CN209691785U - A kind of light source module group and its die cutting die - Google Patents

Abstract

The utility model discloses a kind of light source module group and its die cutting dies, light source module group includes substrate and multiple LED chips, the surface of the substrate, which is equipped with, forms conductive grid by multiple lateral conducting wires and multiple longitudinal conducting wires, multiple LED chips are fixed on substrate, and the anode and cathode of the LED chip are electrically connected with conducting wire respectively；The connection structure of each LED chip be after first series connection parallel-connection structure or be it is first in parallel after cascaded structure.Light source module group disclosed by the utility model, multiple LED chips are disposed on the substrate to form a LED light source mould group, when multiple light sources mould group is applied over the display, the pixel that each light source module group is shown as a compartmentalization, to improve display area display effect, while also reducing the difficulty of display lighting light source local luminance control.

Description

A kind of light source module group and its die cutting die

Technical field

The utility model relates to lighting technical fields, more specifically to LED light source modular structure and its production technology Die cutting die applied in process.

Background technique

Light source of the LED as a new generation, has energy-saving and environmental protection, safety, service life length, low-power consumption, low fever, high photosynthetic efficiency etc. Feature can be widely applied to the fields such as various instructions, display, decoration, backlight and general lighting.

And with the development of OLED (Organic Light Emitting Diode) technology, due to the self-luminous of OLED, wide viewing angle, high comparison Degree, high reaction speed the advantages that extreme shock using LED backlight light source as the LCD display market of mainstream.

In addition the back light of existing LCD display is mainly as composed by multiple strip sources, each strip source Including multiple LED chips being sequentially connected in series, the back light major defect of this structure is compartmentalization poor display effect, whole It is larger that a back light carries out difficulty when local brightness adjusted.

Utility model content

Technical problem to be solved by the utility model is: providing a kind of LED light source mould group for being easy to implement compartmentalization control And its die cutting die.

The solution that the utility model solves its technical problem is:

A kind of light source module group, including substrate and multiple LED chips, the surface of the substrate is equipped with is led by multiple lateral Electric line and multiple longitudinal conducting wires form conductive grid, and the conductive grid is completely covered on the whole table of substrate On face, multiple LED chips are fixed on substrate, and the anode and cathode of the LED chip are electrical with conducting wire respectively Connection；The connection structure of each LED chip be after first series connection parallel-connection structure or be it is first in parallel after cascaded structure.

It as a further improvement of the above technical scheme, will be each according to the on-off of conducting wire in each conductive grid Conducting wire is divided into the first grid route and the second grid route in conductive grid, and each first grid route is connection , each first grid route is in parallel after making each LED chip form first series connection or is concatenated connection after first parallel connection Structure, the second grid route is partial cut.

As a further improvement of the above technical scheme, the LED chip is arranged in conducting wire, each LED chip Positive electrode and negative electrode be electrically connected with the conducting wire below LED chip, anode and the company of conducting wire of the LED chip Contact is defined as the first tie point, and the cathode of the LED chip and the tie point of conducting wire are defined as the second tie point, each Conducting wire between the first tie point and the second tie point of LED chip is equipped with breakpoint.

As a further improvement of the above technical scheme, the LED chip rectangular array is distributed on substrate, Zong Xiangfang Upwards and in transverse direction, distance is identical between two adjacent conducting wires, two adjacent column LED chip phases in transverse direction It is separated by least two conducting wires every two row LED chips adjacent at least one conducting wire, longitudinal direction.

As a further improvement of the above technical scheme, the distance between two adjacent LED chips is not more than 20mm.

As a further improvement of the above technical scheme, the anode of each LED chip is in the same direction or adjacent Two column LED chips anode in the opposite direction or two adjacent row LED chips anode in the opposite direction.

As a further improvement of the above technical scheme, each LED chip is flip-chip.

As a further improvement of the above technical scheme, the edge of the LED chip is equipped with wall, and the wall is rounded Rim of a cup.

As a further improvement of the above technical scheme, the packaging plastic with fluorescent powder is filled in the wall.

The application also discloses a kind of for being punched out the die cutting die of operation to above-mentioned light source module group simultaneously, including sets There are the rectangular fixed frame and multiple punched parts of opening, the punched part is removably mounted in rectangular fixed frame, respectively The bottom of a punched part be equipped with blade, installation site of each punched part in rectangular fixed frame respectively with base Conducting wire on plate in each conductive grid is corresponding, the blade of punched part shape when being punched out to light source module group At a punching face, there are at least one intersection points with corresponding conducting wire in the punching face.

It as a further improvement of the above technical scheme, further include bottom plate, the bottom plate can accommodate punching equipped with multiple The groove of the blade of component is cut, the setting position of each groove is opposite with the conducting wire in conductive grid each on substrate It answers.

As a further improvement of the above technical scheme, multiple guide grooves, the punching are provided in the rectangular fixed frame The two sides for cutting component are respectively embedded in two guide grooves.

As a further improvement of the above technical scheme, it is provided with multiple columns on the rectangular fixed frame, defines one The outer peripheral surface of the same column is arranged in threshold range, two guide grooves that neighbor distance is less than threshold range.

As a further improvement of the above technical scheme, the punched part be divided into the first punched part for being laterally arranged with And the second vertically arranged punched part, first punched part and the equal rectangular array side of being distributed in of the second punched part In shape fixed frame.

As a further improvement of the above technical scheme, size there are two being set in the vertical direction of first punched part Consistent first through hole is set in the vertical direction of second punched part there are two consistent second through-hole of size, and described the The aperture of one through-hole is greater than the aperture of the second through-hole；The die cutting die further include more the first vertically arranged fixed links and More the second fixed links being laterally arranged, the aperture of the first through hole and the diameter of the first fixed link match, and described second The aperture of through-hole and the diameter of the second fixed link match, first fixed link in the radial direction be equipped with several sizes with The third through-hole that second fixed shank diameter matches, every first fixed link is also cross each first punching in same row The first through hole on component is cut, every second fixed link is also cross on each second punched part in same a line Third through-hole on two through-holes and the first fixed link, the both ends of first fixed link and the both ends of the second fixed link are solid It is scheduled on the side of rectangular fixed frame.

As a further improvement of the above technical scheme, several are equably provided on the side of the rectangular fixed frame Reinforcing prop.

The beneficial effects of the utility model are:

1. multiple LED chips are disposed on the substrate to form a LED light source mould by light source module group disclosed by the utility model Group, when multiple light sources mould group is applied over the display, the pixel that each light source module group is shown as a compartmentalization, to improve Display area display effect, while also reducing the difficulty of display lighting light source local luminance control.

2. die cutting die disclosed by the utility model matches use with the light source module group, passes through punched part and side The dismoutability connection structure of shape fixed frame is punched out operation to the conducting wire at different location on substrate in light source module group, To realize each specific electricity connection function of LED chip in light source module group.

Detailed description of the invention

It, below will be to required in embodiment description in order to illustrate more clearly of the technical scheme in the embodiment of the utility model Attached drawing to be used is briefly described.Obviously, described attached drawing is a part of the embodiment of the utility model, rather than complete Portion's embodiment, those skilled in the art without creative efforts, can also be obtained according to these attached drawings it His design scheme and attached drawing.

Fig. 1 is the light source module group structural schematic diagram (not being punched) of the utility model；

Fig. 2 is the first connection schematic diagram of the light source module group of the utility model；

Fig. 3 is second of connection schematic diagram of the light source module group of the utility model；

Fig. 4 is the third connection schematic diagram of the light source module group of the utility model；

Fig. 5 is the 4th kind of connection schematic diagram of the light source module group of the utility model；

Fig. 6 is the structural schematic diagram of the die cutting die of the utility model；

Fig. 7 is the connection schematic diagram of rectangular fixed frame and punched part in the die cutting die of the utility model；

Fig. 8 is the method flow diagram of light source module group manufacturing method.

Specific embodiment

It is carried out below with reference to technical effect of the embodiment and attached drawing to the design of the application, specific structure and generation clear Chu is fully described by, to be completely understood by the purpose, feature and effect of the application.Obviously, described embodiment is this Shen A part of the embodiment please, rather than whole embodiments, are based on embodiments herein, and those skilled in the art is not paying Other embodiments obtained under the premise of creative work belong to the range of the application protection.In addition, be previously mentioned in text All connection relationships not singly refer to that component directly connects, and referring to can be according to specific implementation situation, by adding or reducing connection Auxiliary, Lai Zucheng more preferably connection structure.Each technical characteristic in the invention, under the premise of not conflicting conflict It can be with combination of interactions.Finally, it should be noted that such as term in text " center, upper and lower, left and right, vertical, horizontal, inside and outside " The orientation or positional relationship of instruction is then to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of description this technology side Case and simplified description, rather than the device or element of indication or suggestion meaning must have a particular orientation, with specific orientation Construction and operation, therefore should not be understood as the limitation to the application.

The application also disclose a kind of light source module group and it is a kind of applied in the light source module group manufacturing process to rush Cut mold.

Referring to Fig.1, the application discloses a kind of light source module group first, and the light source module group is preferentially used as back light application In the display.

The first embodiment of light source module group, including substrate 100 and multiple LED chips 200, the surface of the substrate 100 Equipped with forming conductive grid, multiple LED by multiple lateral conducting wires 300 and multiple longitudinal conducting wires 300 Chip 200 is fixed on the substrate 100, and the preferential rectangular array of the LED chip 200 is arranged on the substrate 100, the LED core The anode and cathode of piece 200 are electrically connected with conducting wire 300 respectively；The connection structure of each LED chip 200 is first to connect Afterwards parallel-connection structure or be it is first in parallel after cascaded structure.

Parallel-connection structure is preferably with each LED chip 200 in a line or same after first the connecting of each LED chip 200 Each LED chip 200 on one column is serially connected to form series arm, and each series arm is parallel with one another；

Each LED chip 200 it is first in parallel after cascaded structure be preferably with each LED chip 200 in a line or same The formation parallel branch parallel with one another of each LED chip 200 on one column, each parallel branch are serially connected.

The setting of multiple LED chips 200 is formed a LED light source mould by the light source module group in the present embodiment on the substrate 100 Group, multiple light sources mould group are applied when on the back light of display, the picture that each light source module group is shown as a compartmentalization Vegetarian refreshments to improve display area display effect, while also reducing the difficulty of display backlight light source local luminance control.

Specifically, each LED chip 200 is preferably Mini LED chip, and Mini LED core chip size is less than 200um*200um, set 200 quantity of LED chip is preferably N*N on substrate 100, the LED chip on the substrate 100 200 arrange in N*N rectangular lattice.

It should be noted that the quantity of LED chip 200 represents apply aobvious to a certain extent on the substrate 100 When showing on device, the quality of compartmentalization display effect, the quantity of LED chip 200 is fewer on substrate 100, and compartmentalization display effect is got over It is good, but control pin needed for controlling all light source module groups is also more, thus by the string between LED chip 200 simultaneously Join to reach 200 quantity of LED chip and control the balance of pin.

Further, in this embodiment since each LED chip 200 needs to form effective electric connection structure, It is disconnected to determine the need for setting that conducting wire 300 on each conductive grid needs the connection circuit diagram according to LED chip 200 Point, according to the on-off of conducting wire 300 in each conductive grid in the present embodiment, by conducting wire 300 in each conductive grid It is divided into the first grid route and the second grid route, each first grid route is connection, each first net Ruling road is in parallel after each formation of LED chip 200 is first connected or is concatenated connection structure after first parallel connection, second net Ruling road is partial cut, in order to guarantee the second grid route be disconnect, need by the second grid lines road certain One section is cut off, and the length cut off is determined because of actual needs.It is further to note that being not institute in practical application Second grid route requires cutting, referring for example to Fig. 2, after four LED chips 200 are specifically first connected in Fig. 2 simultaneously Be coupled structure, and those skilled in the art understand positioned at lowermost transverse conductance route 300, do not cut off actually be also can be with , but what is uniquely followed cannot make be formed in principle effective series-parallel connection knot between each LED chip 200 Structure.

Further, in this embodiment the LED chip 200 is arranged in conducting wire 300, each LED chip 200 Conducting wire 300 of the positive electrode and negative electrode with the lower section of LED chip 200 be electrically connected, the anode of the LED chip 200 with lead The tie point of electric line 300 is defined as the first tie point, and the cathode of the LED chip 200 and the tie point of conducting wire 300 are fixed Justice is the second tie point, and the conducting wire 300 between the first tie point and the second tie point of each LED chip 200 is all provided with There is breakpoint, guarantees that the positive electrode and negative electrode of each LED chip 200 are not in short circuit.Specifically, in actual production manufacturing process In, the LED chip 200 can be set between adjacent conducting wire 300, but need to require LED chip 200 at this time The distance between positive electrode and negative electrode size between two adjacent conducting wires 300 at a distance from size it is consistent, therefore design process In in order to make up this defect, conventional way is the width for increasing conducting wire 300, but thus cost of manufacture will It greatly improves, and inherently belongs to a miniature mould group using Mini LED as the light source module group of LED chip 200, increase The width of conducting wire 300 easily reduces the electrical isolation distance between two conducting wires, increases two neighboring conducting wire 300 risks being shorted, therefore preferably each LED chip 200 is arranged in conducting wire 300 for the present embodiment, thus Just without between the distance the distance between the positive electrode and negative electrode of LED chip 200 size or adjacent two conducting wires 300 Size has excessive requirement.

Further, in order to preferably improve the compartmentalization display effect of light source module group, in the present embodiment, the LED core 200 rectangular array of piece is distributed on the substrate 100, on longitudinal direction and in transverse direction, two adjacent conducting wires 300 Between distance it is identical, two adjacent column LED chips 200 are separated by least one conducting wire 300, phase on longitudinal direction in transverse direction Two adjacent row LED chips 200 are separated by least two conducting wires 300.

It is further preferred that two column LED chips 200 adjacent in transverse direction are separated by a conducting wire 300, longitudinal direction Upper two adjacent row LED chips 200 are separated by two conducting wires 300, on the central point and conductive grid of the LED chip 200 300 central point of conducting wire be overlapped.

Further, in this embodiment when the light source module group is applied over the display as back light, back light Diffuser plate is will be installed in mould group, which is used to carry out secondary light-distribution processing to light source module group, makes back light mould group Light is transmitted in the form of area source, therefore in order to reduce the usage quantity of LED chip 200, reduction production cost is two neighboring There are certain distances for LED chip 200, but when distance is excessive between two adjacent LEDs chip 200, it is also desirable to bigger is mixed Electrical distance is just able to satisfy the condition of output face light source, increases display thickness to a certain extent, therefore the technical program passes through Many experiments are crossed, are guaranteeing light mixing distance satisfaction output when obtaining the distance between two adjacent LED chips 200 no more than 20mm Under conditions of area source, while reducing the thickness of display.

Further, in this embodiment the anode of each LED chip 200 is in the same direction or two adjacent column LED chip 200 anode in the opposite direction or two adjacent row LED chips 200 anode in the opposite direction.

Referring to Fig. 2 to Fig. 5, set that there are four LED chips 200 on substrate 100, four LED chips 200 are with 2*2 rectangular lattice Mode is arranged, and the anode shown in Fig. 2 for being each LED chip 200 is towards in identical situation, using parallel-connection structure after first connecting Realize the circuit connection of each LED chip 200；The anode shown in Fig. 3 for being each LED chip 200 towards in identical situation, The circuit connection of each LED chip 200 is realized using cascaded structure after first parallel connection；Shown in Fig. 4 is adjacent two column LED chip In the case that 200 anode direction is opposite, the circuit connection of each LED chip 200 is realized using parallel-connection structure after first connecting；Figure It is to be realized respectively in the case that the anode direction of adjacent two column LED chip 200 is opposite using cascaded structure after first parallel connection shown in 5 The circuit connection of a LED chip 200.It should be noted that Fig. 2, into Fig. 5, the intersection in conducting wire 300 only represents It is the position there are a breakpoint, does not imply that the object that specific upper position in kind intersects there are one.

Further, in this embodiment each LED chip 200 is flip-chip, it is easy to implement LED chip 200 Anode and the electric connection of cathode and conducting wire 300 operate.

Further, in this embodiment the edge of the LED chip 200 be equipped with wall, the rounded rim of a cup of wall, Effectively increase the light emitting angle of back light mould group, while the protective effect to LED chip 200 can also be played to a certain degree.

Further, in this embodiment the packaging plastic with fluorescent powder is filled in the wall, to meet white light output It is required that.

Next the application discloses applied die cutting die structure when a kind of above-mentioned light source module group of manufacture.

Referring to figure 6 and figure 7, the first embodiment of die cutting die, the rectangular fixed frame 400 and multiple including being equipped with opening Punched part 500, the punched part 500 are removably mounted in rectangular fixed frame 400, with the rectangular fixed frame 400 It is opening down when the case where be illustrated, the bottom of each punched part 500 is equipped with blade 600, each punching Component 500 the installation site in rectangular fixed frame 400 respectively with the conducting wire 300 in each conductive grid on substrate 100 Corresponding, the blade 600 of the punched part 500 forms a punching face, the punching when being punched out to light source module group There are at least one intersection points with corresponding conducting wire 300 in face.Due to needing to certain conducting wires 300 in light source module group Being punched out operation can make each LED chip 200 form series-parallel electrical connection, and die cutting die utilizes punched part 500 produce breakpoint in certain conducting wires 300, according to the specific shape of the blade 600 of punched part 500 in practical application Shape guarantees that punching face of the punched part 500 formed in blanking process and the conducting wire 300 corresponding to it at least have one A intersection point.Such as when the blade 600 of punched part 500 is linear type blade, it will appear one after punching in conducting wire 300 Breakpoint will appear two when punched part 500 is non-closed curve (such as circular arc) type blade in conducting wire 300 after punching Breakpoint will appear two in conducting wire 300 after punching and break when punched part 500 is closed curve (as round) type blade Point, but since blade 600 is closed curve, so can be directly by a certain section of excision of conducting wire 300, energy in blanking process Enough better ensure that the electrical isolation of conducting wire 300.

Die cutting die described in the present embodiment matches use with light source module group, passes through punched part 500 and rectangular fixed frame 400 dismoutability connection structure is punched out operation to the conducting wire 300 in light source module group on substrate 100 at different location, To realize the specific electricity connection function of each LED chip 200 in light source module group, process is simple, and specific physical connection Route can be changed freely, strong operability.

Further, if punching object is the light source module group for MiniLED, itself just belong to a microdevice, 100 thickness of substrate of this light source module group is minimum, and the blade 600 of punched part 500 is difficult to make by apparatus control when punching It is fixed in substrate 100 at the blade 600 after punching, if but controlling blade 600 when punched part 500 is punched and passing completely through base Plate 100, reaches the supporting surface at 100 back side of substrate, and is easily damaged blade 600, therefore die cutting die described in the present embodiment is also Including bottom plate 700, the bottom plate 700 is equipped with the groove 710, Ge Gesuo of multiple blades 600 that can accommodate punched part 500 The setting position for stating groove 710 is corresponding with the conducting wire 300 in each conductive grid on substrate 100.Utilize die cutting die When being punched out to substrate 100, control blade 600 cuts off conducting wire 300 directly through substrate 100, and blade 600 passes through base It can reach and rest on after plate 100 in the groove 710 of bottom plate 700, prevent bottom plate 700 from damaging to blade 600.

It is further to note that the first is by cutting there are two types of the generation types of the groove 710 of the bottom plate 700 Slot knife carries out downwards grooving operations from 700 upper surface of bottom plate, to form groove 710；Second is that fixation is more on bottom plate 700 The setting position of a square column, multiple square columns is corresponding with each conductive grid of substrate 100 respectively, two neighboring square column Between be formed groove 710.

Further, in this embodiment multiple guide grooves 910 are provided in the rectangular fixed frame 400, the punching portion The two sides of part 500 are respectively embedded in two guide grooves 910.By the setting of the guide groove 910, guarantee in blanking process Each punched part 500 is not in offset situation.In addition in the present embodiment in order to guarantee the guide groove 910 have it is enough Mechanical strength, the present embodiment are also provided with multiple columns 900 on rectangular fixed frame 400, define a threshold range, it is adjacent away from From the outer peripheral surface that the same column 900 is arranged in two guide grooves 910 for being less than threshold range.

Further, in this embodiment the punched part 500 divide the first punched part 510 to be laterally arranged and The second vertically arranged punched part 520, first punched part 510 and the equal rectangular array of the second punched part 520 It is distributed in rectangular fixed frame 400.Size consistent first is logical there are two setting in the vertical direction of first punched part 510 Hole 511, sets that there are two consistent second through-hole 521 of size, described first is logical in the vertical direction of second punched part 520 The aperture in hole 511 is greater than the aperture of the second through-hole 521；The die cutting die further includes more the first vertically arranged fixed links 810 and more the second fixed links 820 being laterally arranged, the diameter in the aperture of the first through hole 511 and the first fixed link 810 Match, the aperture of second through-hole 521 and the diameter of the second fixed link 820 match, the diameter of first fixed link 810 The third through-hole (not shown in figure) to match to direction equipped with several sizes and 820 diameter of the second fixed link, every First fixed link 810 is also cross the first through hole 511 on each first punched part 510 in same row, every institute It is solid also cross the second through-hole 521 and first on each second punched part 520 in same a line to state the second fixed link 820 The both ends of third through-hole in fixed pole 810, the both ends of first fixed link 810 and the second fixed link 820 pass through nut It is fixed on the side of rectangular fixed frame 400.Specifically, it before being punched out to light source module group, needs according to each LED chip 200 specific connection circuits, install punched part 500, or as shown in fig. 6, root in the corresponding position of rectangular fixed frame 400 Circuit is specifically connected according to LED chip 200, punched part 500 corresponding to the conducting wire 300 for needing to be punched out enables solid Fixed pole passes through its through-hole far from blade 600, does not need punched part 500 corresponding to the conducting wire 300 being punched out, and enables Fixed link passes through it close to the through-hole of blade 600.

Further, in this embodiment being equably provided with several reinforcing props on the side of the rectangular fixed frame 400 410.By the setting of each reinforcing prop 410, the intensity of rectangular fixed frame 400, the reinforcing prop can be effectively improved 410 concrete shape those skilled in the art can freely design, and reinforcing prop 410 described in the present embodiment is specially cylinder.

Referring to Fig. 8, next the application discloses a kind of above-mentioned die cutting die of utilization, manufactures the manufacture of above-mentioned light source module group Method.

The first embodiment of the manufacturing method of light source module group, comprising the following steps:

Step 100, multiple lateral conducting wires 300 and multiple longitudinal conducting wires are made on the substrate 100 300；

Step 200, LED chip 200 is fixed on the substrate 100, anode and cathode to LED chip 200 respectively with Conducting wire 300 is electrically connected；

Step 300, the connection line figure of each LED chip 200 is drawn；

Step 400, according to the connection line figure drawn, using die cutting die to the conducting wire 300 on substrate 100 into Row punching operation；

Wherein step 300 need guarantee executing step 400 completion.

LED chip 200 described in step 200 is fixed in conductive grid.

In step 400 specifically includes the following steps:

Step 410, according to the connection line figure, the cutting position of conducting wire 300 on substrate 100 is set；

Step 420, according to the cutting position of conducting wire 300 on substrate 100, in the rectangular fixed frame 400 of die cutting die Upper corresponding position installs and fixes punched part 500；

Step 430, operation is punched out to the conducting wire 300 on substrate 100 using die cutting die.

Further include step 500 in the present embodiment, operation, the step are packaged to the LED chip 200 on substrate 100 500 settings execute after step 200；The step 500 the following steps are included:

Step 510, wall, the rounded rim of a cup of wall are set at the edge of each LED chip 200 of substrate 100；

Step 520, in the wall of each LED chip 200 filling tape fluorescent powder packaging plastic.

The second embodiment of the manufacturing method of light source module group is distinguished compared with first embodiment in institute in this present embodiment Stating LED chip 200 is specifically to be fixed in the conducting wire 300 of substrate 100, by the anode and conductor wire of the LED chip 200 The tie point on road 300 is defined as the first tie point, and the cathode of the LED chip 200 and the tie point of conducting wire 300 are defined For the second tie point, in step 200 will LED chip 200 it is fixed on the substrate 100 before, further include by the first tie point and the The conducting wire 300 of two tie points is cut off.

The 3rd embodiment of the manufacturing method of light source module group, first embodiment are compared, and difference is described in the present embodiment LED chip 200 is specifically to be fixed in the conducting wire 300 of substrate 100, by the anode and conducting wire of the LED chip 200 300 tie point is defined as the first tie point, and the tie point of the cathode of the LED chip 200 and conducting wire 300 is defined as Second tie point, when manufacturing conducting wire 300 in step 100, in the conducting wire of the first tie point and the second tie point Breakpoint is reserved in 300.

Light source module group manufacturing method described in three above embodiment is specifically connected according to designed LED chip 200 Line map installs punched part 500 on the corresponding position of the rectangular fixed frame 400 of die cutting die, finally utilizes die cutting die Operation is punched out to the substrate 100 of light source module group, to obtain final light source module group.

The better embodiment of the application is illustrated above, but the invention is not limited to the implementation Example, those skilled in the art can also make various equivalent modifications under the premise of without prejudice to the application spirit or replace It changes, these equivalent variation or replacement are all included in the scope defined by the claims of the present application.

Claims (16)

1. a kind of light source module group, it is characterised in that: including substrate (100) and multiple LED chips (200), the substrate (100) Surface be equipped with and by multiple lateral conducting wires (300) and multiple longitudinal conducting wires (300) form conductive grid, institute Conductive grid to be stated to be covered in the whole surface of substrate (100), multiple LED chips (200) are fixed on substrate (100), The anode and cathode of the LED chip (200) are electrically connected with conducting wire (300) respectively；Each LED chip (200) Connection structure be after first series connection parallel-connection structure or be it is first in parallel after cascaded structure.

2. a kind of light source module group according to claim 1, it is characterised in that: according to conducting wire in each conductive grid (300) conducting wire (300) in each conductive grid is divided into the first grid route and the second grid route, respectively by on-off A first grid route is connection, and each first grid route makes each LED chip (200) formation first connect It is in parallel afterwards or be it is first in parallel after concatenated connection structure, the second grid route is partial cut.

3. a kind of light source module group according to claim 1, it is characterised in that: the LED chip (200) is arranged in conductor wire On road (300), the positive electrode and negative electrode of each LED chip (200) are electrical with the conducting wire (300) below LED chip (200) Connection, the anode of the LED chip (200) and the tie point of conducting wire (300) are defined as the first tie point, the LED core The cathode of piece (200) and the tie point of conducting wire (300) are defined as the second tie point, and the first of each LED chip (200) connects Conducting wire (300) between contact and the second tie point is equipped with breakpoint.

4. a kind of light source module group according to claim 3, it is characterised in that: LED chip (200) rectangular array point Cloth is on substrate (100), and on longitudinal direction and in transverse direction, distance is identical between two adjacent conducting wires (300), horizontal Two adjacent column LED chips (200) are separated by least one conducting wire (300) on direction, two adjacent rows on longitudinal direction LED chip (200) is separated by least two conducting wires (300).

5. a kind of light source module group according to claim 4, it is characterised in that: between two adjacent LED chips (200) away from From no more than 20mm.

6. a kind of light source module group according to claim 3, it is characterised in that: the positive court of each LED chip (200) Same direction perhaps adjacent two column LED chips (200) anode in the opposite direction or two adjacent row LED chips (200) anode is in the opposite direction.

7. a kind of light source module group according to claim 1, it is characterised in that: each LED chip (200) is upside-down mounting Chip.

8. a kind of light source module group according to claim 1, it is characterised in that: the edge of the LED chip (200), which is equipped with, to be enclosed Wall, the rounded rim of a cup of wall.

9. a kind of light source module group according to claim 8, it is characterised in that: be filled with the envelope with fluorescent powder in the wall Fill glue.

10. a kind of die cutting die, it is characterised in that: rectangular fixed frame (400) and multiple punched parts including being equipped with opening (500), the punched part (500) is removably mounted in rectangular fixed frame (400), each punched part (500) Bottom be equipped with blade (600), installation site of each punched part (500) in rectangular fixed frame (400) respectively with The conducting wire (300) of each conductive grid is corresponding on substrate (100), and the blade (600) of the punched part (500) is right A punching face is formed when light source module group is punched out, the punching face and corresponding conducting wire (300) have at least one A intersection point.

11. die cutting die according to claim 10, it is characterised in that: it further include bottom plate (700), the bottom plate (700) It is equipped with the groove (710) of multiple blades (600) that can accommodate punched part (500), the setting of each groove (710) Position is corresponding with conducting wire (300) in each conductive grid on substrate (100).

12. die cutting die described in 0 or 11 according to claim 1, it is characterised in that: setting in the rectangular fixed frame (400) Have multiple guide grooves (910), the two sides of the punched part (500) are respectively embedded in two guide grooves (910).

13. die cutting die according to claim 12, it is characterised in that: be provided on the rectangular fixed frame (400) more A column (900), defines a threshold range, and two guide grooves (910) that neighbor distance is less than threshold range are arranged same The outer peripheral surface of a column (900).

14. die cutting die according to claim 12, it is characterised in that: the punched part (500) is divided into lateral setting The first punched part (510) and vertically arranged the second punched part (520), first punched part (510) and Second punched part (520) rectangular array is distributed in rectangular fixed frame (400).

15. die cutting die according to claim 14, it is characterised in that: the Vertical Square of first punched part (510) Set upwards there are two the consistent first through hole of size (511), set in the vertical direction of second punched part (520) there are two Consistent second through-hole (521) of size, the aperture of the first through hole (511) are greater than the aperture of the second through-hole (521)；The punching Cutting mold further includes more vertically arranged the first fixed links (810) and more the second fixed links (820) being laterally arranged, institute The diameter in the aperture and the first fixed link (810) of stating first through hole (511) matches, the aperture of second through-hole (521) with The diameter of second fixed link (820) matches, and first fixed link (810) is equipped with several sizes and the in the radial direction The third through-hole that two fixed links (820) diameter matches, every first fixed link (810) is also cross each in same row First through hole (511) on a first punched part (510), every second fixed link (820) is also cross in same a line Each second punched part (520) on the second through-hole (521) and the third through-hole in the first fixed link (810), it is described The both ends of first fixed link (810) and the both ends of the second fixed link (820) are each attached to the side of rectangular fixed frame (400).

16. die cutting die according to claim 10, it is characterised in that: on the side of the rectangular fixed frame (400) It is provided with several reinforcing props (410) evenly.