CN207019617U - Wafer surface flatness detector - Google Patents
Wafer surface flatness detector Download PDFInfo
- Publication number
- CN207019617U CN207019617U CN201720757272.5U CN201720757272U CN207019617U CN 207019617 U CN207019617 U CN 207019617U CN 201720757272 U CN201720757272 U CN 201720757272U CN 207019617 U CN207019617 U CN 207019617U
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- China
- Prior art keywords
- instrument board
- supporting plate
- rotating disc
- amesdial
- wafer surface
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Length Measuring Devices With Unspecified Measuring Means (AREA)
Abstract
Wafer surface flatness detector, three to four amesdials are installed on its instrument board, amesdial is fixed with the fixing screws of instrument board side, one side lower part of instrument board is provided with two locating dowels, three support feets, instrument board is placed on supporting plate, chip is uniformly placed in supporting plate upper outer circumference, supporting plate is placed on rotating disc center, rotate the locating pin that panel surface side is provided with two supporting plates, rotate and multigroup parallel double card groove is machined with panel surface excircle, rotating disc is arranged on bottom plate by annular bearing.Using this technology, place the wafer on the outer circumference surface of supporting plate surface, the measurement column of amesdial on instrument board is placed on same wafer surface, operator once obtains the measurement data of the multiple diverse locations of wafer surface, so as to be rapidly completed the detection to wafer flatness, only need to rotate rotating disc after being measured, you can repeat aforesaid operations, be rapidly completed the detection of more wafers on supporting plate.
Description
Technical field
This technology belongs to wafer detecting device technical field, is related to a kind of wafer surface flatness detector.
Background technology
After chip is cut down in flakes from crystal bar, fine grinding is polished, flatness detection is then carried out, works as detected value
Product is qualified when in the error range of permission.In the prior art, detect the detector of wafer surface flatness by instrument board and
The amesdial composition of installation on the dash panel, three support feets are provided with the downside of instrument board, install one thousand on the dash panel
Divide table, the measurement column of amesdial passes through instrument board, and measured object surface is touched in lower end.When use, survey chip will be waited to be placed on
On one smooth supporting plate, three support feets of instrument board are placed on chip periphery, the measurement column lower end of amesdial on supporting plate
Touch wafer surface, amesdial shows survey measurements, and repeatedly traverse measurement post in the position of wafer surface, records reading, meter again
Minimum value and the average value of the difference of other numbers of measurement every time are calculated, product is qualified when average value is less than regulation.Because the detection is every
It is secondary to detect a point, and per the value for needing to detect on a piece of corresponding to the point of at least three diverse locations, therefore, operator
, it is necessary to record data after the value each put of detection, correction data again after having detected, judge whether the wafer flatness is qualified,
Wafer surface flatness is detected using this detector, service speed is slow, and operating efficiency is low.
The content of the invention
It is an object of the invention to provide a kind of wafer surface flatness detector, solves in the prior art, existing chip
Detecting instrument for surface planeness service speed is slow, ineffective problem.
The technical scheme is that:A kind of wafer surface flatness detector, is provided with length phase under its instrument board
With three support feets, amesdial is installed on instrument board, the detector by circle instrument board, supporting plate, rotating disc and bottom plate group
Into, three to four equally distributed amesdials are installed on the dash panel, the measurement column lower end of amesdial on a horizontal plane,
The horizontal plane is parallel with the plane that three support feet lower ends determine, amesdial is fixed with the fixing screws of instrument board side, instrument
One side lower part of plate is provided with two locating dowels, and instrument board is placed on supporting plate, and chip, instrument are uniformly placed in supporting plate upper outer circumference
Support feet on dash board is supported on chip periphery, and the measurement column of amesdial is located in same wafer surface, and supporting plate, which is placed on, to be turned
Moving plate center, the locating pin that panel surface side is provided with two supporting plates is rotated, rotate and multigroup put down is machined with panel surface excircle
Capable double card groove, center is provided with annular bearing below rotating disc, and annular bearing is installed below on bottom plate.
Using technical scheme, supporting plate is placed on rotating disc first, pallet side is withstood on rotating disc
In locating pin, the chip of waxing is uniformly distributed and is placed on the outer circumference surface of supporting plate surface, underdash locating dowel is by rotating
Double card groove on disk slips into, and the measurement column of the amesdial on instrument board touches same wafer surface, and operator once obtains chip
The measurement data of the multiple diverse locations in surface, so as to be rapidly completed the detection to wafer flatness.
Because the supporting plate last time can place more wafers, in the case that survey crew does not move in position, it is only necessary to rotate
Rotating disc, you can repeat aforesaid operations, be rapidly completed the detection of more wafers on supporting plate.
Greatly improved using the efficiency detected after this technology, the operating efficiency of testing staff declines to a great extent.
Brief description of the drawings
Fig. 1 is lateral structure schematic diagram of the present utility model.
Fig. 2 is the vertical view figure structure schematic representation in the utility model.
Specific embodiment
Embodiment, as depicted in figs. 1 and 2:A kind of wafer surface flatness detector, length is installed under its instrument board 8
Three support feets 7 of identical are spent, amesdial 9 are installed, the detector is by circular instrument board 8, supporting plate 1, rotating disc on instrument board 8
2 and bottom plate 4 form, four equally distributed amesdials 9 are installed on instrument board 8, the lower end of measurement column 10 of amesdial 9 is one
On individual horizontal plane, the horizontal plane is parallel with the plane that three lower ends of support feet 7 determine, the fixation of the side of instrument board 8 of amesdial 9
Screw 11 is fixed, and a side lower part of instrument board 8 is provided with two locating dowels 12, and instrument board 8 is placed on supporting plate 1, outer on supporting plate 1
Chip 6 is uniformly placed in circumference, the support feet 7 on instrument board 8 is supported on the periphery of chip 6, and the measurement column 10 of amesdial 9 is positioned at same
In one piece of wafer surface, supporting plate 1 is placed on the center of rotating disc 2, and the surface side of rotating disc 2 is provided with the locating pin of two supporting plates 1
3, seven groups of parallel double card grooves 13 are machined with the surface excircle of rotating disc 2, and center is provided with annular bearing below rotating disc 2
5, annular bearing 5 is installed below on bottom plate 4.
Claims (1)
1. wafer surface flatness detector, in its instrument board(8)Under three support feets of length identical are installed(7), instrument
Plate(8)Upper installation amesdial(9), it is characterised in that:The detector is by circular instrument board(8), supporting plate(1), rotating disc(2)With
Bottom plate(4)Composition, in instrument board(8)On three to four equally distributed amesdials are installed(9), amesdial(9)Measurement column
(10)Lower end is on a horizontal plane, the horizontal plane and three support feets(7)The plane that lower end determines is parallel, amesdial(9)With
Instrument board(8)The fixing screws of side(11)It is fixed, instrument board(8)A side lower part two locating dowels are installed(12), instrument
Plate(8)It is placed on supporting plate(1)On, supporting plate(1)Chip is uniformly placed in upper outer circumference(6), instrument board(8)On support feet(7)
It is supported on chip(6)Periphery, amesdial(9)Measurement column(10)In same wafer surface, supporting plate(1)It is placed on rotation
Disk(2)Center, rotating disc(2)Surface side is provided with two supporting plates(1)Locating pin(3), rotating disc(2)On the excircle of surface
It is machined with multigroup parallel double card groove(13), in rotating disc(2)Center is provided with annular bearing below(5), annular bearing(5)Under
Face is arranged on bottom plate(4)On.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201720757272.5U CN207019617U (en) | 2017-06-27 | 2017-06-27 | Wafer surface flatness detector |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201720757272.5U CN207019617U (en) | 2017-06-27 | 2017-06-27 | Wafer surface flatness detector |
Publications (1)
Publication Number | Publication Date |
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CN207019617U true CN207019617U (en) | 2018-02-16 |
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CN201720757272.5U Active CN207019617U (en) | 2017-06-27 | 2017-06-27 | Wafer surface flatness detector |
Country Status (1)
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CN (1) | CN207019617U (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108775854A (en) * | 2018-07-13 | 2018-11-09 | 安徽悦众车身装备有限公司 | A kind of automobile cylinder housing mould assembling surface smoothness detecting tool |
CN110514123A (en) * | 2019-09-20 | 2019-11-29 | 成都博奥晶芯生物科技有限公司 | A kind of microstructured bodies two-dimensional detecting method and device based on laser displacement sensor |
CN110823055A (en) * | 2018-08-13 | 2020-02-21 | 奇景光电股份有限公司 | Measuring jig |
CN112050719A (en) * | 2020-08-31 | 2020-12-08 | 华虹半导体(无锡)有限公司 | Wafer warping degree detection device and method |
CN113503802A (en) * | 2021-07-30 | 2021-10-15 | 东风汽车集团股份有限公司 | Oil seal end face run-out detection device and detection method |
CN114001632A (en) * | 2021-11-02 | 2022-02-01 | 中国科学院光电技术研究所 | Flatness detection device and detection method for large ultra-precise annular plane |
CN117073614A (en) * | 2023-10-17 | 2023-11-17 | 青岛国工新钻材料科技有限公司 | Diamond wafer measuring device and measuring method thereof |
WO2024041322A1 (en) * | 2022-08-25 | 2024-02-29 | Tcl Zhonghuan Renewable Energy Technology Co., Ltd. | Surface flatness detecting device for single crystal square rod |
-
2017
- 2017-06-27 CN CN201720757272.5U patent/CN207019617U/en active Active
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108775854A (en) * | 2018-07-13 | 2018-11-09 | 安徽悦众车身装备有限公司 | A kind of automobile cylinder housing mould assembling surface smoothness detecting tool |
CN110823055A (en) * | 2018-08-13 | 2020-02-21 | 奇景光电股份有限公司 | Measuring jig |
CN110823055B (en) * | 2018-08-13 | 2022-04-22 | 奇景光电股份有限公司 | Measuring jig |
CN110514123A (en) * | 2019-09-20 | 2019-11-29 | 成都博奥晶芯生物科技有限公司 | A kind of microstructured bodies two-dimensional detecting method and device based on laser displacement sensor |
CN110514123B (en) * | 2019-09-20 | 2021-04-02 | 成都博奥晶芯生物科技有限公司 | Microstructure two-dimensional detection method and device based on laser displacement sensor |
CN112050719A (en) * | 2020-08-31 | 2020-12-08 | 华虹半导体(无锡)有限公司 | Wafer warping degree detection device and method |
CN113503802A (en) * | 2021-07-30 | 2021-10-15 | 东风汽车集团股份有限公司 | Oil seal end face run-out detection device and detection method |
CN114001632A (en) * | 2021-11-02 | 2022-02-01 | 中国科学院光电技术研究所 | Flatness detection device and detection method for large ultra-precise annular plane |
CN114001632B (en) * | 2021-11-02 | 2023-09-19 | 中国科学院光电技术研究所 | Flatness detection device and detection method for large ultra-precise annular plane |
WO2024041322A1 (en) * | 2022-08-25 | 2024-02-29 | Tcl Zhonghuan Renewable Energy Technology Co., Ltd. | Surface flatness detecting device for single crystal square rod |
CN117073614A (en) * | 2023-10-17 | 2023-11-17 | 青岛国工新钻材料科技有限公司 | Diamond wafer measuring device and measuring method thereof |
CN117073614B (en) * | 2023-10-17 | 2024-01-12 | 青岛国工新钻材料科技有限公司 | Diamond wafer measuring device and measuring method thereof |
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Legal Events
Date | Code | Title | Description |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20180518 Address after: 653101 North Hongta Town, Hongta District, Yuxi, China Patentee after: Yunnan langene Technology Co. Ltd. Address before: 322000 No. 126 Sufu Road, Suxi Town, Yiwu City, Jinhua, Zhejiang Patentee before: Aquamarine Technology (Yiwu) Co. Ltd. |
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TR01 | Transfer of patent right |