CN117073614B - Diamond wafer measuring device and measuring method thereof - Google Patents
Diamond wafer measuring device and measuring method thereof Download PDFInfo
- Publication number
- CN117073614B CN117073614B CN202311342857.7A CN202311342857A CN117073614B CN 117073614 B CN117073614 B CN 117073614B CN 202311342857 A CN202311342857 A CN 202311342857A CN 117073614 B CN117073614 B CN 117073614B
- Authority
- CN
- China
- Prior art keywords
- plate
- fixedly connected
- threaded rod
- diamond wafer
- bevel gear
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000010432 diamond Substances 0.000 title claims abstract description 82
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 82
- 238000000034 method Methods 0.000 title abstract description 12
- 238000001514 detection method Methods 0.000 claims abstract description 43
- 230000002457 bidirectional effect Effects 0.000 claims description 31
- 230000033001 locomotion Effects 0.000 claims description 21
- 230000005540 biological transmission Effects 0.000 claims description 11
- 238000005259 measurement Methods 0.000 claims description 4
- 238000000691 measurement method Methods 0.000 claims description 3
- 238000012545 processing Methods 0.000 claims description 3
- 238000007689 inspection Methods 0.000 claims 2
- 238000001125 extrusion Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 47
- 230000002441 reversible effect Effects 0.000 description 4
- 230000001360 synchronised effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 241000283070 Equus zebra Species 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000010437 gem Substances 0.000 description 1
- 229910001751 gemstone Inorganic materials 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002113 nanodiamond Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229910052611 pyroxene Inorganic materials 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
- G01B21/30—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring roughness or irregularity of surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The invention discloses a diamond wafer measuring device and a measuring method thereof, which relate to the technical field of application of diamond detection equipment and currently provide the following scheme, wherein the device comprises a machine body and a driving mechanism, wherein the driving mechanism is arranged in the machine body; the positioning mechanism is arranged above the machine body, one end of the positioning mechanism is connected with the driving mechanism, the positioning mechanism comprises a linkage plate movably sleeved with the machine body and a positioning baffle fixedly connected with the linkage plate, and the driving mechanism drives the linkage plate to move up and down and simultaneously drives the positioning baffle to move up and down synchronously. The invention can accurately position the diamond wafer to be detected, simultaneously carry out clamping and fixing treatment during detection, not only can carry out flatness detection treatment on the surface plane of the diamond wafer, but also can carry out flatness detection treatment on the circumferential surface and circumference of the diamond wafer, thereby effectively improving the effect and efficiency of detecting the diamond wafer.
Description
Technical Field
The invention relates to the technical field of application of diamond detection equipment, in particular to a diamond wafer measuring device and a measuring method thereof.
Background
The diamond is a natural element mineral composed of carbon elements, the crystal is in an octahedron, a rhombohedron and a cube, and is also in a shape of a polymer sometimes, and is colorless and transparent, the diamond is formed under the conditions of high temperature and high pressure in the deep part of the earth, is mainly produced in kimberlite, kalium magnesian zebra and pyroxene, is mainly produced in the regions of south africa, russia, australia and the like in the world, the diamond in China is mainly produced in Shandong Mongolian, liaoning tile shop and Hunan Yuan river basin, the application of the diamond is very wide, the diamond in the precious stone grade can be cut into the diamond, the thermal conductivity and the resistivity of the diamond are the highest in all substances, the nano diamond film can be deposited on the surface of electronic component materials, the size of the radiating part of the diamond can be reduced, and the infrared window of satellites and high-power lasers can be manufactured by utilizing the excellent infrared penetrability of the diamond;
the existing diamond wafer is required to be detected after the cultivation, the manufacturing and the shaping are finished, the existing detection equipment is divided into a plurality of types, different equipment is required to be used for detecting different positions, or the position of the diamond wafer to be detected is changed, so that the detection effect and the efficiency are affected.
Disclosure of Invention
The invention provides a diamond wafer measuring device and a measuring method thereof, which are used for solving the defects in the prior art.
In order to achieve the above purpose, the present invention adopts the following technical scheme:
the diamond wafer measuring device comprises a machine body and a driving mechanism, wherein the driving mechanism is arranged in the machine body;
the positioning mechanism is arranged above the machine body, one end of the positioning mechanism is connected with the driving mechanism, the positioning mechanism comprises a linkage plate movably sleeved with the machine body and a positioning baffle fixedly connected with the linkage plate, and the driving mechanism drives the linkage plate to move up and down and simultaneously drives the positioning baffle to synchronously move up and down;
the fixing mechanism is arranged above the machine body, one end of the fixing mechanism is connected with the driving mechanism, the fixing mechanism comprises a threaded rod, a moving plate sleeved with the threaded rod in a threaded mode and a traction rod fixedly connected to the bottom of the moving plate, the driving mechanism drives the threaded rod to rotate, the rotating of the threaded rod drives the moving plate to synchronously move, and the moving of the moving plate drives the traction rod to move;
the surface flatness detection mechanism is arranged below the movable plate and comprises a sleeve rotationally connected with the traction rod and a linkage frame fixedly connected below the sleeve;
the circumference detection mechanism is arranged above the machine body, one end of the circumference detection mechanism is connected with the driving mechanism, the circumference detection mechanism comprises a bidirectional threaded rod connected with the interior of the machine body in a rotating mode, a movable frame sleeved with the bidirectional threaded rod respectively in a threaded mode and a supporting plate fixedly connected to the top of the movable frame, the driving mechanism drives the bidirectional threaded rod to rotate, and the bidirectional threaded rod rotates to synchronously drive the movable frame and the supporting plate to move.
Further, the driving mechanism comprises a double-shaft motor fixedly connected with the inside of the machine body, and a first bevel gear and a second bevel gear are fixedly sleeved on output shafts at two ends of the double-shaft motor respectively.
Further, fixed establishment still includes the first guide bar with organism top fixed connection, the movable plate corresponds threaded rod and first guide bar and is equipped with first screw hole and first guiding hole respectively, the inside at first screw hole is established to threaded rod thread bush, first guide bar movable sleeve establishes the inside at first guiding hole, the bottom fixedly connected with grip block of traction lever, threaded rod corresponds second bevel gear department fixedly connected with third bevel gear, one side and the second bevel gear meshing transmission of third bevel gear.
Further, the surface flatness detection mechanism further comprises a driving motor fixedly connected with the top of the movable plate, a first gear is fixedly connected with an output shaft of the driving motor, a second gear is fixedly connected with a sleeve corresponding to the first gear, one side of the second gear is in meshed transmission with the first gear, a plurality of first detectors are fixedly connected to an array on the linkage frame, and clamping plates are symmetrically and fixedly connected to the linkage frame.
Further, circumference detection mechanism still includes the fourth bevel gear of establishing with the fixed cover of two-way threaded rod, one side and the first bevel gear meshing transmission of fourth bevel gear, the inside fixedly connected with second guide bar of organism, second screw hole and second guiding hole have been seted up respectively to the corresponding two-way threaded rod of movable frame and second guide bar, the inside at the second screw hole is established to the two-way threaded rod thread bush, the inside at the second guiding hole is established to the movable cover of second guide bar, the top fixedly connected with arc guide rail of backup pad, the inside movable cover of arc guide rail is equipped with the movable block, fixed cover is equipped with the second detector on the movable block, the movable groove has been seted up in the backup pad, the inside movable cover of movable groove is equipped with the spacing, the one end fixedly connected with locking plate of spacing, first draw-in groove has been seted up to corresponding second detector department on the locking plate, one side movable cover of second detector is established in the inside of first draw-in groove, one side fixedly connected with fixed plate of backup pad, fixedly connected with spring resistance between fixed plate and the locking plate.
Further, the positioning mechanism further comprises a through hole which is formed in the top of the machine body, the linkage plate is movably sleeved inside the through hole, a sliding groove is formed in the linkage plate, a sliding block is fixedly connected to the inside of the through hole corresponding to the sliding groove, the sliding block is movably sleeved inside the sliding groove, a third gear is fixedly sleeved on the bidirectional threaded rod, a rack is fixedly connected to the linkage plate corresponding to the third gear, and one side of the rack is in meshed transmission with the third gear.
Further, the top fixedly connected with of organism places the round platform, the bottom fixedly connected with supporting seat of organism, the cardboard corresponds second detector department and has seted up the second draw-in groove, second detector movable sleeve establishes the inside at the second draw-in groove, the cooperation chamfer has been seted up respectively to cardboard and locking plate's both sides.
A diamond wafer measurement method, which is suitable for the diamond wafer measurement device described in any one of the above, comprising the following steps:
step one: placing the diamond wafer to be detected on the placing round table through a positioning baffle, and enabling the placed diamond wafer to be positioned at the center of the placing round table through the positioning baffle;
step two: after the diamond wafer to be detected is placed, the double-shaft motor is started positively, synchronous rotation of the first bevel gear and the second bevel gear is synchronously driven through forward starting of the double-shaft motor, the rotation of the first bevel gear is meshed with the fourth bevel gear, the rotation of the fourth bevel gear drives the rotation of the bidirectional threaded rod, the rotation of the bidirectional threaded rod drives the moving frame to move towards the middle, meanwhile, the rotation of the bidirectional threaded rod drives the rotation of the third gear, the rotation of the third gear synchronously drives the rack to move, meanwhile, the linkage plate 5 is driven to move, the positioned diamond wafer is released through the movement of the linkage plate, meanwhile, the moving frame drives the supporting plate to synchronously move when moving towards the middle, the movement of the supporting plate drives the arc guide rail and the second detector to synchronously move, and meanwhile, the detecting head of the second detector is enabled to contact with the circumference surface of the diamond wafer to be detected;
step three: the rotation of the second bevel gear is synchronously meshed with the rotation of the third bevel gear, the rotation of the third bevel gear drives the rotation of the threaded rod, the rotation of the threaded rod drives the movable plate to synchronously move, the movement of the movable plate drives the traction rod and the clamping plate to move, the diamond wafer to be detected is clamped and fixed through the movement of the clamping plate, the linkage frame and the first detector are simultaneously driven to move, the detection head of the first detector is simultaneously contacted with the upper surface of the diamond wafer to be detected, the clamp plate is driven to synchronously downwards when the linkage frame downwards moves, the locking plate is downwards extruded, and the second detector is in limiting contact through downwards extruding the locking plate;
step four: when the locking plate carries out spacing contact to the second detector, biax motor stop work, simultaneously driving motor carries out forward start, the rotation of driving motor drives first gear when the start-up of driving motor, the rotation of first gear rotates with the second gear meshing, the rotation through the rotation drive sleeve pipe of second gear rotates, rotate when sheathed tube rotation drive interlock frame, the rotation drive first detector of interlock frame carries out the roughness and detects the processing to the upper surface of treating the diamond wafer, the rotation of interlock frame drives the second detector through the cardboard and carries out the motion around the arc guide rail, when the one end of arc guide rail is moved to the second detector, driving motor reverse start, the driving motor reverse start back drives the second detector and moves to the arc guide rail other end, because the cooperation chamfer has been seted up to cardboard and locking plate symmetry, the cardboard makes the locking plate move downwards when leading to cardboard and locking plate butt, make the second detector move to the opposite side of arc guide rail smoothly, carry out the roughness and circumference detection processing to the circumference surface of treating the diamond wafer through the circumferential motion of second detector.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the invention, power output treatment is carried out on equipment and fixed clamping treatment is carried out during rapid and accurate placement and detection of diamond wafers to be detected by installing a driving mechanism, a positioning mechanism and a fixing mechanism, wherein the driving mechanism respectively drives synchronous rotation of a first bevel gear and a second bevel gear through starting of a double-shaft motor, the rotation of the first bevel gear synchronously drives synchronous rotation of a bidirectional threaded rod, meanwhile, the rotation of the threaded rod is driven through the rotation of the second bevel gear, and the movement treatment of a clamping plate is driven through the rotation of the threaded rod;
2. the invention carries out flatness and circumference detection treatment on the upper surface and the circumference surface of a diamond wafer to be detected by installing a surface flatness detection mechanism and a circumference detection mechanism, wherein the surface flatness detection mechanism drives the rotation of a sleeve by the starting of a driving motor, the rotation of the sleeve synchronously drives the rotation of a linkage frame, and the rotation of the linkage frame synchronously drives a second detector to synchronously carry out circumference movement treatment;
in summary, the device has novel design and simple operation, the device not only can accurately position the diamond wafer to be detected, but also can carry out clamping and fixing treatment during detection, and can carry out flatness detection treatment on the surface plane of the diamond wafer, and simultaneously can carry out flatness detection treatment on the circumferential surface and circumference of the diamond wafer, thereby effectively improving the effect and efficiency of diamond wafer detection.
Drawings
FIG. 1 is a schematic diagram of a diamond wafer measuring apparatus and a method for measuring the same according to the present invention;
FIG. 2 is a schematic diagram of a driving mechanism of a device and a method for measuring a diamond wafer according to the present invention;
FIG. 3 is a schematic view of a partial bottom perspective structure of a driving mechanism and a circumference detecting mechanism of a diamond wafer measuring device and a measuring method thereof according to the present invention;
FIG. 4 is a schematic view of a partial bottom perspective structure of a circumference detecting mechanism of a diamond wafer measuring device and a measuring method thereof according to the present invention;
FIG. 5 is a schematic view showing a bottom perspective structure of a circumference detecting mechanism of a diamond wafer measuring device and a measuring method thereof according to the present invention;
FIG. 6 is a schematic bottom perspective view of a fixture mechanism of a diamond wafer measuring apparatus and a measuring method thereof according to the present invention;
fig. 7 is a schematic bottom perspective view of a surface flatness detecting mechanism of a diamond wafer measuring device and a measuring method thereof according to the present invention.
In the figure: 1. a body; 2. a biaxial motor; 3. a first bevel gear; 4. a second bevel gear; 5. a linkage plate; 6. positioning a baffle; 7. a threaded rod; 8. a moving plate; 9. a traction rod; 10. a clamping plate; 11. a first guide bar; 12. a third bevel gear; 13. a sleeve; 14. a linkage frame; 15. a first detector; 16. a second gear; 17. a driving motor; 18. a first gear; 19. a clamping plate; 20. a two-way threaded rod; 21. a fourth bevel gear; 22. a moving rack; 23. a support plate; 24. an arc-shaped guide rail; 25. a moving block; 26. a second detector; 27. a limit bar; 28. a locking plate; 29. a fixing plate; 30. a resistance spring; 31. a third gear; 32. a rack; 33. and a second guide bar.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more of the described features. In the description of the present invention, the meaning of "a plurality" is two or more, unless explicitly defined otherwise. Furthermore, the terms "mounted," "connected," "coupled," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the terms in the present invention will be understood by those skilled in the art in detail, and the present invention will be further described in detail with reference to the accompanying drawings.
Example 1
Referring to fig. 1-7: the diamond wafer measuring device comprises a machine body 1 and a driving mechanism, wherein the driving mechanism is arranged in the machine body 1 and is used for carrying out power output treatment on equipment;
the positioning mechanism is arranged above the machine body 1, one end of the positioning mechanism is connected with the driving mechanism, the positioning mechanism comprises a linkage plate 5 movably sleeved with the machine body 1 and a positioning baffle plate 6 fixedly connected with the linkage plate 5, the driving mechanism drives the linkage plate 5 to move up and down, and meanwhile, the positioning baffle plate 6 is driven to move up and down synchronously, and the positioning mechanism is used for accurately positioning the diamond wafer to be detected;
the fixing mechanism is arranged above the machine body 1, one end of the fixing mechanism is connected with the driving mechanism, the fixing mechanism comprises a threaded rod 7, a movable plate 8 sleeved with the threaded rod 7 in a threaded mode and a traction rod 9 fixedly connected to the bottom of the movable plate 8, the driving mechanism drives the threaded rod 7 to rotate, the rotation of the threaded rod 7 drives the movable plate 8 to synchronously move, the movement of the movable plate 8 drives the traction rod 9 to move, and the clamping and fixing treatment of diamond wafers to be detected is carried out through the fixing mechanism, so that displacement influence on detection results caused by the diamond wafers during detection is effectively avoided;
the surface flatness detection mechanism is arranged below the movable plate 8 and comprises a sleeve 13 rotationally connected with the traction rod 9 and a linkage frame 14 fixedly connected below the sleeve 13, and the surface flatness detection mechanism is used for detecting the surface flatness of the diamond wafer;
the circumference detection mechanism is arranged above the machine body 1, one end of the circumference detection mechanism is connected with the driving mechanism, the circumference detection mechanism comprises a bidirectional threaded rod 20 which is rotationally connected with the inside of the machine body 1, a movable frame 22 which is respectively sleeved with the bidirectional threaded rod 20 in a threaded manner, and a supporting plate 23 which is fixedly connected to the top of the movable frame 22, the driving mechanism drives the bidirectional threaded rod 20 to rotate, and the bidirectional threaded rod 20 rotates to synchronously drive the movable frame 22 and the supporting plate 23 to move, so that the circumference flatness of the outer surface of the diamond wafer is detected and treated through the circumference detection mechanism.
In the invention, the driving mechanism comprises a double-shaft motor 2 fixedly connected with the inside of the machine body 1, wherein a first bevel gear 3 and a second bevel gear 4 are respectively fixedly sleeved on output shafts at two ends of the double-shaft motor 2, and the starting of the double-shaft motor 2 synchronously drives the first bevel gear 3 and the second bevel gear 4 to rotate.
In the invention, the fixing mechanism further comprises a first guide rod 11 fixedly connected with the top of the machine body 1, a first threaded hole and a first guide hole are respectively formed in the moving plate 8 corresponding to the threaded rod 7 and the first guide rod 11, the threaded rod 7 is sleeved in the first threaded hole in a threaded manner, the first guide rod 11 is movably sleeved in the first guide hole, the bottom end of the traction rod 9 is fixedly connected with a clamping plate 10, a third bevel gear 12 is fixedly connected to the position, corresponding to the second bevel gear 4, of the threaded rod 7, one side of the third bevel gear 12 is in meshed transmission with the second bevel gear 4, the rotation of the second bevel gear 4 synchronously drives the rotation of the third bevel gear 12, and the rotation of the third bevel gear 12 drives the rotation of the threaded rod 7.
In the invention, the surface flatness detection mechanism further comprises a driving motor 17 fixedly connected with the top of the moving plate 8, a first gear 18 is fixedly connected with an output shaft of the driving motor 17, a second gear 16 is fixedly connected with a position of the sleeve 13 corresponding to the first gear 18, one side of the second gear 16 is meshed with the first gear 18 for transmission, a plurality of first detectors 15 are fixedly connected with an array on the linkage frame 14, clamping plates 19 are symmetrically and fixedly connected with the linkage frame 14, and the movement of the linkage frame 14 synchronously drives the clamping plates 19 to move.
According to the invention, the circumference detection mechanism further comprises a fourth bevel gear 21 fixedly sleeved with the bidirectional threaded rod 20, one side of the fourth bevel gear 21 is in meshed transmission with the first bevel gear 3, a second guide rod 33 is fixedly connected to the inside of the machine body 1, a second threaded hole and a second guide hole are respectively formed in the movable frame 22 corresponding to the bidirectional threaded rod 20 and the second guide rod 33, the bidirectional threaded rod 20 is in threaded sleeve mode in the second threaded hole, the second guide rod 33 is movably sleeved in the second guide hole, the top of the supporting plate 23 is fixedly connected with the arc-shaped guide rail 24, a movable block 25 is movably sleeved in the arc-shaped guide rail 24, a second detector 26 is fixedly sleeved on the movable block 25, a movable groove is formed in the supporting plate 23, a limit bar 27 is movably sleeved in the movable groove, one end of the limit bar 27 is fixedly connected with a locking plate 28, a first clamping groove is formed in the locking plate 28 corresponding to the second detector 26, one side of the second detector 26 is movably sleeved in the first clamping groove, one side of the supporting plate 23 is fixedly connected with a fixed plate 29, a resistance 30 is fixedly connected between the fixed plate 29 and the locking plate 28, and the resistance 30 is fixedly connected with the resistance 30, and the resistance 30 is used for limiting the movement of the spring 28 through the resistance.
In the invention, the positioning mechanism further comprises a through hole formed in the top of the machine body 1, the linkage plate 5 is movably sleeved in the through hole, a sliding groove is formed in the linkage plate 5, a sliding block is fixedly connected to the position, corresponding to the sliding groove, in the through hole, the sliding block is movably sleeved in the sliding groove, a third gear 31 is fixedly sleeved on the bidirectional threaded rod 20, a rack 32 is fixedly connected to the position, corresponding to the third gear 31, of the linkage plate 5, one side of the rack 32 is in meshed transmission with the third gear 31, and the rotation of the third gear 31 drives the rack 32 to synchronously move.
According to the invention, the top of the machine body 1 is fixedly connected with a placing round table, the bottom of the machine body 1 is fixedly connected with a supporting seat, a second clamping groove is formed in the position, corresponding to the second detector 26, of the clamping plate 19, the second detector 26 is movably sleeved in the second clamping groove, two sides of the clamping plate 19 and the locking plate 28 are respectively provided with a matched chamfer, and the clamping plate 19 is matched with the second detector 26, so that the clamping plate 19 drives the second detector 26 to slowly move along the arc-shaped guide rail 24.
Example 2
The embodiment provides a technical scheme based on the first embodiment: a diamond wafer measurement method, which is suitable for any one of the above diamond wafer measurement apparatuses, comprising the steps of:
step one: the diamond wafer to be detected is placed on the placing round table through the positioning baffle 6, and the placed diamond wafer is positioned at the center of the placing round table through the positioning baffle 6;
step two: after the diamond wafer is placed, the double-shaft motor 2 is started positively, the first bevel gear 3 and the second bevel gear 4 are synchronously driven to synchronously rotate through the forward starting of the double-shaft motor 2, the first bevel gear 3 is meshed with the fourth bevel gear 21, the bidirectional threaded rod 20 is driven to rotate through the rotation of the fourth bevel gear 21, the moving frame 22 is driven to move towards the middle through the rotation of the bidirectional threaded rod 20, the third gear 31 is driven to rotate through the rotation of the bidirectional threaded rod 20, the rack 32 is synchronously driven to move through the rotation of the third gear 31, the linkage plate 5 is driven to move, the positioned diamond wafer is released through the movement of the linkage plate 5, the supporting plate 23 is driven to synchronously move when the moving frame 22 moves towards the middle, the arc-shaped guide rail 24 and the second detector 26 are driven to synchronously move through the movement of the supporting plate 23, and meanwhile the detecting head of the second detector 26 is contacted with the circumferential surface of the diamond wafer to be detected;
step three: the rotation of the second bevel gear 4 is synchronously meshed with the rotation of the third bevel gear 12, the rotation of the third bevel gear 12 drives the rotation of the threaded rod 7, the rotation of the threaded rod 7 drives the moving plate 8 to synchronously move, the movement of the moving plate 8 drives the traction rod 9 and the clamping plate 10 to move, the diamond wafer to be detected is clamped and fixed through the movement of the clamping plate 10, the linkage frame 14 and the first detector 15 are driven to move, the detection head of the first detector 15 is simultaneously contacted with the upper surface of the diamond wafer to be detected, the linkage frame 14 drives the clamping plate 19 to synchronously move downwards when moving downwards, the locking plate 28 is simultaneously extruded downwards, and the second detector 26 is in limiting contact through downwards extruding the locking plate 28;
step four: when the locking plate 28 carries out limit contact on the second detector 26, the double-shaft motor 2 stops working, meanwhile, the driving motor 17 is started in the forward direction, when the driving motor 17 is started to drive the first gear 18 to rotate, the first gear 18 rotates in meshed with the second gear 16, the sleeve 13 is driven to rotate through the rotation of the second gear 16, the interlocking frame 14 is driven to rotate when the sleeve 13 rotates, the first detector 15 is driven to carry out flatness detection treatment on the upper surface of a diamond wafer to be detected through the rotation of the interlocking frame 14, the interlocking frame 14 drives the second detector 26 to move around the arc-shaped guide rail 24 through the clamping plate 19, when the second detector 26 moves to the end position of one end of the arc-shaped guide rail 24, the driving motor 17 is started in the reverse direction, the second detector 26 is driven to move towards the other end of the arc-shaped guide rail 24 after the driving motor 17 is started in the reverse direction, and the clamping plate 19 and the locking plate 28 are symmetrically provided with matched chamfers, so that the clamping plate 19 and the locking plate 28 move downwards when being abutted, the clamping plate 19 and the locking plate 28 smoothly move to the other side of the arc-shaped guide rail 24, and the second detector 26 move smoothly, and the circumference of the diamond wafer to be detected through the circumferential movement of the second detector 26.
The foregoing is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art, who is within the scope of the present invention, should make equivalent substitutions or modifications according to the technical scheme of the present invention and the inventive concept thereof, and should be covered by the scope of the present invention.
Claims (8)
1. A diamond wafer measuring device, comprising a machine body (1), characterized in that;
the driving mechanism is arranged in the machine body (1);
the positioning mechanism is arranged above the machine body (1), one end of the positioning mechanism is connected with the driving mechanism, the positioning mechanism comprises a linkage plate (5) movably sleeved with the machine body (1) and a positioning baffle plate (6) fixedly connected with the linkage plate (5), and the driving mechanism drives the linkage plate (5) to move up and down and simultaneously drives the positioning baffle plate (6) to synchronously move up and down;
the fixing mechanism is arranged above the machine body (1), one end of the fixing mechanism is connected with the driving mechanism, the fixing mechanism comprises a threaded rod (7), a moving plate (8) sleeved with the threaded rod (7) in a threaded mode and a traction rod (9) fixedly connected to the bottom of the moving plate (8), the driving mechanism drives the threaded rod (7) to rotate, the rotation of the threaded rod (7) drives the moving plate (8) to synchronously move, and the movement of the moving plate (8) drives the traction rod (9) to move;
the surface flatness detection mechanism is arranged below the movable plate (8) and comprises a sleeve (13) rotationally connected with the traction rod (9) and a linkage frame (14) fixedly connected below the sleeve (13);
the circumference detection mechanism is arranged above the machine body (1), one end of the circumference detection mechanism is connected with the driving mechanism, the circumference detection mechanism comprises a bidirectional threaded rod (20) which is connected with the inside of the machine body (1) in a rotating mode, a movable frame (22) which is sleeved with the bidirectional threaded rod (20) in a threaded mode and a supporting plate (23) which is fixedly connected to the top of the movable frame (22), the driving mechanism drives the bidirectional threaded rod (20) to rotate, and the rotation of the bidirectional threaded rod (20) synchronously drives the movable frame (22) and the supporting plate (23) to move.
2. The diamond wafer measuring device according to claim 1, wherein the driving mechanism comprises a double-shaft motor (2) fixedly connected with the inside of the machine body (1), and two end output shafts of the double-shaft motor (2) are fixedly sleeved with a first bevel gear (3) and a second bevel gear (4) respectively.
3. The diamond wafer measuring device according to claim 2, wherein the fixing mechanism further comprises a first guide rod (11) fixedly connected with the top of the machine body (1), the moving plate (8) is provided with a first threaded hole and a first guide hole corresponding to the threaded rod (7) and the first guide rod (11) respectively, the threaded rod (7) is sleeved in the first threaded hole in a threaded manner, the first guide rod (11) is movably sleeved in the first guide hole, the bottom end of the traction rod (9) is fixedly connected with a clamping plate (10), the threaded rod (7) is fixedly connected with a third bevel gear (12) corresponding to the second bevel gear (4), and one side of the third bevel gear (12) is meshed with the second bevel gear (4).
4. The diamond wafer measurement device according to claim 2, wherein the surface flatness detection mechanism further comprises a driving motor (17) fixedly connected with the top of the moving plate (8), an output shaft of the driving motor (17) is fixedly connected with a first gear (18), the sleeve (13) is fixedly connected with a second gear (16) corresponding to the first gear (18), one side of the second gear (16) is meshed with the first gear (18) for transmission, a plurality of first detectors (15) are fixedly connected to the array on the linkage frame (14), and clamping plates (19) are symmetrically and fixedly connected to the linkage frame (14).
5. The diamond wafer measuring device according to claim 4, wherein the circumference detecting mechanism further comprises a fourth bevel gear (21) fixedly sleeved with the bidirectional threaded rod (20), one side of the fourth bevel gear (21) is in meshed transmission with the first bevel gear (3), a second guide rod (33) is fixedly connected to the inside of the machine body (1), a second threaded hole and a second guide hole are respectively formed in the movable frame (22) corresponding to the bidirectional threaded rod (20) and the second guide rod (33), the bidirectional threaded rod (20) is in threaded sleeve arrangement in the second threaded hole, the second guide rod (33) is movably sleeved in the second guide hole, an arc-shaped guide rail (24) is fixedly connected to the top of the supporting plate (23), a movable block (25) is movably sleeved in the arc-shaped guide rail (24), a second detector (26) is fixedly sleeved on the movable block (25), a movable groove is formed in the supporting plate (23), a limit bar (27) is correspondingly formed in the movable sleeve, a locking plate (27) is fixedly connected to the first side of the first detector (28), a locking plate (28) is fixedly connected to the second detector (26), a resistance spring (30) is fixedly connected between the fixing plate (29) and the locking plate (28).
6. The diamond wafer measuring device according to claim 1, wherein the positioning mechanism further comprises a through hole formed in the top of the machine body (1), the linkage plate (5) is movably sleeved inside the through hole, a sliding groove is formed in the linkage plate (5), a sliding block is fixedly connected to the position, corresponding to the sliding groove, of the through hole, the sliding block is movably sleeved inside the sliding groove, a third gear (31) is fixedly sleeved on the bidirectional threaded rod (20), a rack (32) is fixedly connected to the position, corresponding to the third gear (31), of the linkage plate (5), and one side of the rack (32) is in meshed transmission with the third gear (31).
