CN206806340U - The focus planar detector assembly encapsulation structure of integrated multilevel TEC - Google Patents
The focus planar detector assembly encapsulation structure of integrated multilevel TEC Download PDFInfo
- Publication number
- CN206806340U CN206806340U CN201720613355.7U CN201720613355U CN206806340U CN 206806340 U CN206806340 U CN 206806340U CN 201720613355 U CN201720613355 U CN 201720613355U CN 206806340 U CN206806340 U CN 206806340U
- Authority
- CN
- China
- Prior art keywords
- tec
- fixed
- integrated
- focal plane
- battery lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
Abstract
This patent discloses a kind of focus planar detector assembly encapsulation structure of integrated multilevel TEC, including package shell, multistage TEC, battery lead plate, focal plane module, diaphragm, getter, cover plate, window etc..Pyramid multistage TEC is integrated in component, fixed between shell, multistage TEC, battery lead plate using the filling of high heat conduction silver paste, fixed between focal plane module and battery lead plate with Low-temperature epoxy glue, the electricity of focal plane module is drawn through the realization of flexible-belt line.Field stop is integrated in component and radiation proof diaphragm, wherein field stop are fixed on battery lead plate, and radiation proof diaphragm is fixed in the middle one-level of pyramid multistage TEC.All parts are sealed after being completed by Laser Welding and high vacuum exhaustion.The type component can realize the refrigeration encapsulation of extensive focal plane module, simple in construction, cryogenic temperature is low, be adapted to the encapsulation of extension wavelength indium gallium arsenic and intermediate waves tellurium cadmium focal plane module.
Description
Technical field
This patent is related to a kind of method for packing of photodetector, specifically infrared Jiao applied to 180K~250K work
The occasion of planar detector cryogenic vacuum encapsulation.
Background technology
Extension wavelength indium gallium-arsenium coke plane detector (1.7~2.5 μm) is in Aero-Space, mineral prospecting, precision weapons system
Lead, the field such as infrared alarm and identification, reconnaissance and surveillance is widely used.Limited by sensitivity, infrared detector typically needs
Work at low temperature, generally detector is encapsulated in metal Dewar and utilizes refrigeration machine cooling.Due to indium gallium arsenic epitaxial material
With preferable uniformity and stability, make it that there is higher detectivity under 180K~250K operating temperature, at this
Temperature range work can be freezed by TEC and use shell to be sealed, and can greatly simplify encapsulating structure, be reduced
Packaging cost.Xu Qin flies et al. to report the super long alignment InGaAs detector encapsulating structures of thermoelectric cooling a kind of, application number：
201310469740.5 realize conventional wavelengths indium gallium-arsenium coke plane detector by the way of one-level thermoelectric cooling nitrogen charging gas shielded
Encapsulation, the structure cryogenic temperature is higher (more than 250K), be not suitable for 180K~250K warm area extension wavelength indium galliums arsenic detection
The encapsulation of device.
The content of the invention
This patent purpose is to provide the structure and envelope suitable for extension wavelength indium gallium-arsenium coke plane detector low temperature bonding
Dress method, focus planar detector operation temperature area 180K~250K.It is equally applicable to the intermediate waves mercury cadmium telluride and antimony extended to high temperature
Change the encapsulation of indium focus planar detector.
A kind of encapsulating structure of the focal plane infrared detector module of integrated multilevel TEC, including package shell 1,
Multistage TEC 2, battery lead plate 3, focal plane module 4, field stop 5, radiation proof diaphragm 6, cover plate 7, window 8, radiation proof
Screen 9, getter 10, getter pressing plate 11, blast pipe 12, flexible-belt line 13.The underrun high heat conduction of multistage TEC 2
Silver paste is fixed on the bottom surface in the cavity of package shell 1, and battery lead plate 3 is fixed on multistage TEC 2 by high heat conduction silver paste
Upper surface, focal plane module 4 is fixed on battery lead plate 3 by Low-temperature epoxy glue.The one end of flexible-belt line 13 is fixed by soldering
In the stitch of package shell 1, the other end is fixed on battery lead plate 3 by epoxy low temperature glue, and focal plane is completed using ultrasonic bond technique
The electricity of module 4 is drawn.Field stop 5 is integrated in component and radiation proof diaphragm 6, wherein field stop 5 pass through epoxy low temperature glue
It is fixed on battery lead plate 3, radiation proof diaphragm 6 is fixed on by epoxy low temperature glue in the middle one-level of multistage TEC 2.Disappear
Gas agent 10 is arranged on the bottom surface in the cavity of package shell 1, is fixed by getter pressing plate 11, getter pressing plate 11 uses
Screw is attached with package shell 1.Protective shield of radiation 9 is installed between getter 10 and multistage TEC 2, passes through screw
Or electric resistance welding is fixed.Window 8 first passes through eutectic weldering and completes sealing welding with cover plate 7, then cover plate 7 and package shell 1 are entered
Row sealing is welded.Integrated exhaust duct 12 on package shell 1, for high vacuum exhaustion.
Described multistage TEC 2 is pyramid structure, and cold end area is small, and the area of intergrade is big, Ke Yifang
Radiation proof diaphragm 6 is just installed.
Described field stop 5 and the inner chamber body of radiation proof diaphragm 6 have black coating or coating, and outer surface is polishing
Layer or Gold plated Layer.
There is Gold plated Layer on described package shell 1, cover plate 7, protective shield of radiation 9, surface, and the surface of flexible-belt line 13 has magnetic control to splash
Penetrate the layer gold of processing.
The encapsulating structure of the focal plane detection device assembly of the integrated multilevel TEC of this patent has following three features：
First, using case package form, pyramid multistage TEC is integrated, using two level mechanism of diaphragm, can effectively be suppressed
Veiling glare and reduction TEC cold end heat load；Second, the electrical interface of focal plane module is drawn by flexible-belt line, pass
The pin interconnection of shell stitch and battery lead plate under the overall leadership is pressed by ultrasonic key and solved, but due to the peace of pyramid multistage TEC
Dress can cause battery lead plate larger with shell stitch spacing and cause the reduction of lead reliability, and flexible-belt line can effectively solve this
Problem, and be more beneficial for assembling and integrate, operating efficiency is high, good reliability.Third, component uses Vacuum Package, it is internally integrated and disappears
Gas agent, component vacuum life length.
Brief description of the drawings
Fig. 1 component diagrammatic cross-sections.
Fig. 2 pyramid multistage TEC top views.
Top view after the completion of Fig. 3 component packages.
In figure：1 package shell, 2 multistage TECs, 3 battery lead plates, 4 focal plane modules, 5 field stops, 6 radiation proofs
Diaphragm, 7 cover plates, 8 windows, 9 protective shield of radiations, 10 getters, 11 getter pressing plates, 12 blast pipes, 13 flexible-belt lines.
Embodiment：
A kind of focus planar detector assembly encapsulation structure for integrated multilevel TEC that this patent provides, such as Fig. 1.Bag
Include package shell 1, multistage TEC 2, battery lead plate 3, focal plane module 4, field stop 5, radiation proof diaphragm 6, cover plate 7,
Window 8, protective shield of radiation 9, getter 10, getter pressing plate 11, blast pipe 12, flexible-belt line 13.The selection of package shell 1 can cut down material
Material, side sintered glass bead suture introducing needle.Multistage TEC 2 selects level Four pyramid structure, such as Fig. 2, its underrun
High heat conduction silver paste is fixed on the bottom surface in the cavity of package shell 1, and its positive and negative current electrode is connected to package shell 1 by soldering
Stitch.Battery lead plate 3 is fixed on the upper surface of multistage TEC 2 by high heat conduction silver paste, and focal plane module 4 passes through low temperature
Epoxy glue is fixed on battery lead plate 3.Flexible-belt line 13 uses polyimide material, and inside is metal electrode, and surface carries out magnetic control
Layer gold processing is sputtered, the stitch of package shell 1 is fixed in one end of flexible-belt line 13 by soldering, and the other end passes through epoxy low temperature glue
Battery lead plate 3 is fixed on, recycles ultrasonic bond technique to complete the electricity of focal plane module 4 and draws.Field stop 5 is integrated in component
With radiation proof diaphragm 6, wherein field stop 5 is fixed on battery lead plate 3 by epoxy low temperature glue, and its bore size is set according to optics
Meter determines that radiation proof diaphragm 6 is fixed on by epoxy low temperature glue on the second level of multistage TEC 2.Getter 10 is installed
On bottom surface in the cavity of package shell 1, it is fixed by getter pressing plate 11, gas agent pressing plate 11 is used outside screw and component
Shell 1 is attached.Protective shield of radiation 9 is installed between getter 10 and multistage TEC 2, is fixed on component by electric resistance welding
On shell 1.Window 8 first passes through eutectic weldering and completes sealing welding with cover plate 7, then cover plate 7 and package shell 1 are carried out into Laser Welding
Connect.Integrated exhaust duct 12 on package shell 1, later ultrahigh vacuum exhaust is completed for the sealing of whole component, after the completion of sealing
Component such as Fig. 3.
Claims (5)
1. a kind of focus planar detector assembly encapsulation structure of integrated multilevel TEC, including package shell (1), Multi-stage heat
Electric refrigerator (2), battery lead plate (3), focal plane module (4), field stop (5), radiation proof diaphragm (6), cover plate (7), window
(8), protective shield of radiation (9), getter (10), getter pressing plate (11), blast pipe (12), flexible-belt line (13)；It is characterized in that：
The underrun high heat conduction silver paste of described multistage TEC (2) is fixed on the bottom surface in package shell (1) cavity
On, battery lead plate (3) is fixed on the upper surface of multistage TEC (2) by high heat conduction silver paste, and focal plane module (4) is by low
Temperature epoxy glue is fixed on battery lead plate (3)；Package shell (1) stitch is fixed in flexible-belt line (13) one end by soldering, another
Battery lead plate (3) is fixed in end by epoxy low temperature glue, and the electricity that focal plane module (4) is completed using ultrasonic bond technique is drawn；
Field stop (5) is integrated in component and radiation proof diaphragm (6), wherein field stop (5) are fixed on electrode by epoxy low temperature glue
On plate (3), radiation proof diaphragm (6) is fixed on by epoxy low temperature glue in the middle one-level of multistage TEC (2)；Getter
(10) it is arranged on the bottom surface in package shell (1) cavity, is fixed by getter pressing plate (11), getter pressing plate (11)
It is attached using screw and package shell (1)；Protective shield of radiation (9) is installed on getter (10) and multistage TEC (2)
Between, fixed by screw or electric resistance welding；Window (8) first passes through eutectic weldering and completes sealing welding with cover plate (7), then will lid
Plate (7) carries out sealing welding with package shell (1)；The blast pipe (12) for high vacuum exhaustion is integrated on package shell (1).
2. a kind of focus planar detector assembly encapsulation structure of integrated multilevel TEC according to claim 1, its
It is characterised by：Described multistage TEC (2) is cold can conveniently to install the pyramid structure of radiation proof diaphragm (6)
End area is small, and the area of intergrade is big.
3. a kind of focus planar detector assembly encapsulation structure of integrated multilevel TEC according to claim 1, its
It is characterised by：Described field stop (5) and the inner chamber body of radiation proof diaphragm (6) have black coating or coating, and outer surface is throwing
Light processing layer or Gold plated Layer.
4. a kind of focus planar detector assembly encapsulation structure of integrated multilevel TEC according to claim 1, its
It is characterised by：There is Gold plated Layer on described package shell (1), cover plate (7), protective shield of radiation (9), surface.
5. a kind of focus planar detector assembly encapsulation structure of integrated multilevel TEC according to claim 1, its
It is characterised by：There is the layer gold that magnetron sputtering is handled on described flexible-belt line (13) surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720613355.7U CN206806340U (en) | 2017-05-27 | 2017-05-27 | The focus planar detector assembly encapsulation structure of integrated multilevel TEC |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720613355.7U CN206806340U (en) | 2017-05-27 | 2017-05-27 | The focus planar detector assembly encapsulation structure of integrated multilevel TEC |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206806340U true CN206806340U (en) | 2017-12-26 |
Family
ID=60742132
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720613355.7U Active CN206806340U (en) | 2017-05-27 | 2017-05-27 | The focus planar detector assembly encapsulation structure of integrated multilevel TEC |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206806340U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108493271A (en) * | 2018-03-13 | 2018-09-04 | 东南大学 | A kind of chip-scale superminiature refrigeration machine for non-refrigeration type infrared detector |
| CN111327809A (en) * | 2020-03-23 | 2020-06-23 | 中国科学院长春光学精密机械与物理研究所 | Circuit structure for realizing vacuum refrigeration of imaging terminal |
| CN112363360A (en) * | 2020-06-15 | 2021-02-12 | 武汉高德智感科技有限公司 | Diaphragm, infrared module and infrared imaging device |
-
2017
- 2017-05-27 CN CN201720613355.7U patent/CN206806340U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108493271A (en) * | 2018-03-13 | 2018-09-04 | 东南大学 | A kind of chip-scale superminiature refrigeration machine for non-refrigeration type infrared detector |
| CN111327809A (en) * | 2020-03-23 | 2020-06-23 | 中国科学院长春光学精密机械与物理研究所 | Circuit structure for realizing vacuum refrigeration of imaging terminal |
| CN111327809B (en) * | 2020-03-23 | 2021-06-25 | 中国科学院长春光学精密机械与物理研究所 | Circuit structure for realizing vacuum refrigeration of imaging terminal |
| CN112363360A (en) * | 2020-06-15 | 2021-02-12 | 武汉高德智感科技有限公司 | Diaphragm, infrared module and infrared imaging device |
| CN112363360B (en) * | 2020-06-15 | 2022-12-13 | 武汉高德智感科技有限公司 | Diaphragm, infrared module and infrared imaging device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN206806340U (en) | The focus planar detector assembly encapsulation structure of integrated multilevel TEC | |
| CN209029389U (en) | Wafer-level packaging infrared detector | |
| CN107275415A (en) | The focal plane infrared detector module encapsulating structure of integrated multilevel TEC | |
| US5056929A (en) | Temperature compensation type infrared sensor | |
| EP2400540A1 (en) | Vacuum sealed package, printed circuit board having vacuum sealed package, electronic device, and method for manufacturing vacuum sealed package | |
| CN104022046B (en) | Mixing wafer-level vacuum encapsulating method and structure based on banding getter | |
| US20060060785A1 (en) | Component for detecting electromagnetic radiation, particularly infrared radiation, infrared optical imaging unit including such a component and process for implementing it | |
| CN105304505B (en) | Mix wafer-level vacuum encapsulating method and structure | |
| CN106847759A (en) | Vacuum encapsulation structure and its method for packing, the device for Vacuum Package | |
| CN105758531A (en) | Vacuum packaging assembly for non-refrigeration infrared detector | |
| CN106404187A (en) | Non-refrigerated focal plane infrared detector chip vacuum packaging structure and process | |
| CN107340061A (en) | A kind of infrared detector ice chest | |
| CN103456757A (en) | All-metal sealed EMCCD camera refrigeration dewar | |
| CN210625860U (en) | Low-temperature high-vacuum infrared detector packaging structure | |
| CN100411183C (en) | Infrared imaging sensor and its vacuum packing method | |
| EP1673814B1 (en) | Manufacturing method of an integrated package for a radiation sensing device | |
| CN105842726B (en) | Tellurium-zinc-cadmium X-ray detector with nitrogen-filled semiconductor refrigeration | |
| CN211347102U (en) | Metal micro Dewar vacuum structure of infrared detector | |
| CN102956661B (en) | A kind of chip packaging method and encapsulating structure thereof | |
| CN105552095B (en) | A kind of antivacuum thermoelectric cooling unit for area array CCD | |
| JP2011174763A (en) | Infrared detector | |
| JPS586136B2 (en) | Koden Souchi | |
| CN201797230U (en) | Miniature TO-packaged wide-temperature-range solid-state laser | |
| CN108180672B (en) | Vacuum packaging Dewar of EMCCD detector | |
| CN101025303A (en) | Photoelectric conversion solar vacuum glass composite trasducing tube |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant |