CN207116423U - A kind of New LED - Google Patents
A kind of New LED Download PDFInfo
- Publication number
- CN207116423U CN207116423U CN201721101763.0U CN201721101763U CN207116423U CN 207116423 U CN207116423 U CN 207116423U CN 201721101763 U CN201721101763 U CN 201721101763U CN 207116423 U CN207116423 U CN 207116423U
- Authority
- CN
- China
- Prior art keywords
- substrate
- light
- bearing
- emitting diode
- backlight unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
A kind of New LED; provide a kind of great power LED of good heat dissipation effect; including substrate and the light-emitting diode chip for backlight unit being arranged on substrate; the substrate is arranged on support; support includes two be arranged symmetrically; two supports respectively come with a leg; its other end and together; a bearing is collectively forming, bearing is cylinder or polygon prism shape structure, and the substrate is flexible laminar's structure; it is wrapped on bearing; the light-emitting diode chip for backlight unit is uniformly arranged on substrate, in the outside of the substrate, is additionally provided with transparent insulating protective layer.The utility model is simple in construction, novel, and production cost is low, good heat dissipation effect, service life length, is adapted to batch production, is worth of widely use.
Description
Technical field
LED field is the utility model is related to, specially a kind of new high power LED.
Background technology
LED is applied as forth generation lighting device in landscape, instruction, display, backlight and special lighting etc.
Field highlights its advantage, and has played the effect of energy-conservation, longevity, corresponding speed are fast etc. huge.Develop in lighting engineering
History in, LED technology is also very of short duration, but due to LED brightness and color dynamic control it is easy, appearance and size is small, makes
With long lifespan, without infrared ray and ultraviolet, light emission direction is strong the features such as it is had begun to Large-scale intrusion general lighting
Field, but it is intended to give full play to LED performance advantage, into general illumination market, it is also necessary to develop high-power type luminous two
Pole pipe, luminous efficiency is improved, lift the uniformity of color and luster.
Large-power LED in the market, mainly with surface-mount type structure, i.e., fix one on a planar substrates
Or several light-emitting diode chip for backlight unit chips, because chip lighting angle itself is not over 180 °, surface-mount type structure subject wafer sheet
Body angle and planar substrates are in the light influence, and the LED lighting angles of this structure are maximum to be no more than 180 °, is limited by angle, Surface Mount
The LED of type structure will substitute incandescent lamp bulb, during applied to general lighting, it is necessary to be assembled into three-dimensional module by its more, make its hair
Angular could use after breaking through 180 °.Semiconductor light source for illuminating physical spaces of the existing patent containing three-dimensional rack（Shen
Please numbers 2007800196354）A kind of light source that can reach stereo luminous effect is disclosed, but the structure of its support Design is to adopt
With coaxial three-dimensional bracket, its 3 D stereo support with axle is by hollow shell（Negative electrode）With cap equipped with the guide pin extended（Sun
Pole）It is set in together, isolates using megohmite insulant and fix anode and cathode, its more chip die bonds is on negative electrode, only by negative electrode
Radiating, secondly the helicitic texture on support actual illumination using it is upper with it is heat sink on nut can not be brought into close contact, with heat sink reality
Border contact area is little, so radiating effect of its support itself is poor, causes illuminating effect poor, and it is numerous to be equipped with part for it in addition
More, packaging technology is complicated, and difficulty or ease realize large-scale promotion.
Utility model content
The technical problems to be solved in the utility model is overcome the deficiencies in the prior art, there is provided a kind of novel high-power lights
Diode.
In order to solve the above technical problems, the utility model proposes technical scheme be：
A kind of New LED, including substrate and the light-emitting diode chip for backlight unit that is arranged on substrate, in the utility model, institute
State substrate to be arranged on support, support includes two be arranged symmetrically, and two supports respectively come with a leg, and its other end is simultaneously
Together, a bearing is collectively forming, bearing is cylinder or polygon prism shape structure, and the substrate is flexible laminar's structure, bag
It is rolled on bearing, the light-emitting diode chip for backlight unit is uniformly arranged on substrate, in the outside of the substrate, is additionally provided with transparent
Insulating protective layer.
In the utility model, the substrate is soft super thin metal plate, and the support is thermal conducting material support.
In the utility model, at least one set of light-emitting diode chip for backlight unit, every group of light emitting diode are provided with the substrate
Chip is connected in series with each other, and is connected in parallel with other groups of light-emitting diode chip for backlight unit.
In the utility model, the substrate is wrapped in side and the top surface of bearing.
Further, light-emitting diodes of the light-emitting diode chip for backlight unit for being arranged on bearing side with being arranged on bearing top surface
Die is to be connected in parallel.
Further, the light-emitting diode chip for backlight unit number for being arranged on bearing side is provided in the luminous of bearing top surface
Twice of diode chip for backlight unit number, and the light-emitting diode chip for backlight unit number for being arranged on bearing side is divided into two groups and is connected in parallel, and
Light-emitting diode chip for backlight unit with being arranged on bearing top surface is connected in parallel.
In the utility model, the insulating protective layer is set in the outside of substrate and bearing, is in integral structure with it.
In the utility model, two legs of the support set two electrodes respectively, successively with each light-emitting diodes
Die connects.
In the utility model, fluorescence coating is provided with the outside of the light-emitting diode chip for backlight unit.
Compared with prior art, metal substrate thermal resistance of the present utility model is small, and pliability is good, can flexing and can radiating,
Can be fabricated to according to support it is variously-shaped, do not influence radiating and luminous efficiency, and then improve service life, also easily realize more
The encapsulation of powerful light-emitting diode chip for backlight unit, meanwhile, the cooperation of substrate and support so that luminous efficiency and lighting angle have
Breakthrough raising, and it is all extremely convenient to be fabricated to lamp assembled, and can save the heat of auxiliary heat dissipation under certain condition
It is heavy, assembling procedure can be reduced, substantially reduces the manufacturing cost of product.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model.
In figure：Substrate 1, light-emitting diode chip for backlight unit 2, support 3, leg 4, bearing 5, insulating protective layer 6, wire 7.
Embodiment
The utility model is further described below in conjunction with Figure of description and specific preferred embodiment, but not because
This and limit the scope of protection of the utility model.
New LED shown in Figure 1, including substrate 1 and light-emitting diode chip for backlight unit 2 on substrate 1, the base are set
Plate 1 is arranged on support 3, and support 3 includes two be arranged symmetrically, and two supports 3 respectively come with a leg 4, its other end
And together, a bearing 5 being collectively forming, bearing 5 is cylinder or polygon prism shape structure, and the substrate 1 is soft ultra-thin gold
Belong to plate, be wrapped on bearing 5, the light-emitting diode chip for backlight unit 2 is uniformly arranged on substrate 1, respectively positioned at the side of bearing 5 and
The respective series connection of the light-emitting diode chip for backlight unit 2 of top surface, side and top surface is simultaneously parallel with one another, the outside of the substrate 1, is provided with transparent
Insulating protective layer 6, be set in the outside of substrate 1 and bearing 5, be in integral structure with it.Two legs 4 of the support 3
Two electrodes are set respectively, are connected successively with each light-emitting diode chip for backlight unit 2 by wire 7.
In the utility model, distinctive structure type breaches tradition, by the structure design of stake body between left and right every
Set and two splits of mutually insulated so that their electrode foots as electrode simultaneously again while as support, support
The outstanding heat conducting material with substrate, with reference to the special structural form of support so that it has outstanding radiating effect, Ke Yigai
Become the heat-removal modalities of prior art, eliminate the structure of heat sink auxiliary heat dissipation, reduce the process of assembling, reduce raw material and life
Cost is produced, also allows for repairing.
Therefore, the utility model is simple in construction, novel, and production cost is low, good heat dissipation effect, service life length, fits
Batch production is closed, is worth of widely use.
Claims (8)
1. a kind of New LED, including substrate and the light-emitting diode chip for backlight unit that is arranged on substrate, it is characterised in that the substrate
It is arranged on support, support includes be arranged symmetrically two, and two supports respectively come with a leg, its other end and one
Rise, be collectively forming a bearing, bearing is cylinder or polygon prism shape structure, and the substrate is flexible laminar's structure, is wrapped in
On bearing, the light-emitting diode chip for backlight unit is uniformly arranged on substrate, in the outside of the substrate, is additionally provided with transparent insulation
Protective layer.
2. New LED according to claim 1, it is characterised in that the substrate is soft super thin metal plate, the branch
Frame is thermal conducting material support.
3. New LED according to claim 1, it is characterised in that at least one set of light-emitting diodes are provided with the substrate
Die, every group of light-emitting diode chip for backlight unit are connected in series with each other, and are connected in parallel with other groups of light-emitting diode chip for backlight unit.
4. New LED according to claim 1, it is characterised in that the substrate is wrapped in side and the top surface of bearing.
5. New LED according to claim 4, it is characterised in that the light-emitting diodes tube core for being arranged on bearing side
Piece is to be connected in parallel with the light-emitting diode chip for backlight unit for being arranged on bearing top surface.
6. New LED according to claim 5, it is characterised in that the light-emitting diodes tube core for being arranged on bearing side
Piece number is provided in twice of the light-emitting diode chip for backlight unit number of bearing top surface, and is arranged on the light emitting diode of bearing side
Core number is divided into two groups and is connected in parallel, and the light-emitting diode chip for backlight unit with being arranged on bearing top surface is connected in parallel.
7. New LED according to claim 1, it is characterised in that the insulating protective layer is set in substrate and bearing
Outside, it is in integral structure with it.
8. New LED according to claim 1, it is characterised in that two legs of the support set two electricity respectively
Pole, it is connected successively with each light-emitting diode chip for backlight unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721101763.0U CN207116423U (en) | 2017-08-31 | 2017-08-31 | A kind of New LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721101763.0U CN207116423U (en) | 2017-08-31 | 2017-08-31 | A kind of New LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207116423U true CN207116423U (en) | 2018-03-16 |
Family
ID=61574159
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721101763.0U Expired - Fee Related CN207116423U (en) | 2017-08-31 | 2017-08-31 | A kind of New LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207116423U (en) |
-
2017
- 2017-08-31 CN CN201721101763.0U patent/CN207116423U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180316 Termination date: 20190831 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |