CN109508596A - Optical finger print recognizer component and electronic device - Google Patents
Optical finger print recognizer component and electronic device Download PDFInfo
- Publication number
- CN109508596A CN109508596A CN201710845661.8A CN201710845661A CN109508596A CN 109508596 A CN109508596 A CN 109508596A CN 201710845661 A CN201710845661 A CN 201710845661A CN 109508596 A CN109508596 A CN 109508596A
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- China
- Prior art keywords
- optical
- finger print
- circuit board
- fingerprint sensor
- optical finger
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1324—Sensors therefor by using geometrical optics, e.g. using prisms
Abstract
The invention discloses a kind of optical finger print recognizer components.The optical finger print recognizer component includes cover board, optical finger print identification mould group and reflectance coating.Cover board includes acquisition zone.Optical finger print identifies that mould group includes optical fingerprint sensor and light source, and the lower section of acquisition zone is arranged in optical fingerprint sensor, and the lower section of cover board is arranged in light source.The side of acquisition zone is arranged in reflectance coating.In addition, the invention also discloses a kind of electronic devices.The side of acquisition zone is arranged in reflectance coating by optical finger print recognizer component and electronic device of the invention, the light leakage of light source transmitting can be reduced or avoided to extraneous, and increase the light being incident to above acquisition zone, the intensity of reflected light for detecting optical fingerprint sensor is larger, and then improves the accuracy and sensitivity of fingerprint recognition.
Description
Technical field
The present invention relates to biological identification technology, in particular to a kind of optical finger print recognizer component and electronic device.
Background technique
In the related art, optical finger print identification mould group realizes that fingerprint is known with optical fingerprint sensor and light source
Not, but the light of light source is easy to be leaked to the external world, and the intensity of reflected light detected so as to cause optical fingerprint sensor is insufficient,
And then influence the accuracy and sensitivity of fingerprint recognition.
Summary of the invention
Embodiments of the present invention provide a kind of optical finger print recognizer component and electronic device.
A kind of optical finger print recognizer component of embodiments of the present invention, comprising:
Cover board, the cover board include acquisition zone；
Optical finger print identifies mould group, and the optical finger print identification mould group includes optical fingerprint sensor and light source, the light
The lower section that the acquisition zone is arranged in fingerprint sensor is learned, the lower section of the cover board is arranged in the light source；With
The side of the acquisition zone is arranged in reflectance coating, the reflectance coating.
The side of acquisition zone is arranged in reflectance coating by the optical finger print recognizer component of embodiment of the present invention, it is possible to reduce or
The light leakage for avoiding light source from emitting increases the light being incident to above acquisition zone to the external world, examines optical fingerprint sensor
The intensity of reflected light measured is larger, and then improves the accuracy and sensitivity of fingerprint recognition.
In some embodiments, the optical fingerprint sensor includes photosensitive layer and the light that is arranged on the photosensitive layer
Layer is learned, the optical layer is formed in the lower surface of the acquisition zone or between the acquisition zone and the photosensitive layer, described
Optical layer is formed with microlens array or mesh-structured.
In this way, optical layer can by microlens array or it is mesh-structured by light-ray condensing into photosensitive layer, to increase
Luminous intensity, and then electric signal is formed after facilitating the photosensitive element (such as photodiode) in photosensitive layer photosensitive.
In some embodiments, the light source is display screen, and the display screen is fitted in the lower surface of the cover board, institute
State lower surface lower surface corresponding with the acquisition zone position that optical fingerprint sensor is fitted in the display screen.
In this way, can use light source of the display screen as optical finger print identification mould group, so that the light of light source transmitting is more
Uniformly, be conducive to improve the accuracy of fingerprint recognition.
In some embodiments, the optical finger print recognizer component includes display screen, and the display screen is fitted in described
The lower surface of cover board, the optical fingerprint sensor be fitted in the lower surface of the acquisition zone and with the display screen interval.
In this way, facilitating the thickness that optical finger print recognizer component is thinned, optical finger print recognizer component is made to be easier to be integrated in
In electronic device, the demand of electronic device thin design can satisfy.
In some embodiments, the light source is display screen, and the display screen is fitted in the lower surface of the cover board, institute
The upper surface for stating display screen offers mounting groove, and the optical fingerprint sensor is fitted in the lower surface of the acquisition zone and is located at
In the mounting groove.
In this way, facilitating the thickness that optical finger print recognizer component is thinned, optical finger print recognizer component is made to be easier to be integrated in
In electronic device, the demand of electronic device thin design can satisfy.
In some embodiments, the optical finger print identification mould group includes circuit board assemblies, and the circuit board assemblies connect
Connect the optical fingerprint sensor.
In this way, the finger print information that optical fingerprint sensor is got can be handled by circuit board assemblies, stored, be passed
Defeated equal operation.
In some embodiments, the optical finger print identification mould group includes control unit, and the circuit board assemblies include
First circuit board and second circuit board, the first circuit board connect the optical fingerprint sensor and the second circuit board,
Described control unit setting is in the first circuit board, and described control unit is for reading and storing the optical fingerprint sensor
The electric signal of output, described control unit are passed by the electric signal that the second circuit board exports the optical fingerprint sensor
Transport to external circuit.
In this way, control unit can read and store the electric signal with finger print information of optical fingerprint sensor output,
Pass through second circuit board again for the electric signal transmission with finger print information to external circuit, so that external circuit can obtain fingerprint
Information simultaneously carries out fingerprint recognition.
In some embodiments, the circuit board assemblies include the first connector and the second connector, and described first connects
Connect device and connect the optical fingerprint sensor and the first circuit board, second connector connect the first circuit board and
The second circuit board.
In this way, optical fingerprint sensor can realize the connection with first circuit board, the first circuit by the first connector
Plate can realize the connection with second circuit board by the second connector.
In some embodiments, the first circuit board is printed circuit board, and the second circuit board is flexible circuit
Plate.
In this way, optical fingerprint sensor can be relatively easily arranged on a printed circuit, and utilize flexible circuit
Flexible circuit plate benging can be arranged in a lesser space or be adjusted to flexible circuit board by the flexible nature of plate
It is suitble to the position connecting with external circuit.
A kind of electronic device of embodiments of the present invention, the optical finger print identification group including any of the above-described embodiment
Part.
The side of acquisition zone is arranged in reflectance coating by above-mentioned electronic device, it is possible to reduce or the light for avoiding light source from emitting
Be leaked to the external world, and increase the light being incident to above acquisition zone, the intensity of reflected light for detecting optical fingerprint sensor compared with
Greatly, so improve fingerprint recognition accuracy and sensitivity.
Additional aspect and advantage of the invention will be set forth in part in the description, and will partially become from the following description
Obviously, or practice through the invention is recognized.
Detailed description of the invention
Above-mentioned and/or additional aspect and advantage of the invention is from combining in description of the following accompanying drawings to embodiment by change
It obtains obviously and is readily appreciated that, in which:
Fig. 1 is the structural schematic diagram of the optical finger print recognizer component of embodiment of the present invention；
Fig. 2 is another structural schematic diagram of the optical finger print recognizer component of embodiment of the present invention；
Fig. 3 is another structural schematic diagram of the optical finger print recognizer component of embodiment of the present invention；
Fig. 4 is another structural schematic diagram of the optical finger print recognizer component of embodiment of the present invention；
Fig. 5 is another structural schematic diagram of the optical finger print recognizer component of embodiment of the present invention；
Fig. 6 is another structural schematic diagram of the optical finger print recognizer component of embodiment of the present invention；
Fig. 7 is another structural schematic diagram of the optical finger print recognizer component of embodiment of the present invention.
Main element symbol description:
Optical finger print recognizer component 100, cover board 10, acquisition zone 12, optical finger print identify mould group 20, optical fingerprint sensor
22, photosensitive layer 222, optical layer 224, light source 24, display screen 242, mounting groove 2422, prism 26, the 28, first electricity of circuit board assemblies
Road plate 282, second circuit board 284, the first connector 286, the second connector 288, control unit 29, reflectance coating 30.
Specific embodiment
Embodiments of the present invention are described below in detail, the example of the embodiment is shown in the accompanying drawings, wherein from beginning
Same or similar element or element with the same or similar functions are indicated to same or similar label eventually.Below by ginseng
The embodiment for examining attached drawing description is exemplary, and for explaining only the invention, and is not considered as limiting the invention.
In the description of the present invention, it is to be understood that, term " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside", " up time
The orientation or positional relationship of the instructions such as needle ", " counterclockwise " is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of
The description present invention and simplified description, rather than the device or element of indication or suggestion meaning must have a particular orientation, with spy
Fixed orientation construction and operation, therefore be not considered as limiting the invention.In addition, term " first ", " second " are only used for
Purpose is described, relative importance is not understood to indicate or imply or implicitly indicates the quantity of indicated technical characteristic.
" first " is defined as a result, the feature of " second " can explicitly or implicitly include one or more feature.?
In description of the invention, the meaning of " plurality " is two or more, unless otherwise specifically defined.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected.It can
To be mechanical connection, it is also possible to be electrically connected.It can be directly connected, can also can be indirectly connected through an intermediary
The interaction relationship of connection or two elements inside two elements.It for the ordinary skill in the art, can be with
The concrete meaning of above-mentioned term in the present invention is understood as the case may be.
Fig. 1-7 is please referred to, the optical finger print recognizer component 100 of embodiments of the present invention includes cover board 10, optical finger print
Identify mould group 20 and reflectance coating 30.Cover board 10 includes acquisition zone 12.Optical finger print identifies that mould group 20 includes optical fingerprint sensor
22 and light source 24, optical fingerprint sensor 22 lower section of acquisition zone 12 is set, the lower section of cover board 10 is arranged in light source 24.Reflection
The side of acquisition zone 12 is arranged in film 30.
The optical finger print recognizer component 100 of embodiment of the present invention can be applied to the electronics dress of embodiment of the present invention
It sets, in other words, the electronic device of embodiment of the present invention includes the optical finger print recognizer component 100 of embodiment of the present invention.
Reflectance coating 30 is arranged in acquisition zone 12 the optical finger print recognizer component 100 and electronic device of embodiment of the present invention
Side, it is possible to reduce or the light leakage for avoiding light source 24 from emitting is to the external world, and increases the light being incident to above acquisition zone 12
Line, the intensity of reflected light for detecting optical fingerprint sensor 22 is larger, and then improves the accuracy and sensitivity of fingerprint recognition.
In some embodiments, acquisition zone 12 refers to the region corresponding with optical fingerprint sensor 22 of cover board 10, the area
Domain is used to place finger for user.Reflectance coating 30 can be metallic reflective coating, be also possible to dielectric reflectance coating, can also be gold
Belong to dielectric reflectance coating.It is not specifically limited herein.
In some embodiments, the side of acquisition zone 12 is arranged in reflectance coating 30, it can be understood as, the shape of acquisition zone 12
Shape is cuboid, and wherein the upper surface of acquisition zone 12 can be used for user's placement finger, and the lower surface of acquisition zone 12 may be regarded as putting
The position of optical finger print identification mould group 20 is set, reflectance coating 30 can be set any in addition to upper and lower surfaces in acquisition zone 12
On one or more sides.When reflectance coating 30 is arranged, the direction of light can be emitted according to the position of light source 24, light source 24
The setting position of reflectance coating 30 is determined with the position of optical fingerprint sensor 22.Wherein, reflectance coating 30 can be by cover board 10
It is upper to slot to be formed in the side of acquisition zone 12, it is also possible to be set up directly on the side of cover board 10.
In one example, cmos sensor can be used in optical fingerprint sensor 22.
Referring to Fig. 1, in one embodiment, the side of light source 24 and cover board 10 is arranged in optical fingerprint sensor 22
Between side, the side of cover board 10 may be regarded as the side of acquisition zone 12, therefore, reflectance coating 30 can be arranged in the side of cover board 10
Side, without slotting on cover board 10.
Referring to Fig. 2, in one embodiment, light source 24 be arranged in optical fingerprint sensor 22 and cover board 10 side it
Between, therefore, it can slot on cover board 10 so that reflectance coating 30 to be arranged in the side of acquisition zone 12.
Referring to Fig. 3, in one embodiment, optical fingerprint sensor 22 is close to the side of cover board 10, and light source 24
The lower section of the optical fingerprint sensor 22 is set, therefore, can be slotted on cover board 10 to adopt the setting of reflectance coating 30
Collect the side in area 12, and reflectance coating 30 can be arranged in the side of cover board 10, is also equivalent to that acquisition zone 12 is arranged in
Side.
In some embodiments, light source 24 is point source of light.Point source of light is, for example, LED light source.
In some embodiments, electronic device includes mobile phone, tablet computer, access control system etc..In embodiment party of the present invention
In formula, electronic device is mobile phone.
In some embodiments, electronic device includes shell (not shown), and cover board 10 connect to form receiving sky with shell
Between, accommodating space be used for accommodate and protect optical finger print identification mould group 20 and electronic device other elements (such as mainboard, battery,
Loudspeaker, camera etc.).It can protect all elements in accommodating space not by outer using the water proof and dust proof ability of accommodating space
Boundary's interference, so that all elements can work normally.In one embodiment, cover board 10 can be cover-plate glass.
Referring to Fig. 1-3, in some embodiments, optical fingerprint sensor 22 includes photosensitive layer 222 and setting
Optical layer 224 on photosensitive layer 222, between acquisition zone 12 and photosensitive layer 222, optical layer 224 is formed with optical layer 224
Microlens array is mesh-structured.
In this way, optical layer 224 can by microlens array or it is mesh-structured by light-ray condensing into photosensitive layer 222, from
And increase the intensity of light, and then form electric signal after facilitating the photosensitive element (such as photodiode) in photosensitive layer 222 photosensitive.
Specifically, optical layer 224 is formed with microlens array or mesh-structured, it can be understood as, optical layer 224 can be with shape
It could be formed with microlens array at thering is microlens array or optical layer 224 to could be formed with mesh-structured or optical layer 224
With it is mesh-structured.
It is appreciated that optical layer 224 is mainly used for gathering reflected light in photosensitive layer 222, in some embodiments,
Optical finger print identification mould group 20 can also omit optical layer 224.It should be noted that photosensitive layer 222 may include photosensitive element battle array
Column, such as the photodiode being arranged in array, in addition, the photosensitive element of light-sensing element array can in microlens array
Lenticule or mesh-structured aperture correspond, i.e. the corresponding lenticule of a photosensitive element or a corresponding aperture,
It is not specifically limited herein.
In some embodiments, microlens array can be between acquisition zone 12 and photosensitive layer 222, for example, by using one
Block glass substrate, by being handled glass substrate to form microlens array, then the glass base that microlens array will be formed
Plate is arranged between acquisition zone 12 and photosensitive layer 22.
In some embodiments, mesh-structured to be formed between acquisition zone 12 and photosensitive layer 222, for example, by using one
Block glass substrate by being handled glass substrate to form multiple apertures, then the glass substrate for forming multiple apertures is set
It sets between acquisition zone 12 and photosensitive layer 22, light is projected into photosensitive layer 222 using pinhole imaging system principle.Aperture can be blind
Hole or through-hole, blind hole run through the upper surface or lower surface of glass substrate, and through-hole runs through the upper and lower surfaces of glass substrate.
Referring to Fig. 4, in some embodiments, optical fingerprint sensor 22 includes photosensitive layer 222 and is arranged in light sensation
Optical layer 224 on layer 222, optical layer 224 are formed in the lower surface of acquisition zone 12, and optical layer 224 is formed with microlens array
Or it is mesh-structured.
In this way, optical layer 224 can by microlens array or it is mesh-structured by light-ray condensing into photosensitive layer 222, from
And increase the intensity of light, and then form electric signal after facilitating the photosensitive element (such as photodiode) in photosensitive layer 222 photosensitive.
It is appreciated that optical layer 224 is mainly used for gathering reflected light in photosensitive layer 222, in some embodiments,
Optical finger print identification mould group 20 can also omit optical layer 224.It should be noted that photosensitive layer 222 may include photosensitive element battle array
Column, such as the photodiode being arranged in array, in addition, the photosensitive element of light-sensing element array can in microlens array
Lenticule or mesh-structured aperture correspond, i.e. the corresponding lenticule of a photosensitive element or a corresponding aperture,
It is not specifically limited herein.
In some embodiments, the processing such as sandblasting can be carried out by the lower surface to acquisition zone 12, thus lenticule battle array
Column are formed in the lower surface of acquisition zone 12.
It is specifically, mesh-structured to be formed in acquisition zone 12 referring to Fig. 4, that is, pass through the shape on acquisition zone 12
At multiple apertures, light is projected into photosensitive layer 222 using pinhole imaging system principle.Aperture can be blind hole or through-hole, and blind hole is passed through
The upper surface or lower surface of acquisition zone 12 are worn, through-hole runs through the upper and lower surfaces of acquisition zone 12.In one embodiment,
Aperture is blind hole, and blind hole runs through the lower surface of acquisition zone 12.
It should be noted that optical layer 224 is formed in the thickness that optical fingerprint sensor 22 can be thinned in acquisition zone 12,
I other words the thickness of optical finger print recognizer component 100 can be thinned.
Referring to Fig. 1-3, in some embodiments, optical finger print identification mould group 20 includes being located under cover board 10
The prism 26 of side, the light that prism 26 is configured to the sending of secondary light source 24 propagate to the top of acquisition zone 12.
In this way, prism 26 can assemble the light of the sending of light source 24, then light is transmitted to the top of acquisition zone 12, thus
Increase the intensity for the reflected light that optical fingerprint sensor 22 detects, and then improves the accuracy and sensitivity of fingerprint recognition.
In some embodiments, optical finger print identification mould group 20 can also omit prism 26, and the light that light source 24 issues can
It is transmitted to the top of acquisition zone 12.
Specifically, in fig. 1 and 2, light source 24 is configured to emit the top of light to acquisition zone 12, and optical finger print passes
Sensor 22 is configured to receive the light emitted by the light source 24 of the top reflection of acquisition zone 12.That is, light source 24 emits
Light the top of acquisition zone 12 can be emitted to without optical fingerprint sensor 22 after prism 26.
In Fig. 3, light source 24 is configured to emit light to optical fingerprint sensor 22, and optical fingerprint sensor 22 is matched
It is set to the top that the light that light source 24 emits is transmitted to acquisition zone 12, and receives the light source 24 reflected by the top of acquisition zone 12
The light of transmitting.The light that light source 24 emits can be incident to optical fingerprint sensor 22 after prism 26.
In this way, the light that light source 24 emits reaches acquisition zone 12 after passing through from optical fingerprint sensor 22, then from acquisition zone
12 are emitted to the top of the outside of optical finger print recognizer component 100 or acquisition zone 12.When user's finger is touched in acquisition zone 12
When upper surface, the light that finger print reflection is emitted from 12 side of acquisition zone forms reflection light, and reflection light is transmitted to optics and refers to
Line sensor 22, so that optical fingerprint sensor 22 can acquire the fingerprint letter of user according to the light intensity of the light detected
Breath.
It should be noted that when light passes through optical fingerprint sensor 22 for the first time, (light that light source 24 emits is from light
Fingerprint sensor 22 is learned to pass through), light, which has not arrived, at this time touches user's finger, does not have finger print information, therefore this time
Optical finger print at this time can be removed by algorithm and sense without saving by learning the electric signal that the detection light of fingerprint sensor 22 obtains
The electric signal that device 22 transmits, such as by judge whether optical fingerprint sensor 22 obtains within the predetermined time after light source 24 is luminous
Electric signal is obtained, if so, judging that light passes through optical fingerprint sensor 22 for the first time；Pass through if it is not, then judging second of light
Optical fingerprint sensor 22.When light passes through optical fingerprint sensor 22 for the second time (optical finger print is returned from 10 lateral reflection of cover board
Sensor 22), light has finger print information at this time, therefore can retain optical fingerprint sensor 22 at this time and detect what light obtained
Electric signal is with the model for subsequent processing acquisition user fingerprints.
It is of course also possible to which the collected electric signal of optical fingerprint sensor 22 is carried out subtraction when subsequent processing electric signal
Processing removes the electric signal when light that light source 24 emits passes through optical fingerprint sensor 22 and retains the electricity with finger print information
Signal.
In some embodiments, photosensitive layer 222 includes substrate, the light-sensing element array being arranged in substrate and connecting line
Road.Light-sensing element array, such as the photodiode being arranged in array.Connection line connects light-sensing element array.It can be in substrate
Light shield layer is set between each photodiode, that is, forms light shield layer array corresponding with light-sensing element array, light source 24 is sent out
The light penetrated can be passed through from the gap between light shield layer array.In this way, passing through optical fingerprint sensor 22 for the first time in light
When, photosensitive layer 222 will not or basically will not produce corresponding electric signal；It is received in reflection light through optical fingerprint sensor 22
When, photosensitive layer 222 can detecte light and form the electric signal for having finger print information.
In some instances, substrate can be semiconductor base.Photosensitive element and connection line can pass through photoetching process shape
At in substrate.Light-sensing element array forms induction zone (area active area, AA), other regions form non-inductive in substrate
Area (the non-area AA), non-inductive area is provided with connection line.
Referring to Fig. 5, in some embodiments, light source is display screen 242, display screen 242 is fitted under cover board 10
Surface, optical fingerprint sensor 22 are fitted in lower surface lower surface corresponding with acquisition zone 12 position of display screen 242.
In this way, can use light source of the display screen 242 as optical finger print identification mould group 20, so that the light of light source transmitting
More uniformly, be conducive to improve the accuracy of fingerprint recognition.
Specifically, display screen 242 includes upper substrate, lower substrate and the light-emitting component between upper substrate and lower substrate
(for self light emitting display panel, light-emitting component is, for example, Organic Light Emitting Diode (OLED) or luminescence of plasma element) and/or
Switching device (for liquid crystal display, switching device is, for example, transistor), upper substrate, lower substrate can be used glass and be made.
It should be noted that optical fingerprint sensor 22 is fitted in the lower surface of display screen 242, so that display screen 242 is sent out
After the light penetrated is transmitted to the top of acquisition zone 12, returns to and pass through display screen 242 to be examined by optical fingerprint sensor 22
It measures.In this way, using display screen 242 as the light source of optical finger print identification mould group 20, additional light source that no setting is required can reduce electricity
The component of sub-device facilitates the volume for reducing electronic device, to keep electronic device lightening.
In some embodiments, display screen 242 can be touch display screen.
Referring to Fig. 6, in some embodiments, optical finger print recognizer component 100 includes display screen 242, display screen 242
It is fitted in the lower surface of cover board 10, optical fingerprint sensor 22 is fitted in the lower surface of acquisition zone 12 and is spaced with display screen 242.
In this way, facilitating the thickness that optical finger print recognizer component 100 is thinned, it is easier optical finger print recognizer component 100
It integrates in an electronic, can satisfy the demand of electronic device thin design.
Specifically, display screen 242 is fitted in the lower surface of cover board 10, optical fingerprint sensor 22 is fitted in acquisition zone 12
Lower surface and be spaced with display screen 242, display screen 242 and 22 same layer interval of optical fingerprint sensor can be made to be arranged, from
And the thickness of optical finger print recognizer component 100 is thinned.In addition, in such an embodiment, optical finger print identifies the light of mould group
Source can be the light source 24 of any embodiment in embodiment corresponding to above-mentioned Fig. 1-4.
Referring to Fig. 7, in some embodiments, light source is display screen 242, display screen 242 is fitted under cover board 10
Surface, the upper surface of display screen 242 offer mounting groove 2422, and optical fingerprint sensor 22 is fitted in the lower surface of acquisition zone 12
And it is located in mounting groove 2422.
In this way, this facilitates the thickness of thinned optical finger print recognizer component 100, hold that optical finger print recognizer component 100 more
It is easy of integration in an electronic, can satisfy the demand of electronic device thin design.
It is appreciated that optical fingerprint sensor 22 is arranged in mounting groove 142, the lower surface position of optical fingerprint sensor 22
In on the bottom surface of mounting groove 142, display screen 242 can be active light emitting display 242 (such as OLED or AMOLED), display screen
242, which can be used as area source, emits light to the acquisition zone 12 of 22 top of optical fingerprint sensor, so that finger is placed on acquisition zone
When 12 top carries out fingerprint recognition, optical fingerprint sensor 22 can receive enough light to form finger print information.Such as
This, using display screen 242 as the light source of optical finger print identification mould group 20, additional light source that no setting is required can reduce electronic device
Component, facilitate reduce electronic device volume, to keep electronic device lightening.
Preferably, the upper surface of optical fingerprint sensor 22 and the upper surface of display screen 242 are substantially flush.In this way, optics
Fingerprint sensor 22 not will lead to the thickness for increasing optical finger print recognizer component 100, further make electronic device lightening.
Referring to Fig. 1-7, in some embodiments, optical finger print identifies that mould group 20 includes circuit board assemblies 28,
Circuit board assemblies 28 connect optical fingerprint sensor 22.
In this way, the finger print information that optical fingerprint sensor 22 is got can be handled by circuit board assemblies 28, be deposited
The operations such as storage, transmission.
In some embodiments, optical finger print identification mould group 20 includes control unit 29, and circuit board assemblies 28 include the
One circuit board 282 and second circuit board 284, first circuit board 282 connect optical fingerprint sensor 22 and second circuit board 284,
For the setting of control unit 29 in first circuit board 282, control unit 29 is used to read and store the output of optical fingerprint sensor 22
Electric signal, the electric signal transmission that control unit 29 is exported optical fingerprint sensor 22 by second circuit board 284 to external electrical
Road.
In this way, control unit 29 can read and store the telecommunications with finger print information of the output of optical fingerprint sensor 22
Number, then pass through second circuit board 284 for the electric signal transmission with finger print information to external circuit, so that external circuit can obtain
It obtains finger print information and carries out fingerprint recognition.
Specifically, optical fingerprint sensor 22, can be by electric signal when detection obtains the electric signal for having finger print information
It is transferred to first circuit board 282, the control unit 29 on first circuit board 282 can handle the output of optical fingerprint sensor 22
Electric signal is to establish the model of fingerprint.
Wherein, first circuit board 282 and second circuit board 284, which is arranged, part circuit structure can be arranged in the first circuit
On plate 282, another part circuit structure is arranged on second circuit board 284, thus when avoiding that a circuit board is only arranged
Optical finger print identifies the oversized of mould group 20.
In the example of Fig. 1, Fig. 2, Fig. 3, Fig. 4, Fig. 5 and Fig. 6, circuit board assemblies 28 are connected under optical fingerprint sensor 22
Surface, more specifically, circuit board assemblies 28 connect the lower surface of photosensitive layer 222.In the example in figure 7, circuit board assemblies 28 connect
The upper surface of optical fingerprint sensor 22 is connect, more specifically, circuit board assemblies 28 connect the upper surface of photosensitive layer 222.Certainly, electric
Road board group part 28 and the link position of optical fingerprint sensor 22 can be adjusted according to the actual situation, not do specific limit herein
It is fixed.
In some embodiments, circuit board assemblies 28 include the first connector 286 and the second connector 288, and first connects
It connects device 286 and connects optical fingerprint sensor 22 and first circuit board 282, the second connector 288 connects first circuit board 282 and the
Two circuit boards 284.
In this way, optical fingerprint sensor 22 can realize the connection with first circuit board 282 by the first connector 286,
First circuit board 282 can realize the connection with second circuit board 284 by the second connector 288.
Specifically, the first connector 286 and the second connector 288 all can be solder joint, conducting wire, plug, socket etc. play company
The component for connecing effect, is not specifically limited herein.It is appreciated that by the first connector 286 and the second connector 288, optics
It can be electrically connected between fingerprint sensor 22 and first circuit board 282, first circuit board 282 and second circuit board 288
Between can be electrically connected.Meanwhile the component wear on first circuit board 282, second circuit board 284 and circuit board
When, the element accordingly damaged or circuit board can be changed by the first connector 286 and the second connector 288.In this way may be used
No replacement is required, and entire optical finger print identifies mould group 20, so that the maintenance cost of optical finger print identification mould group 20 is lower.
In some embodiments, first circuit board 282 is printed circuit board, and second circuit board 284 is flexible circuit board.
In this way, optical fingerprint sensor 22 can be relatively easily arranged on a printed circuit, and utilize flexible electrical
Flexible circuit plate benging can be arranged in a lesser space or adjust flexible circuit board by the flexible nature of road plate
To the suitable position being connect with external circuit.
Specifically, in order to be arranged optical fingerprint sensor 22 on first circuit board 282, first circuit board 282 can be with
For printed circuit board, printed circuit board is hardboard, and quality is more strong, can relatively easily set optical fingerprint sensor 22
It sets on first circuit board 282.And second circuit board 284 is generally used for and external connection, therefore second circuit board 284 can be
A lesser sky can be arranged in using the flexible nature of flexible circuit board in flexible circuit plate benging by flexible circuit board
In or flexible circuit board is adjusted to be suitble to the position that connect with external circuit.
It is appreciated that the electronic device of embodiment of the present invention includes the optical finger print identification group of any of the above-described embodiment
Part 100.
In the present invention unless specifically defined or limited otherwise, fisrt feature second feature "upper" or "lower"
It may include that the first and second features directly contact, also may include that the first and second features are not direct contacts but pass through it
Between other characterisation contact.Moreover, fisrt feature includes the first spy above the second feature " above ", " above " and " above "
Sign is right above second feature and oblique upper, or is merely representative of first feature horizontal height higher than second feature.Fisrt feature exists
Second feature " under ", " lower section " and " following " include that fisrt feature is directly below and diagonally below the second feature, or is merely representative of
First feature horizontal height is less than second feature.
Following disclosure provides many different embodiments or example is used to realize different structure of the invention.In order to
Simplify disclosure of the invention, hereinafter the component of specific examples and setting are described.Certainly, they are merely examples, and
And it is not intended to limit the present invention.In addition, the present invention can in different examples repeat reference numerals and/or reference letter,
This repetition is for purposes of simplicity and clarity, itself not indicate between discussed various embodiments and/or setting
Relationship.In addition, the present invention provides various specific techniques and material example, but those of ordinary skill in the art can be with
Recognize the application of other techniques and/or the use of other materials.
In the description of this specification, reference term " embodiment ", " some embodiments ", " schematically implementation
The description of mode ", " example ", " specific example " or " some examples " etc. means embodiment or example is combined to describe specific
Feature, structure, material or feature are contained at least one embodiment or example of the invention.In the present specification, right
The schematic representation of above-mentioned term is not necessarily referring to identical embodiment or example.Moreover, the specific features of description, knot
Structure, material or feature can be combined in any suitable manner in any one or more embodiments or example.
While embodiments of the present invention have been illustrated and described, it will be understood by those skilled in the art that:
These embodiments can be carried out with a variety of variations, modification, replacement in the case where not departing from the principle of the present invention and objective and become
Type, the scope of the present invention are defined by the claims and their equivalents.
Claims (10)
1. a kind of optical finger print recognizer component characterized by comprising
Cover board, the cover board include acquisition zone；
Optical finger print identifies mould group, and the optical finger print identification mould group includes optical fingerprint sensor and light source, and the optics refers to
The lower section of the acquisition zone is arranged in line sensor, and the lower section of the cover board is arranged in the light source；With
The side of the acquisition zone is arranged in reflectance coating, the reflectance coating.
2. optical finger print recognizer component as described in claim 1, which is characterized in that the optical fingerprint sensor includes light sensation
Layer and the optical layer being arranged on the photosensitive layer, the optical layer are formed in the lower surface of the acquisition zone or adopt positioned at described
Between Ji Qu and the photosensitive layer, the optical layer is formed with microlens array or mesh-structured.
3. optical finger print recognizer component as described in claim 1, which is characterized in that the light source is display screen, the display
Screen is fitted in the lower surface of the cover board, the optical fingerprint sensor be fitted in the display screen lower surface and the acquisition
The corresponding lower surface position in area.
4. optical finger print recognizer component as described in claim 1, which is characterized in that the optical finger print recognizer component includes aobvious
Display screen, the display screen are fitted in the lower surface of the cover board, and the optical fingerprint sensor is fitted under the acquisition zone
Surface and with the display screen interval.
5. optical finger print recognizer component as described in claim 1, which is characterized in that the light source is display screen, the display
Screen is fitted in the lower surface of the cover board, and the upper surface of the display screen offers mounting groove, the optical fingerprint sensor patch
It closes the lower surface in the acquisition zone and is located in the mounting groove.
6. optical finger print recognizer component as described in claim 1, which is characterized in that the optical finger print identification mould group includes electricity
Road board group part, the circuit board assemblies connect the optical fingerprint sensor.
7. optical finger print recognizer component as claimed in claim 6, which is characterized in that the optical finger print identification mould group includes control
Unit processed, the circuit board assemblies include first circuit board and second circuit board, and the first circuit board connects the optics and refers to
Line sensor and the second circuit board, described control unit setting is in the first circuit board, and described control unit is for reading
The electric signal of the optical fingerprint sensor output is taken and stores, described control unit passes through the second circuit board for the light
The electric signal transmission of fingerprint sensor output is learned to external circuit.
8. optical finger print recognizer component as claimed in claim 7, which is characterized in that the circuit board assemblies include the first connection
Device and the second connector, the first connector connection optical fingerprint sensor and the first circuit board, described second
Connector connects the first circuit board and the second circuit board.
9. optical finger print recognizer component as claimed in claim 7, which is characterized in that the first circuit board is printed circuit
Plate, the second circuit board are flexible circuit board.
10. a kind of electronic device, which is characterized in that including optical finger print recognizer component described in any one of claim 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710845661.8A CN109508596A (en) | 2017-09-15 | 2017-09-15 | Optical finger print recognizer component and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710845661.8A CN109508596A (en) | 2017-09-15 | 2017-09-15 | Optical finger print recognizer component and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109508596A true CN109508596A (en) | 2019-03-22 |
Family
ID=65745274
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710845661.8A Withdrawn CN109508596A (en) | 2017-09-15 | 2017-09-15 | Optical finger print recognizer component and electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109508596A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110596931A (en) * | 2019-09-18 | 2019-12-20 | Oppo广东移动通信有限公司 | Display screen assembly and electronic equipment |
| CN110730968A (en) * | 2019-05-06 | 2020-01-24 | 深圳市汇顶科技股份有限公司 | Fingerprint identification device and electronic equipment |
| CN111095269A (en) * | 2019-04-10 | 2020-05-01 | 深圳市汇顶科技股份有限公司 | Optical ID sensing using illumination sources located at the periphery of a display screen |
-
2017
- 2017-09-15 CN CN201710845661.8A patent/CN109508596A/en not_active Withdrawn
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111095269A (en) * | 2019-04-10 | 2020-05-01 | 深圳市汇顶科技股份有限公司 | Optical ID sensing using illumination sources located at the periphery of a display screen |
| CN110730968A (en) * | 2019-05-06 | 2020-01-24 | 深圳市汇顶科技股份有限公司 | Fingerprint identification device and electronic equipment |
| CN110596931A (en) * | 2019-09-18 | 2019-12-20 | Oppo广东移动通信有限公司 | Display screen assembly and electronic equipment |
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Address after: 330013 No.698 Tianxiang Avenue, high tech Zone, Nanchang City, Jiangxi Province Applicant after: OFilm Microelectronics Technology Co.,Ltd. Address before: 330013 No.698 Tianxiang Avenue, high tech Zone, Nanchang City, Jiangxi Province Applicant before: NANCHANG OFILM BIO-IDENTIFICATION TECHNOLOGY Co.,Ltd. Address after: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Applicant after: Jiangxi OMS Microelectronics Co.,Ltd. Address before: 330013 No.698 Tianxiang Avenue, high tech Zone, Nanchang City, Jiangxi Province Applicant before: OFilm Microelectronics Technology Co.,Ltd. |
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Application publication date: 20190322 |