CN105806301A - Surface warpage measurement device and method - Google Patents

Surface warpage measurement device and method Download PDF

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Publication number
CN105806301A
CN105806301A CN201410850396.9A CN201410850396A CN105806301A CN 105806301 A CN105806301 A CN 105806301A CN 201410850396 A CN201410850396 A CN 201410850396A CN 105806301 A CN105806301 A CN 105806301A
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China
Prior art keywords
probe
measurement portion
measured
warp degree
guide rail
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Pending
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CN201410850396.9A
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Chinese (zh)
Inventor
姚力军
潘杰
相原俊夫
大岩彦
大岩一彦
王学泽
傅锦超
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Hefei Jiang Feng Electronic Materials Co., Ltd.
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Ningbo Jiangfeng Electronic Material Co Ltd
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Priority to CN201410850396.9A priority Critical patent/CN105806301A/en
Publication of CN105806301A publication Critical patent/CN105806301A/en
Pending legal-status Critical Current

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Abstract

The invention relates to a surface warpage measurement device and a method. The surface warpage measurement device comprises a foundation, a moving mechanism arranged on the foundation, and a measurement mechanism comprising a measurement portion and a probe stretching out from the measurement portion, wherein the measurement portion and the moving mechanism are connected, the probe is used for contacting with a to-be-measured surface and bears pressure of the to-be-measured surface to move into the measurement portion, the measurement portion is used for measuring moving displacement of the probe, and the measurement mechanism and/or the moving mechanism can do horizontal movement in parallel with the to-be-measured surface. The surface warpage measurement device has advantages of simple structure, convenient operation, relatively low cost and accurate measurement.

Description

Surface warp degree measurement apparatus and method
Technical field
The present invention relates to a kind of surface warp degree measurement apparatus and method.
Background technology
It is currently used for manufacturing liquid crystal display (LiquidCrystalDisplay, LCD) one-piece type target size is bigger, and the requirement of its sputtering surface angularity is high, it is thus desirable to accurately measure its surface warp degree, in order to avoid bigger error occurring and affecting the display effect of liquid crystal display.Wherein, angularity refers to plane degree of crook spatially, and its numerical value plane distance between farthest 2 in the height direction characterizes.
Existing target material surface angularity measurement apparatus is three coordinate measuring machine (CoordinateMeasuringMachining, CMM), including: travel mechanism;It is located at the gauge head in travel mechanism;Controlling organization, for controlling travel mechanism's three-dimensional direction moving along X, Y, Z;DPA data processing activity.Its operation principle is: controlling travel mechanism by controlling organization and move, contact with surface to be measured to gauge head, gauge head detects its surface to be measured sampling site coordinate touched, and coordinate signal is transferred to DPA data processing activity.By the multiple positions along three-dimensional direction moving gauge head to surface to be measured, multiple coordinate signal can be obtained.These some coordinate signals are analyzed by DPA data processing activity, by coordinate figure along Y direction in comparison coordinate signal, can obtain the angularity on surface to be measured.
But, CMM price is sufficiently expensive, wastes one's talent on a petty job a little for detection target angularity, and cost is too high.To this, the present invention proposes a kind of simple in construction, lower-cost new surface warp degree measurement apparatus.
Summary of the invention
The problem that this invention address that is, it is proposed to a kind of simple in construction, lower-cost new surface warp degree measurement apparatus.
For solving the problems referred to above, the present invention provides a kind of surface warp degree measurement apparatus, and this measurement apparatus includes:
Pedestal;
It is erected at the travel mechanism on described pedestal;
Measuring mechanism, including: measurement portion and the probe stretched out from described measurement portion;
Described measurement portion is connected with travel mechanism, and described probe moves in measurement portion for the pressure on contact measured surface the hard to bear surface to be measured of energy, and described measurement portion is for the moving displacement of measuring probe;
Described measuring mechanism and/or travel mechanism can be parallel to surface to be measured and move horizontally.
Alternatively, described travel mechanism includes: guide rail, the first driving mechanism, and described first driving mechanism is for driving guide rail to move horizontally on pedestal;
Described measuring mechanism is connected on guide rail.
Alternatively, described measurement portion is connected on guide rail by slide block, and described slide block can move back and forth along described guide rail.
Alternatively, described travel mechanism also includes: the second driving mechanism, is used for driving described slide block to move along described guide rail.
Alternatively, described measurement portion includes:
Pressure sensitive unit, for sensing and measuring when described probe moves in measurement portion the pressure signal to its applying;
Processing unit, is used for receiving described pressure signal and being converted into displacement signal.
Alternatively, described measurement portion also includes: display unit, for showing the displacement that described processing unit exports.
Alternatively, it is used for measuring target as sputter surface warp degree.
The present invention also provides for a kind of surface warp degree measuring method, and this measuring method includes:
Control probe contact measured surface;
The probe controlling to contact surface to be measured moves horizontally along described surface to be measured;
Measure the displacement along probe axis direction encountering warpage in described probe moving process and occur, as angularity.
Alternatively, the measuring method of described displacement includes: will encounter warpage and occurs movement to be in the axial direction converted into pressure signal in described probe level moving process;
Described pressure signal is converted into displacement signal output.
Compared with prior art, technical scheme has the advantage that
The surface warp degree measurement apparatus of this programme, moved horizontally along surface to be measured by probe, when probe meets with warpage, probe is applied the pressure of the vertical direction along probe axis and makes probe move in measurement portion by warpage, the moving displacement of probe is the height on warpage surface relatively to be measured, is used for characterizing angularity.Therefore, by the moving displacement of measuring probe, the angularity on surface to be measured can be obtained.
The surface warp degree measurement apparatus simple in construction of this programme, easy to operate, less costly, and measure accurately.
Accompanying drawing explanation
Fig. 1 is the surface warp degree measurement apparatus plan view of the specific embodiment of the invention;
Fig. 2 is in the surface warp degree measurement apparatus of the specific embodiment of the invention, the axonometric chart of travel mechanism and measuring mechanism;
Fig. 3~Fig. 4 is the surface warp degree measurement apparatus using the specific embodiment of the invention, measures surface warp and spends the schematic diagram of journey;
Fig. 5 is in measuring mechanism shown in Fig. 2, the structural representation in measurement portion.
Detailed description of the invention
Understandable for enabling the above-mentioned purpose of the present invention, feature and advantage to become apparent from, below in conjunction with accompanying drawing, specific embodiments of the invention are described in detail.
With reference to Fig. 1, Fig. 2, the surface warp degree measurement apparatus of the present embodiment includes:
The pedestal 1 being made up of two discrete cylindrical member 10;
It is erected at the travel mechanism 2 on pedestal 1;
Measuring mechanism 3, including: measurement portion 30 and the probe 31 stretched out from measurement portion 30;
Wherein measurement portion 30 is connected with travel mechanism 2, and probe 31 moves in measurement portion 30 for the pressure on contact measured surface the hard to bear surface to be measured of energy, and measurement portion 30 is for the moving displacement of measuring probe 31;
Measuring mechanism 3 and/or travel mechanism 2 can move horizontally on surface relatively to be measured, wherein said move horizontally as moving along being parallel to surface direction to be measured.
The surface warp degree measurement apparatus of the present embodiment can be used for measuring target, and such as one-piece type LCD target, its operation principle is:
In conjunction with reference to Fig. 3, first, surface warp degree measurement apparatus is placed in benchmark platen 4 by pedestal 1, as in marble platform.It is 0 that the surface of benchmark platen 4 is considered angularity, definitely smooth, it is believed that be datum plane;
Being laid flat on benchmark platen 4 by target 5, the surface to be measured 50 of target 5 is upward, it is ensured that surface 50 to be measured is horizontal positioned, reduces measurement error;
Traveling probe 31 contacts with the surface to be measured 50 of target 5, is now original state.It should be noted that, in original state, can be make probe 31 will not be subject to surface 50 to be measured pressure in the axial direction and towards mobile in measurement portion 30, can also is that and make probe 31 be subject to surface 50 to be measured pressure in the axial direction and move certain distance in measurement portion 30, both situations are all without influence on the measurement scheme of angularity.
In conjunction with reference to Fig. 4, control probe 31 surface 50 relatively to be measured by travel mechanism 2 and move horizontally.
When probe 31 touches the projection 51 on surface 50 to be measured, probe 31 is subject to the pressure of protruding 51 vertical directions along axis applied and moves in measurement portion 30, measurement portion 30 records the moving displacement of probe 31, this moving displacement is the projection 51 height relative to the surface to be measured 50 of original state shown in Fig. 4, is used for characterizing angularity.In the diagram, dotted line is, after probe 31 meets with protruding 51, enter the part in measurement portion 30.
Afterwards, probe 31 is moved horizontally to multiple positions along surface 50 to be measured.After probe 31 crosses protruding 51, probe 31 can be displaced outwardly vertically in measurement portion 30, to its contact measured surface.
If the surface warp degree to be measured recorded in multiple positions is all in allowable range, then it is assumed that target surface to be measured is qualified;
If in certain or certain several positions, the scope that the angularity recorded allows beyond angularity, then it is assumed that this target surface to be measured is defective, and target is eliminated.
It should be noted that, when operational version surface warp degree measurement apparatus measures angularity, arrange probe in original state to be subject to the pressure on surface to be measured and move a certain distance in measurement portion, the pit running into surface to be measured when probe level moves can move towards pit bottom, the displacement now recorded also illustrates that angularity, and simply direction and above-mentioned projection are in a ratio of reversely.
The surface warp degree measurement apparatus of the present embodiment is except being used for measuring target material surface angularity, it may also be used for measure other apparatus surface angularities.The surface warp degree measurement apparatus simple in construction of the present embodiment, less costly, and measure accurately.
With reference to Fig. 1, travel mechanism 2 includes: guide rail the 20, first driving mechanism 21, and guide rail 20 is line slideway, and the first driving mechanism 21 can be located in a cylindrical member 10, for driving guide rail 20 to move horizontally along the direction A being perpendicular to guide rail 20 axis on pedestal 1.Measuring mechanism 3 is connected on guide rail 20 by measurement portion 30.
Specifically, the first driving mechanism 21 can be linear drive motor, and its outfan is connected along direction A with guide rail 20.In conjunction with reference to Fig. 2, guide rail 20 is provided with some through holes 200, correspondingly, each cylindrical member 10 is provided with along two relative for direction A support member (not shown)s, guide rail 20 can pass through through hole 200 and be erected between two support member (not shown)s, and can move back and forth between two support members.
Being provided with slide block 22 on guide rail 20, slide block 22 can move back and forth along guide rail 20.Measurement portion 30 is connected on guide rail 20 by slide block 22.Being provided with the second driving mechanism 23 on guide rail 20, the second driving mechanism 23 is used for driving slide block 22 to move back and forth along guide rail 20.Can being moved along direction B by slide block 22, it is achieved probe 31 moves along direction B and opposite direction thereof, direction B is parallel to the axis direction of guide rail 20, is mutually perpendicular to direction A.
In the present embodiment, move along direction A by means of guide rail 20 and move along direction B with slide block 22, it is achieved probe 31 moving horizontally along two-dimensional directional.In this scenario, owing to guide rail 20 itself is move along being perpendicular to its axis direction, therefore guide rail 20 is without oversize, takes up room little.
In the present embodiment, with reference to Fig. 2, Fig. 5, measurement portion 30 includes:
Housing 32, housing 32 is supported on slide block 22 by supporting seat 33;
It is positioned at the pressure sensitive unit 301 of housing 32, it can be pressure transducer, for sense and measuring probe 31 along axis towards housing 32 in movement be converted into pressure signal: probe 31 in housing 32 mobile time, its pressure acted on pressure sensitive unit 301 changes, pressure sensitive unit 301 is measured and is obtained the change of this pressure, and pressure sensitive unit 301 receives this change in displacement signal and is converted into pressure signal;Wherein, probe contacts with the pressure sensitive district of pressure transducer or sandwiched miscellaneous part between the two, therefore, after probe in axial direction moves, pressure can be applied to pressure sensitive, one the corresponding pressure of displacement, it is possible to carried out the displacement of measuring probe by the mode of the pressure of pressure sensitive unit senses probe;
It is positioned at the processing unit 302 of housing 32, is used for receiving this pressure signal and being converted into displacement signal: pressure signal causes change in electric, processing unit 302 to receive this change in electric, and change in electric is converted into the axial displacement signal of probe 31.Such as, the pressure sensitive film of pressure transducer is stressed and acts on and cause upper and lower polar plate spacing to change, and then generation capacitance variations, processing unit 302 receives this capacitance change signal, calculating obtains spacing change between upper and lower pole plate, and the axial displacement of probe 31 is equal to spacing changing value between upper and lower pole plate.
It is positioned at the display unit 303 of housing 32 outer surface, the displacement after processing for display processing unit 302, the moving displacement of probe 31 can be directly read by display unit 303, very convenient.
The present invention also provides for a kind of surface warp degree detection method, including:
Control probe contact measured surface;
The probe controlling to contact surface to be measured moves horizontally along described surface to be measured;
Measure the displacement along probe axis direction encountering warpage in described probe moving process and occur, as angularity.
The measuring method of described displacement includes: will encounter warpage and occurs movement to be in the axial direction converted into pressure signal in described probe level moving process;
Described pressure signal is converted into displacement signal output.
The device realizing this detection method can detecting device described in above-described embodiment in the present invention, it is also possible to for other other detecting devices designed according to the objective of this method.
Although present disclosure is as above, but the present invention is not limited to this.Any those skilled in the art, without departing from the spirit and scope of the present invention, all can make various changes or modifications, and therefore protection scope of the present invention should be as the criterion with claim limited range.

Claims (9)

1. a surface warp degree measurement apparatus, it is characterised in that including:
Pedestal;
It is erected at the travel mechanism on described pedestal;
Measuring mechanism, including: measurement portion and the probe stretched out from described measurement portion;
Described measurement portion is connected with travel mechanism, and described probe moves in measurement portion for the pressure on contact measured surface the hard to bear surface to be measured of energy, and described measurement portion is for the moving displacement of measuring probe;
Described measuring mechanism and/or travel mechanism can be parallel to surface to be measured and move horizontally.
2. surface warp degree measurement apparatus as claimed in claim 1, it is characterised in that described travel mechanism includes: guide rail, the first driving mechanism, and described first driving mechanism is for driving guide rail to move horizontally on pedestal;
Described measuring mechanism is connected on guide rail.
3. surface warp degree measurement apparatus as claimed in claim 2, it is characterised in that described measurement portion is connected on guide rail by slide block, and described slide block can move back and forth along described guide rail.
4. surface warp degree measurement apparatus as claimed in claim 3, it is characterised in that described travel mechanism also includes: the second driving mechanism, is used for driving described slide block to move along described guide rail.
5. surface warp degree measurement apparatus as claimed in claim 1, it is characterised in that described measurement portion includes:
Pressure sensitive unit, for sensing and measuring when described probe moves in measurement portion the pressure signal to its applying;
Processing unit, is used for receiving described pressure signal and being converted into displacement signal.
6. surface warp degree measurement apparatus as claimed in claim 5, it is characterised in that described measurement portion also includes: display unit, for showing the displacement that described processing unit exports.
7. the surface warp degree measurement apparatus as described in any one of claim 1~6, it is characterised in that be used for measuring target as sputter surface warp degree.
8. a surface warp degree measuring method, it is characterised in that including:
Control probe contact measured surface;
The probe controlling to contact surface to be measured moves horizontally along described surface to be measured;
Measure the displacement along probe axis direction encountering warpage in described probe moving process and occur, as angularity.
9. surface warp degree measuring method as claimed in claim 8, it is characterised in that the measuring method of described displacement includes: will encounter warpage and occurs movement to be in the axial direction converted into pressure signal in described probe level moving process;
Described pressure signal is converted into displacement signal output.
CN201410850396.9A 2014-12-30 2014-12-30 Surface warpage measurement device and method Pending CN105806301A (en)

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Cited By (7)

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Publication number Priority date Publication date Assignee Title
CN106404252A (en) * 2016-08-26 2017-02-15 明基材料有限公司 Warping force measuring device for optical diaphragm
CN107702675A (en) * 2017-09-27 2018-02-16 西安理工大学 Self-adaptive supporting device and measuring system applying same
CN108267112A (en) * 2018-01-26 2018-07-10 温州正康建设有限公司 A kind of detection device for being used to detect formwork for placing deformation
CN108828267A (en) * 2018-03-19 2018-11-16 长江存储科技有限责任公司 Silicon wafer warpage degree measurement method and device
CN108940898A (en) * 2018-06-05 2018-12-07 横店集团东磁股份有限公司 Detect the production line of tile-type magnet angularity and intensity
WO2023056858A1 (en) * 2021-10-08 2023-04-13 宁德时代新能源科技股份有限公司 Electrode plate wavy edge detection device and electrode plate wavy edge detection method
CN117238812A (en) * 2023-11-10 2023-12-15 四川省农业机械科学研究院 Substrate warp measuring device and measuring method

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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106404252A (en) * 2016-08-26 2017-02-15 明基材料有限公司 Warping force measuring device for optical diaphragm
CN107702675A (en) * 2017-09-27 2018-02-16 西安理工大学 Self-adaptive supporting device and measuring system applying same
CN108267112A (en) * 2018-01-26 2018-07-10 温州正康建设有限公司 A kind of detection device for being used to detect formwork for placing deformation
CN108267112B (en) * 2018-01-26 2020-09-01 温州正康建设有限公司 Detection device for detecting deformation of pouring template
CN108828267A (en) * 2018-03-19 2018-11-16 长江存储科技有限责任公司 Silicon wafer warpage degree measurement method and device
CN108940898A (en) * 2018-06-05 2018-12-07 横店集团东磁股份有限公司 Detect the production line of tile-type magnet angularity and intensity
WO2023056858A1 (en) * 2021-10-08 2023-04-13 宁德时代新能源科技股份有限公司 Electrode plate wavy edge detection device and electrode plate wavy edge detection method
CN117238812A (en) * 2023-11-10 2023-12-15 四川省农业机械科学研究院 Substrate warp measuring device and measuring method
CN117238812B (en) * 2023-11-10 2024-04-05 四川省农业机械科学研究院 Substrate warp measuring device and measuring method

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Effective date of registration: 20170721

Address after: The New District of Hefei City, Anhui Province, East Road and road intersection southwest corner station Yu Industrial Park A District E group dormitory building 15

Applicant after: Hefei Jiang Feng Electronic Materials Co., Ltd.

Address before: 315400, No. 198, Mount Ann Road, state science and Technology Industrial Park, Yuyao, Zhejiang, Zhejiang, Ningbo

Applicant before: NINGBO JIANGFENG ELECTRONIC MATERIAL CO., LTD.

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Application publication date: 20160727