CN206907765U - A kind of high effect diode - Google Patents
A kind of high effect diode Download PDFInfo
- Publication number
- CN206907765U CN206907765U CN201720843536.9U CN201720843536U CN206907765U CN 206907765 U CN206907765 U CN 206907765U CN 201720843536 U CN201720843536 U CN 201720843536U CN 206907765 U CN206907765 U CN 206907765U
- Authority
- CN
- China
- Prior art keywords
- base plate
- metal base
- chip
- conductive layer
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
It the utility model is related to the technical field of electronic component, refer in particular to a kind of high effect diode, shell including metal base plate, located at metal base plate, located at the chip portion of metal base plate side and it is sequentially arranged in metal base plate and is provided with multiple pins, the chip portion is provided with least two chips, be provided with conductive layer between at least two chip and metal base plate, at least two chip with its corresponding to weld part electrically connect；The opposite side of the metal base plate is provided with radiating part, and the thickness of the radiating part is less than the thickness of metal base plate；The distance between the metal base plate lower surface and multiple pin upper surfaces are 0.7 to 1cm.In the utility model, the chip portion of metal base plate is provided with conductive layer, and conductive layer is provided with least two chips, and at least two chips improve the amplifying power and efficiency of diode；The bonding great efforts of conductive layer, chip is difficult for drop-off, and steadiness is strong；Radiating part effectively accelerates the chip cooling to chip portion.
Description
Technical field
The technical field of electronic component is the utility model is related to, refers in particular to a kind of high effect diode.
Background technology
Diode, among electronic component, a kind of device with two electrodes, only an electric current is allowed to be flowed through by single direction.
At present, powerful electrical equipment or equipment need to set multiple diodes effectively to realize the electrical equipment or the work(of equipment
Can, but multiple diodes are provided with, multiple radiators need to be set to radiate it simultaneously, otherwise power tube is easily burnt out, Er Qieshe
The placement of wiring layout and diode need to be considered when putting multiple diode wiring, step is extremely cumbersome；Existing diode peace
Chip is fixed in the metal base plate of diode by cartridge chip process, the general form using welding by welding, but
In welding process, enter tin amount and be difficult to hold, excessively easily burn out chip, also unsightly；Very few chip easily comes off, and causes two poles
Pipe can not continue normal use, and the situation of rosin joint may also occur in welding process.
The content of the invention
The technical problems to be solved in the utility model is to provide a kind of steadiness for improving chip and fixing and with efficient
The high effect diode of rate, high efficiency and heat radiation.
In order to solve the above-mentioned technical problem, the utility model adopts the following technical scheme that：
A kind of high effect diode, including metal base plate, the shell located at metal base plate, the core located at metal base plate side
Piece portion and the pin of metal base plate first, second pin and the 3rd pin are sequentially arranged in, first pin and the 3rd pin are equal
Provided with weld part, the second pin is connected with metal base plate, and the chip portion is provided with least two chips, at least two core
Be equipped with conductive layer between piece and metal base plate, at least two chip with its corresponding to weld part electrically connect；It is described
The opposite side of metal base plate is provided with radiating part, and the thickness of the radiating part is less than the thickness of metal base plate；The metal base plate following table
The distance between face and the first pin upper surface are 0.7 to 1cm.
Preferably, metal base plate offers connecting hole.
Preferably, at least two chip array is arranged in the chip portion.
Preferably, the conductive layer is conducting resinl.
The beneficial effects of the utility model are：
The utility model provides a kind of high effect diode, and the chip portion of metal base plate is provided with conductive layer, and conductive layer is set
There are at least two chips, at least two chips improve the amplifying power and efficiency of diode；Welding is instead of with conductive layer, is had
Effect avoids to be caused to damage when chip is weldingly fixed on into chip portion to chip, and the bonding great efforts of conductive layer, and chip is not
Easy to fall off, steadiness is strong；The thickness of radiating part is less than the thickness of metal base plate, the heat in metal base plate chip portion is passed by heat
Pass and be delivered to radiating part, so as to effectively reduce the temperature in chip portion, accelerate the chip cooling to chip portion.
Brief description of the drawings
Fig. 1 is dimensional structure diagram of the present utility model.
Fig. 2 is the dimensional structure diagram of the utility model metal base plate.
Fig. 3 is the dimensional structure diagram at another visual angle of metal base plate in the utility model.
Embodiment
For the ease of the understanding of those skilled in the art, the utility model is made further with reference to embodiment
Bright, the content that embodiment refers to is not to restriction of the present utility model.
As shown in Figure 1 to Figure 3, a kind of high effect diode, including metal base plate 1, the shell 2 located at metal base plate 1, set
In the chip portion 3 of the side of metal base plate 1 and the pin 4 of metal base plate 1 first, the pin 6 of second pin 5 and the 3rd are sequentially arranged in,
The pin 6 of first pin 4 and the 3rd is equipped with weld part 7, and the second pin 5 is connected with metal base plate 1, the chip portion
3 are provided with least two chips 31, are equipped with conductive layer 32 between at least two chip 31 and metal base plate 1, and described at least two
Individual chip 31 with its corresponding to weld part 7 electrically connect；The opposite side of the metal base plate 1 is provided with radiating part 8, the radiating part
8 thickness is less than the thickness of metal base plate 1；The distance between the lower surface of metal base plate 1 and the upper surface of the first pin 4 are
0.7 to 1cm.
It is preferred that the number of chip 31 is two, the distance between the lower surface of metal base plate 1 and the upper surface of the first pin 4 are
0.85cm；One layer of conductive layer 32 first is set in the Tu of chip portion 3 of metal base plate 1, then two chips 31 are sticked in into conductive layer 32,
Then one of chip 31 is connected with the weld part 7 of the first pin 4, the weld part 7 of another pin 6 of chip 31 and the 3rd
The metal base plate 1 that this has been installed, is finally packaged by connection.The chip portion 3 of metal base plate 1 is provided with conductive layer 32, conductive layer
32 are provided with least two chips 31, and at least two chips 31 improve the amplifying power and efficiency of diode；With the generation of conductive layer 32
Welding has been replaced, effectively prevent and chip 31 is caused to damage when chip 31 is weldingly fixed on into chip portion 3, and conductive layer 32
Great efforts are bonded, chip 31 is difficult for drop-off, and steadiness is strong；The thickness of radiating part 8 is less than the thickness of metal base plate 1, makes metal bottom
The heat in the chip portion 3 of plate 1 is delivered to radiating part 8 by heat transfer, so as to effectively reduce the temperature in chip portion, accelerates to chip
The chip 31 in portion 3 radiates.
In the present embodiment, metal base plate 1 offers connecting hole 9, and the connecting hole 9 is used to fix diode.
In the present embodiment, the array arrangement of at least two chip 31 is attractive in appearance in the chip portion 3, array arrangement, and
And the electrical connection of wire and chip 31 has been also convenient for it.
In the present embodiment, the conductive layer 32 is conducting resinl, and conducting resinl is conductive energy after one kind solidifies or dried
Adhesive, and cohesive is strong, difficult for drop-off.
, it is necessary to illustrate in description of the present utility model, for the noun of locality, if any term " " center ", " transverse direction
(X) ", " longitudinal direction (Y) ", " vertical (Z) " " length ", " width ", " thickness ", " on ", " under ", "front", "rear", "left", "right",
The indicating position such as " vertical ", " level ", " top ", " bottom ", " interior ", " outer ", " clockwise ", " counterclockwise " and position relationship be based on
Orientation shown in the drawings or position relationship, it is for only for ease of narration the utility model and simplifies description, rather than instruction or dark
Show that the device of meaning or element there must be specific orientation, be constructed and operated with particular orientation, it is impossible to be interpreted as limiting this reality
With new specific protection domain.
In addition, be only used for describing purpose if any term " first ", " second ", and it is not intended that indicating or implying relatively heavy
The property wanted or the implicit quantity for indicating technical characteristic.Thus, " first " is defined, " second " feature can be expressed or implicit include
One or more this feature, in the utility model description, " several " are meant that two or more, unless otherwise bright
It is really specific to limit.
In the utility model, except as otherwise clear stipulaties and restriction, if any term " assembling ", " connected ", " connection " term
It should go to understand as broad sense, for example, it may be being fixedly connected or being detachably connected, or be integrally connected；It can also be machine
Tool connects；Can be joined directly together or be connected by intermediary, can be that two element internals are connected.For
For those of ordinary skill in the art, it can understand that specific in the utility model of above-mentioned term containing as the case may be
Justice.
Embodiment described above only expresses some embodiments of the present utility model, and its description is more specific and detailed,
But therefore it can not be interpreted as the limitation to the utility model patent scope.It should be pointed out that for the common of this area
For technical staff, without departing from the concept of the premise utility, various modifications and improvements can be made, these all belong to
In the scope of protection of the utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.
Claims (4)
1. a kind of high effect diode, including metal base plate（1）, located at metal base plate（1）Shell（2）, located at metal base plate
（1）The chip portion of side（3）And it is sequentially arranged in metal base plate（1）First pin（4）, second pin（5）With the 3rd pin
（6）, first pin（4）With the 3rd pin（6）It is equipped with weld part（7）, the second pin（5）With metal base plate（1）
Connection, it is characterised in that：The chip portion（3）Provided with least two chips（31）, at least two chip（31）With metal bottom
Plate（1）Between be equipped with conductive layer（32）, at least two chip（31）Weld part corresponding to it（7）Electrical connection；
The metal base plate（1）Opposite side be provided with radiating part（8）, the radiating part（8）Thickness be less than metal base plate（1）Thickness；
The metal base plate（1）Lower surface and the first pin（4）The distance between upper surface is 0.7 to 1cm.
A kind of 2. high effect diode according to claim 1, it is characterised in that：Metal base plate（1）Offer connecting hole
（9）.
A kind of 3. high effect diode according to claim 1, it is characterised in that：At least two chip（31）Array
It is arranged in the chip portion（3）.
A kind of 4. high effect diode according to claim 1, it is characterised in that：The conductive layer（32）For conducting resinl.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720843536.9U CN206907765U (en) | 2017-07-12 | 2017-07-12 | A kind of high effect diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720843536.9U CN206907765U (en) | 2017-07-12 | 2017-07-12 | A kind of high effect diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206907765U true CN206907765U (en) | 2018-01-19 |
Family
ID=61312537
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720843536.9U Expired - Fee Related CN206907765U (en) | 2017-07-12 | 2017-07-12 | A kind of high effect diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206907765U (en) |
-
2017
- 2017-07-12 CN CN201720843536.9U patent/CN206907765U/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201479458U (en) | Radiation structure capable of controlling electromagnetic radiation | |
| CN206907765U (en) | A kind of high effect diode | |
| CN104821785B (en) | Photovoltaic junction box | |
| CN201064069Y (en) | Heat radiating structure for circuit board | |
| CN211045416U (en) | Microelectronic chip packaging structure | |
| CN201927619U (en) | Wiring box used for photovoltaic component | |
| CN206286704U (en) | A kind of welder of lithium ion battery | |
| CN107887353A (en) | High reliability rectifier bridge stack device | |
| CN201421851Y (en) | Led | |
| CN205987528U (en) | Printed circuit board assembly easily dispels heat | |
| CN211240289U (en) | PCB convenient to paster | |
| CN207832991U (en) | A kind of LED light bar board test auxiliary power supply | |
| CN206975959U (en) | A kind of small space distance LED display screen module of high density | |
| CN209471972U (en) | Chip bipolar Schottky diode | |
| CN207602557U (en) | Fixing device is isolated in a kind of IGBT module | |
| CN203040008U (en) | Printed circuit board with copper base embedded with circuit | |
| CN205883832U (en) | Heat radiation structure of power tube | |
| CN205939041U (en) | Circuit backboard face connects line knot to construct | |
| CN210088698U (en) | Integrated solar street lamp light source board | |
| CN205510521U (en) | USB socket circuit board that heat dissipation is strengthened | |
| CN218735162U (en) | Low-loss transformer circuit board | |
| CN204948496U (en) | A kind of heat radiation pcb board and LED | |
| CN203708192U (en) | Photovoltaic junction box | |
| CN213213930U (en) | Multilayer printed circuit board | |
| CN207491312U (en) | A kind of FPC and backlight |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180119 Termination date: 20210712 |