CN206472429U - A kind of radiator and a kind of electronic equipment - Google Patents
A kind of radiator and a kind of electronic equipment Download PDFInfo
- Publication number
- CN206472429U CN206472429U CN201621189239.9U CN201621189239U CN206472429U CN 206472429 U CN206472429 U CN 206472429U CN 201621189239 U CN201621189239 U CN 201621189239U CN 206472429 U CN206472429 U CN 206472429U
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- China
- Prior art keywords
- radiator
- housing
- upper substrate
- fin
- infrabasal plate
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a kind of radiator and a kind of electronic equipment.The radiator, connection is located at the heat generating components of enclosure interior, including infrabasal plate, lower fin, upper substrate and the upper fin set gradually from the bottom to top, and the upper substrate is connected with the housing, to the housing seal；The infrabasal plate and lower fin are located at the enclosure interior, and the upper fin is located at the hull outside；The infrabasal plate and the heat generating components thermal contact conductance.Radiator of the present utility model passes through housing, contacted respectively with the heat generating components and exterior space in housing, set up a quick heat transfer path, the heat that heat generating components is produced directly is transmitted to by exterior space by heat transfer, radiating efficiency is higher, heat-sinking capability is stronger, can effectively solve the problem that radiating and cooling problem；And the upper substrate of radiator is hermetically connected with the shell, a part for housing is constituted, the airtight waterproof requirement of housing is met.
Description
Technical field
The utility model is related to heat sink technology field, more particularly to a kind of radiator for airtight waterproof electronic equipment
And a kind of electronic equipment.
Background technology
For there is the electronic equipment of waterproof requirement, how to realize its quick radiating and cooling is a problem of this area.
Fig. 1 shows a kind of heat dissipation design of common airtight waterproof electronic equipment, including three parts, respectively euthermic chip
3, the radiator 2 attached on euthermic chip 3, for sealing the housing 1 being hedged off from the outer world, the housing is closed shell, its heat
Transmittance process be：Heat is passed to Inner heat sink 2 by euthermic chip 3 by heat transfer, and Inner heat sink 2 is made by heat radiation
With radiation to closed shell 1, closed shell 1 transfers heat to outside air again by radiation and convection action, completes internal
The radiating of portion's euthermic chip 1.
However, in above-mentioned radiator structure, due to waterproof demand, electronic equipment internal needs sealing, causes inner air
It can not be exchanged with outside air, therefore there is heat-sinking capability deficiency, cause the problems such as housing is overheated, chip temperature is too high；Surface
Temperature overheating, influences usage experience, and internal chip temperature is too high, influences the chip life-span, or even has the risk for burning out chip, seriously
The normal of influence airtight waterproof electronic equipment is used.
Utility model content
In view of the problem of the radiator heat-dissipation scarce capacity of prior art airtight waterproof electronic equipment, it is proposed that this practicality is new
A kind of radiator and a kind of electronic equipment of type, directly shell is transmitted to by the radiator through housing by heat from enclosure interior
Outside body, heat-sinking capability is improved, while upper substrate and housing seal by radiator, meet waterproof requirement.
To achieve these goals, the utility model employs following technical scheme：
A kind of radiator, connection is located at the heat generating components of enclosure interior, and the radiator includes what is set gradually from the bottom to top
Infrabasal plate, lower fin, upper substrate and upper fin, the upper substrate are connected with the housing, to the housing seal；The lower base
Plate and lower fin are located at the enclosure interior, and the upper fin is located at the hull outside；The infrabasal plate and the heating part
Part thermal contact conductance.
Alternatively, the radiator be aluminum alloy material, the infrabasal plate, lower fin, upper substrate and upper fin one into
Type.
Alternatively, the upper fin surface is provided with oxide layer or radiative material layer.
Alternatively, the infrabasal plate of the radiator is coated with heat-conducting silicone grease with the heat generating components contact surface, or sets
There is heat-conducting silica gel sheet.
Alternatively, the upper substrate of the radiator is Nian Jie with the housing seal by welding or fluid sealant.
Alternatively, the case top lid plate is provided with perforate, and the upper substrate of the radiator is mutually fitted with the hole shape
Match somebody with somebody, and insert in the perforate.
Alternatively, the verge of opening of the upper substrate of the radiator and the case top lid plate is provided with seam.
Alternatively, the area of the infrabasal plate is less than the area of the upper substrate.
Alternatively, the upper substrate constitutes the upper cover plate of the housing, is connected with four walls of the housing.
A kind of electronic equipment, the electronic equipment includes housing and is placed in the heat generating components of enclosure interior, and the electronic equipment is also
The radiator described in as above any one is provided with, the upper substrate of the radiator is connected with the housing, to the electronic equipment
Housing seal；The infrabasal plate and lower fin are located at the enclosure interior, and the upper fin is located at the hull outside；It is described
The infrabasal plate of radiator and the direct thermal contact conductance of the heat generating components.
The beneficial effects of the utility model are：
1st, radiator passes through housing, is contacted respectively with the heat generating components and exterior space in housing, sets up one quickly
Heat transfer path, is directly transmitted to exterior space, heat-sinking capability is stronger, Neng Gouyou by heat transfer by the heat that heat generating components is produced
Effect solves the problems, such as radiating and cooling；
2nd, the upper substrate of radiator is hermetically connected with the shell, and constitutes a part for housing, and the airtight waterproof for meeting housing will
Ask.
Brief description of the drawings
Fig. 1 is a kind of airtight waterproof electronic equipment dissipating heat design diagram of prior art；
A kind of radiator schematic diagram that Fig. 2 provides for the utility model one embodiment；
A kind of electronic equipment blast for being provided with radiator shown in Fig. 2 that Fig. 3 provides for the utility model one embodiment
Figure；
A kind of electronic equipment section view for being provided with radiator shown in Fig. 2 that Fig. 4 provides for the utility model one embodiment
Figure；
Another electronic equipment sectional view that Fig. 5 provides for the utility model one embodiment；
When Fig. 6 is thermal source 5W, the radiating effect simulation drawing of prior art radiator；
When Fig. 7 is thermal source 5W, the radiating effect simulation drawing of the utility model radiator；
When Fig. 8 is thermal source 8W, the radiating effect simulation drawing of prior art radiator；
When Fig. 9 is thermal source 8W, the radiating effect simulation drawing of the utility model radiator；
When Figure 10 is thermal source 10W, the radiating effect simulation drawing of prior art radiator；
When Figure 11 is thermal source 10W, the radiating effect simulation drawing of the utility model radiator.
In figure, 1. housings；11. perforate；2. radiator；21. on fin；22. upper substrate；23. lower fin；24. infrabasal plate；
3. euthermic chip.
Embodiment
Core concept of the present utility model is：A kind of radiator of large-size is introduced, through housing, while connecting housing
Internal heat resource and Open space, outside opening is directly delivered to by way of heat transfer by heat from internal confined space
Space；Meanwhile, the upper substrate with housing seal is set on a heat sink, normal airtight waterproof function is met.
It is new to this practicality below in conjunction with accompanying drawing to make the purpose of this utility model, technical scheme and advantage clearer
Type embodiment is described in further detail.
A kind of radiator schematic diagram that Fig. 2 provides for the utility model one embodiment；Fig. 3 is one reality of the utility model
The a kind of electronic equipment explosive view of example offer is provided；The a kind of electronic equipment section view that Fig. 4 provides for the utility model one embodiment
Figure.
Referring to shown in Fig. 2-4, radiator 2 disclosed in the utility model, connection is located at the euthermic chip 3 inside housing 1, bag
The infrabasal plate 24 set gradually from the bottom to top, lower fin 23, upper substrate 22 and upper fin 21 are included, upper substrate 22 is connected with housing 1,
Housing 1 is sealed；Infrabasal plate 24 and lower fin 23 are located inside housing 1, and upper fin 21 is located at outside housing 1；Radiator 2 leads to
Infrabasal plate 24 and the thermal contact conductance of euthermic chip 3 are crossed, and passes sequentially through infrabasal plate 24, lower fin 23, upper substrate 22 and upper fin 21
The heat of euthermic chip 3 is transmitted to the outside of housing 1 and realizes radiating.
The radiation processes of the utility model radiator include：Sequentially pass through infrabasal plate, lower fin, upper substrate and upper fin
Heat transfer, and by the radiation and convection current of upper fin to Open space, due to heat transfer specific heat radiant heat transfer efficiency more
It is high, it is known that, with the heat transfer of existing radiator structure shown in Fig. 1 compared with the radiation processes of --- radiation --- radiation and convection current, this
The radiating efficiency of utility model radiator is higher, and radiating is faster.In addition, upper substrate is connected with housing, sealing waterproof can be realized
Function, and housing heat is absorbed, control case temperature.Again, because the lower fin of the utility model radiator is larger, phase is absorbed
Change smaller with thermal temperature, with certain buffer capacity, can more effectively avoid the thermal shock of euthermic chip, prevent heating
Chip overheating aging.
Preferably, radiator 2 is aluminum alloy material, infrabasal plate 24, lower fin 23, upper substrate 22 and the one of upper fin 21 into
Type, structure is integral, in the absence of the heat transfer interface of unlike material, and the homogeneous heat transfer of material is uniform.
Preferably, the upper surface of fin 21 is provided with oxide layer by anode processing or spray painting processing is provided with radiation
Material layer, such as radiates enamelled coating to increase radiation, more effectively improves heat loss through radiation effect.
Preferably, the infrabasal plate 24 of radiator 2 and the contact surface of euthermic chip 3 are coated with heat-conducting silicone grease, or are provided with and lead
Hot silica gel piece, can reduce the thermal resistance with the contact surface of euthermic chip 3, accelerate heat conduction, improve radiating effect.
Preferably, the upper substrate 22 of radiator 2 is Nian Jie with the sealing of housing 1 by welding or fluid sealant, forms closed system,
Meet waterproof demand.Specifically, following connected mode can be used：
The upper cover plate of housing 1 is provided with perforate 11, the upper substrate 22 of radiator 2 is adapted and inserted out with the shape of perforate 11
Hole 11, then by welding or it is gluing be connected with upper cover plate, as shown in Figure 4.Preferably, in the embodiment, the upper substrate of radiator 2
22 are provided with seam with the edge of perforate 11 of the upper cover plate of housing 1, are easily installed and realize better seal effect.
Or, increase the size of upper substrate 22 of radiator 2, upper substrate 22 is directly constituted the upper cover plate of housing 1, with housing
1 four walls connection, as shown in Figure 5.Such a mode is low to processing request, and assembling process is easier, such as in upper substrate 22
Lower edge pastes waterproof double faced adhesive tape, is pressed against on four walls of housing 1, so that it may realize reliable sealing.
Specific radiator upper substrate size and the link position relation with housing, can be according to sealing grade, waterproof surface
The demands such as position, heat dissipation capacity size and appearance are determined.
The invention also discloses a kind of electronic equipment, referring again to Fig. 2-5, the electronic equipment includes housing 1 and is placed in shell
Euthermic chip 3 inside body 1, the electronic equipment is additionally provided with any radiator 2 as described above, the upper substrate of radiator 2
22 are connected with housing 1, the housing seal to electronic equipment, and infrabasal plate 24 and lower fin 23 are located inside housing 1, upper fin 22
Outside housing 1；The infrabasal plate 24 of radiator 2 is directly contacted with euthermic chip 3, and passes sequentially through infrabasal plate 24, lower fin
23rd, the heat of euthermic chip 3 is transmitted to the outside of housing 1 and realized by upper substrate 22 and upper fin 21 radiates.
By taking Fig. 2-4 illustrated embodiments as an example, the assembling process of the electronic equipment is：Euthermic chip 3 is first assembled to electronics
The inside relevant position of apparatus casing 1, radiator 2 is installed by the perforate 11 above casting of electronic device 1, the size of perforate 11
It is consistent with the size of upper substrate 22 of radiator 2, upper substrate 22 and the shape of perforate 11 above casting of electronic device 1 of radiator 2
It is adapted, in the insertion perforate 11 of upper substrate 22, space welding or sealant sealing；The infrabasal plate 24 and heat generating core of radiator 2
The surface laminating of piece 3, so constitutes a new closed system by casting of electronic device 1, radiator 2 and euthermic chip 3, can
The demand of waterproof normally is met, while realizing quick heat radiating, the overheat of housing 1 and euthermic chip 3 is effectively prevented.
Preferably, in this embodiment, the area of infrabasal plate 24 is less than the area of upper substrate 22, is so easy to installing
Cheng Zhong, installation is inserted by radiator 2 from the perforate 11 of housing 1.
Fig. 6-Fig. 7 uses analogue simulation software, simulates in 200mm*200mm*80mm confined spaces, plus a 5W thermal source
When existing radiator (Fig. 6) shown in Fig. 1 and the utility model radiator (Fig. 7) effect contrast figure.From the results, it was seen that
With new design, chip surface temperature can reduce about 5.7 DEG C.Contrasted with bigger thermal source, effect will be more bright
It is aobvious.Fig. 8-Fig. 9 is 8W thermal source, and chip temperature can reduce by 7.9 DEG C.Figure 10-Figure 11 is 10W thermal source, and chip temperature can be with
9.3 DEG C of reduction.
In summary, the beneficial effects of the utility model include：
1st, using the radiator of large-size, through housing, while connecting enclosure interior thermal source and Open space, lead to
Heat is directly delivered to Open space by the mode for crossing heat transfer from internal confined space, compared with prior art radiating effect
More preferably；
2nd, it is connected using upper substrate with housing, normal sealing water-proof function can be realized, and absorb housing heat, is controlled
Case temperature, improves usage experience；
3rd, because the lower fin of the utility model radiator is larger, absorb identical thermal temperature and change smaller, with certain
Buffer capacity, can more effectively avoid the thermal shock of euthermic chip, prevent euthermic chip from crossing heat ageing.
Preferred embodiment of the present utility model is the foregoing is only, protection model of the present utility model is not intended to limit
Enclose.All any modification, equivalent substitution and improvements made within spirit of the present utility model and principle etc., are all contained in this reality
With in new protection domain.
Claims (10)
1. a kind of radiator, heat generating components of the connection positioned at enclosure interior, it is characterised in that the radiator include from the bottom to top according to
The infrabasal plate of secondary setting, lower fin, upper substrate and upper fin, the upper substrate are connected with the housing, to the housing seal；
The infrabasal plate and lower fin are located at the enclosure interior, and the upper fin is located at the hull outside；The infrabasal plate and institute
State heat generating components thermal contact conductance.
2. radiator as claimed in claim 1, it is characterised in that the radiator is aluminum alloy material, the infrabasal plate, under
Fin, upper substrate and upper fin are integrally formed.
3. radiator as claimed in claim 1, it is characterised in that the upper fin surface is provided with oxide layer or radiation material
The bed of material.
4. radiator as claimed in claim 1, it is characterised in that the infrabasal plate of the radiator is contacted with the heat generating components
Face is coated with heat-conducting silicone grease, or is provided with heat-conducting silica gel sheet.
5. radiator as claimed in claim 1, it is characterised in that the upper substrate of the radiator by welding or fluid sealant with
The housing seal bonding.
6. radiator as claimed in claim 5, it is characterised in that the case top lid plate is provided with perforate, the radiator
Upper substrate be adapted with the hole shape, and insert in the perforate.
7. radiator as claimed in claim 6, it is characterised in that the upper substrate of the radiator and the case top lid plate
Verge of opening is provided with seam.
8. radiator as claimed in claim 1, it is characterised in that the area of the infrabasal plate is less than the face of the upper substrate
Product.
9. radiator as claimed in claim 5, it is characterised in that the upper substrate constitutes the upper cover plate of the housing, with institute
State the four walls connection of housing.
10. a kind of electronic equipment, the electronic equipment includes housing and is placed in the heat generating components of enclosure interior, it is characterised in that should
Electronic equipment is additionally provided with the radiator as described in claim any one of 1-9, the upper substrate of the radiator and the housing
Connection, the housing seal to the electronic equipment；The infrabasal plate and lower fin are located at the enclosure interior, the upper fin position
In the hull outside；The infrabasal plate of the radiator and the direct thermal contact conductance of the heat generating components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621189239.9U CN206472429U (en) | 2016-11-04 | 2016-11-04 | A kind of radiator and a kind of electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621189239.9U CN206472429U (en) | 2016-11-04 | 2016-11-04 | A kind of radiator and a kind of electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206472429U true CN206472429U (en) | 2017-09-05 |
Family
ID=59710713
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621189239.9U Active CN206472429U (en) | 2016-11-04 | 2016-11-04 | A kind of radiator and a kind of electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206472429U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108012509A (en) * | 2017-12-26 | 2018-05-08 | 成都共同散热器有限公司 | A kind of double-face integral formula radiator and its processing technology |
-
2016
- 2016-11-04 CN CN201621189239.9U patent/CN206472429U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108012509A (en) * | 2017-12-26 | 2018-05-08 | 成都共同散热器有限公司 | A kind of double-face integral formula radiator and its processing technology |
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