CN207099191U - Camera module chip package base - Google Patents
Camera module chip package base Download PDFInfo
- Publication number
- CN207099191U CN207099191U CN201721034172.6U CN201721034172U CN207099191U CN 207099191 U CN207099191 U CN 207099191U CN 201721034172 U CN201721034172 U CN 201721034172U CN 207099191 U CN207099191 U CN 207099191U
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- China
- Prior art keywords
- supporting part
- camera module
- chip package
- package base
- module chip
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Abstract
A kind of camera module chip package base is the utility model is related to, including：Metab, including second supporting part at first supporting part at center and edge, first supporting part is recessed relative to the second supporting part to be set, and first supporting part is enclosed provided with loophole, and the edge of second supporting part further bends and forms leg.Above-mentioned camera module chip package base, metab molds second supporting part at the first supporting part and edge, respectively supporting optical filter and voice coil motor, intensity can greatly be strengthened, can effectively solve the problem that do pure plastic parts it is thin after intensity deficiency the shortcomings that, simultaneously because intensity improves, the most thin limit of pure plastic cement can be broken through, is vacateed to the encapsulation of mobile phone dual camera module chip and more uses space.
Description
Technical field
Electronic device field is the utility model is related to, more particularly to a kind of camera module chip package base.
Background technology
Chip package base in mobile phone camera module group is the component in mobile phone camera module group, is used on pcb board
Between electronic component and voice coil motor.
Chip package base in mobile phone camera module group is the pure plastic parts obtained by injection molding.
It is also more next to the thickness requirement of the chip package base in mobile phone camera module group at present because mobile phone the more does the more thin
Thinner, available space is also just less and less for mobile phone camera module group, because electronic component is also more next on pcb board
It is more, this just the requirement to the chip package base space in mobile phone camera module group also with regard to more and more higher.
Pure plastic parts windowing patch smalt (optical filter) position of chip package base in mobile phone camera module group at present
Place influences because injection molding process and plastic cement material flow etc., and most thin meat thickness can only accomplish 0.15mm or so, if meat thickness is thin again,
Injection molding is difficult to process, i.e., enabled to process, and due to factors such as insufficient strengths, can not meet to paste smalt
Intensity requirement in the intensity requirement of (optical filter) and module use, this, which is just forced, seeks new technique to meet technical requirements.
Utility model content
Based on this, it is necessary to propose a kind of camera module die chip encapsulation base plate, can make in mobile phone camera module group
Chip package base do it is thin, increase inner space, and solve chip package base do it is thin after intensity deficiency the shortcomings that.
A kind of camera module chip package base, including：Metab, including first supporting part at center and edge
Second supporting part, first supporting part is recessed relative to the second supporting part to be set, and first supporting part is enclosed provided with loophole,
The edge of second supporting part further bends and forms leg.
Above-mentioned camera module chip package base, metab mold second carrying at the first supporting part and edge
Portion, respectively to support optical filter and voice coil motor, can greatly strengthen intensity, can effectively solve the problem that do pure plastic parts it is thin after
Intensity deficiency the shortcomings that, simultaneously because intensity improve, the most thin limit of pure plastic cement can be broken through, give mobile phone dual camera module
Chip package, which is vacateed, more uses space.
Connecting portion that in one of the embodiments, the leg includes extending from after the bending of the edge of the second supporting part,
From extension and the supporting part parallel with the second supporting part after the bending of the end of connecting portion.
In one of the embodiments, the supporting part extends along the direction away from the first supporting part.
In one of the embodiments, second supporting part is provided with four edges, and each edge is each formed with a place
Leg is stated, the supporting part of the leg is coplanar.
In one of the embodiments, receiving space is surrounded between the supporting part.
In one of the embodiments, formed with the sticking insulating barrier of tool on the surface of first supporting part.
In one of the embodiments, the metab has first supporting part and the second supporting part at two,
The second supporting part at wherein two is connected.
In one of the embodiments, the metab is simple metal part, stainless steel part or alloy components.
In one of the embodiments, the metab is the one that metal sheet is formed by stretching mode
Part.
In one of the embodiments, the thickness of the metal sheet is 0.03~0.15 millimeter.
Brief description of the drawings
Fig. 1 is the schematic diagram of the camera module chip package base of the utility model embodiment one；
Fig. 2 is the top view of the camera module chip package base shown in Fig. 1；
Fig. 3 is the side view of the camera module chip package base shown in Fig. 1；
Fig. 4 is the schematic diagram of the camera module chip package base of embodiment two.
Embodiment
To enable above-mentioned purpose of the present utility model, feature and advantage more obvious understandable, below in conjunction with the accompanying drawings to this
The embodiment of utility model is described in detail.Elaborate many details in order to abundant in the following description
Understand the utility model.But the utility model can be to be much different from other manner described here to implement, this area
Technical staff can do similar improvement in the case of without prejudice to the utility model connotation, therefore the utility model is not by following public affairs
The limitation for the specific embodiment opened.
It should be noted that when element is referred to as " being fixed on " another element, it can be directly on another element
Or there may also be element placed in the middle.When an element is considered as " connection " another element, it can be directly connected to
To another element or it may be simultaneously present centering elements.
Unless otherwise defined, all of technologies and scientific terms used here by the article is led with belonging to technology of the present utility model
The implication that the technical staff in domain is generally understood that is identical.It is simply in term used in the description of the present utility model herein
The purpose of description specific embodiment, it is not intended that in limitation the utility model.Term as used herein " and/or " include
The arbitrary and all combination of one or more related Listed Items.
Below in conjunction with the accompanying drawings, the better embodiment of the utility model camera module chip package base is illustrated.
The camera module chip package base of the utility model embodiment one, it is by metal one referring to figs. 1 to Fig. 3
Metab made of shaping.
Metab includes first supporting part 10 at center and second supporting part 20 at edge.First supporting part 10 relative to
Second supporting part 20 depression is set.First supporting part 10 is enclosed provided with loophole 110.The edge of second supporting part 20 is further bent
And form leg 30.Wherein, the first supporting part 10 is carrying optical filter.Loophole 110 uses for optical filter.Second supporting part
20 carrying voice coil motor.Leg 30 is being bearing on circuit board.
The surface of first supporting part 10 can also further be insulated by special surface treatment mode and be adhered to strong
Characteristic, i.e., formed with having sticking insulating barrier.Optical filter is bonded in the tool when being fixed to the first supporting part 10 sticking
On insulating barrier.
Metab is the integral piece that metal sheet is formed by integral stretching mode.Further, the thickness of metal sheet
Spend for 0.03~0.15 millimeter.Metab is simple metal part, stainless steel part or alloy components etc..Such as, metab can be copper
Base, superalloy.
Connecting portion 310 that leg 30 includes extending from after the bending of the edge of the second supporting part 20, from the end of connecting portion 310
Extension and the supporting part 320 parallel with the second supporting part 20 after bending.Further, supporting part 320 is along away from the first supporting part
10 direction extension.
Second supporting part 20 is provided with four edges.Each edge is each formed with leg 30 at one, and the support of each leg 30
Portion 320 is coplanar, so as to conveniently be attached to circuit board.320 surround receiving space between supporting part, to accommodate sensitive chip.
The method for preparing camera module chip package base of the present utility model is summarized as follows.
1. thick metal (alloy, copper, stainless steel etc.) sheet materials of 0.03~0.15mm are rushed by precise punching die first
It is pressed into the shape and packaging for meeting client's function needs.
2. metal (alloy, copper, stainless steel etc.) product for striking out predetermined shape is passed through into special surface treatment mode
Insulated and adhere to strong characteristic and packaging, obtain metab.
The camera module chip package base of the utility model embodiment 1 is singly to take the photograph base.In addition, camera module core
Piece encapsulation base plate can also be that the double of embodiment 2 as shown in Figure 4 take the photograph base.
Join Fig. 4, double differences for taking the photograph base with singly taking the photograph base are：An optical filter can only be installed by singly taking the photograph base.It is double to take the photograph bottom
Seat can then install two optical filters simultaneously.Wherein, metab has the first supporting part 10 and the second supporting part 20 at two, and
And the second supporting part 20 at two is connected.Therefore, double bases of taking the photograph equally can be formed by stretching by metal sheet.
The processing mode of current pure plastic parts existing in the industry, can not meet the chip package in mobile phone dual camera module
It is strong required for the thick technical requirements and H/R components and camera module less than 0.15mm of meat at base windowing patch infrared fileter
Degree requires.
What the utility model obtained is pure hardware one tensioning member, can break through the most thin limit of pure plastic cement, most thin to accomplish
0.03~0.15mm scope, vacate to mobile phone single camera, the encapsulation of dual camera module chip and more use space.
What the utility model obtained is pure hardware one tensioning member, because using simple metal drawing and forming, is significantly increased
Intensity, can effectively solve the problem that do pure plastic parts it is thin after intensity deficiency the shortcomings that.
In addition, the utility model can solve the aging disadvantages that plastic cement uses process for a long time.Further, since heat dispersion carries
Height, the utility model can aid in distributing sensitive chip heat caused by carry out photoelectric conversion, being capable of quick heat radiating.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality
Apply all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, the scope that this specification is recorded all is considered to be.
Embodiment described above only expresses several embodiments of the present utility model, and its description is more specific and detailed,
But therefore it can not be interpreted as the limitation to utility model patent scope.It should be pointed out that the common skill for this area
For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to
The scope of protection of the utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.
Claims (10)
- A kind of 1. camera module chip package base, it is characterised in that including：Metab, including second supporting part at first supporting part at center and edge, first supporting part is relative to second Supporting part depression is set, and first supporting part is enclosed provided with loophole, and the edge of second supporting part is further bent and shape Into leg.
- 2. camera module chip package base according to claim 1, it is characterised in that the leg is included from second The connecting portion that extends after the edge bending of supporting part, from extension and the branch parallel with the second supporting part after the bending of the end of connecting portion Support part.
- 3. camera module chip package base according to claim 2, it is characterised in that the supporting part is along away from the The direction extension of one supporting part.
- 4. camera module chip package base according to claim 2, it is characterised in that second supporting part is provided with Four edges, each edge are each formed with the leg at one, and the supporting part of the leg is coplanar.
- 5. camera module chip package base according to claim 4, it is characterised in that surrounded between the supporting part Receiving space.
- 6. camera module chip package base according to claim 1, it is characterised in that the table of first supporting part Formed with the sticking insulating barrier of tool on face.
- 7. camera module chip package base according to claim 1, it is characterised in that the metab has two First supporting part and the second supporting part at place, wherein the second supporting part at two is connected.
- 8. camera module chip package base according to claim 1, it is characterised in that the metab is proof gold Belong to part, stainless steel part or alloy components.
- 9. camera module chip package base according to claim 1, it is characterised in that the metab is The integral piece that metal sheet is formed by stretching mode.
- 10. camera module chip package base according to claim 9, it is characterised in that the thickness of the metal sheet Spend for 0.03~0.15 millimeter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721034172.6U CN207099191U (en) | 2017-08-17 | 2017-08-17 | Camera module chip package base |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721034172.6U CN207099191U (en) | 2017-08-17 | 2017-08-17 | Camera module chip package base |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207099191U true CN207099191U (en) | 2018-03-13 |
Family
ID=61542026
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721034172.6U Active CN207099191U (en) | 2017-08-17 | 2017-08-17 | Camera module chip package base |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207099191U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111736289A (en) * | 2019-03-25 | 2020-10-02 | 信泰光学(深圳)有限公司 | Optical module |
-
2017
- 2017-08-17 CN CN201721034172.6U patent/CN207099191U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111736289A (en) * | 2019-03-25 | 2020-10-02 | 信泰光学(深圳)有限公司 | Optical module |
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