CN206977322U - A kind of solar inverter encapsulating structure - Google Patents
A kind of solar inverter encapsulating structure Download PDFInfo
- Publication number
- CN206977322U CN206977322U CN201720776108.9U CN201720776108U CN206977322U CN 206977322 U CN206977322 U CN 206977322U CN 201720776108 U CN201720776108 U CN 201720776108U CN 206977322 U CN206977322 U CN 206977322U
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- CN
- China
- Prior art keywords
- mounting base
- package casing
- solar inverter
- seal closure
- encapsulating structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Inverter Devices (AREA)
- Casings For Electric Apparatus (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
It the utility model is related to a kind of solar inverter encapsulating structure, including encapsulation inner casing and package casing;Encapsulating inner casing includes mounting base, the circuit board on mounting base, and is located at the circuit board surface metal sealing cover fixed with the sealing of mounting base upper surface;Seal closure inwall and inner top surface are provided with multiple metal absorber plates, and outer surface is provided with metallic contact strips;Connection strap is provided with sliding block away from seal closure one end;Package casing is made of metal, and inner surface setting has chute corresponding with sliding block;Mounting base lower surface is provided with multiple first installation screws;Package casing bottom surface is provided with the second installation screw corresponding with the first installation screw;The circuit board of solar inverter by mounting base and seal closure carry out it is hermetically sealed after, sliding block coordinates with chute is put into seal closure and mounting base in package casing, easy for installation by screw locking package casing and mounting base, good waterproof performance, perfect heat-dissipating.
Description
Technical field
Solar inverter technical field is the utility model is related to, is sealed more specifically to a kind of solar inverter
Assembling structure.
Background technology
Solar inverter is used to direct current energy being converted to alternating current, needs to carry out preferable waterproof and dissipates during its use
Thermal protection;The solar inverter waterproof and heat dispersion used at present is poor.
Utility model content
The technical problems to be solved in the utility model is, for the drawbacks described above of prior art, there is provided a kind of solar energy
Inverter unit enclosures structure.
Technical scheme is used by the utility model solves its technical problem:
Construct a kind of solar inverter encapsulating structure, including encapsulation inner casing and package casing;Wherein, the encapsulation inner casing
Circuit board including mounting base, on the mounting base, and it is located at the circuit board surface and the installation bottom
The fixed metal sealing cover of plate upper surface sealing;The seal closure inwall and inner top surface are provided with multiple metal absorber plates, outside
Surface is provided with metallic contact strips;The connection strap is provided with sliding block away from described seal closure one end;The package casing is by gold
Category is made, and inner surface setting has chute corresponding with the sliding block;The mounting base lower surface is provided with multiple first peaces
Fill screw;The package casing bottom surface is provided with the second installation screw corresponding with first installation screw.
Solar inverter encapsulating structure described in the utility model, wherein, the package casing bottom surface is provided with support
Play the strip tray of the mounting base;Through hole corresponding with first installation screw is provided with the tray.
Solar inverter encapsulating structure described in the utility model, wherein, the package casing surface is provided with multiple
Air vent;The package casing bottom surface is provided with leaking hole.
Solar inverter encapsulating structure described in the utility model, wherein, the leaking hole perforate top edge is provided with
Ring sleeve, described sleeve pipe are highly less than tray height.
The beneficial effects of the utility model are:The circuit board of solar inverter is carried out by mounting base and seal closure
After hermetically sealed, sliding block coordinates with chute is put into seal closure and mounting base in package casing, is encapsulated by screw locking outer
Shell and mounting base, easy for installation, good waterproof performance, absorb heat by multiple absorber plates and it is passed through into seal closure and connection strap
Radiated on conduction to package casing, considerably increase area of dissipation, and then enhance heat dispersion.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below in conjunction with accompanying drawing and reality
Applying example, the utility model is described in further detail, and drawings in the following description are only the section Example of the present invention, for this
For the those of ordinary skill of field, on the premise of not paying creative work, it is attached other can also to be obtained according to these accompanying drawings
Figure:
Fig. 1 is the solar inverter encapsulating structure sectional view of the utility model preferred embodiment.
Embodiment
In order that the purpose, technical scheme and advantage of the utility model embodiment are clearer, below in conjunction with this practicality
Technical scheme in new embodiment carries out clear, complete description, it is clear that described embodiment is portion of the present utility model
Divide embodiment, rather than whole embodiments.Based on embodiments of the invention, those of ordinary skill in the art are not paying creation
Property work on the premise of the every other embodiment that is obtained, belong to the scope of protection of the utility model.
The solar inverter encapsulating structure of the utility model preferred embodiment is as shown in figure 1, including encapsulation inner casing 1 and envelope
Casing 2;Encapsulating inner casing 1 includes mounting base 10, the circuit board 11 on mounting base 10, and is located at circuit board 11
The surface metal sealing cover 12 fixed with the sealing of the upper surface of mounting base 10;The inwall of seal closure 12 and inner top surface are provided with multiple
Metal absorber plate 120, outer surface are provided with metallic contact strips 121;Connection strap 121 is provided with sliding block away from the one end of seal closure 12
122;Package casing 2 is made of metal, and inner surface setting has chute 20 corresponding with sliding block 122;The lower surface of mounting base 10
It is provided with multiple first installation screws 100;The bottom surface of package casing 2 is provided with and 100 corresponding second peace of the first installation screw
Fill screw 21;The circuit board 11 of solar inverter by mounting base 10 and seal closure 12 carry out it is hermetically sealed after, sliding block 122
Coordinate with chute 20 and seal closure 12 and mounting base 10 are put into package casing 2, pass through screw locking package casing 2 and installation
Bottom plate 10, easy for installation, good waterproof performance, intensity is hardly damaged greatly;Heat is absorbed by multiple absorber plates 120 and is passed through it close
Sealing cover 12 and connection strap 121 are conducted to radiating on package casing, considerably increase area of dissipation, and then enhance heat dispersion.
As shown in figure 1, the bottom surface of package casing 2 is provided with the strip tray 22 for holding up mounting base 10;On tray 22
It is provided with and 100 corresponding through hole 220 of the first installation screw;Mounting base 10 is held up by tray 22, even if in package casing 2
Ponding is not easy to impact circuit board 11.
As shown in figure 1, the surface of package casing 2 is provided with multiple air vents 23;The bottom surface of package casing 2 is provided with leaking hole
24;Heat dispersion is strengthened by air vent 23, can Quick drainage by leaking hole 24.
As shown in figure 1, the perforate top edge of leaking hole 24 is provided with ring sleeve 25, it is high that the height of sleeve pipe 25 is less than tray 22
Degree;Energy member-retaining portion ponding, a period of time of part ponding thereafter can carry after being intake by the package casing 2 of sleeve pipe 25
High radiating effect.
It should be appreciated that for those of ordinary skills, can according to the above description be improved or converted,
And all these modifications and variations should all belong to the protection domain of the appended claims for the utility model.
Claims (4)
1. a kind of solar inverter encapsulating structure, including encapsulation inner casing and package casing;Characterized in that, the encapsulation inner casing
Circuit board including mounting base, on the mounting base, and it is located at the circuit board surface and the installation bottom
The fixed metal sealing cover of plate upper surface sealing;The seal closure inwall and inner top surface are provided with multiple metal absorber plates, outside
Surface is provided with metallic contact strips;The connection strap is provided with sliding block away from described seal closure one end;The package casing is by gold
Category is made, and inner surface setting has chute corresponding with the sliding block;The mounting base lower surface is provided with multiple first peaces
Fill screw;The package casing bottom surface is provided with the second installation screw corresponding with first installation screw.
2. solar inverter encapsulating structure according to claim 1, it is characterised in that the package casing bottom surface is set
It is equipped with the strip tray for holding up the mounting base;It is provided with the tray corresponding with first installation screw logical
Hole.
3. solar inverter encapsulating structure according to claim 2, it is characterised in that the package casing surface is set
There are multiple air vents;The package casing bottom surface is provided with leaking hole.
4. solar inverter encapsulating structure according to claim 3, it is characterised in that the leaking hole perforate top edge
Ring sleeve is provided with, described sleeve pipe is highly less than tray height.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201720776108.9U CN206977322U (en) | 2017-06-30 | 2017-06-30 | A kind of solar inverter encapsulating structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201720776108.9U CN206977322U (en) | 2017-06-30 | 2017-06-30 | A kind of solar inverter encapsulating structure |
Publications (1)
Publication Number | Publication Date |
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CN206977322U true CN206977322U (en) | 2018-02-06 |
Family
ID=61406015
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201720776108.9U Active CN206977322U (en) | 2017-06-30 | 2017-06-30 | A kind of solar inverter encapsulating structure |
Country Status (1)
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CN (1) | CN206977322U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109757054A (en) * | 2019-02-22 | 2019-05-14 | 深圳源创智能照明有限公司 | A kind of circuit board sealing structure and circuit board encapsulating method |
-
2017
- 2017-06-30 CN CN201720776108.9U patent/CN206977322U/en active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109757054A (en) * | 2019-02-22 | 2019-05-14 | 深圳源创智能照明有限公司 | A kind of circuit board sealing structure and circuit board encapsulating method |
CN109757054B (en) * | 2019-02-22 | 2023-05-30 | 深圳源码智能照明有限公司 | Circuit board sealing structure and circuit board sealing method |
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