuit board (PCB) 81 is caused, so that the size increase of fingerprint recognition component 100, therefore can be in printed circuit
The lower section of plate 81 sets flexible PCB 83, and part circuit structure (such as connector 84) is arranged on flexible PCB 83.
Flexible PCB 83 can be attached by connector 84 and outer member (mainboard of such as electronic installation).At certain
In a little embodiments, connector 84 includes the part that solder joint, wire, plug, socket etc. play connection function, does not do specific limit herein
It is fixed.
In some embodiments, printed circuit board (PCB) 81 includes solder joint 82, and printed circuit board (PCB) 81 passes through solder joint 82 and flexibility
Circuit board 83 connects.Printed circuit board (PCB) 81 and flexible PCB 83 can be in communication with each other, so as to which printed circuit board (PCB) 81 will can obtain
The electric signal of the optical fingerprint sensor 24 obtained and the electric signal transmission of capacitive fingerprint sensor 34 are to flexible PCB 83.
In some embodiments, processor (not shown) is provided with flexible PCB 83, processor can be used for locating
Manage the electric signal of optical fingerprint sensor 24 and the electric signal of capacitive fingerprint sensor 34.
Specifically, flexible PCB 83 can be provided with processor and interlock circuit structure, and processor processing includes fingerprint
The electric signal of information is to establish the model of fingerprint.
In some embodiments, fingerprint recognition component 100 includes stiffening plate 85, and stiffening plate 85 is arranged on flexible PCB
The lower surface of 83 one end.
In this way, stiffening plate 85 can be used for the intensity for strengthening flexible PCB 83.
It is appreciated that due to the flexible nature of flexible PCB 83, the stress of flexible PCB 83 is caused easily to produce crack,
It is difficult to connect printed circuit board (PCB) 81 and flexible PCB 83 or the installation elements on flexible PCB 83, therefore will can mends
Strong plate 85 is arranged on the lower surface of one end of flexible PCB 83 so that with reference to stiffening plate 85 flexible PCB 83 it is strong
Degree is enough, and then conveniently connects printed circuit board (PCB) 81 and flexible PCB 83 or installation elements are carried out on flexible PCB 83
Deng operation.
In some embodiments, stiffening plate 85 is arranged on the lower surface of one end of flexible PCB 83, such as is arranged on
The lower surface of one end that flexible PCB 83 is connected with printed circuit board (PCB) 81, in this way, can both realize flexible PCB 83 and print
The connection of printed circuit board 81, and can cause the flexible PCBs 83 of other parts that still there is higher flexibility in order to change by
The bending of flexible PCB 83.
Stiffening plate 85 is, for example, stainless steel plate.
It is appreciated that the electronic installation of the utility model embodiment includes the fingerprint recognition group of any of the above-described embodiment
Part 100.
In the utility model, unless otherwise clearly defined and limited, fisrt feature second feature it " on " or it
" under " can directly be contacted including the first and second features, it is not directly to contact but lead to that can also include the first and second features
The other characterisation contact crossed between them.Moreover, fisrt feature second feature " on ", " top " and " above " include the
One feature is directly over second feature and oblique upper, or is merely representative of fisrt feature level height and is higher than second feature.First is special
Sign second feature " under ", " lower section " and " below " including fisrt feature immediately below second feature and obliquely downward, or only
Represent that fisrt feature level height is less than second feature.
Following disclosure provides many different embodiments or example is used for realizing different structure of the present utility model.
In order to simplify disclosure of the present utility model, hereinafter the part and setting of specific examples are described.Certainly, they are only
Example, and purpose does not lie in limitation the utility model.In addition, the utility model can in different examples repeat reference numerals
And/or reference letter, this repetition are for purposes of simplicity and clarity, itself not indicate discussed various embodiments
And/or the relation between setting.In addition, various specific techniques and the example of material that the utility model provides, but this
Field those of ordinary skill can be appreciated that the application of other techniques and/or the use of other materials.
In the description of this specification, reference term " embodiment ", " some embodiments ", " schematically implementation
The description of mode ", " example ", " specific example " or " some examples " etc. means to combine embodiment or example describe it is specific
Feature, structure, material or feature are contained at least one embodiment or example of the present utility model.In this specification
In, identical embodiment or example are not necessarily referring to the schematic representation of above-mentioned term.Moreover, the specific spy of description
Sign, structure, material or feature can combine in an appropriate manner in any one or more embodiments or example.
While there has been shown and described that embodiment of the present utility model, one of ordinary skill in the art can manage
Solution：A variety of to the progress of these embodiments can change in the case where not departing from principle and objective of the present utility model, change,
Replace and modification, the scope of the utility model are limited by claim and its equivalent.
Claims (11)
- A kind of 1. fingerprint recognition component, it is characterised in that including：Optical finger print identifies module, and the optical finger print identification module includes optical fingerprint sensor；WithCapacitive fingerprint identifies module, and the capacitive fingerprint identification module includes capacitive fingerprint sensor, the optical finger print sensing Device and the capacitive fingerprint sensor are arranged at intervals with layer, between the optical fingerprint sensor and the capacitive fingerprint sensor Position formed S type spacer portions.
- 2. fingerprint recognition component as claimed in claim 1, it is characterised in that the spacer portion is filled with insulating materials.
- 3. fingerprint recognition component as claimed in claim 1, it is characterised in that optical finger print identification module include light source and Light guide, the light guide are arranged on the lower section of the optical fingerprint sensor, and the light source is arranged on the side of the light guide Face.
- 4. fingerprint recognition component as claimed in claim 1, it is characterised in that the fingerprint recognition component includes cover plate, described Optical fingerprint sensor and the capacitive fingerprint sensor are fitted in the lower surface of the cover plate by optical cement.
- 5. fingerprint recognition component as claimed in claim 4, it is characterised in that the fingerprint recognition component includes sealing, described Sealing encapsulates side, the side of the capacitive fingerprint sensor and the side of the optical cement of the optical fingerprint sensor.
- 6. fingerprint recognition component as claimed in claim 4, it is characterised in that the optical fingerprint sensor include optical layer and The photosensitive layer of the optical layer lower surface is arranged on, the optical layer is fitted in the lower surface of the cover plate by the optical cement And formed with microlens array.
- 7. fingerprint recognition component as claimed in claim 1, it is characterised in that the fingerprint recognition component includes printed circuit Plate, the optical fingerprint sensor and the capacitive fingerprint sensor are respectively provided with the printed circuit board.
- 8. fingerprint recognition component as claimed in claim 7, it is characterised in that the fingerprint recognition component includes connecting line, institute Optical fingerprint sensor is stated to connect with the printed circuit board (PCB) by the connecting line with the capacitive fingerprint sensor, it is described Fingerprint recognition component includes sealing, and the sealing encapsulates the connection of the connecting line, the printed circuit board (PCB) and the connecting line Place, the optical fingerprint sensor and the junction of the connecting line, the company of the capacitive fingerprint sensor and the connecting line Connect the side at place, the side of the optical fingerprint sensor and the capacitive fingerprint sensor.
- 9. fingerprint recognition component as claimed in claim 7, it is characterised in that the fingerprint recognition component includes flexible circuit Plate, one end of the flexible PCB are arranged on the lower section of the printed circuit board (PCB), and the other end of the flexible PCB is set There is connector.
- 10. fingerprint recognition component as claimed in claim 9, it is characterised in that the fingerprint recognition component includes stiffening plate, institute State the lower surface that stiffening plate is arranged on one end of the flexible PCB.
- 11. a kind of electronic installation, it is characterised in that including the fingerprint recognition component described in claim 1-10 any one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721188607.2U CN207182333U (en) | 2017-09-15 | 2017-09-15 | Fingerprint recognition component and electronic installation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721188607.2U CN207182333U (en) | 2017-09-15 | 2017-09-15 | Fingerprint recognition component and electronic installation |
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| Publication Number | Publication Date |
|---|---|
| CN207182333U true CN207182333U (en) | 2018-04-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721188607.2U Expired - Fee Related CN207182333U (en) | 2017-09-15 | 2017-09-15 | Fingerprint recognition component and electronic installation |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109977785A (en) * | 2019-03-01 | 2019-07-05 | 惠科股份有限公司 | Finger print input device |
-
2017
- 2017-09-15 CN CN201721188607.2U patent/CN207182333U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109977785A (en) * | 2019-03-01 | 2019-07-05 | 惠科股份有限公司 | Finger print input device |
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| GR01 | Patent grant | ||
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| CP03 | Change of name, title or address |
Address after: 330013 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee after: Jiangxi OMS Microelectronics Co.,Ltd. Address before: 330013 east of Xueyuan 6th Road, south of Tianxiang Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee before: OFilm Microelectronics Technology Co.,Ltd. Address after: 330013 east of Xueyuan 6th Road, south of Tianxiang Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee after: OFilm Microelectronics Technology Co.,Ltd. Address before: 330013 No.698 Tianxiang Avenue, high tech Zone, Nanchang City, Jiangxi Province Patentee before: NANCHANG OFILM BIO-IDENTIFICATION TECHNOLOGY Co.,Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180403 |