CN206947337U - Exempt from the UV LED light source modules of encapsulation - Google Patents
Exempt from the UV LED light source modules of encapsulation Download PDFInfo
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- CN206947337U CN206947337U CN201720737411.8U CN201720737411U CN206947337U CN 206947337 U CN206947337 U CN 206947337U CN 201720737411 U CN201720737411 U CN 201720737411U CN 206947337 U CN206947337 U CN 206947337U
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- Prior art keywords
- metallic plate
- circuit board
- light source
- led light
- ceramic circuit
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Abstract
A kind of UV LED light source modules for exempting from encapsulation are the utility model is related to, it includes：Ceramic circuit board, there is crystal bonding area；UV LED chip arrays, are arranged on crystal bonding area；First metallic plate, be arranged on ceramic circuit board and outside the crystal bonding area, the first metallic plate adjacent to crystal bonding area side formed with the first inserting groove；Second metallic plate, be oppositely disposed at the first metallic plate on ceramic circuit board and outside the crystal bonding area, the second metallic plate adjacent to crystal bonding area side formed with the second inserting groove；Glass panel, the first inserting groove and the second inserting groove are plugged in, and cover UV LED chip arrays.The utility model is protected using glass panel to UV LED chip arrays, and UV LED chips are wrapped up without using encapsulating material, the problem of in the absence of encapsulating material aging of the prior art and heat dispersion difference, so as to effectively extend module service life.
Description
Technical field
It the utility model is related to a kind of UV-LED light source module groups.
Background technology
According to the difference of wavelength, UV (ultraviolet light) can be divided into UVA (wavelength 315-400nm), (wavelength is UVB
280-315nm) and a variety of grades such as UVC (wavelength 200-280nm).Wherein, the UVC of short wavelength, which has, sterilizes and purifies work(
Can, the UVA of long wavelength can apply to exposure device or solidification equipment.
Chinese patent literature CN103794603A discloses one kind and exempts to encapsulate UV-LED curing light source modules, including silicon substrate
Plate, reflection interconnection layer is set in the front of silicon substrate, the upper surface for reflecting interconnection layer sets some groups of positive and negative Eutectic Layers, and every group just
Negative Eutectic Layer is formed by P eutectics electrode and N eutectics electrode, and LED chip, LED chip table are set on every group of positive and negative Eutectic Layer
Face is covered with casting glue；Wherein, LED chip presses 1 by the LED chip of tetra- kinds of wavelength of 365nm, 380nm, 395nm, 405nm:1:1:
1 proportioning is integrated；Water-filled radiator is connected by weld layer at the back side of silicon substrate, water inlet pipe and water outlet are set on water-filled radiator
Pipe.
As disclosed in patent documents above, in existing UV-LED light source module groups, generally use epoxy resin or silica gel
LED chip is wrapped up Deng encapsulating material, to play a part of protecting LED chip (and gold thread of electrical connection LED chip).But
Because ultraviolet light can accelerate the aging of the encapsulating materials such as epoxy resin and silica gel, and the low thermal conductivity of encapsulating material can also reduce
The heat-sinking capability of module, therefore the problem of UV-LED light source module group service lifes are shorter be present.
The content of the invention
In view of the shortcomings of the prior art, main purpose of the present utility model, which is to provide one kind and can effectively extend it, uses the longevity
The UV-LED light source module groups of life.
In order to realize above-mentioned main purpose, the utility model provides a kind of UV-LED light source module groups for exempting from encapsulation, its
Including：
Ceramic circuit board, there is crystal bonding area；
UV-LED chip arrays, are arranged on crystal bonding area；
First metallic plate, is arranged on ceramic circuit board and outside crystal bonding area, the first metallic plate is adjacent to crystal bonding area
Side formed with the first inserting groove；
Second metallic plate, it is oppositely disposed at the first metallic plate on ceramic circuit board and outside crystal bonding area, second
Metallic plate adjacent to crystal bonding area side formed with the second inserting groove；
Glass panel, the first inserting groove and the second inserting groove are plugged in, and cover UV-LED chip arrays.
From above technical scheme, the utility model is protected using glass panel to UV-LED chip arrays, nothing
LED chip need to be wrapped up using encapsulating material as in the prior art, it is old in the absence of encapsulating material of the prior art
The problem of changing with heat dispersion difference, so as to effectively extend module service life.Secondly, glass panel is plugged in the first inserting groove
With the second inserting groove, the manufacture craft of module significantly simplify.
Further, on the one hand the utility model is propped up glass panel by the metallic plate with excellent heat dispersion performance
Support, quick heat radiating is carried out to LED chip module together with ceramic circuit board using metallic plate, on the other hand in glass panel and pottery
Open space is formed between porcelain circuit board, in order to which air flows through LED chip and carries out heat loss through convection, so as to effectively improve module
Heat dispersion.In addition, metallic plate can play a protective role to ceramic circuit board, ceramic circuit board is effectively reduced because of outer masterpiece
With and the possibility of fragmentation.
According to a kind of embodiment of the present utility model, UV-LED light source module groups also include through the first metallic plate and
First mounting hole of ceramic circuit board, the second mounting hole through the second metallic plate and ceramic circuit board.
In above-mentioned technical proposal, because mounting hole runs through metallic plate and ceramic circuit board, therefore when fixed UV-LED light sources
During module, the fastener pressure applied for being arranged in mounting hole is acted directly on metallic plate so that ceramic circuit board has
Larger bearing area, so as to prevent ceramic circuit board in the presence of fastening pressure it is chipping.
According to another embodiment of the present utility model, between the first inserting groove and the second inserting groove and glass panel
There is the inclined surface to cooperate in the plugging direction, consequently facilitating carrying out grafting operation to glass panel, and improve glass
Connection reliability between panel and metallic plate.It should be noted that in the utility model, inclined surface refers to it relative to glass
It is obliquely installed for the main surface of panel.
According to another embodiment of the present utility model, glass panel, the first metallic plate and the second metallic plate it is outer
Side surface is concordantly set.
According to another embodiment of the present utility model, the first metallic plate and the second metallic plate and ceramic circuit board it
Between be connected with each other by the hot-press solidifying of prepreg.
In the utility model, the first metallic plate and the second metallic plate can be any metallic plates such as copper coin, aluminium sheet, steel plate.
Wherein, from the point of view of processing and cost is easy to, the first metallic plate and the second metallic plate are both preferably aluminium sheet.
In the utility model, ceramic circuit board can be the arbitrary ceramic circuit board such as aluminium nitride, aluminum oxide, carborundum.
Wherein, from the point of view of cost and heat dispersion, aluminium nitride ceramics circuit board is preferable.In addition, ceramic circuit board can be with
It is one side, two-sided or multilayer circuit board.
According to another embodiment of the present utility model, UV-LED chip arrays are rectangular array.
According to another embodiment of the present utility model, binding post is additionally provided with ceramic circuit board, in order to
Realize the electric connection between module and other devices.
According to another embodiment of the present utility model, driving IC is additionally provided with ceramic circuit board.
It is below in conjunction with the accompanying drawings and specific real in order to more clearly illustrate the purpose of this utility model, technical scheme and advantage
Applying mode, the utility model is described in further detail.
Brief description of the drawings
Fig. 1 is the structural representation of the utility model UV-LED light source module group preferred embodiments；
Fig. 2 is the structure decomposition figure of the utility model UV-LED light source module group preferred embodiments.
Embodiment
As illustrated in fig. 1 and 2, the UV-LED light source module groups as the utility model preferred embodiment include having crystal bonding area 11
Aluminium nitride ceramics circuit board 1, the array of UV-LED chips 2, the first metallic plate 3, the and of the second metallic plate 4 that are arranged on crystal bonding area 11
Glass panel 5.Wherein, crystal bonding area 11 is arranged as the more of rectangular array formed with least two electrode pad (not shown)s
Individual UV-LED chips 2 are fixed on crystal bonding area by gluing process, between multiple UV-LED chips 2 and LED chip 2 and electrode pad
Between pass through gold thread (not shown) realize electrical connection.It is readily appreciated that, in other embodiment of the present utility model, can adopts
With flip chip type UV-LED chips, and corresponding electrode pad is formed in crystal bonding area, the LED chip is electrically connected by SMT techniques
It is connected on the respective electrode pad of crystal bonding area.
First metallic plate 3 and the second metallic plate 4 are aluminium sheet, and the first metallic plate 3 is arranged on ceramic circuit board 1 and is located at
Outside crystal bonding area 11, the second metallic plate 4 and the first metallic plate 3 are oppositely disposed on ceramic circuit board 1 and are similarly positioned in die bond
Outside area 11.Wherein, the hot-press solidifying of prepreg is passed through between the first metallic plate 3 and the second metallic plate 4 and ceramic circuit board 1
And it is connected with each other.Specifically, semi-solid preparation is placed between the first metallic plate 3 and the second metallic plate 4 and ceramic circuit board 1 first
Piece, then solidified by heat pressing process prepreg, so as to by the first metallic plate 3 and the second metallic plate 4 and ceramic circuit
Plate 1 interconnects.
First metallic plate 3 adjacent to crystal bonding area 11 side formed with the first inserting groove 31, the second metallic plate 4 is adjacent to solid
The side of crystalline region 11 is formed with the second inserting groove 41.Glass panel 5 is plugged in the first inserting groove 31 and the second inserting groove 32, so as to
Carried by the first metallic plate 3 and the second metallic plate 4.As shown in figure 1, the array of UV-LED chips 2 is completely covered in glass panel 5,
And the substantially concordant setting of the outer surface (main surface) of glass panel 5, the first metallic plate 3 and the second metallic plate 4.Such as Fig. 2 institutes
Show, the end that glass panel 5 is connected with the first metallic plate 3 and the second metallic plate 4 is formed with the nauropemeter extended along grafting direction
Face 51, the first inserting groove 31 and the second inserting groove 41 are similarly formed as inclined-plane with the surface that inclined surface 51 is engaged.
For the ease of realizing that the installation of UV-LED light source module groups is fixed, UV-LED light source module groups also include running through the first metal
Two the first mounting holes 32 of plate 3 and ceramic circuit board 1, two second installations through the second metallic plate 4 and ceramic circuit board 1
Hole 42.Wherein, the first mounting hole 32 and the second mounting hole 42 are separately positioned on the corner positions of UV-LED light source module groups, such as spiral shell
The fastener (not shown) of nail may pass through mounting hole 32 and 42 and UV-LED light source module groups be fixed into miscellaneous part.
Although the first metallic plate 3 and the second metallic plate 4 covering ceramic circuit board 1 are located at crystal bonding area in above preferred embodiment
All surfaces outside 11, but it should be readily apparent to one skilled in the art that in other embodiment of the present utility model, the first metal
The metallic plate 4 of plate 3 and second can only cover the part surface that ceramic circuit board 1 is located at outside crystal bonding area 11, and can make pottery
On the surface that porcelain circuit board 1 is not covered by the first metallic plate 3, the second metallic plate 4 and glass panel 5 set binding post and/
Or the electronic component such as driving IC.
Although the utility model is disclosed above with preferred embodiment, the model of the utility model implementation is not limited to
Enclose.Any one of ordinary skill in the art, do not departing from invention scope of the present utility model, when a little improvement can be made,
I.e. every equal improvement done according to the utility model, should be the scope of protection of the utility model and is covered.
Claims (10)
- A kind of 1. UV-LED light source module groups for exempting from encapsulation, it is characterised in that including：Ceramic circuit board, there is crystal bonding area；UV-LED chip arrays, it is arranged on the crystal bonding area；First metallic plate, is arranged on the ceramic circuit board and outside the crystal bonding area, first metallic plate is adjacent In the side of the crystal bonding area formed with the first inserting groove；Second metallic plate, be oppositely disposed at first metallic plate on the ceramic circuit board and positioned at the crystal bonding area it Outside, second metallic plate adjacent to the side of the crystal bonding area formed with the second inserting groove；Glass panel, first inserting groove and second inserting groove are plugged in, and cover the UV-LED chip arrays.
- 2. UV-LED light source module groups as claimed in claim 1, it is characterised in that：The UV-LED light source module groups also include running through First mounting hole of first metallic plate and the ceramic circuit board, through second metallic plate and the ceramic circuit board The second mounting hole.
- 3. UV-LED light source module groups as claimed in claim 1, it is characterised in that：First inserting groove and second grafting There is the inclined surface to cooperate in the plugging direction between groove and the glass panel.
- 4. UV-LED light source module groups as claimed in claim 1, it is characterised in that：The glass panel, first metallic plate It is concordant with the outer surface of second metallic plate to set.
- 5. UV-LED light source module groups as claimed in claim 1, it is characterised in that：First metallic plate and second metal It is connected with each other between plate and the ceramic circuit board by the hot-press solidifying of prepreg.
- 6. UV-LED light source module groups as claimed in claim 1, it is characterised in that：First metallic plate and second metal Plate is aluminium sheet.
- 7. UV-LED light source module groups as claimed in claim 1, it is characterised in that：The ceramic circuit board is aluminium nitride ceramics electricity Road plate.
- 8. UV-LED light source module groups as claimed in claim 1, it is characterised in that：The UV-LED chip arrays are rectangle battle array Row.
- 9. UV-LED light source module groups as claimed in claim 1, it is characterised in that：Wiring is additionally provided with the ceramic circuit board Terminal.
- 10. UV-LED light source module groups as claimed in claim 1, it is characterised in that：Drive is additionally provided with the ceramic circuit board Dynamic IC.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720737411.8U CN206947337U (en) | 2017-06-23 | 2017-06-23 | Exempt from the UV LED light source modules of encapsulation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720737411.8U CN206947337U (en) | 2017-06-23 | 2017-06-23 | Exempt from the UV LED light source modules of encapsulation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206947337U true CN206947337U (en) | 2018-01-30 |
Family
ID=61364855
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720737411.8U Expired - Fee Related CN206947337U (en) | 2017-06-23 | 2017-06-23 | Exempt from the UV LED light source modules of encapsulation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206947337U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110171197A (en) * | 2019-06-27 | 2019-08-27 | 南京伯克利新材料科技有限公司 | A kind of UV-LED cure lamp |
-
2017
- 2017-06-23 CN CN201720737411.8U patent/CN206947337U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110171197A (en) * | 2019-06-27 | 2019-08-27 | 南京伯克利新材料科技有限公司 | A kind of UV-LED cure lamp |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180130 Termination date: 20200623 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |