CN206907791U - The encapsulating structure of display screen, light fixture and its LED lamp bead - Google Patents

Abstract

The utility model belongs to LED encapsulation technologies field, aim to provide a kind of display screen, the encapsulating structure of light fixture and its LED lamp bead, in the utility model, the encapsulating structure of the LED lamp bead forms lead frame by etch process and is directly integrally formed out each leg when forming lead frame, because on lead frame formed with least one conducting function area and at least one nonfunctional area, each conducting function area is enclosed by corresponding nonfunctional area, each leg is formed in corresponding conducting function area, namely, each leg is formed in the middle part of lead frame, therefore, it is avoided that and flash occurs during cutting and cause occur the bad phenomenon of even tin during scolding tin；In addition, by model technique on lead frame formed with epoxy resin, so, you can greatly improve the combination between encapsulation glue-line and lead frame, and then the water resistance of the encapsulating structure of the LED lamp bead, display screen and light fixture is increased dramatically.

Description

The encapsulating structure of display screen, light fixture and its LED lamp bead

Technical field

The utility model belongs to LED encapsulation technologies field, is to be related to a kind of encapsulating structure of LED lamp bead more specifically, And the display screen and light fixture of the encapsulating structure with the LED lamp bead.

Background technology

Light emitting diode (Light Emitting Diode, abbreviation LED) is a kind of solid state semiconductor devices, its conduct Electric energy can be converted into luminous energy by a kind of luminescent device, changed incandescent filament and lighted what is lighted with electricity-saving lamp tricolor powder Principle.Generally, LED spectrum almost all is concentrated in visible light frequency band, thus, under the control of computer technology, LED light Source can utilize three kinds of primary colours of red, green and blue, these three colors is had 256 grades of gray scales and allow them arbitrarily to mix, and finally, produce The different color of 256 × 256 × 256=16777216 kinds, thus, protean photochromic combination is formed, is realized rich and varied Dynamic change effect and various images.In a word, on the whole, it is very distinct the characteristics of LED, as long lifespan, light efficiency are high, radiationless With low energy consumption etc., thus, it is widely used in the technical fields such as display screen, light fixture.

Wherein, LED lamp bead is the important component of LED display, and every piece of LED display is provided with thousands of lamp beads, Thus, the package quality of LED lamp bead is particularly significant for LED display.However, in the prior art, the encapsulation knot of LED lamp bead The poor waterproof properties of structure, and because the scolding tin pin of traditional LED lamp bead encapsulating structure is generally formed by cutting machine cutting, cutting There is flash in Shi Rongyi, and this can cause when surface mounting technology (Surface Mount Technology, abbreviation SMT) produces Easily there is the bad phenomenon that scolding tin pin connects tin.

Utility model content

The purpose of this utility model is to provide a kind of encapsulating structure of LED lamp bead, to solve to exist in the prior art LED lamp bead encapsulating structure poor waterproof properties and easily there is the technical problem that scolding tin pin connects tin.

In order to solve the above technical problems, the technical solution adopted in the utility model is：A kind of encapsulation knot of LED lamp bead is provided Structure, the encapsulating structure of the LED lamp bead includes the lead frame of wire, at least one LED chip and etched technological forming, described to lead Coil holder is provided with least one conducting function area and at least one nonfunctional area, and each conducting function area is by corresponding described non- Functional areas enclose；In in each conducting function area, the lead frame is provided with negative pole carrier and to facilitate each LED core The chip carrier that piece is sticked, the wire is connected between each LED chip and the negative pole carrier；

In in each conducting function area, integrally formed with least one weldering when the etch process on the lead frame A leg is corresponded to after pin, the negative pole carrier and each chip carrier；

By model technique formed with encapsulating the wire, each LED chip and described lead on the lead frame The encapsulation glue-line of coil holder.

Further, the model is passed through in the outer side surface close to the side of each LED chip, the encapsulation glue-line Technique is formed as mat surface.

Further, etch-forming has the first honeycomb hole and multiple second honeycomb holes in each nonfunctional area, each described Second honeycomb hole is located at the surrounding of first honeycomb hole, and corresponding to the negative pole carrier and each chip carrier be respectively positioned on Between first honeycomb hole and second honeycomb hole.

Further, the pass of first honeycomb hole is cross-type.

Further, the LED chip has 3, and the leg has 4, and second honeycomb hole has 4.

Further, each LED chip is respectively red light chips, green glow chip and blue chip.

Further, the thickness of the lead frame is 0.2mm~0.3mm.

Further, the encapsulation glue-line is made up of epoxide resin material.

Compared with prior art, the beneficial effect of the encapsulating structure of LED lamp bead provided by the utility model is：

The encapsulating structure of the LED lamp bead is by etch process formation lead frame and directly integral while lead frame is formed Mold each leg, because on lead frame formed with least one conducting function area and at least one nonfunctional area, each conducting function Area is enclosed by corresponding nonfunctional area, and each leg is formed in corresponding conducting function area, and in other words, each leg is formed and led The middle part of coil holder, therefore, it is avoided that and flash occurs during cutting and cause occur the bad phenomenon of even tin during scolding tin；It is in addition, logical Cross model technique on lead frame formed with encapsulation glue-line (such as epoxy resin), so, you can greatly improve encapsulation glue-line with Combination between lead frame, and then the water resistance of the encapsulating structure of the LED lamp bead is increased dramatically.

The purpose of this utility model additionally provides a kind of display screen, in order to solve the above technical problems, the utility model uses Technical scheme be：A kind of display screen is provided, the display screen includes display panel, and the display panel is luminous provided with several Unit, the luminescence unit include the encapsulating structure of above-mentioned LED lamp bead.

Compared with prior art, the beneficial effect of display screen provided by the utility model is：The display screen by using The encapsulating structure of above-mentioned LED lamp bead, it is ensured that the waterproof and dampproof performance of display screen, make it have more stable display effect Fruit, meanwhile, the reliability of display screen is improved, the display screen is applied to indoor and outdoor.

The purpose of this utility model additionally provides a kind of light fixture, in order to solve the above technical problems, what the utility model used Technical scheme is：A kind of light fixture is provided, the light fixture includes luminous component, and the luminous component includes at least one above-mentioned LED The encapsulating structure of lamp bead.

Compared with prior art, the beneficial effect of light fixture provided by the utility model is：The light fixture is applied to indoor and outdoor, By using the encapsulating structure of above-mentioned LED lamp bead, it is ensured that the waterproof and dampproof performance of the light fixture, make it have what is more stablized Illumination effect, thus, improve the reliability of the light fixture.

Brief description of the drawings

, below will be to embodiment or prior art in order to illustrate more clearly of the technical scheme in the embodiment of the utility model The required accompanying drawing used is briefly described in description, it should be apparent that, drawings in the following description are only that this practicality is new Some embodiments of type, for those of ordinary skill in the art, on the premise of not paying creative work, can be with root Other accompanying drawings are obtained according to these accompanying drawings.

Fig. 1 is the structural representation after the lead frame die bond bonding wire of the encapsulating structure of LED lamp bead in the utility model embodiment Figure；

Fig. 2 is the partial enlarged drawing at A in Fig. 1；

Fig. 3 is the internal structure signal of single LEDs lamp bead in the encapsulating structure of LED lamp bead in the utility model embodiment Figure；

Fig. 4 is the front view of single LEDs lamp bead in the encapsulating structure of LED lamp bead in the utility model embodiment；

Fig. 5 is the bottom view of single LEDs lamp bead in Fig. 4；

Fig. 6 is the lateral plan of single LEDs lamp bead in Fig. 4；

Fig. 7 is the knot of the lead frame that etched technique is formed in the encapsulating structure of LED lamp bead in the utility model embodiment Structure schematic diagram.

Wherein, the label in accompanying drawing is as follows：

100- wires, 200-LED chips, 210- red light chips, 220- green glows chip, 230- blue chips；

300- lead frames, 310- conducting functions area, 311- negative poles carrier, 312- chip carriers, 313- legs, 320- NOT functions Can area, the honeycomb holes of 321- first, the honeycomb holes of 322- second；400- encapsulation glue-line, 410- outer side surfaces.

Embodiment

In order that technical problem to be solved, technical scheme and advantage of the present utility model are more clearly understood, below With reference to drawings and Examples, the utility model is further elaborated.It should be appreciated that specific implementation described herein Example only to explain the utility model, is not used to limit the utility model.

It should be noted that when part is referred to as " being fixed on " or " being arranged at " another part, it can be directly another On individual part or it is connected on another part.When a part is known as " being connected to " another part, it can be with It is directly to another part or is indirectly connected on another part.

It should be noted that in the accompanying drawing of the utility model embodiment same or analogous label correspond to it is same or analogous Part；In description of the present utility model, it is to be understood that if there is the side of the instructions such as term " on ", " under ", "left", "right" Position or position relationship are based on orientation shown in the drawings or position relationship, are for only for ease of description the utility model and simplification is retouched State, rather than instruction or imply signified device or element there must be specific orientation, with specific azimuth configuration and operation, Therefore, described in accompanying drawing position relationship term being given for example only property explanation, it is impossible to be interpreted as the limitation to this patent, for this For the those of ordinary skill in field, the concrete meaning of above-mentioned term can be understood as the case may be.

In addition, term " first ", " second " are only used for describing purpose, and it is not intended that instruction or hint relative importance Or the implicit quantity for indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can be expressed or Implicitly include one or more this feature.In the description of the invention, " multiple " are meant that two or more, Unless otherwise specifically defined.

Carried out below in conjunction with realization of the specific accompanying drawing to a kind of encapsulating structure of LED lamp bead provided by the utility model detailed Ground describes.

It should be noted that the encapsulating structure of the LED lamp bead is a kind of adopting surface mounted LED lamp bead of the indoor and outdoor of small spacing Encapsulating structure, certainly, it can also use in other encapsulating structures if appropriate.

As shown in Figures 1 to 7, the encapsulating structure of the LED lamp bead, including wire 100, at least one LED chip 200 and warp The lead frame 300 of etch process shaping.Wherein, in the present embodiment, the thickness of lead frame 300 is 0.2mm~0.3mm.For side Just the encapsulation of the encapsulating structure of the LED lamp bead and conducting function can be realized, lead frame 300 is provided with least one conducting function Area 310 and at least one nonfunctional area 320, each conducting function area 310 are enclosed by corresponding nonfunctional area 320.It should be noted that Because of the particularity of etch process, generally, in the present embodiment, each nonfunctional area 320 is ultimately formed into alveolate texture, certainly, Other shapes can be also shaped to as needed.

To complete the installation of the circuit of LED lamp bead, each LED chip 200 is sticked on lead frame 300, such as Fig. 1 to Fig. 3 institutes Show, in each conducting function area 310, lead frame 300 is provided with negative pole carrier 311 and chip carrier 312, wherein, each chip carries Body 312 is primarily to facilitate each LED chip 200 to be sticked.Again as shown in Figure 1 to Figure 3, each LED chip 200 and negative pole carrier Wire 100 is connected between 311.

As shown in Figure 2 and Figure 5, circuit turn-on is realized for convenience of each LED chip 200, in each conducting function area 310, led Integrally formed with least one leg 313 on coil holder 300, wherein, each leg 313 is in the etch-forming technique of lead frame 300 In directly formed.A leg 313 is corresponded to after negative pole carrier 311 and each chip carrier 312, it is clear that it is to be appreciated that as schemed Shown in 6, each LED chip 200 is electrically connected in circuit board (not shown) by corresponding leg 313.

It should be noted that because each conducting function area 310 is enclosed by corresponding nonfunctional area 320, thus, as shown in figure 5, Each leg 313 of shaping in each conducting function area 310, positioned at the centre position of lead frame 300, and by the direct shape of etch process Into, therefore, as shown in Figure 5 and Figure 6, the outer perimeter wall of each leg 313 is mat surface, beneficial to raising lead frame 300 and encapsulation glue-line Combination between 400, and each leg 313 is more smooth, compares beneficial to upper tin.

As shown in Fig. 1, Fig. 4 and Fig. 6, formed with encapsulation glue-line 400 on lead frame 300, wherein, the encapsulation glue-line 400 is led Will be to packaging conductive wire 100, each LED chip 200 and lead frame 300.It need to stress, to improve the encapsulation glue-line 400 Combination between lead frame 300, and then the water resistance of the encapsulating structure is improved, the encapsulation glue-line 400 passes through model technique Formed.It should be noted that specifically in this embodiment, it is preferred that, the encapsulation glue-line 400 is made up of epoxide resin material.

Further, as LED lamp bead provided by the utility model encapsulating structure a kind of embodiment, through mould Technological forming is made, as shown in fig. 6, being formed as in the outer side surface 410 close to the side of each LED chip 200, encapsulation glue-line 400 Mat surface, so, the exiting surface of each LED chip is no longer shiny surface, thus, is easy to the encapsulating structure for improving the LED lamp bead should During for display devices such as display screens, contrast of the screen body in blank screen.

Further, as LED lamp bead provided by the utility model encapsulating structure a kind of embodiment, such as scheme 1st, shown in Fig. 2 and Fig. 7, etch-forming has the first honeycomb hole 321 and multiple second honeycomb holes 322 in each nonfunctional area 320, and each Two honeycomb holes 322 are located at the surrounding of the first honeycomb hole 321, and negative pole carrier 311 and each chip carrier 312 be respectively positioned on corresponding to the Between one honeycomb hole 321 and the second honeycomb hole 322, it is clear that by so rational topology layout, encapsulate glue-line 400 and wire Combination between frame 300 can be relatively good.By upper it is to be appreciated that the first honeycomb hole 321 and each second in each nonfunctional area 320 Honeycomb hole 322 is formed together during molding lead frame 300 by etch process.

Specifically in this embodiment, it is preferred that the pass of the first honeycomb hole 321 is cross-type.Specifically, such as Fig. 1 and figure Shown in 5, LED chip 200 has 3, it is possible to understand that ground, leg 313 have 4, and the second honeycomb hole 322 has 4.

Further, as LED lamp bead provided by the utility model encapsulating structure a kind of embodiment, such as scheme Shown in 2 and Fig. 3, each LED chip 200 is respectively red light chips 210, green glow chip 220 and blue chip 230.It should be noted that The priority of red light chips 210, green glow chip 220 and blue chip 230, which puts in order, to be decided according to the actual requirements.

The utility model also provides a kind of display screen, and the display screen includes display panel (not shown), wherein, display panel Including several luminescence unit (not shown), luminescence unit includes above-mentioned LED encapsulation structure.The display screen is because having well Waterproof and dampproof performance, and there is good soldering reliability, thus the high request of indoor and outdoor display screen can be met.

The utility model also provides a kind of light fixture, and the light fixture includes luminous component (not shown), and luminous component is included at least One above-mentioned LED encapsulation structure.

Preferred embodiment of the present utility model is the foregoing is only, is not limited to the utility model.For this For the technical staff in field, the utility model can have various modifications and variations.It is all in the spirit and principles of the utility model Within, any modification, equivalent substitution and improvements made etc., it should be included within right of the present utility model.

Claims (10)

1. The encapsulating structure of 1.LED lamp beads, it is characterised in that：Including wire, at least one LED chip and etched technological forming Lead frame, the lead frame are provided with least one conducting function area and at least one nonfunctional area, each conducting function area Enclosed by the corresponding nonfunctional area；In in each conducting function area, the lead frame be provided with negative pole carrier and to The chip carrier for facilitating each LED chip to be sticked, described lead is connected between each LED chip and the negative pole carrier Line；

   In in each conducting function area, integrally formed with least one leg when the etch process on the lead frame, A leg is corresponded to after the negative pole carrier and each chip carrier；

   By model technique formed with encapsulating the wire, each LED chip and the lead frame on the lead frame Encapsulation glue-line.
2. 2. the encapsulating structure of LED lamp bead as claimed in claim 1, it is characterised in that：In close to the one of each LED chip Side, the outer side surface of the encapsulation glue-line are formed as mat surface by the model technique.
3. 3. the encapsulating structure of LED lamp bead as claimed in claim 1, it is characterised in that：Etch-forming in each nonfunctional area There are the first honeycomb hole and multiple second honeycomb holes, each second honeycomb hole is located at the surrounding of first honeycomb hole, and described Negative pole carrier and each chip carrier be respectively positioned on corresponding between first honeycomb hole and second honeycomb hole.
4. 4. the encapsulating structure of LED lamp bead as claimed in claim 3, it is characterised in that：The pass of first honeycomb hole is ten Cabinet frame type.
5. 5. the encapsulating structure of LED lamp bead as claimed in claim 3, it is characterised in that：The LED chip has 3, the weldering Pin has 4, and second honeycomb hole has 4.
6. 6. the encapsulating structure of LED lamp bead as claimed in claim 5, it is characterised in that：Each LED chip is respectively feux rouges core Piece, green glow chip and blue chip.
7. 7. the encapsulating structure of the LED lamp bead as described in any one of claim 1 to 6, it is characterised in that：The thickness of the lead frame For 0.2mm~0.3mm.
8. 8. the encapsulating structure of the LED lamp bead as described in any one of claim 1 to 6, it is characterised in that：The encapsulation glue-line is by ring Oxygen resin material is made.
9. 9. display screen, including display panel, the display panel is provided with several luminescence units, it is characterised in that：The hair Light unit includes the encapsulating structure of the LED lamp bead as described in any one of claim 1 to 8.
10. 10. light fixture, including luminous component, it is characterised in that：The luminous component includes at least one such as claim 1 to 8 times The encapsulating structure of LED lamp bead described in one.