7. The diamond wafer measuring device according to claim 5, wherein the top of the machine body (1) is fixedly connected with a placing round table, the bottom of the machine body (1) is fixedly connected with a supporting seat, a second clamping groove is formed in the position, corresponding to the second detector (26), of the clamping plate (19), the second detector (26) is movably sleeved in the second clamping groove, and matching chamfers are respectively formed in two sides of the clamping plate (19) and the locking plate (28).
8. A diamond wafer measurement method suitable for use in a diamond wafer measurement apparatus according to any one of claims 1 to 7, comprising the steps of:
step one: the diamond wafer to be detected is placed on the placing round table through the positioning baffle plate (6), and the placed diamond wafer is positioned at the center of the placing round table through the positioning baffle plate (6);
step two: after the diamond wafer is placed, the double-shaft motor (2) is started positively, the first bevel gear (3) and the second bevel gear (4) are synchronously driven to synchronously rotate through the forward starting of the double-shaft motor (2), the first bevel gear (3) rotates to be meshed with the fourth bevel gear (21), the bidirectional threaded rod (20) is driven to rotate through the rotation of the fourth bevel gear (21), the moving frame (22) is driven to move towards the middle through the rotation of the bidirectional threaded rod (20), meanwhile, the third gear (31) is driven to rotate through the rotation of the bidirectional threaded rod (20), the rack (32) is synchronously driven to move, the linkage plate (5) is driven to move, the positioned diamond wafer is released from positioning through the movement of the linkage plate (5), the supporting plate (23) is synchronously driven to move when the moving frame (22) moves towards the middle, the arc-shaped guide rail (24) and the second detector (26) are synchronously driven to move, and meanwhile, the detecting head of the second detector (26) is contacted with the circumference surface of the diamond wafer to be detected;
step three: the rotation of the second bevel gear (4) is synchronously meshed with the rotation of the third bevel gear (12), the rotation of the third bevel gear (12) drives the threaded rod (7) to rotate, the rotation of the threaded rod (7) drives the moving plate (8) to synchronously move, the movement of the moving plate (8) drives the traction rod (9) and the clamping plate (10) to move, the diamond wafer to be detected is clamped and fixed through the movement of the clamping plate (10), the linkage frame (14) and the first detector (15) are driven to move, the detection head of the first detector (15) is simultaneously contacted with the upper surface of the diamond wafer to be detected, the clamp plate (19) is driven to synchronously move downwards when the linkage frame (14) moves downwards, the locking plate (28) is simultaneously extruded downwards, and the second detector (26) is in limiting contact through downward extrusion of the locking plate (28);
step four: when the locking plate (28) is in limit contact with the second detector (26), the double-shaft motor (2) stops working, meanwhile, the driving motor (17) is started positively, when the driving motor (17) is started to drive the first gear (18) to rotate, the first gear (18) is meshed with the second gear (16) to rotate, the sleeve (13) is driven to rotate through the rotation of the second gear (16), when the sleeve (13) rotates to drive the linkage frame (14) to rotate, when the linkage frame (14) rotates to drive the first detector (15) to carry out flatness detection treatment on the upper surface of a diamond wafer to be detected, the linkage frame (14) rotates to drive the second detector (26) to move around the arc-shaped guide rail (24) through the clamping plate (19), when the second detector (26) moves to the end position of one end of the arc-shaped guide rail (24), the driving motor (17) is reversely started to drive the second detector (26) to move towards the other end of the arc-shaped guide rail (24), and as the clamping plate (19) is matched with the locking plate (28) to enable the clamping plate (19) to move downwards and smoothly when the clamping plate (28) is matched with the locking plate (28) to move downwards, the circumferential surface of the diamond wafer to be inspected is subjected to flatness and circumference inspection processing by the circumferential movement of the second inspection instrument (26).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311342857.7A CN117073614B (en) | 2023-10-17 | 2023-10-17 | Diamond wafer measuring device and measuring method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311342857.7A CN117073614B (en) | 2023-10-17 | 2023-10-17 | Diamond wafer measuring device and measuring method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN117073614A CN117073614A (en) | 2023-11-17 |
| CN117073614B true CN117073614B (en) | 2024-01-12 |
Family
ID=88708426
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311342857.7A Active CN117073614B (en) | 2023-10-17 | 2023-10-17 | Diamond wafer measuring device and measuring method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117073614B (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100960039B1 (en) * | 2009-12-09 | 2010-05-31 | 김정배 | General purpose jig device for inspecting automobile components and base assembly of the same |
| JP2012117811A (en) * | 2010-11-29 | 2012-06-21 | Kunitoshi Nishimura | Wafer flatness measuring method |
| CN207019617U (en) * | 2017-06-27 | 2018-02-16 | 蓝晶科技（义乌）有限公司 | Wafer surface flatness detector |
| CN109282773A (en) * | 2018-11-27 | 2019-01-29 | 常州机电职业技术学院 | Pipe fitting detection device and detection system |
| CN208514373U (en) * | 2018-06-22 | 2019-02-19 | 丹东新东方晶体仪器有限公司 | A kind of sapphire processing positioning surface fixture |
| CN216348341U (en) * | 2021-10-26 | 2022-04-19 | 深圳市荣志成精密机械有限公司 | KSD crosses flatness measuring device for line wheel precision forming |
| CN216558711U (en) * | 2021-09-17 | 2022-05-17 | 江门市安诺特炊具制造有限公司 | Non-contact cookware bottom flatness detection device |
| CN218965192U (en) * | 2022-12-07 | 2023-05-05 | 三公井精密科技(苏州)有限公司 | Clamp for wafer test |
| CN116336982A (en) * | 2023-03-13 | 2023-06-27 | 临沭县金易达机械配件有限公司 | Outer diameter snap ring groove detection mechanism of bearing outer ring |
| CN219531896U (en) * | 2023-03-10 | 2023-08-15 | 南京蔚蓝新材料科技有限公司 | Wafer circumference thickness detection device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5639453B2 (en) * | 2010-01-07 | 2014-12-10 | 株式会社ミツトヨ | Lever type detector, stylus, and automatic stylus changer |
| JP7202232B2 (en) * | 2019-03-22 | 2023-01-11 | 株式会社ミツトヨ | Rotary table and roundness measuring machine |
-
2023
- 2023-10-17 CN CN202311342857.7A patent/CN117073614B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100960039B1 (en) * | 2009-12-09 | 2010-05-31 | 김정배 | General purpose jig device for inspecting automobile components and base assembly of the same |
| JP2012117811A (en) * | 2010-11-29 | 2012-06-21 | Kunitoshi Nishimura | Wafer flatness measuring method |
| CN207019617U (en) * | 2017-06-27 | 2018-02-16 | 蓝晶科技（义乌）有限公司 | Wafer surface flatness detector |
| CN208514373U (en) * | 2018-06-22 | 2019-02-19 | 丹东新东方晶体仪器有限公司 | A kind of sapphire processing positioning surface fixture |
| CN109282773A (en) * | 2018-11-27 | 2019-01-29 | 常州机电职业技术学院 | Pipe fitting detection device and detection system |
| CN216558711U (en) * | 2021-09-17 | 2022-05-17 | 江门市安诺特炊具制造有限公司 | Non-contact cookware bottom flatness detection device |
| CN216348341U (en) * | 2021-10-26 | 2022-04-19 | 深圳市荣志成精密机械有限公司 | KSD crosses flatness measuring device for line wheel precision forming |
| CN218965192U (en) * | 2022-12-07 | 2023-05-05 | 三公井精密科技(苏州)有限公司 | Clamp for wafer test |
| CN219531896U (en) * | 2023-03-10 | 2023-08-15 | 南京蔚蓝新材料科技有限公司 | Wafer circumference thickness detection device |
| CN116336982A (en) * | 2023-03-13 | 2023-06-27 | 临沭县金易达机械配件有限公司 | Outer diameter snap ring groove detection mechanism of bearing outer ring |
Non-Patent Citations (1)
| Title |
|---|
| 光盘母盘平整度检测的研究;陈立强;王林;吴宾初;;应用激光(03);全文 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN117073614A (en) | 2023-11-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100978054B1 (en) | X-ray inspection apparatus for battery | |
| CN209802323U (en) | High-precision sheet metal surface detection device | |
| CN117073614B (en) | Diamond wafer measuring device and measuring method thereof | |
| CN219574292U (en) | Probe station wafer measurement controlling means | |
| CN111912364A (en) | Comprehensive checking fixture for location degree of bearing seat hole of rear cover of axle | |
| CN112621247A (en) | Efficient cutting equipment is used in aluminum product processing | |
| CN219026653U (en) | Internal expanding clamp | |
| CN218082675U (en) | Pipe scriber | |
| CN114030891B (en) | Multifunctional glass moving and carrying device | |
| CN216668639U (en) | Multifunctional checking fixture clamping assembly and checking fixture | |
| CN115930780A (en) | Continuous high-precision measuring mechanism based on optical fiber sensor | |
| CN215510692U (en) | High-precision self-locking clamp | |
| CN114674924A (en) | Ceramic coating spraying degree of consistency detection device | |
| CN207939111U (en) | A kind of cable insulation cutter device and cable insulation peel-off device | |
| CN213147647U (en) | Comprehensive measuring tool for automobile reverse gear shifting cantilever | |
| CN216265858U (en) | Simple clamp for magnetic memory detection | |
| CN216328664U (en) | Slicing device for cable detection | |
| CN212723210U (en) | Intelligent needle bed circuit board testing arrangement | |
| CN219617495U (en) | Clamping device is handled in diamond processing | |
| CN214039951U (en) | Large three-coordinate measuring instrument | |
| CN221199681U (en) | Concrete shrinkage testing arrangement that contracts futilely | |
| CN221037288U (en) | Three-coordinate dimension inspection equipment for automobile electrical accessories | |
| CN217302241U (en) | Novel quality detection device for turning part machining | |
| CN215003428U (en) | Precision measurement testing fixture for automobile crankshaft journal | |
| CN216847488U (en) | CCD detection equipment for forming precision appearance machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |