CN207148871U - Fingerprint sensor and intelligent terminal - Google Patents
Fingerprint sensor and intelligent terminal Download PDFInfo
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- CN207148871U CN207148871U CN201721139440.0U CN201721139440U CN207148871U CN 207148871 U CN207148871 U CN 207148871U CN 201721139440 U CN201721139440 U CN 201721139440U CN 207148871 U CN207148871 U CN 207148871U
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- fingerprint sensor
- light source
- glass substrate
- circuit board
- source assembly
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Abstract
A kind of fingerprint sensor and intelligent terminal provided by the utility model, are related to fingerprint identification technology field.The fingerprint sensor is applied to the intelligent terminal.The fingerprint sensor includes glass substrate, light source assembly, inductive layer and circuit board, the light source assembly and inductive layer are respectively arranged at the both sides of the glass substrate, side of the light source assembly away from the glass substrate is connected with the circuit board, the circuit board is connected with the inductive layer by metal wire, it is simple in construction, it is easily installed.Due to eliminating the processing step of the flexible circuit board bending of connection, reducing the workload in batch production process, more easily to the lightening processing of fingerprint sensor, mitigating the human cost in production process.
Description
Technical field
Fingerprint identification technology field is the utility model is related to, in particular to a kind of fingerprint sensor and intelligent terminal.
Background technology
Fingerprint, because it has unchangeable property, uniqueness and obtains convenience, almost as living things feature recognition
Synonym.Fingerprint identification technology is then that the identity of people is mapped with fingerprint, by by the fingerprint of collection and pre-saving
Fingerprint is compared, to verify identity.Fingerprint identification technology application is very extensive, such as the field of safety check such as public security bureau and customs,
Consumer product areas such as the gate control system and private Electronic's equipment of building etc..
Fingerprint sensor is the important composition part of fingerprint recognition, for realizing fingerprint collecting.Fingerprint sensor can wrap
Include optical fingerprint sensor, capacitive fingerprint sensor, ultrasonic fingerprint sensor etc..But in general, optical fingerprint sensor into
Picture effect is relatively preferable, and equipment cost is relatively low.Complicated, the assembling inconvenience of existing optical sensor module, specifically,
Existing optical fingerprint sensor is typically to stack LED, lamp box, glass substrate, sensor chip on circuit boards successively, dress
Timing, by the way that flexible circuit board is bent, circuit board is set to be combined with inductive layer.Due to adding flexible circuit board,
Artificial bending flexible circuit board is needed when connecting integrated circuit associated with it and is connected with corresponding circuit, increases production process
In cost of labor.Obviously it is complicated, and it is unfavorable for lightening processing.
Utility model content
The purpose of this utility model is the fingerprint sensor provided and intelligent terminal, to improve above mentioned problem.
To achieve these goals, the technical scheme that the utility model embodiment uses is as follows：
The utility model provides a kind of fingerprint sensor.The fingerprint sensor includes glass substrate, light source assembly, sensing
Layer and circuit board, the light source assembly and inductive layer are respectively arranged at the both sides of the glass substrate, and the light source assembly is remote
The side of the glass substrate is connected with the circuit board, and the circuit board is connected with the inductive layer by metal wire.
Further, the fingerprint sensor also includes circuit substrate, the side of the circuit substrate and the light source group
Part weld, one end of the metal wire and be arranged at the glass substrate welded disc weld, the other end of the metal wire with
The welded disc welding set in the circuit substrate, the opposite side of the circuit substrate and the welding circuit board, the circuit
Plate is connected with the glass substrate by the metal wire and circuit substrate.
Further, the fingerprint sensor also includes separation layer, and the metal wire and the welded disc are packaged in described
In separation layer.
Further, the separation layer includes insulation rubber plastic packaging layer, the lateral wall of the insulation rubber plastic packaging layer respectively with institute
State glass substrate and light source assembly connection.
Further, the light source assembly includes light source and lamp box, and the light source is arranged in the lamp box, the lamp box
Side be connected with the opposite side of the glass substrate, the opposite side of the lamp box and the circuit substrate are welded.
Further, the fingerprint sensor also includes at least one integrated circuit, the integrated circuit and the circuit
Plate weld.
The utility model also provides a kind of intelligent terminal.Including glass cover-plate, terminal shell and fingerprint sensor, the glass
Glass cover plate is arranged at the side of the terminal shell, and the fingerprint sensor is arranged in the terminal shell, and the fingerprint passes
The side of sensor is connected with the glass cover-plate, and the fingerprint sensor includes glass substrate, light source assembly, inductive layer and circuit
Plate, the glass substrate are arranged between the inductive layer and light source assembly, and the light source assembly is away from the glass substrate
Side is connected with the circuit board, and the circuit board is connected with the inductive layer by metal wire.
Further, the fingerprint sensor also includes circuit substrate, the side of the circuit substrate and the light source group
Part weld, one end of the metal wire and be arranged at the glass substrate welded disc weld, the other end of the metal wire with
The welded disc welding set in the circuit substrate, the opposite side of the circuit substrate and the welding circuit board, the circuit
Plate is connected with the glass substrate by the metal wire and circuit substrate.
Further, the fingerprint sensor also includes separation layer, and the metal wire and the welded disc are packaged in described
In separation layer.
Further, the separation layer includes insulation rubber plastic packaging layer, the lateral wall of the insulation rubber plastic packaging layer respectively with institute
State glass substrate and light source assembly connection.
Compared with prior art, the utility model provides a kind of fingerprint sensor and intelligent terminal.The fingerprint sensing
Device is installed on the intelligent terminal.The fingerprint sensor includes glass substrate, light source assembly, inductive layer and circuit board, described
Light source assembly and inductive layer are respectively arranged at the both sides of the glass substrate；The intelligent terminal includes the fingerprint sensor,
Side of the light source assembly away from the glass substrate is connected with the circuit board, and the circuit board leads to the glass substrate
Metal wire is crossed to connect with circuit substrate.It is simple in construction, the step of bending flexible circuit board is eliminated, is reduced in batch production process
Workload, more easily to the lightening processing of fingerprint sensor.
To enable above-mentioned purpose of the present utility model, feature and advantage to become apparent, preferred embodiment cited below particularly, and
Accompanying drawing appended by cooperation, is described in detail below.
Brief description of the drawings
, below will be to required use in embodiment in order to illustrate more clearly of the technical scheme of the utility model embodiment
Accompanying drawing be briefly described, it will be appreciated that the following drawings illustrate only some embodiments of the present utility model, therefore should not be by
Regard the restriction to scope as, for those of ordinary skill in the art, on the premise of not paying creative work, may be used also
To obtain other related accompanying drawings according to these accompanying drawings.
Fig. 1 shows the structural representation for the fingerprint sensor that the utility model first embodiment provides.
Fig. 2 shows the structural representation for the fingerprint sensor that the utility model second embodiment provides.
Fig. 3 shows the structural representation for the intelligent terminal that the utility model 3rd embodiment provides.
Fig. 4 is sectional view of the intelligent terminal shown in Fig. 3 along II-II directions.
Icon：100- fingerprint sensors；10- glass substrates；20- light source assemblies；21- lamp boxes；22- light sources；30- senses
Layer；40- circuit boards；50- metal wires；60- separation layers；70- welded discs；80- integrated circuits；200- fingerprint sensors；210- glass
Glass substrate；220- light source assemblies；221- lamp boxes；222- light sources；230- inductive layers；240- circuit boards；250- metal wires；260- every
Absciss layer；270- welded discs；280- integrated circuits；290- circuit substrates；300- intelligent terminals；310- glass cover-plates；320- terminals
Housing.
Embodiment
Below in conjunction with accompanying drawing in the utility model embodiment, the technical scheme in the embodiment of the utility model is carried out clear
Chu, it is fully described by, it is clear that described embodiment is only the utility model part of the embodiment, rather than whole realities
Apply example.The component of the utility model embodiment being generally described and illustrated herein in the accompanying drawings can be come with a variety of configurations
Arrangement and design.Therefore, the detailed description of the embodiment of the present utility model to providing in the accompanying drawings is not intended to limit below
Claimed the scope of the utility model, but it is merely representative of selected embodiment of the present utility model.Based on the utility model
Embodiment, the every other embodiment that those skilled in the art are obtained on the premise of creative work is not made, all
Belong to the scope of the utility model protection.
It should be noted that：Similar label and letter represents similar terms in following accompanying drawing, therefore, once a certain Xiang Yi
It is defined, then it further need not be defined and explained in subsequent accompanying drawing in individual accompanying drawing.It is meanwhile new in this practicality
In the description of type, term " first ", " second " etc. are only used for distinguishing description, and it is not intended that indicating or implying relatively important
Property.
First embodiment
It refer to Fig. 1, a kind of fingerprint sensor 100 that the utility model embodiment is provided.The fingerprint sensor 100
Including glass substrate 10, light source assembly 20, inductive layer 30 and circuit board 40.The light source assembly 20 and inductive layer 30 are set respectively
In the both sides of the glass substrate 10.Side of the light source assembly 20 away from the glass substrate 10 connects with the circuit board 40
Connect.The circuit board 40 is connected with the inductive layer 30 by metal wire 50.
The glass substrate 10 can be lens.The glass substrate 10 is arranged at the inductive layer 30 and light source assembly 20
Between.The glass substrate 10 sets a welded disc 70, welded disc 70 and inductive layer on the side away from the light source assembly 20
30 are electrically connected with, and welded disc 70 is used to realize the connection between inductive layer 30 and circuit board 40.
Light source assembly 20 is oppositely arranged with the inductive layer 30.Light passes through glass substrate caused by the light source assembly 20
10.Light projects after glass substrate 10 from induction region corresponding to inductive layer 30.It is described when finger is close to induction region
The light that light source assembly 20 is sent, beaten after glass substrate 10 on the fingerprint close to the finger surface of induction region.It is optional
Ground, the light source assembly 20 include light source 22 and lamp box 21.The light source 22 is arranged in the lamp box 21, the lamp box 21
Side is connected with the glass substrate 10, and the opposite side of the lamp box 21 welds with the circuit board 40.Alternatively, light source 22 can
To be LED.LED is a kind of electroluminescent chip of semiconductor material.The side of the lamp box 21 is provided with opening, described
LED is relative with the opening, so that the light that the LED is sent projects from the opening of lamp box 21.The lamp box 21 is set
The side for having opening is connected with glass substrate 10.Specifically, side of the lamp box 21 provided with opening passes through with glass substrate 10
The bonding gemel connection of solid or liquid.
Inductive layer 30 is connected with the side of the glass substrate 10 away from light source assembly 20.Specifically, positioned at the glass
The induction region of substrate 10.When the light that finger produces close to induction region corresponding to inductive layer 30, the light source assembly 20, warp
Beaten after crossing glass substrate 10 on the finger close to induction region.Inductive layer is reflected back by the finger print close to induction region again
30, received by inductive layer 30.It should be noted that angle that light reflects on the rough strain line of finger surface fingerprint and
The bright and dark light reflected back will be different.Inductive layer 30 is used for the fingerprint reflection or refraction from finger surface received
Light.
The relatively described glass substrate 10 of circuit board 40 is parallel, and circuit board 40 is connected with light source assembly 20 by tin cream.Can
Selection of land, the circuit board 40 can be flexible PCBs.Flexible PCB is made of using polyimides or polyester film as base material
One kind there is height reliability, excellent flexible printed circuit.With Distribution density is high, in light weight, thickness of thin, bending
The characteristics of property is good.The side of the circuit board 40 towards the light source assembly 20 is also provided with a welded disc 70.
In the present embodiment, using routing technique by the welded disc 70 being arranged on the glass substrate 10 with being arranged at
The welded disc 70 of the circuit board 40 is connected by metal wire 50.Alternatively, metal wire 50 can be but not limited to copper cash, gold
Line.The both ends of metal wire 50 with the welded disc 70 on the glass substrate 10 and are arranged at the welded disc of the circuit board 40 respectively
70 welding, make inductive layer 30 be electrically connected with the circuit board 40.
In the present embodiment, the fingerprint sensor 100 also includes separation layer 60.The metal wire 50, the glass base
Welded disc 70 on plate 10 and it is arranged at the welded disc 70 of the circuit board 40 and is packaged in the separation layer 60.It is described
Separation layer 60 is used for the welded disc 70 on metal wire 50, the glass substrate 10 and is arranged at the welded disc 70 of circuit board 40
It is isolated from the outside out, plays the protection to routing region (region i.e. where metal wire 50 and welded disc 70).Alternatively, it is described
Separation layer 60 includes insulation rubber plastic packaging layer, for example, epoxy molding material black glue layer.The lateral wall of the insulation rubber plastic packaging layer point
It is not connected with the glass substrate 10 and light source assembly 20.Make inductive layer 30, glass substrate 10, light source assembly 20 and circuit board 40
A structure for being similar to chip is formed, is conveniently installed and used.And utilize routing technique and epoxy molding material plastic package process
To substitute flexible circuit board to destroy or force to yield technique, technology difficulty is reduced.
The fingerprint sensor 100 also includes at least one integrated circuit 80.Fingerprint sensor 100 will be realized to fingerprint
Collection and identification, in addition to needing inductive layer 30, it is also necessary to some realize the integrated circuit 80 of correlation function, for example,
For forming crestal line (streakline in fingerprint image with one fixed width and trend) in black, valley line according to the light received
(sunk part between streakline) it is white it is digitized, can be by the collection of the multi-grayscale fingerprint image of fingerprint equipment algorithm process
Into circuit 80.In the present embodiment, the integrated circuit 80 and the circuit board 40 are welded.Specifically, surface mount is passed through
(SMT) integrated circuit 80 related to fingerprint sensor 100 is welded on circuit board 40 by making technology.It can be set by generation
It is standby to be welded direct on circuit board 40, without manually installed, avoid use a large amount of manpower handworks, automaticity height.Need
It is noted that make the inductive layer on glass substrate 10 due to being by using the bending to flexible circuit board in the prior art
30 are connected with circuit board 40, and the artificial flexible circuit board that bends simultaneously is connected on interlock circuit, make cost of labor in production process very
It is high.
Second embodiment
It refer to Fig. 2, a kind of fingerprint sensor 200 that the utility model embodiment is provided.The fingerprint sensor 200
Including glass substrate 210, light source assembly 220, inductive layer 230 and circuit substrate 290.The light source assembly 220 and inductive layer 230
It is respectively arranged at the both sides of the glass substrate 210.Side and institute of the light source assembly 220 away from the glass substrate 210
Circuit substrate 290 is stated to connect.The circuit substrate 290 is connected with the glass substrate 210 by metal wire 250.
The glass substrate 210 can be lens.The glass substrate 210 is arranged at the inductive layer 230 and light source group
Between part 220.The glass substrate 210 sets a welded disc 270, the welding on the side away from the light source assembly 220
Disk 270 is electrically connected with inductive layer 230, for realizing the connection between inductive layer 230 and circuit substrate 290.
Light source assembly 220 is oppositely arranged with the inductive layer 230.Light passes through glass caused by the light source assembly 220
Substrate 210, after glass substrate 210, projected from induction region corresponding to inductive layer 230.When finger is close to induction region, institute
The light of the production of light source assembly 220 is stated, is beaten after glass substrate 210 on the fingerprint of finger surface.Alternatively, the light source
Component 220 includes lamp box 221 and light source 222.The light source 222 is arranged in the lamp box 221, the side of the lamp box 221
It is connected with the glass substrate 210, the opposite side of the lamp box 221 welds with the circuit substrate 290.Alternatively, light source
222 can be LED.LED is a kind of electroluminescent chip of semiconductor material.The side of the lamp box 221 is provided with opening,
The LED is relative with the opening, so that the light that the LED is sent projects from the opening of lamp box 221.The lamp box
221 sides for being provided with opening are connected with glass substrate 210.Specifically, the lamp box 221 is provided with side and the glass substrate of opening
210 pass through the bonding gemel connection of solid or liquid.
The relatively described glass substrate 210 of circuit substrate 290 is parallel, and circuit substrate 290 and light source assembly 220 are remote described
The side of glass substrate 210 is connected by tin cream.
The circuit substrate 290 is also provided with a welded disc 270 towards the side of the light source assembly 220.
When installing the fingerprint sensor 200, the circuit substrate 290 is directly connected with the circuit board 240.Electricity
Road plate 240 is welded with side of the circuit substrate 290 away from the light source assembly 220 using tin cream.Alternatively, the circuit
Plate 240 can be flexible PCB.Flexible PCB is that have height to be a kind of made of base material using polyimides or polyester film
Spend reliability, excellent flexible printed circuit.With the characteristics of Distribution density is high, in light weight, thickness of thin, good bending property.
The present embodiment provides fingerprint sensor 100 compared to first embodiment and has increased circuit substrate 290 newly, in contrast reduces technique
Difficulty, the mortality in production process can be reduced to a certain extent.
In the present embodiment, by the welded disc 270 being arranged on the glass substrate 210 and set using routing technique
Connected in the welded disc 270 of the circuit substrate 290 by metal wire 250.Alternatively, metal wire 250 can be but not limited to
It is copper cash, gold thread.The both ends of metal wire 250 are respectively with the welded disc 270 on the glass substrate 210 and being arranged at the circuit
The welded disc 270 of substrate 290 is welded, and inductive layer 230 is electrically connected with the circuit substrate 290.
In the present embodiment, the fingerprint sensor 200 also includes separation layer 260.The metal wire 250, the glass
Welded disc 270 on substrate 210 and it is arranged at the welded disc 270 of the circuit substrate 290 and is packaged in the separation layer 260
It is interior.The separation layer 260 is used for the welded disc 270 on metal wire 250, the glass substrate 210 and is arranged at the circuit
The welded disc 270 of substrate 290 is isolated from the outside out, and plays to routing region (region i.e. where metal wire 250 and welded disc 270)
Protection.Alternatively, the separation layer 260 includes insulation rubber plastic packaging layer, for example, epoxy molding material black glue layer.It is described every
Lateral wall from glue plastic packaging layer is connected with the glass substrate 210, light source assembly 220 and circuit substrate 290 respectively.Make sensing
Layer 230, glass substrate 210, light source assembly 220, circuit substrate 290 and circuit board 240 form a structure for being similar to chip,
Conveniently install and use.And substitute flexible circuit board to destroy or force to yield technique using routing technique and epoxy molding material plastic package process,
Reduce technology difficulty.
The fingerprint sensor 200 also includes at least one integrated circuit 280.Fingerprint sensor 200 will be realized to fingerprint
Collection and identification, in addition to needing inductive layer 230, it is also necessary to which some realize the integrated circuit 280 of correlation function, example
Such as, for forming crestal line (streakline in fingerprint image with one fixed width and trend) in black, paddy according to the light received
Line (sunk part between streakline) it is white it is digitized, can be by the multi-grayscale fingerprint image of fingerprint equipment algorithm process
Integrated circuit 280.In the present embodiment, the integrated circuit 280 and the circuit board 240 are welded.Specifically, pasted by surface
The integrated circuit 280 related to fingerprint sensor 200 is welded on circuit board 240 by dress (SMT) making technology.Life can be passed through
Forming apparatus is welded direct on circuit board 240, without manually installed, avoids using a large amount of manpower handworks, automaticity
It is high.It should be noted that in the prior art due to being to connect inductive layer 230 and circuit board 240 by using flexible circuit board, because
This, needs manually to bend soft when the integrated circuit associated with fingerprint sensor 200 280 is added in fingerprint sensor 200
Circuit board simultaneously connects with corresponding circuit, makes the cost of labor in production process very high.
3rd embodiment
It refer to Fig. 3 and Fig. 4, a kind of intelligent terminal 300 that the utility model embodiment is provided.Intelligent terminal 300 can
To be electronic equipment with fingerprint, for example, mobile phone, notebook computer, tablet personal computer, intelligent door lock, fingerprint reading card device etc..
In the present embodiment, intelligent terminal 300 is by taking mobile phone as an example.Intelligent terminal 300 includes glass cover-plate 310, terminal shell 320 and second
The fingerprint sensor 200 that embodiment provides.In other embodiments or first embodiment provide fingerprint sensor
100.The glass cover-plate 310 is arranged at the side of the terminal shell 320, and the fingerprint sensor 200 is arranged at the end
In end housing 320, the side of the fingerprint sensor 200 is connected with the glass cover-plate 310.
Encapsulation fingerprint sensor 200 can be realized by lower step：Using tin cream by the side of light source assembly 220 with electricity
Base board 290 welds.The opposite side of the light source assembly 220 is connected by adhesive-layer and the glass substrate 210 provided with inductive layer 230
Connect.By the welded disc 270 being arranged on the glass substrate 210 and the circuit substrate 290 is arranged at using routing technique
Welded disc 270 is connected by metal wire 250.The welded disc 270 and metal wire 250 are encapsulated using insulation rubber plastic package process
In insulation rubber plastic packaging layer.The circuit substrate 290 and at least one integrated circuit 280 are welded to using SMT making technologies
Circuit board 240, to obtain fingerprint sensor module.The fingerprint sensor module is bonded with glass cover-plate 310, to obtain
State fingerprint sensor 200.
In summary, the utility model provides a kind of fingerprint sensor and intelligent terminal.The fingerprint sensor installation
In the intelligent terminal.The fingerprint sensor includes glass substrate, light source assembly, inductive layer and circuit board, the light source group
Part and inductive layer are respectively arranged at the both sides of the glass substrate, side and institute of the light source assembly away from the glass substrate
Circuit board connection is stated, the circuit board is connected with the inductive layer by metal wire.It is simple in construction, remove bending flexible circuit board
The step of, the workload in batch production process is reduced, more easily to the lightening processing of fingerprint sensor.
Preferred embodiment of the present utility model is the foregoing is only, is not limited to the utility model, for this
For the technical staff in field, the utility model can have various modifications and variations.It is all in the spirit and principles of the utility model
Within, any modification, equivalent substitution and improvements made etc., it should be included within the scope of protection of the utility model.It should be noted that
Arrive：Similar label and letter represents similar terms in following accompanying drawing, therefore, once determined in a certain Xiang Yi accompanying drawing
Justice, then it further need not be defined and explained in subsequent accompanying drawing.
It is described above, only specific embodiment of the present utility model, but the scope of protection of the utility model is not limited to
In this, any one skilled in the art can readily occur in change in the technical scope that the utility model discloses
Or replace, it should all cover within the scope of protection of the utility model.Therefore, the scope of protection of the utility model should be described with power
The protection domain that profit requires is defined.
Claims (10)
- A kind of 1. fingerprint sensor, it is characterised in that the fingerprint sensor include glass substrate, light source assembly, inductive layer and Circuit board, the light source assembly and inductive layer are respectively arranged at the both sides of the glass substrate, and the light source assembly is away from described The side of glass substrate is connected with the circuit board, and the circuit board is connected with the inductive layer by metal wire.
- 2. fingerprint sensor as claimed in claim 1, it is characterised in that the fingerprint sensor also includes circuit substrate, institute The side and the light source assembly for stating circuit substrate are welded, one end of the metal wire and the welding for being arranged at the glass substrate Disk is welded, and the welded disc set in the other end of the metal wire and the circuit substrate is welded, the circuit substrate it is another Side and the welding circuit board, the circuit board are connected with the glass substrate by the metal wire and circuit substrate.
- 3. fingerprint sensor as claimed in claim 2, it is characterised in that the fingerprint sensor also includes separation layer, described Metal wire and the welded disc are packaged in the separation layer.
- 4. fingerprint sensor as claimed in claim 3, it is characterised in that the separation layer includes insulation rubber plastic packaging layer, described The lateral wall of insulation rubber plastic packaging layer is connected with the glass substrate and light source assembly respectively.
- 5. fingerprint sensor as claimed in claim 2, it is characterised in that the light source assembly includes light source and lamp box, described Light source is arranged in the lamp box, and the side of the lamp box is connected with the glass substrate, the opposite side of the lamp box with it is described Circuit substrate is welded.
- 6. fingerprint sensor as claimed in claim 2, it is characterised in that the fingerprint sensor also includes at least one integrated Circuit, the integrated circuit and the welding circuit board.
- A kind of 7. intelligent terminal, it is characterised in that including glass cover-plate, terminal shell and fingerprint sensor, the glass cover-plate The side of the terminal shell is arranged at, the fingerprint sensor is arranged in the terminal shell, the fingerprint sensor Side is connected with the glass cover-plate, and the fingerprint sensor includes glass substrate, light source assembly, inductive layer and circuit board, institute Glass substrate is stated to be arranged between the inductive layer and light source assembly, the light source assembly away from the glass substrate side with The circuit board connection, the circuit board are connected with the inductive layer by metal wire.
- 8. intelligent terminal as claimed in claim 7, it is characterised in that the fingerprint sensor also includes circuit substrate, described The side of circuit substrate is welded with the light source assembly, one end of the metal wire and the welded disc for being arranged at the glass substrate Welding, the other end of the metal wire weld with the welded disc set in the circuit substrate, the opposite side of the circuit substrate With the welding circuit board, the circuit board is connected with the glass substrate by the metal wire and circuit substrate.
- 9. intelligent terminal as claimed in claim 8, it is characterised in that the fingerprint sensor also includes separation layer, the gold Category line and the welded disc are packaged in the separation layer.
- 10. intelligent terminal as claimed in claim 9, it is characterised in that the separation layer includes insulation rubber plastic packaging layer, it is described every Lateral wall from glue plastic packaging layer is connected with the glass substrate and light source assembly respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721139440.0U CN207148871U (en) | 2017-09-06 | 2017-09-06 | Fingerprint sensor and intelligent terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721139440.0U CN207148871U (en) | 2017-09-06 | 2017-09-06 | Fingerprint sensor and intelligent terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207148871U true CN207148871U (en) | 2018-03-27 |
Family
ID=61677668
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721139440.0U Active CN207148871U (en) | 2017-09-06 | 2017-09-06 | Fingerprint sensor and intelligent terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207148871U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109460694A (en) * | 2017-09-06 | 2019-03-12 | 蓝思科技（长沙）有限公司 | Fingerprint sensor, intelligent terminal and fingerprint sensor package method |
| CN112631116A (en) * | 2020-12-10 | 2021-04-09 | 广东湾区智能终端工业设计研究院有限公司 | Crown mounting structure and electronic equipment |
-
2017
- 2017-09-06 CN CN201721139440.0U patent/CN207148871U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109460694A (en) * | 2017-09-06 | 2019-03-12 | 蓝思科技（长沙）有限公司 | Fingerprint sensor, intelligent terminal and fingerprint sensor package method |
| CN112631116A (en) * | 2020-12-10 | 2021-04-09 | 广东湾区智能终端工业设计研究院有限公司 | Crown mounting structure and electronic equipment |
| CN112631116B (en) * | 2020-12-10 | 2022-03-15 | 广东湾区智能终端工业设计研究院有限公司 | Crown mounting structure and electronic equipment |
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