CN213340338U - High-heat-dissipation-performance package for high-density storage integrated chip - Google Patents
High-heat-dissipation-performance package for high-density storage integrated chip Download PDFInfo
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- CN213340338U CN213340338U CN202022088088.0U CN202022088088U CN213340338U CN 213340338 U CN213340338 U CN 213340338U CN 202022088088 U CN202022088088 U CN 202022088088U CN 213340338 U CN213340338 U CN 213340338U
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- encapsulation
- heating panel
- bottom plate
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Abstract
The utility model discloses a high density storage integration chip is with encapsulation of high heat dispersion, including the encapsulation bottom plate, the upper end of encapsulation bottom plate is provided with the heating panel, the upper end surface of heating panel is provided with the louvre No. one, the upper end of heating panel is provided with the heat-conducting plate, the upper end of heat-conducting plate is provided with connection base, connection base's upper end surface is provided with the louvre No. two, the inside of encapsulation bottom plate is provided with the recess, the surface of encapsulation bottom plate is provided with paints the layer, the upper end of encapsulation bottom plate is provided with the encapsulation apron, the lower extreme of encapsulation apron is provided with. High density storage integration chip with high heat dispersion encapsulation, through being provided with heating panel, louvre, heat-conducting plate, make the radiating effect of chip better, improve the result of use of chip, through being provided with the recess, paint layer, sealing washer, improve the leakproofness of encapsulation, avoid steam, dust to cause the influence to the chip.
Description
Technical Field
The utility model relates to a chip package field, in particular to high-density storage integration high heat dispersion encapsulation for chip.
Background
The chip package is a shell for mounting a semiconductor integrated circuit chip, has the functions of placing, fixing, sealing, protecting the chip and enhancing the electrothermal performance, is a bridge for communicating the internal world of the chip with an external circuit, the connection point of the chip is connected to the pins of the package shell by leads, and the pins are connected with other devices by leads on a printed board; the heat dispersion of the chip package in the prior patent publication CN206893609U is poor, which is not beneficial to the heat dissipation of the chip, and the chip is easily heated to cause damage, thus affecting the use, secondly, the sealing performance of the package shell is not strong, the chip is easily affected by water vapor and dust, and the work of the chip is not beneficial, therefore, the high-density storage integrated chip is provided with the high heat dispersion package.
SUMMERY OF THE UTILITY MODEL
The utility model discloses a main aim at provides high density storage integration high heat dispersion encapsulation for chip can effectively solve the problem in the background art.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
high density storage integration chip is with encapsulation of high heat dispersion, including the encapsulation base, the upper end of encapsulation bottom plate is provided with the heating panel, the upper end surface of heating panel is provided with the louvre No. one, the upper end of heating panel is provided with the heat-conducting plate, the upper end of heat-conducting plate is provided with connection base, connection base's upper end surface is provided with the louvre No. two, the inside of encapsulation bottom plate is provided with the recess, the surface of encapsulation bottom plate is provided with paints the layer, the upper end of encapsulation bottom plate is provided with the encapsulation apron, the lower extreme of encapsulation apron is provided with the.
Preferably, one side of the first heat dissipation hole is provided with a first bolt hole, the upper end outer surface of the heat conduction plate is provided with a second bolt hole, the upper end outer surface of the connection base is provided with a third bolt hole, the upper end of the connection base is provided with an electronic chip, one end of the electronic chip is provided with a wire, and a supporting leg is arranged between the heat dissipation plate and the packaging bottom plate.
By adopting the technical scheme, the following technical effects can be achieved: fixing bolts are utilized to penetrate through the first bolt holes, the second bolt holes and the third bolt holes, the heat dissipation plate, the heat conduction plate and the connecting base can be fixed together, heat dissipation of the chip is facilitated, disassembly and assembly are convenient, parts are replaced, and using effects are improved.
Preferably, the outer surface of the upper end and the outer surface of the lower end of the heat conducting plate are respectively attached to the connecting base and the heat radiating plate, the number of the heat radiating holes is a plurality of groups, the heat radiating holes are located on the outer surface of the upper end of the heat radiating plate and are arranged in an array mode, the positions of the electronic chips correspond to the positions of the heat radiating holes II, the electronic chips are fixedly connected with the connecting base, and the outer surface of the heat radiating plate is provided with a heat conducting silicone grease layer.
By adopting the technical scheme, the following technical effects can be achieved: no. two louvres are convenient for transmit the heat that the electronic chip produced to the heat-conducting plate, and rethread heat-conducting plate conduction is to the heating panel, and the heating panel utilizes self thermal diffusivity and a louvre effectual to give off the heat, and heat dispersion is better, efficiency is higher.
Preferably, the heat-conducting plate is the graphite alkene material, be swing joint between heat-conducting plate and connection base, the heating panel, the position of a bolt hole is corresponding with the position of No. two bolt holes, No. three bolt holes, fixing bolt's quantity is four groups, fixing bolt is the plastic material, fixing bolt matches with a bolt hole, No. two bolt holes, No. three bolt hole homogeneous phases.
By adopting the technical scheme, the following technical effects can be achieved: connect through the fixing bolt of plastic material between heating panel, heat-conducting plate, the connection base, the installation of being convenient for, and it is more convenient when some parts need to be changed or dismantle, and the heat-conducting plate heat conduction effect of graphite alkene material is better simultaneously.
Preferably, the packaging cover plate is matched with the groove, the sealing ring is attached to the smearing layer, the outer surface of the cover plate is attached to the outer surface of the inner wall of the packaging bottom plate, the packaging bottom plate and the packaging cover plate are made of alloy materials, and the packaging bottom plate and the packaging cover plate are both cuboid.
By adopting the technical scheme, the following technical effects can be achieved: the sealing ring made of the plastic material is tightly attached to the smearing layer, so that the sealing performance between the packaging shells is improved, the packaging of the chip is facilitated, and the service life of the chip is prolonged.
Preferably, the sealing washer is the plastic material, be swing joint between sealing washer and the encapsulation apron, the heating panel is the same with heat-conducting plate, connection base's size, the quantity of supporting legs is a plurality of groups, the supporting legs is located the heating panel lower extreme and is the array and arranges, heating panel, heat-conducting plate, connection base, supporting legs all are located the inside of recess.
By adopting the technical scheme, the following technical effects can be achieved: the support legs are used for supporting the heat dissipation plate and the packaging base, so that a good heat dissipation space is provided for heat dissipation of the heat dissipation plate, and the heat dissipation performance is improved.
Compared with the prior art, the utility model discloses following beneficial effect has: the high-density storage integrated chip is packaged by high heat dissipation performance, by arranging the heat dissipation plate, the first heat dissipation hole and the heat conduction plate, when the electronic chip is installed, the heat conduction plate is placed on the outer surface of the upper end of the heat dissipation plate, the connecting base provided with the electronic chip is placed on the outer surface of the upper end of the heat conduction plate, the first bolt hole, the second bolt hole and the third bolt hole are made to correspond, the heat dissipation plate, the heat conduction plate and the connecting base are connected by utilizing a fixing bolt, when the electronic chip generates heat in operation, the heat is conducted to the heat conduction plate through the second bolt hole, the heat conduction plate conducts the heat to the heat dissipation plate, the heat dissipation function of the heat dissipation plate is matched with the first heat dissipation hole for heat dissipation, the heat dissipation effect is better and more efficient, by arranging the groove, the coating layer and the sealing ring, when, make the sealing washer with paint the layer and laminate mutually, encapsulation apron surface and encapsulation bottom plate inner wall laminate mutually, recycle current fixed glue and fix, improve the leakproofness of encapsulation, the result of use is better for traditional mode.
Drawings
Fig. 1 is a schematic view of the overall structure of the high heat dissipation performance package for the high density storage integrated chip of the present invention;
fig. 2 is a schematic view of a partial structure of the high heat dissipation performance package for the high density storage integrated chip of the present invention;
fig. 3 is a partial side sectional view of the high heat dissipation performance package for the high density memory integrated chip of the present invention;
fig. 4 is a schematic view of a partial structure of the high heat dissipation performance package for the high density storage integrated chip of the present invention;
fig. 5 is a partial side sectional view of the high heat dissipation performance package for the high density storage integrated chip of the present invention.
In the figure: 1. packaging the bottom plate; 2. a heat dissipation plate; 3. a first heat dissipation hole; 4. a first bolt hole; 5. a heat conducting plate; 6. a second bolt hole; 7. a connection base; 8. a second heat dissipation hole; 9. a third bolt hole; 10. fixing the bolt; 11. an electronic chip; 12. a wire; 13. supporting legs; 14. a groove; 15. coating a layer; 16. packaging the cover plate; 17. and (5) sealing rings.
Detailed Description
In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.
The first embodiment is as follows:
as shown in fig. 1, 2 and 3, the high-density storage integrated chip is packaged with high heat dissipation performance, which comprises a packaging base, the upper end of a packaging bottom plate 1 is provided with a heat dissipation plate 2, the upper end outer surface of the heat dissipation plate 2 is provided with a heat dissipation hole 3, the upper end of the heat dissipation plate 2 is provided with a heat conduction plate 5, the upper end of the heat conduction plate 5 is provided with a connection base 7, the upper end outer surface of the connection base 7 is provided with a heat dissipation hole 8, the inside of the packaging bottom plate 1 is provided with a groove 14, the outer surface of the packaging bottom plate 1 is provided with a coating layer 15, the upper end of the.
One side of a louvre 3 is provided with bolt hole 4 No. one, the upper end surface of heat-conducting plate 5 is provided with bolt hole 6 No. two, connection base 7's upper end surface is provided with bolt hole 9 No. three, bolt hole 9 No. three inside is provided with fixing bolt 10, fixing bolt 10 is convenient for heating panel 2, heat-conducting plate 5, connect between connection base 7, and convenient to detach, connection base 7's upper end is provided with electronic chip 11, electronic chip 11's one end is provided with wire 12, be provided with supporting legs 13 between heating panel 2 and the encapsulation bottom plate 1, supporting legs 13 is convenient for fixing between heating panel 2 and the encapsulation bottom plate 1, improve heating panel 2's fixity, and provide the heat dissipation space for heating panel 2, and improve the.
Heat-conducting plate 5 upper end surface, the lower extreme surface respectively with connection base 7, heating panel 2 is laminated mutually, be convenient for conduct the heat that the chip produced for heating panel 2, accelerate the heat dissipation, improve the chip result of use, the quantity of a louvre 3 is a plurality of groups, a louvre 3 is located the upper end surface of heating panel 2 and is personally submitted the array and arrange, a louvre 3 has accelerated the radiating rate of heating panel 2, electronic chip 11's position is corresponding with No. two louvre 8's position, be fixed connection between electronic chip 11 and the connection base 7, heating panel 2 surface is provided with the heat conduction silicone grease layer, provide the heat dissipation for the chip, make the efficiency of chip in the course of the work higher.
Heat-conducting plate 5 is the graphite alkene material, heat-conducting plate 5 and connection base 7, be swing joint between the heating panel 2, the position and No. two bolt holes 6 of bolt hole 4, No. three bolt hole 9's position is corresponding, fixing bolt 10's quantity is four groups, strengthen heating panel 2, heat-conducting plate 5, fixing between the connection base 7, fixing bolt 10 is the plastic material, fixing bolt 10 and bolt hole 4, No. two bolt holes 6, No. three bolt hole 9 homogeneous phase match, make heating panel 2, heat-conducting plate 5, connection base 7 closely laminate mutually, make the heat dissipation more even, high efficiency.
Example two:
on the basis of the first embodiment and the second embodiment, as shown in fig. 4 and 5, the package cover plate 16 is matched with the groove 14, the package cover plate 16 can be embedded into the package base plate 1, the seal ring 17 is attached to the smearing layer 15, the outer surface of the cover plate is attached to the outer surface of the inner wall of the package base plate 1, the sealing performance is enhanced, the package base plate 1 and the package cover plate 16 are made of alloy materials, the package base plate 1 and the package cover plate 16 are both rectangular, the seal ring 17 is movably connected with the package cover plate 16, the aging-damaged seal ring 17 can be conveniently replaced, the cost is reduced, and the packaging structure is practical.
It should be noted that, the utility model discloses a high heat dispersion encapsulation of high density storage integration chip, when installing electronic chip 11, laminate heat sink 2, heat-conducting plate 5, connecting base 7 in proper order mutually, reuse fixing bolt 10 to pass through number three bolt hole 9, number two bolt hole 6, number one bolt hole 4 in proper order and fix, connect electronic chip 11 with connecting base 7 again, and make electronic chip 11 correspond to number two through holes, accomplish the installation, when electronic chip 11 generates heat in the work, number two bolt hole 6 can conduct heat to heat-conducting plate 5, heat-conducting plate 5 conducts heat to heat sink 2 again, number one louvre 3 cooperates the heat dissipation function of heat sink 2 itself to dispel the heat, the radiating effect is better, be favorable to electronic chip 11's use, when encapsulating electronic chip 11, connect sealing washer 17 with encapsulation cover plate 16 first, then will encapsulate apron 16 and insert in the inside recess 14 of packaging substrate 1, make sealing washer 17 with paint layer 15 and laminate mutually, and encapsulate 16 surfaces of apron and laminate mutually with packaging substrate 1 inner wall, recycle current fixed glue and fix, improve the leakproofness of encapsulation, avoid steam, dust to electronic chip 11's influence, improve electronic chip 11's result of use, it is comparatively practical.
The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (6)
1. High-density storage integration chip is with high heat dispersion encapsulation, including package substrate (1), its characterized in that: the upper end of encapsulation bottom plate (1) is provided with heating panel (2), the upper end surface of heating panel (2) is provided with louvre (3) No. one, the upper end of heating panel (2) is provided with heat-conducting plate (5), the upper end of heat-conducting plate (5) is provided with connection base (7), the upper end surface of connection base (7) is provided with louvre (8) No. two, the inside of encapsulation bottom plate (1) is provided with recess (14), the surface of encapsulation bottom plate (1) is provided with paints layer (15), the upper end of encapsulation bottom plate (1) is provided with encapsulation apron (16), the lower extreme of encapsulation apron (16) is provided with sealing washer (17).
2. The high-heat-dissipation-performance package for the high-density memory integrated chip as claimed in claim 1, wherein: one side of a heat dissipation hole (3) is provided with a bolt hole (4), the upper end surface of a heat conduction plate (5) is provided with a bolt hole (6) II, the upper end surface of a connection base (7) is provided with a bolt hole (9) III, the inside of the bolt hole (9) III is provided with a fixing bolt (10), the upper end of the connection base (7) is provided with an electronic chip (11), one end of the electronic chip (11) is provided with a wire (12), and a supporting leg (13) is arranged between the heat dissipation plate (2) and the packaging bottom plate (1).
3. The high-heat-dissipation-performance package for the high-density memory integrated chip as claimed in claim 2, wherein: the heat-conducting plate (5) upper end surface, lower extreme surface laminate with connection base (7), heating panel (2) respectively mutually, the quantity of a louvre (3) is a plurality of groups, a louvre (3) are located the upper end surface of heating panel (2) and are the array and arrange, the position of electronic chip (11) is corresponding with the position of No. two louvres (8), be fixed connection between electronic chip (11) and connection base (7), heating panel (2) surface is provided with heat conduction silicone grease layer.
4. The high-heat-dissipation-performance package for the high-density memory integrated chip as claimed in claim 2, wherein: heat-conducting plate (5) are the graphite alkene material, be swing joint between heat-conducting plate (5) and connection base (7), heating panel (2), the position of a bolt hole (4) is corresponding with the position of No. two bolt holes (6), No. three bolt holes (9), the quantity of fixing bolt (10) is four groups, fixing bolt (10) are the plastic material, fixing bolt (10) match with a bolt hole (4), No. two bolt holes (6), No. three bolt holes (9) homogeneous phase.
5. The high-heat-dissipation-performance package for the high-density memory integrated chip as claimed in claim 2, wherein: encapsulation apron (16) and recess (14) phase-match, sealing washer (17) with paint layer (15) and laminate mutually, apron surface and encapsulation bottom plate (1) inner wall surface laminate mutually, encapsulation bottom plate (1) and encapsulation apron (16) are the alloy material, encapsulation bottom plate (1), encapsulation apron (16) all are the cuboid form.
6. The high-heat-dissipation-performance package for the high-density memory integrated chip as claimed in claim 2, wherein: sealing washer (17) are the plastic material, be swing joint between sealing washer (17) and the encapsulation apron (16), heating panel (2) are the same with heat-conducting plate (5), connection base (7) size, the quantity of supporting legs (13) is a plurality of groups, supporting legs (13) are located heating panel (2) lower extreme and are the array and arrange, heating panel (2), heat-conducting plate (5), connection base (7), supporting legs (13) all are located the inside of recess (14).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022088088.0U CN213340338U (en) | 2020-09-22 | 2020-09-22 | High-heat-dissipation-performance package for high-density storage integrated chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022088088.0U CN213340338U (en) | 2020-09-22 | 2020-09-22 | High-heat-dissipation-performance package for high-density storage integrated chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213340338U true CN213340338U (en) | 2021-06-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022088088.0U Active CN213340338U (en) | 2020-09-22 | 2020-09-22 | High-heat-dissipation-performance package for high-density storage integrated chip |
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| Country | Link |
|---|---|
| CN (1) | CN213340338U (en) |
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- 2020-09-22 CN CN202022088088.0U patent/CN213340338U/en active Active
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