CN109508604A - Fingerprint recognition component and electronic device - Google Patents
Fingerprint recognition component and electronic device Download PDFInfo
- Publication number
- CN109508604A CN109508604A CN201710850408.1A CN201710850408A CN109508604A CN 109508604 A CN109508604 A CN 109508604A CN 201710850408 A CN201710850408 A CN 201710850408A CN 109508604 A CN109508604 A CN 109508604A
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- Prior art keywords
- optical
- fingerprint sensor
- recognition component
- fingerprint
- capacitive
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
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- Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Image Input (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
Abstract
The invention discloses a kind of fingerprint recognition components.The fingerprint recognition component includes optical finger print identification mould group and capacitive fingerprint identification mould group.Optical finger print identifies that mould group includes optical fingerprint sensor.Capacitive fingerprint identification mould group includes capacitive fingerprint sensor, optical fingerprint sensor and the setting of capacitive fingerprint sensor same layer interval, and the position between optical fingerprint sensor and capacitive fingerprint sensor forms S type spacer portion.In addition, the invention also discloses a kind of electronic devices.There is optical finger print identification mould group and capacitive fingerprint to identify mould group for fingerprint recognition component of the invention and electronic device, so as to identify the fingerprint of wet finger using optical finger print identification mould group, the fingerprint of dry finger is identified using capacitive fingerprint identification mould group, in addition, optical fingerprint sensor and the setting of capacitive fingerprint sensor same layer interval can reduce the size of fingerprint recognition component and reduce the adverse effect between optical fingerprint sensor and capacitive fingerprint sensor.
Description
Technical field
The present invention relates to biological identification technology, in particular to a kind of fingerprint recognition component and electronic device.
Background technique
In the related art, capacitive fingerprint identification mould group is poor to the recognition capability of wet finger, and optical finger print identifies mould group pair
The recognition capability of dry finger is poor, to influence the experience that user carries out safety verification using fingerprint identification function.
Summary of the invention
Embodiments of the present invention provide a kind of fingerprint recognition component and electronic device.
A kind of fingerprint recognition component of embodiment of the present invention, comprising:
Optical finger print identifies mould group, and the optical finger print identification mould group includes optical fingerprint sensor；With
Capacitive fingerprint identifies mould group, and the capacitive fingerprint identification mould group includes capacitive fingerprint sensor, the optical finger print
Sensor and the setting of capacitive fingerprint sensor same layer interval, the optical fingerprint sensor and the capacitive fingerprint sensor
Between position formed S type spacer portion.
There is the fingerprint recognition component of embodiment of the present invention optical finger print identification mould group and capacitive fingerprint to identify mould group, from
And can use the fingerprint that optical finger print identification mould group identifies wet finger, the finger of dry finger is identified using capacitive fingerprint identification mould group
Line, in addition, optical fingerprint sensor and the setting of capacitive fingerprint sensor same layer interval can reduce the size of fingerprint recognition component
And the adverse effect between reduction optical fingerprint sensor and capacitive fingerprint sensor.
In some embodiments, the spacer portion is filled with insulating materials.
So, it is ensured that optical fingerprint sensor be mutually independent of each other with capacitive fingerprint sensor other side's sensor fingerprint letter
Breath acquisition.
In some embodiments, the optical finger print identification mould group includes light source and light guide, the light guide setting
In the lower section of the optical fingerprint sensor, the side of the light guide is arranged in the light source.
In this way, fingerprint recognition may be implemented in optical finger print identification mould group using the cooperation of light source and optical fingerprint sensor
Function, on the other hand, the light conduction that can be emitted light source using light guide can be such that light source issues to optical fingerprint sensor
Light be uniformly incident to optical fingerprint sensor.
In some embodiments, the fingerprint recognition component includes cover board, the optical fingerprint sensor and the electricity
Hold fingerprint sensor and passes through the lower surface that optical cement is fitted in the cover board.
In this way, optical fingerprint sensor and capacitive fingerprint sensor can be closer to cover boards, so as to shorten optical finger print
It identifies the distance of mould group and capacitive fingerprint identification mould group identification fingerprint, and then enhances optical finger print and identify that mould group and capacitive fingerprint are known
The fingerprint capacity of other mould group.Further, since optical cement has good viscosity and light transmittance, therefore can be with using optical cement
Optical fingerprint sensor and cover board are strongly adhered to together, and do not influence the work of optical fingerprint sensor.
In some embodiments, the fingerprint recognition component includes sealing, and the sealing encapsulates the optical finger print and passes
The side of sensor, the side of the capacitive fingerprint sensor and the optical cement side.
In this way, sealing can fix optical cement, optical fingerprint sensor and capacitive fingerprint sensor, optical finger print is avoided
The shaking of sensor and capacitive fingerprint sensor.
In some embodiments, the optical fingerprint sensor includes optical layer and is arranged in the optical layer lower surface
Photosensitive layer, the optical layer is fitted in the lower surface of the cover board by the optical cement and is formed with microlens array.
In this way, optical layer can by microlens array by light-ray condensing into photosensitive layer, to increase the intensity of light, into
And electric signal is formed after facilitating the photosensitive element (such as photodiode) in photosensitive layer photosensitive.
In some embodiments, the fingerprint recognition component includes printed circuit board, the optical fingerprint sensor and
The capacitive fingerprint sensor is respectively provided on the printed circuit board.
In this way, optical fingerprint sensor and capacitive fingerprint sensor are easily provided on printed circuit board, optical finger print is passed
It, can be respectively by electric signal transmission to printing after sensor and capacitive fingerprint sensor detect the corresponding electric signal of acquisition fingerprint respectively
Circuit board, printed circuit board handle the electric signal of optical fingerprint sensor and the electric signal of capacitive fingerprint sensor respectively to build
The model of vertical fingerprint.
In some embodiments, the fingerprint recognition component includes connecting line, the optical fingerprint sensor and described
Capacitive fingerprint sensor passes through the connecting line and connects with the printed circuit board, and the fingerprint recognition component includes sealing,
The sealing encapsulates the junction of the connecting line, the printed circuit board and the connecting line, the optical fingerprint sensor
It is sensed with the junction of the connecting line, the junction of the capacitive fingerprint sensor and the connecting line, the optical finger print
The side of the side of device and the capacitive fingerprint sensor.
In this way, optical fingerprint sensor and capacitive fingerprint sensor can be connected by connecting line and printed circuit board
It connects, so that optical fingerprint sensor and capacitive fingerprint sensor be facilitated to will test the electric signal transmission of acquisition to printed circuit board.
In addition, can be encapsulated connecting line and junction using sealing, connecting line and junction is avoided to be easily damaged.
In some embodiments, the fingerprint recognition component includes flexible circuit board, one end of the flexible circuit board
The lower section of the printed circuit board is set, and the other end of the flexible circuit board is provided with connector.
Part circuit structure (such as connector) is arranged on flexible circuit board in this way, can use, to avoid printing
Circuit board size is excessive.In addition, flexible circuit plate benging can be arranged in one using the flexible nature of flexible circuit board
The position for being suitble to connect with outer member is adjusted in lesser space or by flexible circuit board.
In some embodiments, the fingerprint recognition component includes stiffening plate, and the stiffening plate is arranged in the flexibility
The lower surface of one end of circuit board.
In this way, stiffening plate can be used for enhancing the intensity of flexible circuit board.
A kind of electronic device of embodiments of the present invention, including the fingerprint recognition component.
In this way, there is electronic device optical finger print identification mould group and capacitive fingerprint to identify mould group, so as to utilize optics
Fingerprint recognition mould group identifies the fingerprint of wet finger, and the fingerprint of dry finger is identified using capacitive fingerprint identification mould group.
Additional aspect and advantage of the invention will be set forth in part in the description, and will partially become from the following description
Obviously, or practice through the invention is recognized.
Detailed description of the invention
Above-mentioned and/or additional aspect and advantage of the invention is from combining in description of the following accompanying drawings to embodiment by change
It obtains obviously and is readily appreciated that, in which:
Fig. 1 is the structural schematic diagram of the fingerprint recognition component of embodiment of the present invention；
Fig. 2 is the optical fingerprint sensor of the fingerprint recognition component of embodiment of the present invention and the company of capacitive fingerprint sensor
Connect schematic diagram.
Main element symbol description:
Fingerprint recognition component 100, cover board 10, optical finger print identify mould group 20, light source 22, optical fingerprint sensor 24, light
It learns layer 242, microlens array 2422, photosensitive layer 244, light guide 26, capacitive fingerprint and identifies mould group 30, capacitive fingerprint sensor
34, optical cement 40, connecting line 50, sealing 60, spacer portion 70, printed circuit board 81, solder joint 82, flexible circuit board 83, connector
84, stiffening plate 85.
Specific embodiment
Embodiments of the present invention are described below in detail, the example of the embodiment is shown in the accompanying drawings, wherein from beginning
Same or similar element or element with the same or similar functions are indicated to same or similar label eventually.Below by ginseng
The embodiment for examining attached drawing description is exemplary, and for explaining only the invention, and is not considered as limiting the invention.
In the description of the present invention, it is to be understood that, term " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside", " up time
The orientation or positional relationship of the instructions such as needle ", " counterclockwise " is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of
The description present invention and simplified description, rather than the device or element of indication or suggestion meaning must have a particular orientation, with spy
Fixed orientation construction and operation, therefore be not considered as limiting the invention.In addition, term " first ", " second " are only used for
Purpose is described, relative importance is not understood to indicate or imply or implicitly indicates the quantity of indicated technical characteristic.
" first " is defined as a result, the feature of " second " can explicitly or implicitly include one or more feature.?
In description of the invention, the meaning of " plurality " is two or more, unless otherwise specifically defined.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected.It can
To be mechanical connection, it is also possible to be electrically connected.It can be directly connected, can also can be indirectly connected through an intermediary
The interaction relationship of connection or two elements inside two elements.It for the ordinary skill in the art, can be with
The concrete meaning of above-mentioned term in the present invention is understood as the case may be.
Referring to Fig. 1, a kind of fingerprint recognition component 100 of embodiment of the present invention, including optical finger print identify mould group 20
Mould group 30 is identified with capacitive fingerprint.Optical finger print identifies that mould group 20 includes optical fingerprint sensor 24, and capacitive fingerprint identifies mould group
30 include capacitive fingerprint sensor 34.Optical fingerprint sensor 24 and the setting of 34 same layer interval of capacitive fingerprint sensor, optics refer to
Position between line sensor 24 and capacitive fingerprint sensor 34 forms S type spacer portion 70.
The fingerprint recognition component 100 of embodiment of the present invention can be applied to the electronic device of embodiment of the present invention, or
Person says that the electronic device of embodiment of the present invention includes the fingerprint recognition component 100 of embodiment of the present invention.
The fingerprint recognition component 100 and electronic device of embodiment of the present invention have optical finger print identification mould group 20 and capacitor
Fingerprint recognition mould group 30 is known so as to be identified the fingerprint of wet finger using optical finger print identification mould group 20 using capacitive fingerprint
Other mould group 30 identifies the fingerprint of dry finger, in addition, optical fingerprint sensor 24 and the setting of 34 same layer interval of capacitive fingerprint sensor
It can reduce the size of fingerprint recognition component 100 and reduce between optical fingerprint sensor 24 and capacitive fingerprint sensor 34 not
Benefit influences.
Referring to Fig. 2, the position between optical fingerprint sensor 24 and capacitive fingerprint sensor 34 forms S type spacer portion
70, so that optical fingerprint sensor 24 and capacitive fingerprint sensor 34 can relatively closely be set together, and then can be with
Further reduce the size of fingerprint recognition component 100.
In some embodiments, optical fingerprint sensor 24 and the setting of 34 same layer interval of capacitive fingerprint sensor, can be with
It is interpreted as, the other side's sensor acquisition that is mutually independent of each other of optical fingerprint sensor 24 and the capacitive fingerprint sensor 34 of same layer setting refers to
Line information.In addition, same layer setting it is to be understood that optical fingerprint sensor 24 and capacitive fingerprint sensor 34 can be placed in it is same
Or on different supporters, supporting surface provided by supporter is in identical height or within the scope of manufacturing process allowable error
Substantially the same height.
In some embodiments, spacer portion 70 is filled with insulating materials.So, it is ensured that 24 He of optical fingerprint sensor
34 phase of capacitive fingerprint sensor be independent of each other other side's sensor finger print information acquisition.
Specifically, insulating materials can be air, that is to say, that spacer portion 70 forms airspace.Insulating materials can also be
The on-gaseous insulating materials being filled between optical fingerprint sensor 24 and capacitive fingerprint sensor 34.
In some embodiments, electronic device includes mobile phone, tablet computer, access control system etc..In embodiment party of the present invention
In formula, electronic device is mobile phone.
In some embodiments, cmos sensor can be used in optical fingerprint sensor 24.
Referring to Fig. 1, in some embodiments, optical finger print identifies that mould group 20 includes light source 22 and light guide
26, the lower section of optical fingerprint sensor 24 is arranged in light guide 26, and the side of light guide 26 is arranged in light source 22.
In this way, optical finger print identification mould group 20 may be implemented to refer to using the cooperation of light source 22 and optical fingerprint sensor 24
Line identification function, on the other hand, the light conduction that light source 22 can be emitted using light guide 26 to optical fingerprint sensor 24,
The light that light source 22 can be made to issue uniformly is incident to optical fingerprint sensor 24.
In some embodiments, light source 22 is point source of light, and point source of light is emitted as flat light source by light guide 26.Point
Shape light source is, for example, LED light source.Light guide 26 is, for example, light guide plate.
Referring to Fig. 1, in some embodiments, fingerprint recognition component 100 includes cover board 10, optical finger print sensing
Device 24 and capacitive fingerprint sensor 34 are fitted in the lower surface of cover board 10 by optical cement 40.
In this way, optical fingerprint sensor 24 and capacitive fingerprint sensor 34 can be closer to cover boards 10, so as to shorten light
It learns fingerprint recognition mould group 20 and capacitive fingerprint identification mould group 30 identifies the distance of fingerprint, and then enhance optical finger print and identify mould group 20
With the fingerprint capacity of capacitive fingerprint identification mould group 30.Further, since optical cement 40 has good viscosity and light transmittance, because
Optical fingerprint sensor 24 and cover board 10 can be strongly adhered to together by this using optical cement 40, and do not influenced optics and referred to
The work of line sensor 24.Meanwhile cover board 10 can also protect optical fingerprint sensor 24 and capacitive fingerprint sensor 34.
In the illustrated embodiment, the light that light source 22 emits is transmitted to optical fingerprint sensor by light guide 26
24, cover board 10 is reached after passing through from optical fingerprint sensor 24, then the outside of fingerprint recognition component 100 is emitted to from cover board 10.
When user's finger is touched at the upper surface of cover board 10, the light that finger print reflection is emitted from 10 side of cover board forms reflected light
Line, reflection light are transmitted to optical fingerprint sensor 24, so that optical fingerprint sensor 24 can be according to the light detected
Light intensity is to acquire the finger print information of user.
It should be noted that when light passes through optical fingerprint sensor 24 for the first time, (light that light source 22 emits passes through
Light guide 26 is transmitted to optical fingerprint sensor 24), light, which has not arrived, at this time touches user's finger, does not have fingerprint letter
Breath, therefore the electric signal that optical fingerprint sensor 24 detects that light obtains at this time can remove this by algorithm without saving
When the electric signal that transmits of optical fingerprint sensor 24, such as by judge optical fingerprint sensor 24 whether after light source 22 is luminous
Predetermined time in obtain electric signal, if so, judge that light first time passes through optical fingerprint sensor 24；If it is not, then judging
Light passes through optical fingerprint sensor 24 for the second time.When light passes through optical fingerprint sensor 24 for the second time (reflection light from
10 lateral reflection of cover board returns optical fingerprint sensor 24), light has finger print information at this time, therefore can retain optical finger print at this time
Sensor 24 detects the electric signal that light obtains to obtain the model of user fingerprints for subsequent processing.
It is of course also possible to which the collected electric signal of optical fingerprint sensor 24 is carried out subtraction when subsequent processing electric signal
Processing, the light that removal light source 22 emits are formed by electric signal and retain and believe with fingerprint when passing through optical fingerprint sensor 24
The electric signal of breath.
In some embodiments, when the application of fingerprint recognition component 100 is with electronic device, electronic device includes shell
(not shown), cover board 10 and shell form accommodating space, and accommodating space is for accommodating and protecting optical finger print identification mould group 20, electricity
Hold the other elements (such as mainboard, battery, loudspeaker, camera) of fingerprint recognition mould group 30 and electronic device.Utilize accommodating space
Water proof and dust proof ability can protect all elements in accommodating space not by external interference, so that all elements can be normal
Work.In one embodiment, cover board 10 can be cover-plate glass.
Referring to Fig. 1, in some embodiments, fingerprint recognition component 100 includes sealing 60, and sealing 60 encapsulates light
Learn side, the side of capacitive fingerprint sensor 34 and the side of optical cement 40 of fingerprint sensor 24.
In this way, sealing 60 can fix optical cement 30, optical fingerprint sensor 24 and capacitive fingerprint sensor 34, avoid
The shaking of optical fingerprint sensor 24 and capacitive fingerprint sensor 34.
Specifically, the optical fingerprint sensor 24 and capacitive fingerprint sensor 34 that have optical cement 30 are being fitted into cover board
When 10 lower surface, the quality of optical cement 30 belongs to semi-cured state than relatively soft, causes to be bonded by optical cement 30 in this way
Optical fingerprint sensor 24 and capacitive fingerprint sensor 34 are easy to shake, therefore utilize 60 encapsulating optical fingerprint sensor 24 of sealing
Side, capacitive fingerprint sensor 34 side and the side of optical cement 30 can be by optical fingerprint sensor 24 and capacitive fingerprint
Sensor 34 is fixed.After the completion of fitting, then optical cement 30 is solidified.In addition, sealing 60 can be it is coloured and opaque
, therefore sealing 60 can play interception, prevent ambient light from entering in optical fingerprint sensor 24 and interfering optical finger print
Sensor 24 identifies fingerprint.Sealing 60 includes the glue such as low temperature hot-setting adhesive, moisture-curable glue, is not specifically limited herein.
Referring to Fig. 1, in some embodiments, optical fingerprint sensor 24 includes that optical layer 242 and setting exist
The photosensitive layer 244 of 242 lower surface of optical layer, optical layer 242 are fitted in the lower surface of cover board 10 and are formed with by optical cement 40
Microlens array 2422.
In this way, optical layer 242 can by microlens array 2422 by light-ray condensing into photosensitive layer 244, to increase
The intensity of light, and then electric signal is formed after facilitating the photosensitive element (such as photodiode) in photosensitive layer 244 photosensitive.
It is appreciated that optical layer 242 is mainly used for gathering reflection light in photosensitive layer 244, in certain embodiments
In, optical finger print identification mould group 20 can also omit optical layer 242.It should be noted that photosensitive layer 244 may include photosensitive element
Array, such as the photodiode being arranged in array, in addition, the photosensitive element of light-sensing element array can and microlens array
Lenticule in 2422 corresponds, i.e. the corresponding lenticule of a photosensitive element is not specifically limited herein.Preferably,
The size of microlens array 2422 is greater than the size of photosensitive layer 244, more light can be made to enter photosensitive layer 244 in this way.
In some embodiments, optical layer 242 includes antireflective coating (not shown), and antireflective coating is formed in lenticule battle array
2422 top of column.
In some embodiments, photosensitive layer 244 includes substrate, the light-sensing element array being arranged in substrate and connecting line
Road.Connection line connects light-sensing element array.The settable light shield layer between each photosensitive element and substrate of photosensitive layer 244,
The light that light source 22 emits is emitted to the outside of optical layer 242 and fingerprint recognition component 100 through the gap between multiple light shield layers.
In this way, photosensitive layer 244 will not or basically will not produce corresponding telecommunications when light passes through optical fingerprint sensor 24 for the first time
Number；When reflection light is through optical fingerprint sensor 24, photosensitive layer 222 can detecte light and form the electricity for having finger print information
Signal.
Referring to Fig. 1, in some embodiments, fingerprint recognition component 100 includes printed circuit board 81, and optics refers to
Line sensor 24 and capacitive fingerprint sensor 34 are arranged on printed circuit board 81.
In this way, optical fingerprint sensor 24 and capacitive fingerprint sensor 34 are easily provided on printed circuit board 81, optics
Fingerprint sensor 24 detects respectively with capacitive fingerprint sensor 34 obtain the corresponding electric signal of fingerprint after, can be respectively by electric signal
It is transferred to printed circuit board 81, printed circuit board 81 handles the electric signal and capacitive fingerprint sensing of optical fingerprint sensor 24 respectively
The electric signal of device 34 is to establish the model of fingerprint.
It is appreciated that printed circuit board 81 is hardboard, quality is more strong, and printed circuit board 81 may be regarded as supporter, because
This is easy for optical fingerprint sensor 24 and capacitive fingerprint sensor 34 to be arranged on printed circuit board 81.
In embodiments of the present invention, capacitive fingerprint identification mould group 30 and optical finger print identify 20 common printed circuit of mould group
Plate 81.It is appreciated that in other embodiments, capacitive fingerprint identification mould group 30 and optical finger print identification mould group 20 can be distinguished
Corresponding two separated printed circuit boards 81, are not specifically limited herein.
Referring to Fig. 1, in some embodiments, fingerprint recognition component includes connecting line 50, optical finger print sensing
Device 24 and capacitive fingerprint sensor 34 are connected by connecting line 50 and printed circuit board 81, and fingerprint recognition component 100 includes envelope
Glue 60, sealing 60 encapsulate connecting line 50, printed circuit board 81 and the junction of connecting line 50, optical fingerprint sensor 24 and connect
The junction of line 50, the junction of capacitive fingerprint sensor 34 and connecting line 50, the side of optical fingerprint sensor 24 and capacitor
The side of fingerprint sensor 34.
In this way, optical fingerprint sensor 24 and capacitive fingerprint sensor 34 can pass through connecting line 50 and printed circuit board
81 are attached, thus facilitate optical fingerprint sensor 24 and capacitive fingerprint sensor 34 will test the electric signal transmission of acquisition to
Printed circuit board 81.In addition, can be encapsulated connecting line 50 and junction using sealing 60, connecting line 50 and connection are avoided
Place is easily damaged.
Connecting line 50 can engage (wire bonding) technique connection sensor and printed circuit board 81 by routing.
In some embodiments, fingerprint recognition component 100 includes flexible circuit board 83, and one end of flexible circuit board 83 is set
It sets in the lower section of printed circuit board 81, the other end of flexible circuit board 83 is provided with connector 84.
Part circuit structure (such as connector 84) is arranged on flexible circuit board 83 in this way, can use, to avoid
Printed circuit board 81 is oversized.In addition, using the flexible nature of flexible circuit board 83, flexible circuit board 83 can be bent with
It is arranged in a lesser space or is adjusted to flexible circuit board 83 position for being suitble to connect with outer member.
Specifically, it if all circuit structures of fingerprint recognition component 100 are all disposed on printed circuit board 81, is easy to lead
The oversized of printed circuit board 81 is caused, so that the size of fingerprint recognition component 100 increases, therefore can be in printed circuit
Flexible circuit board 83 is arranged in the lower section of plate 81, and part circuit structure (such as connector 84) is arranged on flexible circuit board 83.
Flexible circuit board 83 can be attached by connector 84 and outer member (mainboard of such as electronic device).At certain
In a little embodiments, connector 84 includes the component that solder joint, conducting wire, plug, socket etc. play connection function, does not do specific limit herein
It is fixed.
In some embodiments, printed circuit board 81 includes solder joint 82, and printed circuit board 81 passes through solder joint 82 and flexibility
Circuit board 83 connects.Printed circuit board 81 and flexible circuit board 83 can be in communication with each other, so that printed circuit board 81 can will obtain
The electric signal of the optical fingerprint sensor 24 obtained and the electric signal transmission of capacitive fingerprint sensor 34 are to flexible circuit board 83.
In some embodiments, processor (not shown) is provided on flexible circuit board 83, processor can be used for locating
Manage the electric signal of optical fingerprint sensor 24 and the electric signal of capacitive fingerprint sensor 34.
Specifically, processor and interlock circuit structure has can be set in flexible circuit board 83, and processor processing includes fingerprint
The electric signal of information is to establish the model of fingerprint.
In some embodiments, fingerprint recognition component 100 includes stiffening plate 85, and stiffening plate 85 is arranged in flexible circuit board
The lower surface of 83 one end.
In this way, stiffening plate 85 can be used for enhancing the intensity of flexible circuit board 83.
It is appreciated that cause 83 stress of flexible circuit board to be easy to produce crack due to the flexible nature of flexible circuit board 83,
It is difficult to connect printed circuit board 81 and flexible circuit board 83 or the installation elements on flexible circuit board 83, therefore can will mend
The lower surface of one end of flexible circuit board 83 is arranged in strong plate 85 so that in conjunction with stiffening plate 85 flexible circuit board 83 it is strong
Degree enough, and then facilitates connection printed circuit board 81 and flexible circuit board 83 or carries out installation elements on flexible circuit board 83
Deng operation.
In some embodiments, the lower surface of one end of flexible circuit board 83 is arranged in stiffening plate 85, such as setting exists
The lower surface of one end that flexible circuit board 83 is connect with printed circuit board 81, in this way, flexible circuit board 83 and print both may be implemented
The connection of printed circuit board 81, but can make the flexible circuit board 83 of other parts flexibility still with higher in order to change by
83 bending of flexible circuit board.
Stiffening plate 85 is, for example, stainless steel plate.
It is appreciated that the electronic device of embodiment of the present invention includes the fingerprint recognition component of any of the above-described embodiment
100。
In the present invention unless specifically defined or limited otherwise, fisrt feature second feature "upper" or "lower"
It may include that the first and second features directly contact, also may include that the first and second features are not direct contacts but pass through it
Between other characterisation contact.Moreover, fisrt feature includes the first spy above the second feature " above ", " above " and " above "
Sign is right above second feature and oblique upper, or is merely representative of first feature horizontal height higher than second feature.Fisrt feature exists
Second feature " under ", " lower section " and " following " include that fisrt feature is directly below and diagonally below the second feature, or is merely representative of
First feature horizontal height is less than second feature.
Following disclosure provides many different embodiments or example is used to realize different structure of the invention.In order to
Simplify disclosure of the invention, hereinafter the component of specific examples and setting are described.Certainly, they are merely examples, and
And it is not intended to limit the present invention.In addition, the present invention can in different examples repeat reference numerals and/or reference letter,
This repetition is for purposes of simplicity and clarity, itself not indicate between discussed various embodiments and/or setting
Relationship.In addition, the present invention provides various specific techniques and material example, but those of ordinary skill in the art can be with
Recognize the application of other techniques and/or the use of other materials.
In the description of this specification, reference term " embodiment ", " some embodiments ", " schematically implementation
The description of mode ", " example ", " specific example " or " some examples " etc. means embodiment or example is combined to describe specific
Feature, structure, material or feature are contained at least one embodiment or example of the invention.In the present specification, right
The schematic representation of above-mentioned term is not necessarily referring to identical embodiment or example.Moreover, the specific features of description, knot
Structure, material or feature can be combined in any suitable manner in any one or more embodiments or example.
While embodiments of the present invention have been illustrated and described, it will be understood by those skilled in the art that:
These embodiments can be carried out with a variety of variations, modification, replacement in the case where not departing from the principle of the present invention and objective and become
Type, the scope of the present invention are defined by the claims and their equivalents.
Claims (11)
1. a kind of fingerprint recognition component characterized by comprising
Optical finger print identifies mould group, and the optical finger print identification mould group includes optical fingerprint sensor；With
Capacitive fingerprint identifies mould group, and the capacitive fingerprint identification mould group includes capacitive fingerprint sensor, the optical finger print sensing
Device and the setting of capacitive fingerprint sensor same layer interval, between the optical fingerprint sensor and the capacitive fingerprint sensor
Position formed S type spacer portion.
2. fingerprint recognition component as described in claim 1, which is characterized in that the spacer portion is filled with insulating materials.
3. fingerprint recognition component as described in claim 1, which is characterized in that optical finger print identification mould group include light source and
The lower section of the optical fingerprint sensor is arranged in light guide, the light guide, and the side of the light guide is arranged in the light source
Face.
4. fingerprint recognition component as described in claim 1, which is characterized in that the fingerprint recognition component includes cover board, described
Optical fingerprint sensor and the capacitive fingerprint sensor pass through the lower surface that optical cement is fitted in the cover board.
5. fingerprint recognition component as claimed in claim 4, which is characterized in that the fingerprint recognition component includes sealing, described
Sealing encapsulates the side of the side of the optical fingerprint sensor, the side of the capacitive fingerprint sensor and the optical cement.
6. fingerprint recognition component as claimed in claim 4, which is characterized in that the optical fingerprint sensor include optical layer and
The photosensitive layer of the optical layer lower surface is set, and the optical layer is fitted in the lower surface of the cover board by the optical cement
And it is formed with microlens array.
7. fingerprint recognition component as described in claim 1, which is characterized in that the fingerprint recognition component includes printed circuit
Plate, the optical fingerprint sensor and the capacitive fingerprint sensor are respectively provided on the printed circuit board.
8. fingerprint recognition component as claimed in claim 7, which is characterized in that the fingerprint recognition component includes connecting line, institute
It states optical fingerprint sensor and passes through the connecting line with the capacitive fingerprint sensor and connected with the printed circuit board, it is described
Fingerprint recognition component includes sealing, and the sealing encapsulates the connection of the connecting line, the printed circuit board and the connecting line
Place, the optical fingerprint sensor and the junction of the connecting line, the company of the capacitive fingerprint sensor and the connecting line
Connect the side at place, the side of the optical fingerprint sensor and the capacitive fingerprint sensor.
9. fingerprint recognition component as claimed in claim 7, which is characterized in that the fingerprint recognition component includes flexible circuit
The lower section of the printed circuit board, the other end setting of the flexible circuit board is arranged in plate, one end of the flexible circuit board
There is connector.
10. fingerprint recognition component as claimed in claim 9, which is characterized in that the fingerprint recognition component includes stiffening plate, institute
State the lower surface that one end of the flexible circuit board is arranged in stiffening plate.
11. a kind of electronic device, which is characterized in that including fingerprint recognition component described in claim 1-10 any one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710850408.1A CN109508604A (en) | 2017-09-15 | 2017-09-15 | Fingerprint recognition component and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710850408.1A CN109508604A (en) | 2017-09-15 | 2017-09-15 | Fingerprint recognition component and electronic device |
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| CN109508604A true CN109508604A (en) | 2019-03-22 |
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| CN201710850408.1A Withdrawn CN109508604A (en) | 2017-09-15 | 2017-09-15 | Fingerprint recognition component and electronic device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110322809A (en) * | 2019-07-31 | 2019-10-11 | Oppo广东移动通信有限公司 | Electronic equipment |
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2017
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110322809A (en) * | 2019-07-31 | 2019-10-11 | Oppo广东移动通信有限公司 | Electronic equipment |
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Address after: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Applicant after: Jiangxi OMS Microelectronics Co.,Ltd. Address before: 330013 No.698 Tianxiang Avenue, high tech Zone, Nanchang City, Jiangxi Province Applicant before: OFilm Microelectronics Technology Co.,Ltd. Address after: 330013 No.698 Tianxiang Avenue, high tech Zone, Nanchang City, Jiangxi Province Applicant after: OFilm Microelectronics Technology Co.,Ltd. Address before: 330013 No.698 Tianxiang Avenue, high tech Zone, Nanchang City, Jiangxi Province Applicant before: NANCHANG OFILM BIO-IDENTIFICATION TECHNOLOGY Co.,Ltd. |
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| WW01 | Invention patent application withdrawn after publication | ||
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Application publication date: 20190322 |