CN206775825U - FPC circuit board - Google Patents
FPC circuit board Download PDFInfo
- Publication number
- CN206775825U CN206775825U CN201720595406.8U CN201720595406U CN206775825U CN 206775825 U CN206775825 U CN 206775825U CN 201720595406 U CN201720595406 U CN 201720595406U CN 206775825 U CN206775825 U CN 206775825U
- Authority
- CN
- China
- Prior art keywords
- fpc circuit
- circuit boards
- thickness
- layer
- wiring layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000463 material Substances 0.000 claims abstract description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000011889 copper foil Substances 0.000 claims abstract description 7
- 238000007747 plating Methods 0.000 claims abstract description 6
- 229920002799 BoPET Polymers 0.000 claims abstract description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000003351 stiffener Substances 0.000 claims description 5
- 239000006229 carbon black Substances 0.000 claims description 3
- 239000002131 composite material Substances 0.000 claims description 3
- 229910021392 nanocarbon Inorganic materials 0.000 claims description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 abstract description 3
- 239000000853 adhesive Substances 0.000 abstract description 2
- 230000001070 adhesive effect Effects 0.000 abstract description 2
- 230000003647 oxidation Effects 0.000 abstract description 2
- 238000007254 oxidation reaction Methods 0.000 abstract description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 1
- 229910052737 gold Inorganic materials 0.000 abstract 1
- 239000010931 gold Substances 0.000 abstract 1
- 230000003014 reinforcing effect Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 37
- 238000000034 method Methods 0.000 description 10
- 230000006872 improvement Effects 0.000 description 9
- 230000008569 process Effects 0.000 description 6
- 230000008901 benefit Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
The utility model discloses a FPC circuit board, which comprises adhesive paper, a rectangular base material, a wiring layer and a printing ink layer which are arranged from bottom to top in sequence; the wiring layer adopts copper foil to continuously wind a plurality of rectangular coils along the frame of the rectangular substrate and is provided with two ends; the printing ink layer covers the wiring layer and exposes two ends of the rectangular coil; plating gold, tin or an oxide film on the two terminals; the rectangular base material is a PI film or a PET film; the thickness of the ink layer is 5-10 mu m; the FPC circuit board is provided with a circular positioning hole, and a reinforcing strip is arranged along the circumference of the circular positioning hole to prevent the circular positioning hole from being torn. The utility model is used for solve FPC circuit board wiring layer and easily by the oxidation, the locating hole is easily torn, easy electrostatic damage and heat resistance scheduling problem.
Description
Technical field
It the utility model is related to wiring board art, more particularly to a kind of FPC circuit boards.
Background technology
Flexible printed circuit board FPC (Flexible Printed Circuit Board) is with flexible insulating substrate system
Into printed circuit, there is many rigid printed circuit boards the advantages of not possessing.Such as it can with free bend, winding, folding,
It can require any arrangement according to space layout, and arbitrarily be moved and flexible in three dimensions, so as to reach components and parts assembling and lead
The integration of line connection.The volume of electronic product can be substantially reduced using FPC, is applicable electronic product to high density, miniaturization, height
The needs of reliable direction development, are widely used in electronic applications.But during practical set, FPC is often set
Positioning hole is equipped with, when positioning processing on FPC plates, positioning hole easily occurs to tear phenomenon, influences the quality of FPC plates；Some FPC
The copper foil of wiring layer is arranged on most surface and easily causes copper foil to leak outside, and easily causes oxidation blackening problem in higher temperature, such as
Using electronic products such as mobile phone or computers, for a long time using causing temperature to rise, in this case by unsuitable use, it is difficult to
Ensure meet it is ultra-thin on the premise of and meanwhile meet produce qualification rate.
Utility model content
A kind of the shortcomings that the purpose of this utility model is to overcome prior art, there is provided FPC circuit boards.
In order to solve the above technical problems, the utility model employs following technical measures：
A kind of FPC circuit boards, including gummed paper, rectangle base material, wiring layer, the ink layer set gradually from top to bottom；It is described
Wiring layer uses copper foil along some square coils of the rectangle base material frame continuous coiling, and has two terminations；The ink layer
Cover the wiring layer and expose two terminations of the square coil；Gold-plated, tin plating or plating oxide-film on two terminations；
The rectangle base material is PI films or PET film；The thickness of the ink layer is 5 μm~10 μm；The FPC circuit boards are provided with circle
Positioning hole, the circumference of the circular locating openings is provided with stiffener, prevents the circular locating openings from tearing.
As a further improvement, the thickness of the rectangle base material is 10 μm~50 μm.
As a further improvement, the thickness of the ink layer is 8 μm.
As a further improvement, also including antistatic backing, it is arranged between the ink layer and the wiring layer.
As a further improvement, the antistatic backing is conductive nano carbon black antistatic PTFE coatings, and thickness is 12 μm.
As a further improvement, also including refractory layer, the ink layer outer surface is arranged at.
As a further improvement, the refractory layer is PI-EP nanometer composite layers, and thickness is 10 μm.
As a further improvement, the thickness of the FPC circuit boards is not more than 0.05mm.
Compared with prior art, the utility model has advantages below：The utility model is determined the FPC circuit boards
Position hole sets stiffener, prevents from tearing in process is positioned；In the wiring layer brushing ink, copper foil oxygen is prevented
Change, compared to PI film protective layers, ink layer is thinner, and PI films have bounce and are unfavorable for shaping and fix.And it is further provided with anti-quiet
Electric layer and refractory layer, improve the use of FPC circuit boards or the security of process.
Brief description of the drawings
Accompanying drawing is used for providing further understanding to of the present utility model, and a part for constitution instruction, with this practicality
New embodiment is used for explaining the utility model together, does not form to limitation of the present utility model.
Accompanying drawing 1 is a kind of structural representation of FPC circuit boards of the utility model.
Accompanying drawing 2 is a kind of FPC circuit board sections schematic diagram of the utility model.
Main element symbol description
Gummed paper 100
Rectangle base material 200
Wiring layer 300
Ink layer 400
Antistatic backing 500
Refractory layer 600
Termination 10
Stiffener 20
Circular locating openings 30
Embodiment
To make the purpose, technical scheme and advantage of the utility model embodiment clearer, below in conjunction with this practicality
Accompanying drawing in new embodiment, the technical scheme in the utility model embodiment is clearly and completely described.
, it is necessary to illustrate in description of the present utility model, herein, such as first and second or the like relation
Term is used merely to make a distinction an entity or operation with another entity or operation, and not necessarily requires or imply
Any this actual relation or order be present between these entities or operation.Moreover, term " comprising ", "comprising" or its
Any other variant is intended to including for nonexcludability so that process, method, article including a series of elements or
Equipment not only includes those key elements, but also the other element including being not expressly set out, or also include for this process,
Method, article or the intrinsic key element of equipment.In the absence of more restrictions.By sentence " including one ... limit
Fixed key element, it is not excluded that in addition identical also be present in the process including the key element, method, article or equipment will
Element ".
The correlation module being related in the system is hardware system module or is prior art Computer Software journey
The functional module that sequence or agreement are combined with hardware, computer software programs or agreement involved by the functional module itself
The technology being well known to those skilled in the art, it is not the improvements of the system；The system is improved between each module
Interaction relationship or annexation, as the overall construction of system is improved, solved to solve the system
Relevant art problem.
Specific introduce is made to a kind of FPC circuit boards of the present utility model below in conjunction with drawings and embodiments.
Refer to accompanying drawing 1, a kind of FPC circuit boards, including set gradually from top to bottom gummed paper 100, rectangle base material 200,
Wiring layer 300, ink layer 400；The gummed paper, which is used to paste with equipment, to be fixed, and can also use glue etc. in other embodiments
Adhesive material.The wiring layer 300 uses copper foil along some square coils of the rectangle base material frame continuous coiling, and has two
Termination 10；The ink layer 400 covers the wiring layer 300, and exposes two terminations 10 of the square coil, be used for and its
Its equipment is electrically connected；On two terminations 10 it is gold-plated, tin plating or plating oxide-film, avoid two terminations 10 be oxidized and
It is conductive bad；The rectangle base material 200 is PI films or PET film, and PI membrane stabilities are good, and anti-interference is good, and high-low temperature resistant, processing
During technique it is simple, only with sticking, producing efficiency is higher, in the present embodiment, the thickness of the preferable PI films or PET film
Spend for 10 μm~50 μm, by experiment it is further preferred that thickness can be 35 μm, preferably can coordinate with the gummed paper 100
Use, it is not easy to torn to shreds, can also meet the requirement as substrate, while also realize the FPC circuits more thinning；The ink
The thickness of layer 400 is 5 μm~10 μm, it is preferred that thickness is 8 μm, can play good protective effect to the wiring layer 300, and
Ensure the thinness of product；The FPC circuit boards are provided with circular locating openings 30, are provided with along the circumference of the circular locating openings 30
Stiffener 20, prevent the circular locating openings from tearing, so as to influence the normal use of the FPC circuit boards.
Further, antistatic backing 500 is also included in the utility model preferred embodiment, is arranged at the ink layer
Between 400 and the wiring layer 300.In the present embodiment, the antistatic backing 500 applies for conductive nano carbon black antistatic PTFE
Layer, it is preferred that thickness is 12 μm, can effectively prevent that electrostatic is electric to the FPC in actual use or in process
Road plate causes to puncture equivalent damage.
Further, in the utility model preferred embodiment, it is contemplated that the ink layer 400 has heat resistance and asked
Topic, in addition to refractory layer 600, are arranged at the outer surface of ink layer 400.In the present embodiment, the refractory layer 600 is PI-
EP nanometer composite layers, it is preferred that thickness is 10 μm, can effectively prevent the ink layer 400 to be influenced by temperature.
Further, in the utility model preferred embodiment, the thickness of the FPC circuit boards is not more than 0.05mm,
The thickness of the FPC circuit boards is controlled, is advantageous to the FPC circuits and is used in the confined space inside electronic product, is strengthened
The competitiveness of product.
Preferred embodiment of the present utility model is the foregoing is only, it is all at this not to limit the utility model
Within the spirit and principle of utility model, any modification, equivalent substitution and improvements done etc., the utility model should be included in
Within the scope of protection.
Claims (8)
1. a kind of FPC circuit boards, it is characterised in that including gummed paper, rectangle base material, wiring layer, the oil set gradually from top to bottom
Layer of ink；The wiring layer uses copper foil along some square coils of the rectangle base material frame continuous coiling, and has two terminations；Institute
Ink layer is stated to cover the wiring layer and expose two terminations of the square coil；On two terminations it is gold-plated, tin plating or
Plate oxide-film；The rectangle base material is PI films or PET film；The thickness of the ink layer is 5 μm~10 μm；The FPC circuit boards
Circular locating openings are provided with, the circumference of the circular locating openings is provided with stiffener, prevent the circular locating openings from tearing.
2. FPC circuit boards according to claim 1, it is characterised in that the thickness of the rectangle base material is 10 μm~50 μm.
3. FPC circuit boards according to claim 1, it is characterised in that the thickness of the ink layer is 8 μm.
4. FPC circuit boards according to claim 1, it is characterised in that also including antistatic backing, be arranged at the ink layer
Between the wiring layer.
5. FPC circuit boards according to claim 4, it is characterised in that the antistatic backing is that conductive nano carbon black prevents quiet
Electric PTFE coatings, and thickness is 12 μm.
6. FPC circuit boards according to claim 1, it is characterised in that also including refractory layer, be arranged at outside the ink layer
Surface.
7. FPC circuit boards according to claim 6, it is characterised in that the refractory layer is PI-EP nanometer composite layers, and
Thickness is 10 μm.
8. FPC circuit boards according to claim 1, it is characterised in that the thickness of the FPC circuit boards is not more than
0.05mm。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720595406.8U CN206775825U (en) | 2017-05-25 | 2017-05-25 | FPC circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720595406.8U CN206775825U (en) | 2017-05-25 | 2017-05-25 | FPC circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206775825U true CN206775825U (en) | 2017-12-19 |
Family
ID=60639413
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720595406.8U Active CN206775825U (en) | 2017-05-25 | 2017-05-25 | FPC circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206775825U (en) |
-
2017
- 2017-05-25 CN CN201720595406.8U patent/CN206775825U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |